JPS5982795A - Method of producing multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention The present invention relates to a method for manufacturing a multilayer printed circuit board used in electronic equipment, electrical equipment, transmission equipment, wireless equipment, computing equipment, etc., and its purpose is to manufacture a multilayer printed circuit board. To accurately drill and display guide hole positions that serve as a reference during machining.

Conventional guide hole position indicators on multilayer printed circuit boards are made by skilled workers who sense the estimated location where the hole position indicators are buried and then gradually drill holes to expose the display area (1). However, problems such as the incorrect location of the estimated burial site, unclear display parts due to insufficient drilling, disappearance of the display parts due to excessive drilling, inability to perform drilling work, and lack of skilled workers caused problems.

The present invention solves the above-mentioned drawbacks by providing several guide hole position indications at the end of the inner layer material, and marking the indication areas with an adhesive.
- Next, prepreg and metal foil are superimposed on this II- on both sides of the inner J wire, and after heating and pressing, the display part is bored and exposed, and a guide is processed using the guide hole position display as a reference. Since the gloss of the surface of the hole position display section is clearly different from the surface other than the display section, it is possible to know the exact position of the guide hole, eliminating errors in the estimated burial location of the hole position display, and making it easier to drill holes. When the tip of the hole puncher reaches the adhesive position, the metal foil layer changes from a layer with a high resistance value such as a resin-impregnated base material layer to a layer with a low resistance value such as an adhesive layer, thereby changing the position of the guide hole. Since it is easy to see that the area has reached the vicinity of the display area, the display area can be exposed accurately and clearly, eliminating the problems of under-drilling and over-drilling that were previously experienced. In addition, by fixing the prepreg with adhesive, it is possible to prevent the position of the laminate from shifting before heating and pressing, and it is extremely easy to indicate the position of the guide hole ( It is now possible to display .

The method of the present invention will be explained below with reference to the illustrated embodiments. @1 As shown in the figure, the end of the inner layer material 1,
A plurality of guide hole position indicators 2 are provided at the four corners, and the indicator 2 is covered with an adhesive 3 such as a liquid or putty adhesive, an adhesive-impregnated base material, an adhesive-coated base material, etc. Inner layer material 1
Both sides are made of phenolic resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. The synthetic resin liquid is impregnated into base materials such as woven fabrics, nonwoven fabrics, mats, or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. The dried prepreg 4 and a metal foil 5 such as copper foil, aluminum foil, brass foil, Ni...Nokel foil are kneaded together in this order for Km, and after heating and pressing the cutting edge, the display part 2 is bored and exposed. , processing such as through-hole drilling is performed using the guide hole position display 2 as a reference. The metal foil may be used alone, or in order to improve adhesion to the prepreg, the opposite side of the prepreg may be subjected to a release treatment, an adhesive coating drying treatment, or an activation treatment such as a roughening treatment. 1. You can also do it. Furthermore, the surface of the inner layer material can be activated by a physical method such as polishing or a chemical method such as chromic acid-based chemical treatment in order to improve the contact J1f with the prepreg.

As mentioned above, the method of the present invention (according to the method of the present invention) allows accurate determination of the position of the kite hole, which eliminates the problem of incorrect positioning of the estimated burial place indicated by the blue hole position, and also eliminates the problem of under-drilling or over-drilling. [2] Furthermore, it is possible to improve the drilling efficiency, eliminate the need for skilled workers, and prevent misalignment of the laminate before heating and pressing.

[Brief explanation of the drawing]

- Figure 1 is a simplified cross-sectional view of laminated materials according to an embodiment of the method of the present invention. 1 is the inner layer material, 2 is the guide hole position indicator, 3 is the adhesive, 4
5 is a prepreg, 5 is a metal foil, and 6 is an electric circuit. Patent applicant Matsushita Electric Works Co., Ltd. Patent attorney Toshimaru Takemoto (and 2 others) (5) Figure 1

Claims (1)

[Claims] A plurality of guide hole position indicators are provided at the end of the inner layer material, the indicator areas are covered with adhesive, prepreg and metal foil are stacked in this order on both sides of the inner layer material, and after heating and pressing, the indicator areas are drilled. 1. A method for manufacturing a multilayer printed circuit board, characterized in that the guide hole position indication is used as a reference for processing.