JPS61136710A - Manufacturing method of substrate for multi-layer printed circuit - Google Patents

Abstract

PURPOSE:To have position sensing marks displayed correctly, by setting a plurality of metallic position sensing marks at respective ends of inner layer material end getting those marks are sensed by an eddy current detecting type sensor. CONSTITUTION:Position sensing marks 2, 2', 2'', 2''' formed of a plurality of metal pieces are installed on inner layer materials 1, 1' obtained by forming electric circuit(s) on the surface(s) of a lamina plate with its one side face or both side faces covered with copper plate(s). Proprogs 3 produced by impreg nating cloth, paper etc with synthetic resin varnish and drying it, and outer layers 4 made of metallic foil etc. are piled on both sides of the inner layer materials 1, 1'' and heated/pressurized. Then, marks 2 are exposed through a process of spot facing after sensing the mark 2 by means of an eddy current detecting type sensor so that the mark positions can be displayed correctly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a multilayer printed circuit board used in electronic equipment, electrical and electrical equipment, transmission equipment, wireless equipment, computing equipment, and the like.

[Background technology]

The conventional hole position display for position detection on multilayer printed circuit boards is
Skilled workers used to gradually counterbore the estimated burial location of the hole position display to expose the display section.
Problems such as the incorrect location of the estimated burial site, blurring of the display due to insufficient counterboring, disappearance of the display due to excessive counterboring, inability to perform counterboring work, and lack of skilled workers have become a problem, as well as problems with the post-secondary molding process. The disadvantage was that it could not be automated.

[Purpose of the invention]

An object of the present invention is to accurately drill and display position detection marks that serve as references when processing a multilayer printed circuit board.

[Disclosure of the invention]

In the present invention, a plurality of position detection marks are provided at the end of the inner layer material, and then one Resoreg and the outer layer material are stacked on both sides of the inner layer material in this order, heated and pressed, and then the mark portions are detected by an eddy current detection sensor. After that, the counterbore is exposed and processed using the mark as a reference, so the mark position can be accurate to about ±200 microns, so the counterbore after secondary molding,
It has become possible to automate and coordinate processes such as drilling holes and finishing the external shape. An embodiment of the present invention will be described below based on an illustrated embodiment.

〔Example〕

As shown in the drawings, a plurality of position detection marks 2.2.2 are provided at the end, preferably at the corner, of an inner layer material 1.1' in which a circuit is formed on the surface of a single-sided copper-clad laminate or a double-sided copper-clad laminate. .2 After installing all the inner layer materials, apply phenol IHIW, epoxy resin, unsaturated polyester A/resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluoride to both sides of the inner layer material. Single resin, modified product,
Synthetic resin faces made of mixtures, etc. can be replaced with woven fabrics, non-woven fabrics, mats, paper, etc. made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic, and natural fibers such as cotton. The prepreg 3 impregnated and dried on the base material and the outer layer material 4 such as metal foil such as copper foil, aluminum foil, brass foil, nickel/L' foil, or single-sided metal foil-clad laminate are laminated in this order and heated. After pressing, the mark portion 2t is detected by an eddy current detection sensor, then counterbored to expose the mark portion 2t, and processing such as through-hole drilling and external finishing is performed using the mark 2 as a reference. The mark for position detection may be made of metal as long as it is made of metal, and it may be made by using a part of the metal foil-clad laminate when forming the circuit of the inner layer material, or it may be made by gluing metal foil, etc. There are no particular limitations. However, it is preferable to use metal foil.

〔Effect of the invention〕

As described above, according to the method of the present invention, it is possible to know the exact position of the mark for position detection, so it is possible to eliminate the difference in the position of the hole position display for position detection and the estimated burial place. This eliminates the problem of excessive production, improves the efficiency of counterboring work, eliminates the need for skilled workers, and automates the process after secondary forming.

[Brief explanation of drawings]

The drawing is a simplified cross-sectional view of a multilayer printed circuit board material laminated according to an embodiment of the method of the present invention. 1 is the inner layer material, 2 is the position detection mark, 3 is the prepreg,
4 is an outer layer material.

Claims (2)

[Claims] (1) After providing multiple position detection marks on the edge of the inner layer material, heat and press the prepreg and outer layer materials on both sides of the inner layer material in this order, and then detect the marks with an eddy current detection sensor. . A method for manufacturing a multilayer printed circuit board, comprising: performing a counterbore process to expose the mark, and processing the board using the mark as a reference. (2) The method for manufacturing a multilayer printed circuit board according to claim 1, wherein the position detection mark is a metal foil.