JPS5981061U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5981061U JPS5981061U JP17560282U JP17560282U JPS5981061U JP S5981061 U JPS5981061 U JP S5981061U JP 17560282 U JP17560282 U JP 17560282U JP 17560282 U JP17560282 U JP 17560282U JP S5981061 U JPS5981061 U JP S5981061U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electrical wiring
- hole
- printed wiring
- welding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来のプリント配線基板における連
結手段の説明図、第３図〜第９図は本考案に係るプリン
ト配線基板の実施例の説明図である。
Ａ、 Ｂ・・・・・・電気配線基板、２６・・・・・・
スルーホール、２７・・・・・・金属層、２８・・・・
・・金属板、２９・・・・・・ハンダ。1 and 2 are explanatory diagrams of a connecting means in a conventional printed wiring board, and FIGS. 3 to 9 are explanatory diagrams of an embodiment of the printed wiring board according to the present invention. A, B...Electric wiring board, 26...
Through hole, 27...Metal layer, 28...
...Metal plate, 29...Solder.
Claims (1)
され、かつこの重合面部における所定の位首にスルーホ
ールか形成され、さらにこのスルーホール内壁部及びこ
のスルーホールと端部とにわたって熱伝導性の良好な層
を設けた第２の電気配線基板と、溶着部材とからなり、
第１の電気配線基板と第２の電気配線基板とを重合し、
熔融してスルーホールを通り略環状となる溶着部材で結
合したことを特徴とするプリント配線基板。The first electrical wiring board and the second electrical wiring board are superimposed, and a through hole is formed at a predetermined position in the overlapping surface, and the inner wall of the through hole and the end of the through hole are Consisting of a second electrical wiring board provided with a layer with good thermal conductivity over the entire area, and a welding member,
polymerizing a first electrical wiring board and a second electrical wiring board;
A printed wiring board characterized in that the printed wiring board is bonded by a welding member that melts and passes through a through hole to form a substantially annular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17560282U JPS5981061U (en) | 1982-11-22 | 1982-11-22 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17560282U JPS5981061U (en) | 1982-11-22 | 1982-11-22 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5981061U true JPS5981061U (en) | 1984-05-31 |
Family
ID=30381999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17560282U Pending JPS5981061U (en) | 1982-11-22 | 1982-11-22 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5981061U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017183685A (en) * | 2016-03-29 | 2017-10-05 | 日本碍子株式会社 | Metal wiring joining structure and its manufacture |
| CN107241871A (en) * | 2016-03-29 | 2017-10-10 | 日本碍子株式会社 | Metal wiring connected structure and its preparation method |
| KR20210070127A (en) * | 2019-12-04 | 2021-06-14 | 주식회사 파워로직스 | Protect circuit module and method of manufacturing the same |
-
1982
- 1982-11-22 JP JP17560282U patent/JPS5981061U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017183685A (en) * | 2016-03-29 | 2017-10-05 | 日本碍子株式会社 | Metal wiring joining structure and its manufacture |
| CN107241871A (en) * | 2016-03-29 | 2017-10-10 | 日本碍子株式会社 | Metal wiring connected structure and its preparation method |
| US10668558B2 (en) | 2016-03-29 | 2020-06-02 | Ngk Insulators, Ltd. | Metal wiring bonding structure and production method therefor |
| KR20210070127A (en) * | 2019-12-04 | 2021-06-14 | 주식회사 파워로직스 | Protect circuit module and method of manufacturing the same |
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