JP2017183685A - Metal wiring joining structure and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To firmly join a first member having a first contact and a second member having a second contact.SOLUTION: A metal wiring joining structure 100 is obtained by joining a contact 753 of a connection FPC 75 and a heater rand 46 of a seat heater 30 by means of a solder joining member 756. The connection FPC 75 has a metal contact counter rand 754 in a position counter to each of a plurality of contacts 753, and on a face opposite the face of the support layer 751 which face is provided with metal wiring 750, and also has a through-hole 755 extending through the contact counter rand 754, support layer 751, and contact 753. The solder joining member 756 covers the surface of the contact counter rand 754 and also fills the through-hole 755 and a joining space C.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a metal wiring junction structure and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, as a joint structure between a flexible board and a printed board, a structure in which a contact portion such as a contact pattern on the flexible board and a corresponding contact portion on the printed board are electrically connected by soldering is known ( For example, Patent Document 1). An example of such a joining structure is shown in FIG. In the flexible substrate 110, the coverlay film 112 is removed at the substrate end, and the end portion of the copper foil pattern arranged in parallel at a constant pitch is exposed as the contact pattern 114. Then, the contact pattern 114 is superimposed on the contact pattern 124 formed on the printed circuit board 120, and the solder previously attached to at least one surface of the contact pattern 114 and the contact pattern 124 is melted and electrically connected. .

Japanese Patent Laid-Open No. 5-90725

  However, in the joining structure of FIG. 15, the amount of solder attached to at least one surface of the contact pattern 114 and the contact pattern 124 may not be sufficient. In addition, when melting the solder, heat does not spread over the entire solder, resulting in poor connection.

  The present invention has been made to solve the above-described problems, and has as its main object to firmly join a first member having a first contact and a second member having a second contact.

The metal wiring junction structure of the present invention is
A plurality of first metal wirings are provided between the first support layer made of resin and the first coating layer made of resin, and a first contact forming an end of each first metal wiring is exposed from the first coating layer. A first member,
A second member having a plurality of second contacts on the surface of the resin-made second support layer, wherein the second contact is disposed opposite to each of the plurality of first contacts;
A joining member that brazes the first contact and the second contact;
A metal wiring junction structure comprising:
The first member is opposed to the first contact made of metal at a position facing each of the plurality of first contacts on the surface of the first support layer opposite to the surface on which the first metal wiring is provided. And a first through hole penetrating the first contact-facing land, the first support layer, and the first contact.
The joining member covers the surface of the first contact-facing land and is filled in a joining space between the first through hole and between the first contact and the second contact.
Is.

  In this metal wiring joining structure, the joining member covers the surface of the first contact-facing land and fills the inside of the first through hole and the joining space between the first contact and the second contact. When producing this metal wiring joining structure, the brazing material melted at the first contact-facing land can be supplied to the joining space through the first through hole. Therefore, it becomes easier to supply the brazing material to the bonding space as compared with the case where the first contact-facing land and the first through hole are not provided. As a result, it is possible to avoid problems such as insufficient brazing material in the bonding space and insufficient bonding. Further, when the first contact-facing land is heated, the heat is transferred to the bonding space via the first support layer, and the heat of the brazing material in the molten state is also transferred to the bonding space. Therefore, the entire bonding space is heated. As a result, the molten brazing material supplied to the bonding space is likely to spread uniformly in the bonding space. In this way, the problem that the joining space becomes insufficient due to insufficient brazing material in the joining space is avoided, and the brazing material spreads uniformly in the joining space, so that the first contact and the second contact Is firmly joined.

  Note that “brazing” refers to soldering (melting temperature is lower than 450 ° C.) or brazing (melting temperature is 450 ° C. or higher).

  In the metal wiring junction structure of the present invention, the first through hole may have a circular cross section, an elliptical shape, or a rounded rectangular shape. In this way, the brazing material melted at the first contact-facing land can smoothly pass through the first through hole. In particular, an elliptical shape or a rounded rectangular shape is preferable. Usually, the shape of the first contact in plan view is often a rectangle, so if a first through hole having an elliptical cross section or a rounded rectangular cross section is provided so that the major axis is oriented in the long side direction of the rectangle. The opening area of the first through hole can be increased. As a result, the brazing material melted in the first contact-facing land smoothly reaches the bonding space.

  In the metal wiring bonding structure of the present invention, the inner wall of the first through hole may be covered with a metal film. If it carries out like this, the soldering material fuse | melted by the 1st contact opposing land will become easy to wet-spread the inner wall of a 1st through-hole.

  In the metal wiring junction structure according to the present invention, two or more first through holes may be provided for one first contact. In this way, the brazing material melted in the first contact-facing land efficiently reaches the bonding space.

  In the metal wiring junction structure according to the present invention, the second contact has an extension surface facing a virtual extension portion obtained by virtually extending the first contact forward in addition to a basic surface facing the first contact. The joining member covers the surface of the first contact-facing land, the front end surface of the first member, and the extended surface of the second contact, and is filled in the inside of the first through hole and the joining space. It may be. If it carries out like this, since the part which coat | covers the surface of a 1st contact opposing land and the front end surface of a 1st member among joining members can be test | inspected from the outside, a connection condition can be confirmed easily.

  In the metal wiring junction structure of the present invention, the first member may be a flexible printed circuit board (FPC). If it carries out like this, the 1st contact of FPC and the 2nd contact of the 2nd member can be joined firmly.

  In the metal wiring joining structure of the present invention, the second member is a sheet heater that functions as a heater, and is disposed between an electrostatic chuck and a metal support, and the first member May be inserted into the through hole of the support base and joined to the second member. If it carries out like this, in the electrostatic chuck heater by which the sheet heater is arrange | positioned between an electrostatic chuck and a support stand, the 1st contact of a 1st member and the 2nd contact of a sheet heater can be joined firmly.

The manufacturing method of the metal wiring junction structure of the present invention,
(A) A plurality of first metal wirings are provided between the first support layer made of resin and the first coating layer made of resin, and the first contact forming the end of each first metal wiring is the first coating. A first contact-facing land made of metal at a position opposed to each of the plurality of first contacts on the surface of the first support layer opposite to the surface on which the first metal wiring is provided. And a first member having a first through hole penetrating the first contact-facing land, the first support layer, and the first contact;
A second member having a plurality of second contacts on the surface of the second support layer made of resin;
A process to prepare;
(B) With the first contact and the second contact facing each other, a brazing material is applied to the first contact-facing land and heated to melt, and the melted brazing material is converted into the first contact. Supply from the opposing land to the joining space between the first contact and the second contact through the first through hole, and temporarily fix the first contact and the second contact with a spare brazing material in advance. If so, a step of melting the preliminary brazing material by heat transfer;
(C) solidifying the whole brazing material;
Is included.

  In the manufacturing method of this metal wiring junction structure, the first contact point and the second contact point are opposed to each other, and the brazing material is applied to the first contact point facing land and heated to melt. Then, the brazing material melted in the first contact-facing land is supplied to the bonding space through the first through hole. Therefore, it becomes easier to supply the brazing material to the bonding space as compared with the case where the first contact-facing land and the first through hole are not provided. As a result, it is possible to avoid problems such as insufficient brazing material in the bonding space and insufficient bonding. Further, the first contact-facing land is also heated, and the heat is transferred to the bonding space via the first support layer, and the heat of the brazing material in the molten state is also transferred to the bonding space. Therefore, the entire bonding space is heated. As a result, the molten brazing material supplied to the bonding space is likely to spread uniformly in the bonding space. In addition, when the first contact and the second contact are temporarily fixed with a preliminary brazing material, the preliminary brazing material is melted by heat transfer and is in a molten state supplied to the joining space. Integrated with brazing material. Thereafter, the molten brazing material is solidified. The joining member, which is the brazing material after solidifying, covers the surface of the first contact-facing land and fills the inside of the first through hole and the joining space. In this way, the problem that the joining space becomes insufficient due to insufficient brazing material in the joining space is avoided, and the brazing material spreads uniformly in the joining space, so that the first contact and the second contact Is firmly joined.

  In the method for manufacturing a metal wiring junction structure according to the present invention, the first through hole may have a circular cross section, an elliptical shape, or a rounded rectangular shape. In this way, the brazing material melted at the first contact-facing land can smoothly pass through the first through hole. In particular, an elliptical shape or a rounded rectangular shape is preferable.

  In the manufacturing method of the metal wiring joining structure of the present invention, the inner wall of the first through hole may be covered with a metal film. If it carries out like this, the soldering material fuse | melted by the 1st contact opposing land will become easy to spread the inner wall of a 1st through-hole.

  In the method for manufacturing a metal wiring junction structure according to the present invention, two or more first through holes may be provided for one first contact. In this way, the brazing material melted in the first contact-facing land efficiently reaches the bonding space.

  In the method for manufacturing a metal wiring joint structure according to the present invention, the second contact has an extension surface facing a virtual extension portion obtained by virtually extending the first contact forward in addition to a basic surface facing the first contact. And in the step (b), the molten brazing material is further passed from the first contact-facing land to the first contact through the tip surface of the first member and the extended surface of the second contact. You may make it reach the space for joining between the said 2nd contact. If it carries out like this, since the part which coat | covers the surface of a 1st contact opposing land and the front end surface of a 1st member among joining members can be test | inspected from the outside, a connection condition can be confirmed easily. In addition, when the first contact of the first member is aligned so as to face the second contact of the second member, the extended surface of the second contact and the first contact-facing land can be seen from above the first member. Can be easily aligned.

  In the manufacturing method of the metal wiring joining structure of the present invention, the first member may be a flexible printed circuit board (FPC). The second member is a sheet heater that serves as a heater, and is disposed between an electrostatic chuck and a metal support. The first member penetrates the support. It may be inserted into the hole and joined to the second member.

1 is a cross-sectional view illustrating a schematic configuration of a plasma processing apparatus 10. The perspective view which shows the internal structure of the seat heater 30. FIG. The top view when the metal wiring joining structure 100 is seen from the lower surface 30b of the sheet heater 30. FIG. AA sectional drawing of FIG. Explanatory drawing showing the manufacturing process of the metal wiring junction structure 100. FIG. Explanatory drawing showing the manufacturing process of FPC75 for a connection. Explanatory drawing showing the other manufacturing process of the metal wiring junction structure 100. FIG. Sectional drawing of the modification of the metal wiring junction structure 100. FIG. Explanatory drawing of the process of aligning FPC75 for connection with the seat heater 30. FIG. Sectional drawing of the modification of the metal wiring junction structure 100. FIG. The top view of the modification of the metal wiring junction structure 100. FIG. BB sectional drawing of FIG. The top view of the modification of the metal wiring junction structure 100. FIG. Sectional drawing of the modification of FPC75 for a connection. The perspective view of the conventional metal wiring junction structure.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a schematic configuration of the plasma processing apparatus 10, and FIG. 2 is a perspective view showing an internal structure of the seat heater 30.

  As shown in FIG. 1, a plasma processing apparatus 10 that is a semiconductor manufacturing apparatus includes a vacuum chamber 12, a shower head 14, and an electrostatic chuck heater 20. The vacuum chamber 12 is a container formed in a box shape from aluminum alloy or the like. The shower head 14 is provided on the ceiling surface of the vacuum chamber 12. The shower head 14 discharges the process gas supplied from the gas introduction pipe 16 through the gas injection holes 18 into the vacuum chamber 12. The shower head 14 serves as a cathode plate for plasma generation. The electrostatic chuck heater 20 is a device that sucks and holds the wafer W on the wafer mounting surface 22a. Hereinafter, the electrostatic chuck heater 20 will be described in detail.

  The electrostatic chuck heater 20 includes an electrostatic chuck 22, a sheet heater 30, and a support base 60. The lower surface of the electrostatic chuck 22 and the upper surface 30 a of the sheet heater 30 are bonded to each other via the first bonding sheet 81. The upper surface of the support base 60 and the lower surface 30 b of the sheet heater 30 are bonded to each other via the second bonding sheet 82. Examples of the bonding sheets 81 and 82 include a sheet having an acrylic resin layer on both sides of a polypropylene core, a sheet having a silicone resin layer on both sides of a polyimide core, and a sheet of an epoxy resin alone. .

  The electrostatic chuck 22 is a disk-shaped member, in which an electrostatic electrode 24 is embedded in a ceramic sintered body 26. Examples of the ceramic sintered body 26 include an aluminum nitride sintered body and an alumina sintered body. The upper surface of the electrostatic chuck 22 is a wafer placement surface 22a on which the wafer W is placed. The thickness of the ceramic sintered body 26 is not particularly limited, but is preferably 0.5 to 4 mm.

  The sheet heater 30 is a disk-like member, and includes a heat-resistant resin sheet 32 in which a correction heater electrode 34, a jumper wire 36, a ground electrode 40, and a reference heater electrode 44 are built. Examples of the material of the resin sheet 32 include polyimide resin and liquid crystal polymer. The seat heater 30 includes a first electrode region A1 to a fourth electrode region A4 (see FIG. 2) that are parallel to the upper surface 30a of the seat heater 30 and have different heights.

  The first electrode region A1 is divided into a number of zones Z1 (for example, 100 zones or 300 zones). In each zone Z1, the correction heater electrode 34 is wired so as to reach the entire zone Z1 from one end 34a to the other end 34b in the manner of one stroke. In FIG. 2, a virtual line indicated by a dotted line is drawn in the first electrode region A1, and a portion surrounded by the virtual line is defined as a zone Z1. In FIG. 2, for the sake of convenience, the correction heater electrode 34 is shown only in one zone Z1, but the same correction heater electrode 34 is also provided in the other zone Z1. Further, the outer shape of the seat heater 30 is indicated by a one-dot chain line.

  In the second electrode region A2, jumper wires 36 for supplying power to each of the plurality of correction heater electrodes 34 are provided. Therefore, the number of jumper lines 36 matches the number of correction heater electrodes 34. The second electrode region A2 is divided into a number of zones Z2 smaller than the number of zones Z1 (for example, 6 zones or 8 zones). In FIG. 2, a virtual line indicated by a dotted line is drawn in the second electrode region A2, and a portion surrounded by the virtual line is defined as a zone Z2. In FIG. 2, for convenience, the jumper line 36 (a part) is shown only in one zone Z2, but the same jumper line 36 is also provided in the other zones Z2. In the present embodiment, a plurality of correction heater electrodes 34 that fall within the projection area when one zone Z2 is projected onto the first electrode area A1 will be described as belonging to the same group. One end 34a of the correction heater electrode 34 belonging to one set penetrates the one end 36a of the jumper wire 36 in the zone Z2 corresponding to the set in the vertical direction between the first electrode region A1 and the second electrode region A2. They are connected via vias 35 (see FIG. 1). The other end 36b of the jumper wire 36 is drawn to the outer peripheral region 38 provided in the zone Z2. As a result, the other ends 36 b of the jumper wires 36 connected to the correction heater electrodes 34 belonging to the same group are arranged together in one outer peripheral region 38. In the region X in which the outer peripheral region 38 is projected onto the lower surface 30b of the seat heater 30, the jumper land 46a connected to the other end 36b of each jumper wire 36 and the via 41 (see FIG. 1) is arranged side by side. ing. In other words, the plurality of jumper lands 46a are arranged such that two or more jumper lands 46a are exposed to the same region X as a set. The specific resistance of the correction heater electrode 34 is preferably greater than or equal to the specific resistance of the jumper wire 36.

  A ground electrode 40 common to the plurality of correction heater electrodes 34 is provided in the third electrode region A3. Each correction heater electrode 34 is connected to the ground electrode 40 through a via 42 (see FIG. 1) that extends from the first electrode region A1 to the third electrode region A3 through the second electrode region A2. The ground electrode 40 has a protrusion 40a that protrudes outward from the outer periphery. The protrusion 40 a is provided at a position facing the notch 39 in each outer peripheral region 38. The protrusion 40a is connected to a ground land 46b provided on the lower surface 30b of the seat heater 30 via a via 43 (see FIG. 1). The ground land 46 b is provided together with the jumper land 46 a in the region X of the lower surface 30 b of the seat heater 30.

  The fourth electrode region A4 is divided into zones Z4 having a number (for example, 4 zones or 6 zones) smaller than the total number of correction heater electrodes 34 provided in the first electrode region A1. In each zone Z4, a reference heater electrode 44 having a higher output than the correction heater electrode 34 is wired so as to extend from one end 44a to the other end 44b over the entire zone Z4 in the manner of one stroke. In FIG. 2, a virtual line indicated by a dotted line is drawn in the fourth electrode region A4, and a portion surrounded by the virtual line is defined as a zone Z4. In FIG. 2, for the sake of convenience, the reference heater electrode 44 is shown only in one zone Z4, but the same reference heater electrode 44 is also provided in the other zone Z4. Both ends 44a and 44b of each reference heater electrode 44 are connected to a pair of reference lands 50a and 50b provided on the lower surface 30b of the seat heater 30 through vias (not shown) extending from the fourth electrode region A4 to the lower surface 30b of the seat heater 30. It is connected.

  As shown in FIG. 1, the support base 60 is a disk-shaped member made of a metal such as Al or an Al alloy, and a coolant channel 62 is provided therein. A chiller 70 that adjusts the temperature of the refrigerant is connected to the inlet 62 a and the outlet 62 b of the refrigerant flow path 62. When the refrigerant is supplied from the chiller 70 to the inlet 62 a of the refrigerant flow path 62, the refrigerant passes through the refrigerant flow path 62 provided so as to reach the entire support base 60, and passes from the outlet 62 b of the refrigerant flow path 62 to the chiller 70. It is returned and cooled to the set temperature in the chiller 70 and then supplied again to the inlet 62 a of the refrigerant flow path 62. The support base 60 has a plurality of types of through holes 64 to 67 that penetrate the support base 60 in the vertical direction. The through hole 64 is a hole for exposing the power supply terminal 25 of the electrostatic electrode 24 to the outside. The through-hole 65 is a hole for exposing a land group (jumper land 46a and ground land 46b, see FIG. 2) provided in the region X of the lower surface 30b of the seat heater 30 to the outside. The through holes 66 and 67 are for exposing the reference lands 50a and 50b of the reference heater electrode 44 to the outside. Electrically insulating cylinders 66a and 67a are inserted into the through holes 66 and 67, respectively. In addition, although not shown, the support base 60 has a through hole for moving up and down lift pins for lifting the wafer W.

  The plasma processing apparatus 10 further includes an electrostatic chuck power source 72, a correction heater power source 74, a reference heater power source 76, and an RF power source 79. The electrostatic chuck power source 72 is a DC power source and is connected to the power supply terminal 25 of the electrostatic electrode 24 via a power supply rod 73 inserted into the through hole 64. The correction heater power source 74 is a DC power source, and jumper lands 46 a and ground lands 46 b of the correction heater electrode 34 through a connection flexible printed circuit board (connection FPC) 75 that is a metal wiring assembly inserted into the through hole 65. It is connected to the. Specifically, the jumper lands 46a and the ground lands 46b belonging to the same set shown in FIG. 2 are arranged side by side in the same region X, and are therefore connected through one connection FPC 75. The connecting FPC 75 is a cable in which metal wirings 75a and 75b covered with a resin film are bundled in a band shape, and the metal wirings 75a and 76b are exposed at the end facing the region X. The metal wiring 75 a is a conductor for connecting the jumper land 46 a to the positive pole of the correction heater power supply 74, and the metal wiring 75 b is a conductor for connecting the ground land 46 b to the negative pole of the correction heater power supply 74. The reference heater power source 76 is an AC power source, and is connected to one reference land 50 a of the reference heater electrode 44 via a cable terminal 77 inserted into the through hole 66 and is also connected to the cable terminal 78 inserted into the through hole 67. To the other reference land 50b of the reference heater electrode 44. The RF power source 79 is a power source for plasma generation, and is connected to supply high-frequency power to the support base 60 that functions as an anode plate. The shower head 14 functioning as a cathode plate is grounded through a variable resistor.

  Here, the metal wiring joining structure 100 between the seat heater 30 and the connecting FPC 75 will be described with reference to FIGS. 3 is a plan view of the metal wiring bonding structure 100 as viewed from the lower surface 30b of the seat heater 30, and FIG. 4 is a cross-sectional view taken along line AA of FIG. For convenience, the jumper land 46a and the ground land 46b are simply referred to as the heater land 46 without being distinguished, and the metal wirings 75a and 75b are also referred to as the metal wiring 750 without being distinguished. The seat heater 30 has a plurality of heater lands 46 (46a, 46b) exposed in the region X (see FIG. 2) of the lower surface 30b. The connecting FPC 75 is a flat wiring material in which a plurality of metal wirings 750 are covered with a resin. Specifically, the connection FPC 75 includes a plurality of metal wirings 750 between a resin support layer 751 and a resin coating layer 752. The contact 753 that forms the end of each metal wiring 750 is exposed from the coating layer 752. On the surface of the support layer 751 opposite to the surface on which the metal wiring 750 is provided, a metal contact facing land 754 is provided at a position facing each of the plurality of contacts 753. The connection FPC 75 has a through hole 755. In this example, two through holes 755 are provided. The through hole 755 passes through the contact-facing land 754, the support layer 751, and the contact 753. In addition, the through hole 755 has a circular or substantially circular cross section (cross section cut along a horizontal plane). The solder joint member 756 covers the surface of the contact-facing land 754 and fills the space C for joining between the inside of the through hole 755 and the contact 753 and the heater land 46.

  The manufacturing method of such a metal wiring junction structure 100 will be described with reference to FIG. FIG. 5 is an explanatory view showing a manufacturing process of the metal wiring junction structure 100.

  First, as shown in FIG. 5A, preliminary solder 770 is applied to the heater lands 46 of the sheet heater 30. As the preliminary solder 770, for example, cream solder can be used.

  Next, as shown in FIG. 5B, a connection FPC 75 is prepared and arranged so that each contact 753 is in contact with the preliminary solder 770 in a state of facing each heater land 46. The connection FPC 75 is prepared by the following procedure. FIG. 6 is an explanatory view showing the manufacturing process of the connecting FPC 75. First, a support layer with double-sided copper foil in which copper foils 761 and 762 are attached to both sides of a resin-made support layer 751 is prepared (see FIG. 6A). Other metal foils may be used instead of the copper foils 761 and 762. Next, the metal wiring 750 is patterned on the copper foil 761, and the contact-facing land 754 is patterned on the copper foil 762 (see FIG. 6B). As a pattern formation method, a wet etching method can be used. Next, the metal wiring 750 is covered with a resin coating layer 752. As a method of covering with the covering layer 752, a laminating method can be used. However, the contact 753 which is the tip portion of the metal wiring 750 is not covered with the coating layer 752 and is exposed to the outside (see FIG. 6C). Next, a through-hole 755 that penetrates the contact-facing land 754, the support layer 751, and the contact 753 in the vertical direction is formed by a drill or a laser (see FIG. 6D). Thereby, the FPC 75 for connection is obtained. The diameter of the through hole 755 is not particularly limited, but is preferably 0.1 mm or more. In addition, although the through hole 755 can be easily provided by making the contact opposing land 754 and the contact 753 have the same shape, it is not necessarily required to have the same shape as long as the through hole 755 can be provided.

  Next, as shown in FIG. 5C, the preliminary heater 770 is heated with hot air from the spot heater 780 to melt the preliminary solder 770 and then solidify by cooling, whereby the seat heater 30 and the connecting FPC 75 are connected. Temporarily fix. The pre-solder 770 is not secured in an amount sufficient to fill the bonding space C between the contact point 753 and the heater land 46 without a gap, or the heat from the spot heater 780 does not reach the whole and is not sufficiently melted. Often to do. Therefore, the contact 753 and the heater land 46 cannot be firmly soldered with the preliminary solder 770 alone.

  Next, as shown in FIG. 5D, the thread solder 784 is melted by the soldering iron 782 while pressing the thread solder 784 against the upper surface of the contact-facing land 754. Then, the molten solder enters the through hole 755 from the contact-facing land 754 and is supplied to the bonding space C through the through hole 755. Therefore, it becomes easier to supply the molten solder to the bonding space C than in the case where the contact-facing land 754 and the through hole 755 are not provided. As a result, it is possible to avoid the problem that the bonding space C is insufficient and the bonding becomes insufficient. Further, the contact-facing land 754 is also heated, and the heat is transferred to the bonding space C through the support layer 751, and the heat of the molten solder is also transferred to the bonding space C. Therefore, the entire bonding space C is heated. As a result, the molten solder supplied to the bonding space C is likely to spread uniformly in the bonding space C. Further, the preliminary solder 770 is melted by heat transfer and integrated with the molten solder supplied to the bonding space C. Thereafter, the molten solder is solidified to form a solder joint member 756. The joining member, which is the brazing material after solidifying, covers the surface of the first contact-facing land and fills the inside of the first through hole and the joining space. The solder joint member 756 covers the surface of the contact-facing land 754 and fills the inside of the through hole 755 and the joint space C.

   Next, a usage example of the plasma processing apparatus 10 thus configured will be described. First, the wafer W is mounted on the wafer mounting surface 22 a of the electrostatic chuck 22. Then, the inside of the vacuum chamber 12 is depressurized by a vacuum pump so as to have a predetermined degree of vacuum, and a DC voltage is applied to the electrostatic electrode 24 of the electrostatic chuck 22 to generate a Coulomb force or a Johnson-Labeck force, The wafer W is attracted and fixed to the wafer mounting surface 22 a of the electrostatic chuck 22. Next, the inside of the vacuum chamber 12 is set to a process gas atmosphere at a predetermined pressure (for example, several tens to several hundreds Pa). In this state, a high frequency voltage is applied between the shower head 14 and the support base 60 to generate plasma. The surface of the wafer W is etched by the generated plasma. During this time, a controller (not shown) controls so that the temperature of the wafer W becomes a predetermined target temperature. Specifically, the controller inputs a detection signal from a temperature sensor (not shown) that measures the temperature of the wafer W, and each reference heater electrode 44 so that the measured temperature of the wafer W matches the target temperature. The current supplied to the correction heater electrode 34, the current supplied to each correction heater electrode 34, and the temperature of the refrigerant circulated in the refrigerant flow path 62 are controlled. In particular, the controller finely controls the current supplied to each correction heater electrode 34 so that the temperature distribution of the wafer W does not occur. The temperature sensor may be embedded in the resin sheet 32 or may be bonded to the surface of the resin sheet 32.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The connecting FPC 75 of this embodiment corresponds to the first member of the present invention, the sheet heater 30 corresponds to the second member, and the solder joint member 756 corresponds to the joint member. In addition, the supporting layer 751 of the connecting FPC 75 is the first supporting layer, the covering layer 752 is the first covering layer, the metal wiring 750 is the first metal wiring, the contact 753 is the first contact, and the contact facing land 754 is the first. The through-hole 755 corresponds to the first contact-facing land and corresponds to the first through-hole. Further, the resin sheet 32 of the sheet heater 30 corresponds to the second support layer, and the heater land 46 corresponds to the second contact.

  According to the metal wiring joining structure 100 described above, the problem that the solder in the joining space C is insufficient and the joining becomes insufficient is avoided, and the solder spreads uniformly in the joining space C. The contact point 753 of the FPC 75 for use and the heater land 46 of the seat heater 30 are firmly joined. Further, by providing a plurality (two in this case) of the through holes 755 for one contact 753, the solder melted in the contact-facing land 754 efficiently reaches the bonding space C. Furthermore, since the through hole 755 has a circular cross section, the solder melted at the contact-facing land 754 can smoothly pass through the through hole 755.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  In the above-described embodiment, the contact point 753 of the connecting FPC 75 and the heater land 46 of the seat heater 30 are temporarily fixed with the preliminary solder 770, but it is not particularly necessary to temporarily fix with the preliminary solder 770. An example is shown in FIG. First, as shown in FIG. 7A, the bonding space C is left as a gap. At this time, it is preferable that the contact point 753 of the connecting FPC 75 and the heater land 46 of the seat heater 30 are fixed by a tape or a jig (not shown) so as not to deviate from each other. Next, as shown in FIG. 7B, the thread solder 784 is melted by the soldering iron 782 while pressing the thread solder 784 against the upper surface of the contact facing land 754, and the melted solder is passed through the through hole from the contact facing land 754. It may be supplied to the bonding space C via 755. Also in this case, the solder melted in the contact-facing land 754 is supplied to the bonding space C through the through hole 755. Therefore, it becomes easier to supply solder to the bonding space C than in the case where the contact-facing land 754 and the through hole 755 are not provided. As a result, it is possible to avoid the problem that the bonding space C is insufficient and the bonding becomes insufficient. Further, the contact-facing land 754 is also heated, and the heat is transferred to the bonding space C through the support layer 751, and the heat of the molten solder is also transferred to the bonding space C. Therefore, the entire bonding space C is heated. As a result, the solder supplied to the joining space C is likely to spread uniformly in the joining space C. Therefore, as in the above-described embodiment, the contact 753 and the heater land 46 are firmly joined. In this way, the contact 753 and the heater land 46 are firmly joined without being temporarily fixed with the preliminary solder 770.

  In the above-described embodiment, as shown in FIG. 8, the heater land 46 is added to the basic surface 461 that faces the contact point 753, and the extension surface 462 that faces the virtual extension portion 753 b that virtually extends the contact point 753 forward. You may make it have. The solder joint member 756 covers the surface of the contact-facing land 754, the front end surface of the connecting FPC 75, and the extended surface 462 of the heater land 46 of the sheet heater 30, and the inside of the through hole 755 and the contact 753 and the heater land 46. You may make it fill with the space C for joining between. In this way, the portion of the solder joint member 756 that covers the surface of the contact-facing land 754 and the front end surface of the connecting FPC 75 can be inspected (for example, visually) from the outside, so that the connection status can be easily confirmed. it can. Further, when the contact 753 of the connecting FPC 75 is positioned so as to face the heater land 46, the extension surface 462 of the heater land 46 and the contact facing land 754 of the connecting FPC 75 can be seen from above the connecting FPC 75. If used, it can be easily aligned. FIG. 9 shows a state in which one contact point 753 of the connecting FPC 75 is aligned with respect to one heater land 46 with the lower surface 30b of the seat heater 30 facing upward. The alternate long and short dash line is a virtual line that divides the heater land 46 into a basic surface 461 and an extended surface 462. At the time of joining, the contact-facing land 754 of the connecting FPC 75 is exposed to the heater land 46 exposed on the lower surface 30b of the seat heater 30 from the state where the seat heater 30 and the connecting FPC 75 are separated (see FIG. 9A). It approaches so that it may overlap (refer FIG.9 (b)). The basic surface 461 of the heater land 46 is arranged so as to be covered with the contact-facing land 754 (see FIG. 9C). At this time, the rectangular shape of the contact-facing land 754 and the rectangular shape surrounding the extended surface 462 of the heater land 46 are bonded to each other so as to form one rectangular shape. By doing so, the contact 753 formed on the back side of the contact-facing land 754 and the basic surface 461 having the same size as the contact 753 face each other. When the heater land 46 has the extension surface 462, as shown in FIG. 10, the solder joint member 756 is supplied from the contact facing land 754 to the joining space C through the through hole 755 and oozes out into the extension surface 462. The connection status of the solder may be confirmed.

  In the embodiment described above, as shown in FIG. 11, the cross-sectional shape of the through-hole 765 (the shape seen from above) may be an ellipse, and the connecting FPC 75 and the seat heater 30 may be joined by the solder joining member 766. . Usually, the contact point 753 of the connecting FPC 75 is often rectangular in shape when viewed from above (the long side is the direction in which the metal wiring 750 extends). Therefore, the opening area of the through-hole 755 can be increased by providing the through-hole 755 having an elliptical cross section so that the major axis is oriented in the long side direction of the rectangle. As a result, as shown in FIG. 12, the solder melted in the contact-facing land 754 efficiently reaches the bonding space C between the contact 753 and the heater land 46. Therefore, the contact point 753 of the connecting FPC 75 and the heater land 46 of the seat heater 30 are more firmly joined by the solder joint member 766. Further, the cross-sectional area of the through-hole 765 can be secured while securing the remaining area of the contact-facing land 754 after the through-hole 765 is opened. Alternatively, as shown in FIG. 13, the cross-sectional shape (the shape seen from above) of the through hole 765 may be a rounded rectangle. By doing so, the cross-sectional area of the through-hole 765 can be increased, so that solder and heat can easily pass therethrough.

  In the embodiment described above, the inner wall of the through hole 755 may be covered with a metal film. For example, when processing the connecting FPC 75, a through hole 755 that penetrates the contact opposing land 754, the support layer 751, and the contact 753 in the vertical direction is formed by a drill or a laser (see FIG. 6D), and then penetrates. A metal layer 755a may be formed on the inner wall of the hole 755 using electroless plating, sputtering, electrolytic plating, or the like (see FIG. 14). As a material of the metal layer 755a, Cu, Ni, Au, Sn, or the like can be used. In this way, the solder melted at the contact-facing land 754 tends to wet and spread on the inner wall of the through hole 755.

  In the above-described embodiment, the connecting FPC 75 is exemplified as the first member and the seat heater 30 is exemplified as the second member. However, the present invention is not particularly limited to this combination. For example, a flat cable may be used as the first member, and a printed wiring board may be used as the second member.

  This application is based on US Provisional Application No. 62 / 314,547 and US Provisional Application No. 62 / 314,556 filed on March 29, 2016, all of which are incorporated by reference. Is included herein.

DESCRIPTION OF SYMBOLS 10 Plasma processing apparatus, 12 Vacuum chamber, 14 Shower head, 16 Gas introduction pipe, 18 Gas injection hole, 20 Electrostatic chuck heater, 22 Electrostatic chuck, 22a Wafer mounting surface, 24 Electrostatic electrode, 25 Power supply terminal, 26 Ceramic sintered body, 30 sheet heater, 30a upper surface, 30b lower surface, 32 resin sheet, 34 correction heater electrode, 34a one end, 34b other end, 35 via, 36 jumper wire, 36a one end, 36b other end, 38 outer peripheral region, 39 Notch, 40 ground electrode, 40a protrusion, 41-43 via, 44 reference heater electrode, 44a one end, 44b other end, 46 heater land, 46a jumper land, 46b ground land, 50a, 50b reference land, 60 support base, 62 refrigerant Channel, 62a inlet, 62b outlet, 64- 66 through hole, 66a, 67a electrically insulating cylinder, 67 through hole, 70 chiller, 72 electrostatic chuck power supply, 73 power supply rod, 74 correction heater power supply, 75 connecting FPC, 75a, 75b metal wiring, 76 reference heater power supply, 77 , 78 Cable terminal, 79 RF power supply, 81 First bonding sheet, 82 Second bonding sheet, 100 Metal wiring bonding structure, 110 Flexible substrate, 112 Cover lay film, 114 Contact pattern, 120 Print substrate, 124 Contact pattern, 461 Basic Surface, 462 extended surface, 750 metal wiring, 751 support layer, 752 coating layer, 753 contact, 753b virtual extension, 754 contact facing land, 755 through hole, 755a metal layer, 756 solder joint member, 761, 762 copper foil, 765 Through hole, 76 Solder joint members, 780 spot heater, C bonding space, Al to A4 first electrode region to the fourth electrode region, Z1-Z4 zone.

Claims (12)

A plurality of first metal wirings are provided between the first support layer made of resin and the first coating layer made of resin, and a first contact forming an end of each first metal wiring is exposed from the first coating layer. A first member,
A second member having a plurality of second contacts on the surface of the resin-made second support layer, wherein the second contact is disposed opposite to each of the plurality of first contacts;
A joining member that brazes the first contact and the second contact;
A metal wiring junction structure comprising:
The first member is opposed to the first contact made of metal at a position facing each of the plurality of first contacts on the surface of the first support layer opposite to the surface on which the first metal wiring is provided. And a first through hole penetrating the first contact-facing land, the first support layer, and the first contact.
The joining member covers the surface of the first contact-facing land and is filled in a joining space between the first through hole and between the first contact and the second contact.
Metal wiring joint structure. The first through hole has a circular cross section, an elliptical shape, or a rounded rectangular shape,
The metal wiring junction structure according to claim 1. The inner wall of the first through hole is covered with a metal film,
The metal wiring junction structure according to claim 1 or 2. Two or more first through holes are provided for one first contact,
The metal wiring junction structure according to any one of claims 1 to 3. In addition to the basic surface facing the first contact, the second contact has an extension surface facing a virtual extension that virtually extends the first contact forward.
The joining member covers the surface of the first contact-facing land, the front end surface of the first member, and the extended surface of the second contact, and is filled in the inside of the first through hole and the joining space. Yes,
The metal wiring junction structure according to any one of claims 1 to 4. The first member is a flexible printed circuit board.
The metal wiring junction structure according to any one of claims 1 to 5. The second member is a sheet heater that serves as a heater, and is disposed between the electrostatic chuck and a metal support.
The first member is inserted into the through hole of the support base and joined to the second member.
The metal wiring junction structure according to any one of claims 1 to 6. (A) A plurality of first metal wirings are provided between the first support layer made of resin and the first coating layer made of resin, and the first contact forming the end of each first metal wiring is the first coating. A first contact-facing land made of metal at a position opposed to each of the plurality of first contacts on the surface of the first support layer opposite to the surface on which the first metal wiring is provided. And a first member having a first through hole penetrating the first contact-facing land, the first support layer, and the first contact;
A second member having a plurality of second contacts on the surface of the second support layer made of resin;
A process to prepare;
(B) With the first contact and the second contact facing each other, a brazing material is applied to the first contact-facing land and heated to melt, and the melted brazing material is converted into the first contact. Supply from the opposing land to the joining space between the first contact and the second contact through the first through hole, and temporarily fix the first contact and the second contact with a spare brazing material in advance. If so, a step of melting the preliminary brazing material by heat transfer;
(C) solidifying the whole brazing material;
A method of manufacturing a metal wiring junction structure including The first through hole has a circular cross section, an elliptical shape, or a rounded rectangular shape,
The manufacturing method of the metal wiring joining structure of Claim 8. The inner wall of the first through hole is covered with a metal film,
The manufacturing method of the metal wiring joining structure of Claim 8 or 9. Two or more first through holes are provided for one first contact,
The manufacturing method of the metal wiring junction structure of any one of Claims 8-10. In addition to the basic surface facing the first contact, the second contact has an extension surface facing a virtual extension that virtually extends the first contact forward.
In the step (b), the molten brazing material is further allowed to reach the gap from the first contact-facing land through the tip surface of the first member and the extended surface of the second contact.
The manufacturing method of the metal wiring joining structure of any one of Claims 8-11.