JPS5980927A - Epitaxial growth device - Google Patents

Epitaxial growth device

Info

Publication number
JPS5980927A
JPS5980927A JP19171682A JP19171682A JPS5980927A JP S5980927 A JPS5980927 A JP S5980927A JP 19171682 A JP19171682 A JP 19171682A JP 19171682 A JP19171682 A JP 19171682A JP S5980927 A JPS5980927 A JP S5980927A
Authority
JP
Japan
Prior art keywords
chamber
gas
heating furnace
chambers
epitaxial growth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19171682A
Other languages
Japanese (ja)
Inventor
Mikio Mori
毛利 幹生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP19171682A priority Critical patent/JPS5980927A/en
Publication of JPS5980927A publication Critical patent/JPS5980927A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD

Abstract

PURPOSE:To execute a gas piping and the changeover of a gas easily and accurately by circularly fixing and arranging a plurality of small-sized chambers each encasing one wafer, partially covering the chambers with an arcuate heating furnace covering a plurality of the chambers, making the heating furnace travel on a circular and heating the chambers in succession. CONSTITUTION:Chamber groups (a), (a)... are supplied with the gas in response to the uniform motion of the heating furnace 12. A wafer exchanger 13 loads and unloads a series of wafers in opposition to the chamber a4 until the chamber a1 enters into the heating furnace 12 again after it leaves from the furnace. When the chamber a1 enters into the heating furnace 12, a temperature rise is started, the chamber is elevated up to a fixed temperature required after a fixed time passes, and a vapor etching gas is fed to clean the surface of the wafers 1 by the gas. The supply of said gas is changed over to that of a reactive gas and epitaxial growth operation is started, the chamber a1 advances close by the outlet of the heating furnace 12 when said operation is completed, H2 gas and N2 gas are fed from the outlet and the temperature of the chamber drops, and the chamber is discharged from the heating furnace 12.

Description

【発明の詳細な説明】 技術分野 この発明は半導体クエーハのエピタキシャル成長装置で
、詳しくは複数の半導体クエーノ・の/り/°りを独立
したエピタキシャル成長用室であるチャンバに入れて独
立してエピタキシャル成長させる枚葉型連続エピタキシ
ャル成長装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an epitaxial growth apparatus for semiconductor quadrature. More specifically, the present invention relates to an epitaxial growth apparatus for semiconductor quadrature. This invention relates to a leaf type continuous epitaxial growth device.

背景技術 半導体クエーハ(以下単にクエーハと称す)の表面にシ
リコン単結晶のエピタキシャル成長層を形成する装置の
現在夾用化されているほとんどtir=数のクエーハを
同室に収納して行うバッチ処理タイプのものである。こ
れの代表的な二側を第7図と第2図で説明すると、第1
図の横型エピタキシャル成長装置は複数のクエーハ(1
)+11・・・を7枚の矩形の平板状サセプタ(2)上
に載置してこれをサセプタホルダー(3)で傾斜させた
状態で水平方向に延びる炉心管(4)内に入れ、適当な
加熱手段でクエーハ(13111・・・を加熱して炉心
管(4)内に一端部から他端部へとエピタキシャル成長
に必要な5in4、S i O/ 2 + H2等のガ
ス(5)を流す構造のもので、ガス(5)は炉心管(4
)内で熱分解或は還元反応して複数のクエーハ+111
11・・・上にエピタキシャル成長層を形成していく。
BACKGROUND TECHNOLOGY A currently used batch processing type apparatus for forming an epitaxial growth layer of silicon single crystal on the surface of a semiconductor quafer (hereinafter simply referred to as a "quafer") is performed by storing almost a tire number of quafers in the same room. It is. The two representative sides of this are explained in Figure 7 and Figure 2.
The horizontal epitaxial growth apparatus shown in the figure has a plurality of quafers (1
)+11... were placed on seven rectangular flat susceptors (2), and placed in a horizontally extending reactor core tube (4) with the susceptor holder (3) tilted, and Heat the quafer (13111...) with suitable heating means and flow the gas (5) such as 5in4, S i O / 2 + H2, etc. necessary for epitaxial growth from one end to the other end in the furnace tube (4). The gas (5) is in the reactor core tube (4).
) to undergo thermal decomposition or reduction reaction to produce multiple Quaha+111
11... An epitaxial growth layer is formed on top.

第2図の縦型エピタキシャル成長装置は円形リング状の
水平なサセプタ(6)上に複数のクエーハm tl)・
・・を載置し、サセプタ(6)をドーム状のベルジャ(
7)内に封入して回転させなからクエーハfil il
+・・・を加熱すると共に、サセプタ(6)の中央開口
部(6)より所望のガス(5)を噴き出させて複数のク
エーハill f1+・・・上にエピタキシャル成長層
を形成する装置である。第2図の装置はエピタキシャル
成長動作中クエーハ+1+ fl+・・・が回動するの
で、第1図の装置に比べより均一なエピタキシャル成長
層の形成が可能である。
The vertical epitaxial growth apparatus shown in FIG.
..., and place the susceptor (6) on the dome-shaped bell jar (
7) Do not enclose it inside and rotate it.
+... is a device that forms an epitaxial growth layer on a plurality of quail f1+... by spouting a desired gas (5) from the central opening (6) of a susceptor (6). . Since the apparatus shown in FIG. 2 rotates the quafers +1+fl+ during the epitaxial growth operation, it is possible to form a more uniform epitaxial growth layer than in the apparatus shown in FIG.

上記各装置は複数のクエーハを同室内で同時にエピタキ
シャル成長させるので処理能力にしれるが、パッチ処理
のためどうしても品質に若干のバラツキが生じる。また
最近の傾向としてクエーハ/枚からより多くの半導体ペ
レットを得るためクエーハが大径化している。例えば従
来のクエーハ直径は一〜ダインチ程度であったが最近は
5インチを越えるものが必要に応じ出現している。クエ
ーハ大径化により上記各装置はサセプタ(21,(61
上に載るクエーハの枚数が減少して処理能力が低下する
傾向にあり、これの対策としてサセプタ(2+、+61
を大きくしてクエーハ塔載枚数の低減防止を図ることが
考えられるが、これでは品質のバラツキが増々大きくな
って好ましくない。
Each of the above-mentioned devices epitaxially grows a plurality of quafers simultaneously in the same room, which increases throughput, but due to patch processing, some variation in quality inevitably occurs. Furthermore, as a recent trend, the diameter of the quafer is increasing in order to obtain more semiconductor pellets from each quafer. For example, conventional quafer diameters were about 1 to 2 inches, but recently, quafers with diameters exceeding 5 inches have appeared as needed. Due to the enlargement of the Quafer diameter, each of the above devices has a susceptor (21, (61
There is a tendency for the processing capacity to decrease as the number of quafers placed on top decreases, and as a countermeasure to this, susceptors (2+, +61
It is conceivable to increase the number of Quafers to prevent a reduction in the number of Quafers loaded on the tower, but this is not preferable because it increases the variation in quality.

またクエーハ大径化に対する善処策としてクエーハ/枚
/枚を独立したエピタキシャル成長用案であるチャンバ
に入れて単独にエピタキシャル成長させる枚葉型のもの
や、ウェーハをベルトコンベアに乗せて昇温室、ペーパ
エツチング¥、エピタキシャル成長室、降温室などの各
室に順次に透り込むコンベア方式連続処理型のものなど
が考えられているが、コンベア方式のものはガス洩れ防
止対策など困難な問題が多くて未だ実験の段階であ)、
また枚葉型のものには次のものが考えられる。ff1J
も、加熱平膜以外のエピタキシャル成長、に必要な手段
(ガス封入排気平膜、クエーへ支持手段など)を持つチ
ャンバをレール上に複数個配備し、/り/りのチャンバ
にクエーハを7枚ずり入れてから各チャンバをレールの
長尺な一部を跨ぐ範囲に固定された加熱炉内に順次に送
り込み、加熱炉内走行中に昇温、ベーパエツチング、エ
ピタキシャル成長、降温等を順次に行い、加熱炉から出
たチャンバに刻してはクエーハのアンロードおヨヒ再ロ
ードを行って再度加熱炉へと送り出す装置である。この
ような枚葉型はクエーハ大径化に十分対応でき、また品
質が均一化する利点を有するが、上述&成においてはチ
ャンバが移動するためチャンバに必要なガスを送り且つ
排気するガス系の配管や各種ガスの切換えなどがi#、
 しくてかなり複雑化して実用的でない。
In addition, as a good measure for increasing the diameter of the wafers, there are single-wafer types in which the wafers are placed in an independent epitaxial growth chamber for epitaxial growth, and wafers are placed on a belt conveyor in heating chambers and paper etching. Conveyor-type continuous processing systems have been considered, in which the gas passes through each chamber in sequence, such as an epitaxial growth chamber or a cooling chamber, but conveyor-type systems have many difficult problems, such as measures to prevent gas leakage, and have not yet been tested. stage),
In addition, the following types can be considered as single-leaf types. ff1J
In addition, multiple chambers with the means necessary for epitaxial growth other than heated flat films (gas filled and exhausted flat films, support means for quays, etc.) are installed on the rail, and seven quays are placed in each chamber. Then, each chamber is sequentially sent into a heating furnace that is fixed in an area that straddles a long part of the rail, and while it is running in the heating furnace, heating, vapor etching, epitaxial growth, temperature cooling, etc. are performed sequentially, and the heating is performed. This is a device that unloads and reloads the quake after it is carved into the chamber that exits the furnace, and then sends it out to the heating furnace again. This type of single-wafer type is able to cope with larger quaternary diameters, and has the advantage of uniform quality. However, in the above-mentioned process, the chamber moves, so the gas system that sends the necessary gas to the chamber and exhausts it is required. Piping, various gas switching, etc.
It is complicated and impractical.

発明の開示 本発明は上記枚葉型の改良で、チャンバを固定し、加熱
炉を可動式にしてズ用性を藁めた枚葉型連続タイプのエ
ピタキシャル成長装置′f:提供する。
DISCLOSURE OF THE INVENTION The present invention provides a single-wafer continuous type epitaxial growth apparatus 'f' which is an improvement on the single-wafer type described above and has a fixed chamber and a movable heating furnace, thereby reducing the usability.

本発明の特徴は7枚のクエーハを収納する小型チャンバ
を複数個円状に固定配置したチャンバ群に連続した複数
のチャンバを覆う円孤形加熱炉を部分的に被せ、当該加
熱炉をチャンバ群に沿う円軌道上を走行させてチャンバ
群の各チャンバを連続して順次に加熱すること、及び上
記加熱炉から出たーgISのチャンバに対してクエーノ
・交換に必要な一連の作業を行うことである。このよう
にすることにより、チャンバのガス配管やガス切換えが
容易且つ正確にでき、また枚葉型の利点であるクエーハ
大径化に対する対応の容易性、品質の均一化が十分に発
揮できる発明を実施するための最良の形蒋 第3図及び第ダ図の実施例において、(IOjは環状の
固定されたチャンバ群、0匂は円弧形の可動式加熱炉で
ある。チャンバ群(101は7枚のクエーハ1l)t”
収納してエピタキシャル成長させる小型チャンバ(I4
)を複数個(N個)円状に連続して固定配列したもので
、これの中心部に自動クエーハ交換機0尋が配備される
。加熱炉02はチャンバ群(10)のN個より少ない例
えば(N−J’)個の連続したチャンバ(a) (&)
・・・を覆う断面略コ字状のもので、チャンバ群(lO
)に沿って円軌道を連続的に走行して内部のチャンバ(
a) (a)・・・を順次に必要な温度まで加熱昇温さ
せそして降温させる。
The feature of the present invention is that a chamber group in which a plurality of small chambers for storing seven Quafers are fixedly arranged in a circular shape is partially covered with an arc-shaped heating furnace that covers a plurality of continuous chambers, and the heating furnace is connected to the chamber group. to run on a circular trajectory along a circular trajectory to successively heat each chamber of the chamber group, and to perform a series of operations necessary for quaeno exchange on the chambers of the gIS that have come out of the heating furnace. It is. By doing this, the gas piping and gas switching of the chamber can be done easily and accurately, and the advantage of the single wafer type is that it is easy to cope with the increase in the diameter of the Quafer and the quality is uniform. BEST MODE FOR CARRYING OUT THE INVENTION In the embodiment shown in FIGS. 7 pieces of quaha 1l)t”
A small chamber (I4) for storing and epitaxial growth
) are fixedly arranged in a continuous circular manner, and an automatic Quafer exchanger 0 fathom is installed in the center of this. The heating furnace 02 has less than N of the chamber group (10), for example, (N-J') consecutive chambers (a) (&).
It is approximately U-shaped in cross section and covers the chamber group (lO
) along a circular track to reach the inner chamber (
a) (a)... is heated one after another to the required temperature and then cooled down.

クエーハ交換機(13)は加熱炉θ匂と同期して回転し
て加熱炉(喝から出たチャンバ(a)に対して必要なり
エーハのロードおよびアンロード作業を自動的に行うロ
ボットである。
The quaternary exchanger (13) is a robot that rotates in synchronization with the temperature of the heating furnace θ and automatically loads and unloads necessary wafers into the chamber (a) that has come out of the heating furnace (chamber (a)).

N個のチャンバ(IL) (a)・・・は個々が独立し
た同一構造のもので、その7個の具体例を第5図に示す
と(財)は固定ボックス、θ5)及び08)は固定ボッ
クスHt 貫通して上方に突出しだサセプタホルタ及び
ガス供給管、(+7)はサセプタホルダ05)トガス供
給管Ql19を囲続して必要な作業空間を作るドーム状
の透明な石英製ベルジャで、固定ボックス圓上にシール
リングQ8)を介して着脱可能に搭載される。(+9)
はサセプタホルダ(+5)で支持される円板状のサセプ
タで、この上に7枚のクエーハ(11が載る。翰はガス
排気管でベルジャ+171内に供給されたガスを排気す
る。(21)はモータでサセプタホルダ05)を適宜回
転させる。各チャンバ(&) (&)、・・・には例え
ば第に図に示す配管でクエーノ・交換やエピタキシャル
成長に必要なN2やN2ガス、ペーパエツチングガス(
H2+HO/など)、反応ガス(エピタキシャル成長に
必要なガス)が供給される。
N chambers (IL) (a)... are each independent and have the same structure, and seven specific examples are shown in Figure 5. (I) is a fixed box, and θ5) and 08) are Fixed box Ht The susceptor holder and gas supply pipe that penetrate and protrude upwards (+7) are fixed with a dome-shaped transparent quartz bell jar that surrounds the susceptor holder 05) and the gas supply pipe Ql19 to create the necessary work space. It is removably mounted on the box circle via a seal ring Q8). (+9)
is a disk-shaped susceptor supported by a susceptor holder (+5), and seven quakers (11) are placed on it. The susceptor is a gas exhaust pipe that exhausts the gas supplied to the bell jar +171. (21) The susceptor holder 05) is appropriately rotated by a motor. For example, in each chamber (&) (&), ..., N2, N2 gas, and paper etching gas (
H2+HO/etc.) and a reaction gas (gas necessary for epitaxial growth) are supplied.

加熱炉(1′4は断面コ字状の断熱材からなるフレーム
翰の内部に断面溝形の反射板瞥を固定し、反射板(財)
の内面に沿って例えば赤外線ランプ(21)を複数個所
定の配列で装着したものである。この加熱炉(121は
チャンバ群(a) (IL)・・・の各固定ボックスf
141(141・・・上に敷設した一本の同心円状レー
ル<251 (251上に7レーム翰(2蜀の下端に投
打たローラ翰(ハ)・・・を転動させることで移動可能
とされる。各ランプ(財)□□□)・・・の電力供給は
レール(25)am・からスリップリング等を介して行
えばよい。
Heating furnace (1'4 is a reflective plate with a grooved cross section is fixed inside the frame frame made of heat insulating material with a U-shaped cross section.
For example, a plurality of infrared lamps (21) are mounted in a predetermined arrangement along the inner surface of the lamp. Each fixed box f of this heating furnace (121 is a chamber group (a) (IL)...
141 (141... one concentric circular rail laid on <251 Power can be supplied to each lamp (product) □□□) from the rail (25) via a slip ring or the like.

クエーハ交換1Q3)に鉱加熱炉(12)と一体重に回
転する回転テーブル但乃上に処理前と処理済みのクエー
ハを収納保管する2つのキャリヤt28i @9)、加
熱炉(11から出た7つのチャンバ(a)のベルジャ(
17)を持ち上げて再び降ろす一連の作業をするアーム
働などの他、前述ベルジャ07)が持ち上げられた間に
サセプタ(l匈から処理後のクエーハ141を取出して
一方のキャリヤ(29)に運び、処理前の新しいクエー
ハ(11を他のキャリヤ(281から取出してサセプタ
(+9)へ運ぶ手段やこの交換手段上必要なりリーニン
グ手段、各種安全対策などが装備されている。
Quafer exchange 1Q3), a rotary table that rotates as one with the ore heating furnace (12), two carriers t28i @9) for storing and storing unprocessed and processed quafers on the ore heating furnace (12), and a 7 Belljar (a) with two chambers (a)
In addition to the arm work that carries out a series of operations such as lifting up the belljar 17) and lowering it again, while the belljar 07) is being lifted up, the processed quaternary 141 is taken out from the susceptor (1) and carried to one of the carriers (29). It is equipped with a means for taking out a new quafer (11) before processing from another carrier (281) and transporting it to the susceptor (+9), a leaning means necessary for this exchanging means, and various safety measures.

次に上記装置による動作を詳述する。チャンバ群110
3の各チャンバ(幅す・・・へのガス供給のタイミング
は加熱炉(2噂の等速の動きに合わせて行われ、いま7
つのチャンバ(a工)について第2図を参照して説明す
る。チャンバ(a□)が第2図(イ)(ロ)の如く加熱
炉021から出て再度式るまでの間にクエーハ交f!g
!a峙がチャンバ(&1)K対向シテ一連のクエーハの
ロードおよびアンローF作iを行う。この作業は例えば
クリーンエアーカーテンの始動、ベルジャクランプ、ベ
ルジャθηのロック解除とそのMU、ベルジャ持ち上け
、クエーハ有無確詔、クエーハチャック(真空チャック
等で)、クエーハ取出し収納、サセプタ(19)上の真
空及びN2ガスによるクリーニング、ボックス(+41
上のクリーニング、キャリヤシ碍からのクエーハ取出し
及びサセプタ(+9)への供給、ベルジャ(+?)の降
下及びロック、N2ガス充填及びリークチェック、エア
ーカーテン停止などである。チャンバ(&、)が第2図
(ハ)の如く加熱炉0渇に入ると昇温か開始され、一定
時同経過後必要な定温まで上昇する第2図に)の時点で
ベーパエツチングガスが供給されてクエーハ11)の表
面がガスクリーニングされる。そして第2図(ホ)の時
点から反応ガスの供給に切り換えられてエピタキシャル
成長動作が11始され、これが完了する頃になると第2
図(へ)の如くベルジャ(a工)は加熱炉(I匂の出口
近くにきて、ここからは132ガス、N2ガスが供給さ
れて降温状部に入り、十分降温したところで加熱炉(l
々から出る。以下上記動作が繰り返し連おCして行われ
る。
Next, the operation of the above device will be described in detail. Chamber group 110
The timing of gas supply to each chamber (width...
The two chambers (a) will be explained with reference to FIG. During the time when the chamber (a□) leaves the heating furnace 021 and is reheated as shown in FIGS. g
! A facing chamber (&1) K performs a series of loading and unloading F operations. This work includes, for example, starting the clean air curtain, unlocking the belljar clamp, belljar θη and its MU, lifting the belljar, confirming the presence or absence of the quaker, chucking the quaver (using a vacuum chuck, etc.), taking out and storing the quake, and susceptor (19). ) cleaning with vacuum and N2 gas on the box (+41
Cleaning of the top, taking out the quafer from the carrier and supplying it to the susceptor (+9), lowering and locking the bell jar (+?), filling with N2 gas and checking for leaks, stopping the air curtain, etc. When the chamber (&) enters the heating furnace zero as shown in Figure 2 (c), the temperature starts to rise, and after a certain period of time the temperature rises to the required constant temperature (see Figure 2), vapor etching gas is supplied. Then, the surface of the Quafer 11) is gas-cleaned. Then, from the point in time (e) in Figure 2, the supply of reaction gas is switched to the epitaxial growth operation, which starts from the 11th stage, and when this is completed, the 2nd stage
As shown in the figure, the bell jar (A) comes near the outlet of the heating furnace (I), from which 132 gas and N2 gas are supplied and enters the cooling section, and when the temperature has cooled down sufficiently, the heating furnace (L)
come out from each other. Thereafter, the above operations are repeated in succession.

尚、本発明は上記実施例に限定されるものではなく、例
えば加熱炉Hの加熱方式は高周波誘導加熱方式なども可
能であるが、昇降温が速くて装備がfln単、安価な上
述ランプ方式が望ましい0 以上のように、本発明によればクエーハ大径化に容易に
対応でき、また加熱炉移動方式の採用によりベルジャ群
のガス供給及び交換手段である配管が簡単で且つガスリ
ークの問題もなくなり、信頼性の高い実用的な枚葉型連
続エピタキシャル成長装置が提供できる。
Note that the present invention is not limited to the above-mentioned embodiments. For example, the heating method of the heating furnace H can be a high-frequency induction heating method, but the above-mentioned lamp method is preferable because the temperature rises and falls quickly, the equipment is simple, and it is inexpensive. As described above, according to the present invention, it is possible to easily cope with increasing the diameter of the quaker, and by adopting the heating furnace moving method, the piping that is the gas supply and exchange means for the bell jar group is simple, and the problem of gas leakage can be avoided. Therefore, a highly reliable and practical single-wafer type continuous epitaxial growth apparatus can be provided.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は従来のエピタキシャル成長装置の二
側を示す概略図、第3図及び第7図は本発明の実施例を
示す平面図及び正面図、第5図は第3図のX−X線拡大
断面図、第g図は第3図の装置のガス配管の一例を示す
配管図、第2図は第3図の装置の動作を説明するだめの
各動作時の平面略図である。 +11 e・半導体クエーハ、1lojJ・・チャンバ
群、(a)・・チャンバ、02)・・加熱炉、Q濁・・
クエーハ交換機。 第1図 ぢ12図
1 and 2 are schematic views showing two sides of a conventional epitaxial growth apparatus, FIGS. 3 and 7 are plan views and front views showing an embodiment of the present invention, and FIG. - An enlarged X-ray sectional view, Figure g is a piping diagram showing an example of gas piping of the apparatus in Figure 3, and Figure 2 is a schematic plan view of each operation to explain the operation of the apparatus in Figure 3. . +11 e・Semiconductor Quafer, 1lojJ・Chamber group, (a)・Chamber, 02)・Heating furnace, Q turbidity・・
Quaha exchange machine. Figure 1-12

Claims (1)

【特許請求の範囲】[Claims] +1)各々が7枚の半導体クエーハを収納して加熱手段
以外のエピタキシャル成長に必要な手段を備えた小型チ
ャンバを複数個円状に固定配列してなる環状チャンバ群
と、チャンバ群の複数個連続したチャンバを覆う円弧形
を有し、内部のチャンバを加熱しながらチャンバ群に沿
って円軌動を動く可動式加熱炉と、加熱炉と同期運転し
て加熱炉から出たチャンバに対して半導体クエーハのロ
ードおよびアンロード作業を行うクエーハ交換機とを具
備したことを特徴とするエピタキシャル成長装置。
+1) An annular chamber group consisting of a plurality of small chambers, each of which houses seven semiconductor wafers and is equipped with means necessary for epitaxial growth other than a heating means, fixedly arranged in a circular shape, and a plurality of consecutive chamber groups. A movable heating furnace that has an arc shape that covers a chamber and moves in a circular orbit along a group of chambers while heating the internal chambers, and a semiconductor that operates synchronously with the heating furnace and is connected to the chamber that exits the heating furnace. An epitaxial growth apparatus comprising a quafer exchanger for loading and unloading a quafer.
JP19171682A 1982-10-29 1982-10-29 Epitaxial growth device Pending JPS5980927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19171682A JPS5980927A (en) 1982-10-29 1982-10-29 Epitaxial growth device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19171682A JPS5980927A (en) 1982-10-29 1982-10-29 Epitaxial growth device

Publications (1)

Publication Number Publication Date
JPS5980927A true JPS5980927A (en) 1984-05-10

Family

ID=16279286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19171682A Pending JPS5980927A (en) 1982-10-29 1982-10-29 Epitaxial growth device

Country Status (1)

Country Link
JP (1) JPS5980927A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163320A (en) * 1986-01-14 1987-07-20 Canon Inc Forming device for deposit film
JPH0234789A (en) * 1988-07-21 1990-02-05 Hitachi Electron Eng Co Ltd Vapor-phase reactor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163320A (en) * 1986-01-14 1987-07-20 Canon Inc Forming device for deposit film
JPH0234789A (en) * 1988-07-21 1990-02-05 Hitachi Electron Eng Co Ltd Vapor-phase reactor

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