JPS5978769A - 自動半田付装置 - Google Patents
自動半田付装置Info
- Publication number
- JPS5978769A JPS5978769A JP18848782A JP18848782A JPS5978769A JP S5978769 A JPS5978769 A JP S5978769A JP 18848782 A JP18848782 A JP 18848782A JP 18848782 A JP18848782 A JP 18848782A JP S5978769 A JPS5978769 A JP S5978769A
- Authority
- JP
- Japan
- Prior art keywords
- rail
- carrier
- pair
- parallel
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 2
- 241001340534 Eido Species 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18848782A JPS5978769A (ja) | 1982-10-27 | 1982-10-27 | 自動半田付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18848782A JPS5978769A (ja) | 1982-10-27 | 1982-10-27 | 自動半田付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5978769A true JPS5978769A (ja) | 1984-05-07 |
JPS6121743B2 JPS6121743B2 (enrdf_load_stackoverflow) | 1986-05-28 |
Family
ID=16224586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18848782A Granted JPS5978769A (ja) | 1982-10-27 | 1982-10-27 | 自動半田付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5978769A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103752982A (zh) * | 2013-12-17 | 2014-04-30 | 合肥邦立电子股份有限公司 | 锡焊炉自动送料台 |
-
1982
- 1982-10-27 JP JP18848782A patent/JPS5978769A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103752982A (zh) * | 2013-12-17 | 2014-04-30 | 合肥邦立电子股份有限公司 | 锡焊炉自动送料台 |
CN103752982B (zh) * | 2013-12-17 | 2015-12-16 | 合肥邦立电子股份有限公司 | 锡焊炉自动送料台 |
Also Published As
Publication number | Publication date |
---|---|
JPS6121743B2 (enrdf_load_stackoverflow) | 1986-05-28 |
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