JPS5978769A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To provide a semi-automatic soldering device which lifts and transfers the two shafts suspending a substrate by means of a chain and guide rail in a supply section and passes the substrate through a required treatment section in dip type soldering wherein a carrier moves back and forth. CONSTITUTION:A substrate 2 is held by a shaft 7 having a roll 9 and a pawl 3 suspended from a bar 6 attached to a chain 17. The shaft 7 and the bar 6 are connected to each other by an outside frame 5. As the chain 17 on a guide moves, the bar 6 is moved and the shaft 7 is moved by the roll 9 on a rail 16. The substrate 2 is cleaned in a fluxer part 7, dried by a preheater 12, and cooled by a cooling fan 13. The bar 6 and the shaft 7 are lowered by the guide of the sprockets 39, 45 provided to the chain 17 and the guide of rails 27, 28 in a dip type solder tank 14, so that the substrate is submerged in the solder. The soldered substrate 2 is returned to the original supply section A by the chain 17 and the rail 16. The semi-automatic soldering is accomplished with the device of a short length.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic soldering device, and more specifically, the present invention relates to an automatic soldering device, and more particularly, a soldering device in which devices such as a fluxer, a pre-heater, a cooling fan, and a soldering bath are sequentially arranged linearly in parallel in the running direction of a carrier. This relates to an automatic soldering device in which a carrier reciprocates linearly along a line.

Most conventional automatic soldering devices of this type are of the round type. This round type soldering device is disadvantageous because it is large-scale and requires a large installation area. Furthermore, even in the case of a straight-line type device, the present invention aims to eliminate these problems and provide an automatic soldering device that is compact and can be mass-produced.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be explained below based on the drawings.

1 is a carrier, and this carrier 1 includes a pair of frames 4.4, an outer frame 5.5 provided outside adjacent to this frame 4.4, and a pair of frames 4.
．． 4 and a rod 6 for mounting the outer frame 5.5 in parallel;
It consists of a shaft 7.

The frame 4.4 is provided at one end with a claw 3 having a holding portion 3a at the lower end for holding the substrate 2 horizontally.

Furthermore, the outer frame 5.5 is provided with four portions 8 at its distal end for hooking onto a guide bale, which will be described later.

Further, a roller 9 is rotatably mounted on the shaft 7 and located outside the outer frame 5.5.

1O is the main body of the device, and this main body 20 includes a fluxer 1, a preheater 12, a cooling fan 13, and a dip type solder in the running direction of the carrier 1 from the supply side A of the printed circuit board (hereinafter simply referred to as the board) 2. A soldering line 15 is formed in which the devices of Wj 14 are sequentially arranged linearly in parallel.

Further, a pair of rails 16.16 are arranged on the main body 10 in close proximity to each other along this soldering line 15, and on the outside of this rail 16.16, adjacent to the rails 16, ]6,
A pair of parallel drive chains 17, 17 are arranged to form a transport line for substrates 2 in which carriers 1 linearly reciprocate along soldering line 15.

A horizontal rail 27 is attached to the rail 16.16 from the supply side of the board 2 to the upper side of the solder tank 14.
7, an inclined rail 27 is attached on top of the solder tank 14, and a lower horizontal rail 28 is attached following this similar rail 27. Also, close to this rail, limit switches 50 and 51 are provided at the end of the preheater 12 and the end of the horizontal section 41 in conjunction with the motor 20 to temporarily stop the carrier.

Moreover, when the fluxer 11 is a foaming type fluxer,
A chevron portion 28 is formed directly above the horizontal rail 27 on which the fluxer 11 is located.

The chevron portion 28 is composed of a fixed rail 30 parallel to the horizontal rail 26 disposed in the middle, and a movable rail 32 and a return rail 34 disposed on both sides of the fixed rail 30.

The fixed rail 30 is attached and fixed to the Cheno guide rail 18 with screws or rivets 31 at a height that prevents bubbles 29 from the foamed fluxer 11 from adhering to the printing surface 2a of the board 2 when the carrier 1 returns. There is.

Furthermore, the movable rail 32 is disposed on one end side of the fixed rail 30, that is, on the solder tank 14 side, and the carrier l is disposed on the solder tank 14 side.
14, the shaft 33 is implanted in the Cheno guide rail 18 so that it comes into contact with the guide rod 26 of the carrier 1 and the rollers 9, opens easily, and returns after the rollers 9 have passed.
It is movably attached to.

Further, the return rail 34 is disposed on the other end side of the fixed rail 30, that is, on the supply side A, and has an end movably attached to a shaft 35 implanted in the cheno guide rail 18.

Further, the i return 34 is a bottle shaft installed on the chain guide rail 8 side so that it is open when the carrier l moves to the solder bath 14 side and closed when the carrier l returns. A torsion coil spring 38 is interposed between the bottle shaft 37 and the return rail 34.

Next, the driving chino 17.17 is driven by the chino guide rail 1.
This drive chino 17.17
The guide rods 26 are mounted across the rails 16, 16 at regular intervals, for example the length of the carrier l.

At both ends of this driving chino 17.17, there are sprockets 19, 19 and 19, which drive this driving chino 17.17.
is provided.

One of the sprockets 19& is such that a sprocket 22 is pivotally attached to a shaft 21 of a motor 20, and a sprocket 24 is driven by a chino 23, and this sprocket 24 is driven by a chino 25 to drive a sprocket 19a.

In addition, the lower chi
(171) C, shift the length of the guide ball 26 from the roller 9 of the carrier l from the M diagonal wheel 27 and install the sprocket 38a.
The sprocket 39 forms an inclined portion 40 parallel to the inclined rail 27.

The lower chain 17b between the sprocket 39 and the sprocket 19a forms a horizontal part 41 that is not parallel to the lower horizontal rail 28, and when the roller 9 moves down the inclined rail 27, the carrier l is attached to the guide rod 26. The rod 6 follows and the substrate 2 is lowered horizontally with respect to the solder liquid level 14a, reaching the lower horizontal rail so that the printed surface 2a is horizontally attached to the solder liquid level 14a.

Further, a sprocket 42 is arranged adjacent to the sprocket 19a so that the substrate 2 does not tilt more than a certain slope.

Further, a ski 7-43 is attached to the solder tank 14 for scraping out solder gas remaining in the upper layer of molten solder in the solder tank 14.

This schema 43 is attached to a chain 44 that circulates through the solder tank 14, and this chain 44 moves through a sprocket provided coaxially with the sprocket 38a, so that the schema 43 circulates through the solder 4w14. ing.

Further, numeral 49 is a slag for receiving the solder scum scraped out by the schema 43.

Next, the operating state of the soldering device according to the present invention will be explained.

After turning on the operation panel 50, on the supply side A, the board 2
The printed side 2a of the holder is placed on the lower side and inserted into the holding part 3a between the claws 3.3.

Then, insert the recess 8.8 of the outer frame 5.5 into the guide rod 2.
6, the carrier 1 moves along the soldering line 15 while being pulled by the lower chain 17b of the drive unit 17. Note that the rollers 9 run on rails 16.

Then, when the position of fluxer 11 is reached, printing rIrJ2a
Fluxa is applied to. Next, the substrate 2 reaches the preheater 12 and is heated to a predetermined temperature. Further, the cooling fan 13 is stopped by the limit switch 50 and then moved to the Ushita tank 14.

On the solder tank 14, the guide @l 26 reaches the inclined portion 40, and at the same time the rollers 9 reach the inclined rail 27, and the substrate 2 descends parallel to the solder liquid level 14a.

At the same time as the guide rod 26 reaches the horizontal portion 4, the roller 9 reaches the lower horizontal rail 28, is temporarily stopped by the limit switch 51, and the solder liquid adheres to the printing surface 2a. This stopping time is about 3 to 4 seconds.

When the soldering to the printed surface 2a is completed (the guide bar 26 becomes a sprocket), as the gear rear 10 rotates, the concave portion 8 side of the gear rear 10 is lifted by a certain negative amount and shifts to the return position.

In the case of return, the guide rod 26 moves to the upper rail 17a, the roller 9 returns to the inclined rail 27, and moves to the horizontal rail 26.
Go back.

FIG. 11 shows the moving state of the carrier l, B shows the soldering state, 0 shows the state at the time of return, and D shows the horizontal rail 2.
This shows a state in which Flo 9 is running on 6. Then, when reaching the chevron portion 29, the roller 9 travels up the movable rail 32 and reaches the fixed rail 30. When the roller 9 passes this fixed rail 30 and rides on one end of the return rail 34, the other end of the return rail descends due to the weight of the roller 9, comes into contact with the horizontal rail 26, and the roller 9 runs. and is collected by supply side A.

When the gear rear 1 returns to the supply side A, 7f of the board 2 between the holding parts 3FL is cut out and the board 2 is recovered.

According to the present invention described above, it is an automatic soldering device in which a dip-type soldering tank is used and the carrier reciprocates in a straight line to perform soldering. The length of the device is approximately 2 m because the board is returned at an angle so that the printed surface does not stick to the solder liquid surface of the solder tank. The height of the device is low and can be manufactured compactly.

Furthermore, although the device is compact, the printed surface of the board can be automatically soldered and recovered in the same manner as conventional devices, and the device is inexpensive.

Furthermore, the schema is circulated through the solder bath by a driving chino, so that a good soldering operation can be performed at all times.

[Brief explanation of drawings]

The figures show one embodiment of the present invention, in which Fig. 1 is a plan view, Fig. 2 is an explanatory drawing, Fig. 3 is a sectional view taken along line AA in Fig. 1, and Fig. 4 is an explanation of a portion of the fluxer. Figure 5 is B- of Figure 1.
B sectional view, Figure 6 is an enlarged plan view of the chevron, Figure 7 is the 6th
8 is a plan view of the solder tank portion, FIG. 9 is an explanatory diagram of the solder tank portion, FIG. 1O is an explanatory diagram showing the moving state of the carrier in the solder tank portion, and Figure 1 a
-O sectional view. Zuo 4 Nasu Bume 5 Eido 2Δ Procedural Amendment (No. 11R4, 1981, Mr. Kazuo Wakasugi, Commissioner of the Patent Office, Display of the case, Showa t7, 1983, 1983, 1983, 1983, 11R4, 1981, Kazuo Wakasugi), 4. Agent 〒166 6. Number of inventions increased by amendment −

Claims (1)

[Claims] A pair of parallel frames provided with claws of a predetermined height to hold the board horizontally, and a pair of outer frames parallel to the frame whose tips are hooked to the guide rod of the chino near the outside of the frame are connected to the rod. The fluxer, preheater, cooling fan, and dip-type solder bath are sequentially installed in a straight line in the running direction of the carrier, which is fixed by a shaft and has a pair of rollers at the end of the shaft outside the outer frame. A pair of parallel rails are placed on both sides of the soldering line at a distance between the rollers of the carrier, and a pair of parallel rails are placed along the soldering line arranged in parallel with each other. A pair of driving chains that move the carrier back and forth are arranged in parallel, and a chevron is provided on the rail where the fluxer is placed to prevent bubbles from adhering when the carrier returns, and a slope for the carrier to enter is provided at the solder tank position. A lower horizontal rail is provided following this inclined rail, and the printed surface of the board is attached horizontally to the solder liquid level. An automatic soldering device that travels back on a lower horizontal rail, an inclined rail, and a horizontal rail, the board returns to the supply side at a constant angle, and a schema circulates through a solder tank by driving a drive chino.