JPS6331820Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of the invention] The present invention relates to an automatic soldering device used, for example, when soldering a hoop material that becomes a lead frame fitted to an IC board of a hybrid IC. It is something.

[Technical background of the invention and its problems]

Recently, a semi-finished product has appeared in which, for example, a long hoop material formed by continuously molding a large number of lead frames is fitted onto a substrate-like main body of a large number of hybrid ICs arranged in a series. This kind of hoop material needs to be soldered to the substrate-like body, and it is also necessary to provide an oxidation-preventing film over the entire hoop material.
It is necessary to solder the entire hoop material,
In such a case, the question becomes how to hold the substrate-like body and how to release the holding using what kind of holder.

[Purpose of invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide an automatic soldering device that is capable of holding and removing an object to be soldered having a hoop material.

[Structure of the idea]

(Means for Solving the Problems) The present invention provides a vertical turning section 1 between the upper return line 11 and the lower soldering line 12.
A soldering object conveyor 5 is provided in an endless manner, and the soldering object 1 is reversed through the soldering objects 1 through the soldering objects 3 and 14.
In the automatic soldering apparatus, a flux tank 6 and a solder tank 8 are provided along the conveyor 5, and clamp holders 26 for holding objects to be soldered are provided at predetermined pitches on the conveyor 5. This clamp holder 26 has a vertical part of an L-shaped cross section as a clamping part, can be opened and closed via a hinge 44, and has a horizontal part 45.
a pair of clamp plates 45 integrally provided with a pressed portion 50; and a spring 5 that applies a biasing force in the closing direction to the pair of clamp plates 45.
Consists of 1. Further, a clamp opening/closing operation unit for attaching a soldering object is provided on the return line 11 above the conveyor 5 to open the clamp plates 45 upward by pushing down the pressed portions 50 of the pair of clamp plates 45. 55 is provided at the terminal end of the soldering line 12 on the lower side of the transport conveyor 5, and a cover is provided which opens the clamp plates 45 downward by pushing up the pressed portions 50 of the pair of clamp plates 45. A clamp opening/closing operation section 56 for removing soldered objects is provided.

(Function) In the present invention, in the upper return line 11, the vertical portions of the pair of L-shaped clamp plates 45, which serve as the clamping portions, face upward, and the horizontal portions 45a are provided with the vertical portions facing upward. Since the pressed parts 50 can be moved downward around the hinge 44, by pressing down the pressed parts 50 on both sides at the same time using the soldering object attachment clamp opening/closing operation part 55,
The vertical parts of a pair of clamp plates 45 having an L-shaped cross section are opened, and the object to be soldered 1 is inserted between them.
When the pressing force of the opening/closing operation part 55 is released, the pair of clamp plates 4 are moved by the spring 51.
5 elastically closes and clamps the object 1 to be soldered. Also, in the lower soldering line 12, L
A pair of shaped clamp plates 45 have vertical parts serving as clamping parts facing downward, and pressed parts 50 provided on each horizontal part 45a.
can be moved upward around the hinge 44, so by simultaneously pushing up the pressed parts 50 on both sides by the soldering object removal clamp opening/closing operation part 56, the vertical parts of the pair of clamp plates 45 of the L-shaped cross section can be moved upwardly. , and remove the object to be soldered 1 from between them.

[Example of idea]

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.

Figure 1 shows a large number of hybrids arranged in a series.
A large number of lead frames 2 are mounted on the substrate-like body of IC1.
A semi-finished product is shown in which a long hoop material 3 formed by continuous molding is fitted. This hoop material 3 is soldered to the entire hoop material including the fitting portion to the substrate-like main body, and a solder film for preventing oxidation is formed on the entire hoop material. Finally, by separating the connecting band portion 4 of this hoop material 3 from each lead frame 2, each lead frame 2
are independent from each other, and each substrate-like body is also independent. FIG. 2 shows how the hoop material 3 is fitted.

The automatic soldering apparatus shown in FIG. 3 includes a flux tank 6 in which flux is foamed along the lower side of a conveyor 5 that conveys the hybrid IC 1 as an object to be soldered by tact movement;
A preheater 7, a solder tank 8 for storing molten solder, and a cleaning tank 9 for washing off flux remaining on the hybrid IC etc. are arranged in this order.

As shown in FIG. 4, the conveyor 5 is
It is provided in an endless manner between the upper return line 11 and the lower soldering line 12 via vertical turning parts 13 and 14. This conveyor 5 mainly consists of an endless chain, and a large diameter sprocket 15 that meshes with the endless chain is connected to a motor 1 via a transmission mechanism 16.
It is driven by rotating at 7. Numerals 18 and 19 are small diameter sprockets, and a large number of small diameter sprockets 19 form a detour corresponding to the ultrasonic cleaning tank 9a and the steam cleaning tank 9b.

As shown in FIG. 5, the conveyor 5 is
The left and right endless chains 23 are slidably fitted between the upper and lower chain guides 22 attached to the left and right L-shaped rails 21, and the mounting plate 2 is installed between the left and right chains 23.
4 is installed, and a pair of vertical motion bearings 25 are fixed to this mounting plate 24. A vertically movable rod 27 of a clamp holder 26 for holding an object to be soldered is fitted into this vertically movable bearing 25 so as to be vertically movable, and a pressed plate 28 is bridged and fixed between the vertically movable rods 27.
A compression coil spring 29 is installed between the pressed plate 28 and the vertical motion bearing 25, and elastically biases the clamp holder 26 upward at the lower soldering line 12. This clamp holder 2
6 are provided in large numbers at each predetermined pitch of the conveyor 5.

Further, above the left side of the flux tank 6, a clamp holder pressing mechanism 31 is provided which presses the clamp holder 26 located above the flux tank 6 downward to lower it. That is, the lower plate 32 and the upper plate 33 are connected to the connecting plate 34 and the guide rod 3.
5, the vertical movement bearing 37 of the push-down plate 36 is fitted to this guide rod 35 so as to be able to move vertically, and the piston rod 39 of the air cylinder 38, which has a cylinder body fixed on the upper plate 33, is pressed. A pressing screw 40 is connected to the lowering plate 36 and is provided at the tip of the pressing plate 36, facing the center of the pressed plate 28 of the clamp holder 26. A clamp holder pressing mechanism 41 having the same structure as this clamp holder pressing mechanism 31 is also provided at a corresponding position in the solder bath 8, as shown in FIG.

As shown in FIGS. 6 and 7, the clamp holder 26 fixes a hinge mounting plate 43 on the vertically movable base plate 42.
A pair of clamp plates 45 having a vertical part of an L-shaped cross section as a clamping part are provided on both sides of the plate via a hinge 44.
A side plate 47 with support rollers 46 is fixed on the left and right ends of the vertically movable base plate 42, and the screws 48 provided on this side plate 47 and the A tension coil spring 51 is disposed between the horizontal protrusion 49 fixed to the left and right ends of the horizontal portion 45a of the clamp plate 45 and the root of a pressed rod 50 as a pressed portion protruding outward from the side plate 47. By the elasticity of this spring 51,
The clamp plates 45 are energized so that the hybrid IC 1 is held between the rubber plates 52 fixed to the opposing surfaces of the left and right clamp plates 45. 6th
The strength of the left and right springs 51 shown in the figure is such that the left side is stronger than the right side, and the left side clamp plate 45, which is biased clockwise by the left side spring 51, is fixed on the hinge mounting plate 43. It is locked by a stopper 53. Note that a large number of protrusions 54 are formed on the left rubber plate 52.

Moreover, as shown in FIG.
A clamp opening/closing operation part 55 for attaching a soldering object is provided on the upper return line 11, and this operation part 55
The horizontal portion 45 of the clamp plate 45 is
As shown in FIG. 3, the clamp plate 4 is
5 so that it opens upward. Further, a clamp opening/closing operation section 56 for removing the soldering object is provided at the terminal end of the soldering line 12 on the lower side of the conveyor 5, and this operation section 56 allows the downward direction to be made as shown in the lower side of FIG. By pushing up the horizontal portion 45a of the clamp plate 45 via the pressed rod 50, the clamp plate 45 is opened downward. The operating portions 55 and 56 operate to advance and retreat a member that engages with the pressed rod 50 using an air cylinder or the like.

Next, the operation will be explained. When the tact conveyance is stopped, the pressed rod 50 of the clamp holder 26 is pushed down in the operation section 55, the pair of clamp plates 45 are opened against the spring 51, and a hybrid is created between the plates 45. After inserting the substrate-like body of IC1, this plate 45 is attached to the spring 5.
1 to sandwich the IC1 between the rubber plates 52.
At this time, the hoop material 3 of the IC 1 protruding above the clamp holder 26 is reversed by the movement in the rotating section 13 and is positioned on the flux tank 6 facing downward as shown in FIG. Here, when the tact movement is stopped, the air cylinder 38 pushes down the plate 3.
Connect the clamp holder 26 to the spring 29 through the
The hoop material 3 of IC1 held in the clamp holder 26 is pressed down against the foam flux 57.
Immerse it inside and apply flux. When the pressure by the air cylinder 38 is released, the clamp holder 26 is returned to its upward position by the spring 29. Subsequently, after heating the hoop material 3 on the preheater 7, the clamp holder 26 is pushed down by the air cylinder 38 of the clamp holder pushing down mechanism 41 in the same way as when applying the flux on the solder bath 8.
The hoop material 3 of the IC 1 is dipped into molten solder and soldered. Next, the flux adhering to the hoop material 3 etc. is washed off in the cleaning tank 9, and the next operating section 56 is cleaned.
At this point, by pushing up the pressed rod 50 of the stopped clamp holder 26 and opening the pair of downward clamp plates 45, the IC1 placed between the rubbers 52 of this plate 45 is removed from between the rubbers 52.

The object to be soldered is hybrid.
It can be applied not only to hoop materials for ICs, but also to hoop materials for light emitting diodes, transistors, etc.

[Effect of idea]

According to the present invention, the clamp holders for holding objects to be soldered are inverted between the upper return line and the lower soldering line through the vertical rotation part, and each clamp holder is provided with a spring. A pair of clamp plates each having a vertical part of an L-shaped cross section as a clamping part that holds an object to be soldered by the elasticity of the clamp plate is held by a clamp opening/closing operation part for attaching an object to be soldered installed in the return line, and the horizontal part of the clamp plate is By pressing down the pressed part provided on the soldering line, it opens upward, and also by opening/closing the clamp operating part for removing the soldered object provided on the soldering line. , a long object to be soldered having a hoop material can be reliably held using the elasticity of a spring, and the object to be soldered can be easily inserted into a clamp plate that opens upward, and a clamp that opens downward. The object to be soldered can be easily removed from the plate, and since each clamp holder does not need to be equipped with an opening/closing drive mechanism, it can be easily formed, and a large number of clamp holders can be easily installed on a conveyor. ,Therefore, the mounting, soldering,
It is possible to easily perform continuous extraction.

[Brief explanation of the drawing]

Figure 1 is a plan view of an IC made by fitting hoop materials.
2 is a sectional view thereof, FIG. 3 is a plan view showing an embodiment of the automatic soldering device of the present invention, FIG. 4 is a front view thereof, and FIG. 5 is a sectional view taken along the line - 6 is a cross-sectional view taken along the line -- in FIG. 5, and FIG. 7 is a cross-sectional view taken along the line -- in FIG. 1...Hybrid IC as a soldering object,
5... Conveyor conveyor, 6... Flux tank, 8... Solder tank, 11... Return line, 12... Soldering line, 13, 14... Circulating part, 26... Clamp holder, 44... Hinge, 45... Clamp plate, 4
5a...Horizontal part, 50...Pressed rod as a pressed part, 51...Spring, 55...Clamp opening/closing operation part for attaching a soldering object, 56...Clamp opening/closing operation part for removing a soldering object.

Claims (1)

[Scope of Claim for Utility Model Registration] An endless conveyor for conveying objects to be soldered is provided between an upper return line and a lower soldering line for reversing the objects to be soldered through a vertical rotation section, In an automatic soldering device in which a flux tank and a solder tank are installed along the soldering line on the lower side of the transport conveyor, the transport conveyor is provided at predetermined pitches, the vertical part of the L-shaped cross section is used as the clamping part, and the hinge is used as the clamping part. A clamp holder for holding an object to be soldered, consisting of a pair of clamp plates that can be opened and closed through the clamp plate, and a pressed part is integrally provided on the horizontal part, and a spring that applies a biasing force in the closing direction to the pair of clamp plates. and a clamp opening/closing operation unit for mounting an object to be soldered, which is provided on the return line above the conveyor and opens the clamp plates upward by pushing down the pressed portions of the pair of clamp plates; a clamp opening/closing operation unit for removing soldered objects, which is provided at the terminal end of the soldering line on the lower side of the conveyor and opens the clamp plates downward by pushing up the pressed parts of the pair of clamp plates; An automatic soldering device characterized by: