JPS6121743B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic soldering device, and more particularly, the present invention relates to an automatic soldering device, and more specifically, a soldering device in which a fluxer, a preheater, a cooling fan, and a soldering bath are arranged linearly in parallel in the running direction of a carrier. This invention relates to an automatic soldering device in which a carrier linearly reciprocates along a line.

Most conventional automatic soldering devices of this type are of the round type. This round type soldering device has the disadvantage that the device is large-scale and requires a large installation area. In addition, even the linear type has the disadvantage that the device is long and expensive.

The present invention aims to eliminate these drawbacks and provide an automatic soldering device that is compact and capable of mass production.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be explained below based on the drawings.

1 is a carrier, and this carrier 1 has a pair of parallel frames 4, 4, and these frames 4, 4.
Outer frames 5, 5 provided parallel to the outside of
, a rod 6 for attaching the pair of frames 4, 4 and outer frames 5, 5 in parallel to each other, and a shaft 7.

As shown in FIG. 3, claws 3 are provided at the lower ends of the frames 4, 4 to hold the substrate 2 horizontally, with a holding portion 3a provided at the lower end.

Further, as shown in FIG.
A concave portion 8 is provided for hooking the device.

Further, rollers 9 are rotatably attached to both ends of the shaft 7, and are positioned outside the outer frames 5, 5.

10 is a device main body, and this main body 10 includes:
A fluxer 11,
A soldering line 15 is formed in which devices such as a preheater 12, a cooling fan 13, and a dip-type solder tank 14 are linearly arranged in sequence.

Further, a pair of parallel rails 16, 16 are disposed on the main body 10 along the soldering line 15, and a pair of parallel rails 16, 16 adjacent to and parallel to the rails 16, 16 are arranged on the outside of the rails 16, 16. Drive chains 17, 17 are arranged to form a conveyance line in which the carrier 1 linearly reciprocates along the soldering line 15.

The rails 16 , 16 include a horizontal rail 26 from the supply side A of the board 2 to the vicinity of the solder tank 14 , an inclined rail 27 next to the horizontal rail 26 and above the solder tank 14 , and a horizontal rail 27 next to the horizontal rail 26 and above the solder tank 14 . The lower horizontal rails 28 are successively attached in order. In addition, the boundary position between the preheater 12 and the cooling fan 13 and the horizontal portion 41 are located close to the rails 16, 16.
Limit switches 50 and 51 are located at the end positions and are interlocked with the motor 20 to temporarily stop the carrier 1.
is provided.

Further, as shown in FIG. 4, when the fluxer 11 is a foaming type fluxer, this fluxer 11
A chevron-shaped portion H is formed directly above the horizontal rail 26 where the horizontal rail 26 is located.

As shown in FIGS. 4a, b, and c, this chevron portion H is connected to a fixed rail 30 parallel to the horizontal rail 26 on the horizontal rail 26, and a movable rail 32 arranged on both sides of the fixed rail 30. It is composed of a rail 34.

The fixed rail 30 is fixed to the chain guide rail 18 with screws or rivets 31 at a height that prevents bubbles 29 from the foamed fluxer 11 from adhering to the printed surface 2a of the board 2 when the carrier 1 returns. .

Furthermore, the movable rail 32 is disposed on one end side of the fixed rail 30, that is, on the side of the solder tank 14, and when the carrier 1 moves to the solder tank 14, the guide rod 1
7c and the rollers 9, it opens easily, returns after the rollers 9 have passed, and the lower end side 32 of the movable rail 32
a It is movably attached to a shaft 33 implanted in the chain guide rail 18 so as to abut on the horizontal rail 26.

Furthermore, the return rail 34 is disposed on the other end side of the fixed rail 30, that is, on the supply side A side, and is movably attached to a shaft 35 implanted in the chain guide rail 18.

Moreover, this return rail 34 is shown in FIGS. 6 and 7.
As shown in the figure, when the carrier 1 moves to the solder bath 14 side, it is opened, and when the carrier 1 stutters and runs, the contact surface 34a comes into contact with the horizontal rail 26 when the roller 9 rides on it. , the pin shaft 36 and the return rail 3 installed on the chain guide rail 18 side.
A torsion coil spring 38 is interposed between the pin shafts 37 implanted in 4.

Next, the drive chains 17, 17 are driven along a chain guide rail 18, and the drive chains 17, 17 are provided with guide rods 17c that straddle the rails 16, 16 at intervals of the length of the carrier 1, for example. Multiple pieces are installed.

Moreover, at both ends of the drive chains 17, 17,
Sprockets 19, 19a are provided to drive the drive chains 17, 17.

As shown in FIGS. 8 and 9, one sprocket 19a has a sprocket 22 which is rotatably attached to a shaft 21 of a motor 20 and drives a sprocket 24 by a chain 23.
A chain 25 drives the sprocket 19a.

Further, as shown in FIG. 10, a sprocket 38a is attached to the lower chain 17b of the drive chain 17 at a position above the solder tank 14, and is offset from the inclined rail 27 by the length of the guide rod 17c from the roller 9 of the carrier 1. and sprocket 39 to connect the inclined rail 2.
An inclined portion 40 parallel to 7 is formed.

The lower chain 17b between the sprocket 39 and the sprocket 19a forms a horizontal portion 41 parallel to the lower horizontal rail 28, and the rollers 9 are connected to the inclined rail 2.
7, the rod 6 side of the carrier 1 follows the guide rod 17c, and the board 2 descends horizontally with respect to the solder liquid level 14a, and when it reaches the lower horizontal rail 28, the printed surface 2a becomes the solder liquid level. 14a horizontally.

Further, a sprocket 4 is installed adjacent to the sprocket 19a to prevent the board 2 from tilting more than a predetermined slope.
2 is installed.

Further, as shown in FIG. 9, the solder tank 14 is equipped with a schemer 43 for scraping out solder scum remaining in the upper layer of molten solder in the solder tank 14.

This schemer 43 is attached to a chain 44 that circulates through the solder tank 14.
4 drives a sprocket 47 via a chain 46 by driving a sprocket 45 provided coaxially with the sprocket 8a;
A chain 44 is driven by a coaxial sprocket 48, so that the schemer 43 circulates in the solder bath 14.

Further, numeral 49 is a slag for receiving solder scum scraped out by the schemer 43.

Next, the operating state of the soldering device according to the present invention will be explained.

After turning on the switch on the operation panel 52, the supply side A
Then, the printed surface 2a of the board 2 is placed downward, and the board 2 is positioned and inserted into the holding part 3a between the claws 3, 3.

When the recesses 8, 8 of the outer frames 5, 5 are hooked on the guide rod 17c, the carrier 1 moves along the soldering line 15 while being pulled by the lower chain 17b of the drive chain 17. Note that the rollers 9 run on rails 16.

When the position of the fluxer 11 is reached, the printing surface 2
Fluxer is applied to a. Next, preheater 1
Upon reaching position 2, the substrate 2 is heated to a predetermined temperature. Furthermore, the cooling fan 13 is moved onto the second half of the solder tank 14, which has been temporarily stopped by the limit switch 50.

On the solder tank 14, the guide rod 17c is connected to the inclined part 40.
At the same time, the rollers 9 reach the inclined rails 27, and the substrate 2 descends in a state parallel to the solder liquid level 14a.

At the same time as the guide rod 17c reaches the horizontal portion 41, the roller 9 reaches the lower horizontal rail 28, is temporarily stopped by the limit switch 51, and the solder liquid adheres to the printing surface 2a. This stopping time is about 3 to 4 seconds.

When soldering to the printed surface 2a is completed, the guide rod 1
7c, the recess 8 is connected to the drive chain 1.
7, it goes around the outer periphery of the sprocket 19a and moves toward the upper chain 17a. At this time, the carrier 1 moves to the return position with the concave portion 8 side raised by a certain angle and with the rollers 9 positioned on the lower horizontal rail 28.

After returning, the guide rod 17c moves to the upper chain 17a, and the rollers 9 return to the inclined rail 27 and return to the horizontal rail 26.

Figure 10 shows the moving state of the carrier 1, B shows the soldered state, C shows the return state, and D
shows a state in which the rollers 9 are running on the horizontal rail 26. When reaching the chevron H, the roller 9 travels up the movable rail 32 and reaches the fixed rail 30. When the roller 9 passes this fixed rail 30 and rides on one end of the return rail 34, the other end of the return rail descends due to the weight of the roller 9, comes into contact with the horizontal rail 26, and the roller 9 runs, Collected by supply side A.

When the carrier 1 returns to the supply side A, the holding part 3a
The substrate 2 in between is pulled out and recovered.

According to the present invention described above, it is an automatic soldering device in which a step-type soldering tank is used, and the carrier reciprocates in a straight line to perform soldering. The recessed side returns along the upper rail, and the board is tilted to the extent that the printed surface does not stick to the solder liquid level in the solder bath. Therefore, the length of the device is approximately
It only needs to be as short as 2m, and the height of the device is low, making it compact.

Furthermore, although the device is compact, the printed surface of the board can be automatically soldered and recovered in the same manner as conventional devices, and the device is inexpensive.

Furthermore, the schemer is circulated through the solder bath by a drive chain, so that a good half-drawing operation can always be carried out.

[Brief explanation of the drawing]

The figures show one embodiment of the present invention, in which Fig. 1 is a plan view, Fig. 2 is an explanatory drawing, and Fig. 3 is A of Fig. 1.
-A sectional view, Figure 4a is an explanatory diagram of the fluxer part, and is an explanatory diagram when the roller runs on a movable rail when the carrier returns, and Figure 4b is an explanatory diagram when the roller runs on a fixed rail. Fig. 4c is an explanatory drawing when the roller runs on the return rail, Fig. 5 is a sectional view taken along line B-B in Fig. 1, and Fig. 6
The figure is an enlarged plan view of the chevron part, Fig. 7 is a side view of Fig. 6, Fig. 8 is a plan view of the solder tank part, Fig. 9 is an explanatory diagram of the solder tank part, and Fig. 10a is the solder tank part. FIG. 2 is an explanatory diagram showing the moving state of the carrier in
FIG. 10b is an explanatory diagram of the soldered state, FIG. 10c is an explanatory diagram of the carrier return state, and FIG. 11 is a cross-sectional view taken along line C-C in FIG. 1. It is. Explanation of symbols, A: supply side, H: chevron, 1: carrier, 2: board, 3: claw, 4: frame, 5:
Outer frame, 7: shaft, 8: recess, 9: roller, 1
0: Equipment body, 11: Fluxer, 12: Preheater, 13: Cooling fan, 14: Solder bath, 15: Soldering line, 16: Rail, 17: Drive chain,
17c: Guide rod, 19, 19a: Sprocket, 20: Motor, 22, 24: Sprocket, 23, 25: Chain, 26: Horizontal rail, 2
7: Inclined rail, 28: Lower horizontal rail, 30:
Fixed rail, 32: Movable rail, 34: Return rail, 40: Inclined section, 41: Horizontal section.

Claims (1)

[Claims] 1. On the outside of a pair of parallel frames 4, 4, which have a plurality of claws 3 of a predetermined height at their lower ends, each having a holding part 3a for holding the board 2 horizontally, a recess 8 is provided at the tip thereof to be hooked to a guide rod 17c. A pair of outer frames 5, 5 are arranged parallel to the frames 4, 4 provided with, and the frames 4, 4 and the outer frames 5, 5 are fixed in parallel to each other with a rod 6 and a shaft 7, A pair of rails 16, 1 are provided at both ends of the shaft 7.
A carrier 1 with a pair of rollers 9, 9 provided at an interval of 6
And along a soldering line 15 in which devices such as a fluxer 1, a preheater 12, a cooling fan 13, and a dip type solder tank 14 are arranged in parallel in a linear manner in the running direction of the carrier 1, the soldering line 15 is
A pair of parallel rails 16, 16 on which the rollers 9 of the carrier 1 run are arranged on both sides of the rail 1.
A pair of drive chains 17, 17 are disposed on the outside of the rails 16, 16 in a form that straddles these rails 16, 16 and are parallel to each other, and each of which has a plurality of guide rods 17c attached thereto at length intervals in the traveling direction of the carrier 1. Chain 1
A sprocket 19 and a sprocket 19a are arranged at both ends of the sprocket 7, and a sprocket 24 is driven by a motor 20 via a chain 23, and this sprocket 24 is driven via a chain 25.
On the fluxer 11, there is a parallel fixed rail 30 on a horizontal rail 26 at a height that prevents bubbles 29 from adhering to the printing surface 2a, and on one side of this fixed rail 30, on the side of the solder tank 14, a carrier 1 is placed to solder the solder. When moving to the tank 14 side, it contacts the guide rod 17c and the rollers 9 and opens, allowing the guide rod 17c and the rollers 9 to pass through, and when the carrier 1 returns, it is movable so as to serve as a passing rail for the rollers 9. The movable rail 32, which is freely pivoted, and the supply side A, which is the other side of the fixed rail 30, are open when the carrier 1 travels toward the solder tank 14, and when the carrier 1 travels back, the rollers 9 are opened. A return rail 34 whose contact surface 34a comes into contact with the horizontal rail 26 when the solder tank 14 is mounted is provided with a chevron H on which a return rail 34 is disposed.
A lower horizontal rail 28 is provided next to the inclined rail 27, and an inclined portion 40 is formed in parallel to the inclined rail 27 on the lower chain 17b of the drive chain 17 by a sprocket 38a and a sprocket 39. In addition, a horizontal portion 41 parallel to the lower horizontal rail 28 is formed between the sprocket 39 and the sprocket 19a, and after soldering, the concave portion 8 at the tip is aligned with the guide rod 17c with the roller 9 positioned on the lower horizontal rail 28. While being hooked, the roller 9 rotates around the outer circumference of the sprocket 19a, moves toward the upper chain 17a, and returns, and the roller 9 reversely travels back to the lower horizontal rail 28, the inclined rail 27, and the horizontal rail 16 in this order, and the board is An automatic soldering device that returns to the supply side tilted at a certain angle.