JPS59764Y2 - Power transistor mounting device - Google Patents

Description

[Detailed description of the invention] Control devices for output stages, etc. in OTL circuits (Output Transformer Less circuits) of B-class amplifiers for Sdereo in the audio equipment industry, igniter circuits, etc. in the automobile industry, and DC stabilized power supply circuits, etc. in the information industry. It is well known that power transistors are used in

The power consumption of this type of transistor is large at the collector junction (most of the voltage applied between the collector and emitter is applied to the collector junction), so the heat dissipated by dissipating the heat associated with power consumption in this part Installation of boards is essential.

To connect the collector of a power transistor in a conventional control device to an external load, as shown in FIGS. Collector 4 of 3 (
(usually drawn out to the mounting bracket of transistor 3),
Each lead wire 5 is attached with a lug terminal 6 to a connector ( the connector (accommodating the female electrical connector) 7 and connected to the external load R;
8 (accommodating a female electrical connector) was fitted into the connector 7.

Therefore, since the collector 4 of the power transistor 3 and the connector 7 are connected inside the unit case 1 using the lead wire 5, wiring work is troublesome, and these wirings are complicated inside the unit case 1, and other control elements Also, since there is a connector 7 to which the connector 8 connected to the external load R is fitted, the size of the heat sink 2 of the power transistor 3 is increased, and the size of the unit case 1 is increased. It was not possible to reduce the size.

The present invention focuses on the fact that the heat dissipation plate 2 and the connector 7 perform only independent functions and exist separately, which hinders miniaturization of the unit case 1. The indispensable heat dissipation plate 2 is configured to function as a connector into which the connector 8 connected to the external load R is fitted, and the conventional connector 7 is omitted to reduce the size of the unit case 1.

Hereinafter, embodiments of the present invention will be explained based on the drawings (in addition,
unit cases are omitted).

In FIG. 3, reference numeral 12 denotes a heat sink for mounting and fixing the power transistor 9 through an insulating plate 11. As shown in FIG. Among the partition walls, an oval-shaped notch recess 14 is formed in the inner center of the both end partition walls 13, and a U-shaped notch recess 16 is formed in the center of each of the other partition walls 15. A partition wall through-hole 17 for inserting a rod-shaped connecting terminal is bored at the bottom of the U-shaped notch recess 16 .

In order to attach the power transistor 9 to one surface of the heat sink 12 configured in this way (the surface on which the heat sink fin partition 15 is not formed), as shown in FIG. Threaded portion 19 carved on the outer periphery of the rear end
It is inserted into the through hole 17 and the collector 10 of the power transistor 9 through the insulating bushing 20 into the hole 21 for electrical connection, and is fixed by tightening with a nut 22.

Therefore, as shown in FIG.
A rod-shaped connecting terminal 18 electrically connected to the collector 10 of the power transistor 9 is installed in the interior of the connector 6 so that its tip end protrudes, and the heat sink 12 has one connector (female connector) having the rod-shaped connecting terminal 18. In order to connect the external load R to the collector 10 of the power transistor 9, the external load R is connected and the heat radiation fin partition walls 13 and 15 of the heat radiation plate 12 are connected.
The rod-shaped The connection is made by connecting the connection terminal 18 and the female electrical connector of the connector 23.

As described above, according to the present invention, the power transistor is attached to the heat sink so that the heat sink, which is essential for the power transistor, functions as one connector to which the other connector connected to the external load is mated. When fixing it, we used a rod-shaped connection terminal that is also electrically connected to the collector, so the other connector connected to the external load, which was separate from the heat sink as in the past, can be mated to one side. The connector can be omitted, and the unit case can be made smaller.

In addition, since the installation of the power transistor to the heat sink and the electrical connection to its collector are simultaneously performed using rod-shaped connection terminals, there is no need for internal wiring as in the past, and the assembly of the units that make up the control device is easy. This has the advantage of being extremely easy to work with.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of a power transistor mounting device in a conventional control device, and FIG. 2 is a rear perspective view of a heat sink. FIG. 3 is an exploded perspective view of a mounting device for a power transistor of a control device according to the present invention, and FIG. 4 is a rear perspective view of a heat sink. 9...Power transistor, 10...
Collector, 12... Heat sink, 13.15...
... Bulkhead for radiation fins, 14°16 ... Notch recess, 18 ... Rod-shaped connection terminal (female terminal),
23...External load connection connector (accommodates female electrical connector).

Claims (1)

[Scope of utility model registration request] A plurality of partition walls for heat dissipation fins formed in parallel on one side of the heat dissipation plate are provided with notched recesses into which a connector connected to an external load fits, and a power transistor is connected to the other side of the heat dissipation plate in the form of a rod-shaped connection that penetrates the heat dissipation plate. The connector is fitted into the four notches so as to be fixed by a terminal, and to be connected to the rod-shaped connecting terminal that penetrates the heat sink and protrudes from the − surface on the side where the heat sink fin partition is formed. Features a power transistor mounting device.