JPH08316671A - Electronic equipment - Google Patents

Abstract

PURPOSE: To reduce the size of an electronic equipment by installing in one and the same case a power supply module housing section to house a power supply module and a main printed board and a high-frequency circuit housing section to house a high-frequency circuit printed board. CONSTITUTION: A case 10 which has a power supply module housing section 12 and a high-frequency circuit housing section 13 is installed. A power supply module 1 is so fastened in the power supply module housing section 12 that a rear face of the module 1 may be tightly adhered to a bottom plate of the housing section 12. A main printed board 2 is housed and fastened above the power supply module 1 in the power supply module housing section 12 and terminals of the power supply module 1 are connected to the main printed board 2 through through holes. On the other hand, a high-frequency circuit printed board 30 is housed and fastened in the high-frequency circuit housing section 13. Then, a high heating element 31 is so mounted on the high-frequency circuit printed board 30 that a rear face may be tightly adhered to a bottom plate of the high-frequency circuit housing section 13. After that, a sub printed board 80 is installed on a rear face of a bottom plate 11 of the case 10 and then a feed-through capacitor 35 to be connected to a pad of a high-frequency circuit 3 and a radiating fin 40 are installed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a high frequency circuit and a power supply module for supplying power to the high frequency circuit.

Some electronic devices have a structure as shown in FIG. 5 which includes a high frequency circuit and a power supply module for supplying power to the high frequency circuit. FIG. 5 is an electronic device such as a transmission power amplifier, where 1 is a power supply module, 2 is a main printed board connected to the power supply module, and 4 is a power supply from the power supply module 1 via the main printed board 2. For example, a high-frequency circuit such as a main amplifier 3 is a high-frequency circuit such as a sub-amplifier that receives power supply from the power supply module 1 via the main printed board 2.

Reference numeral 6 is a third high-frequency circuit including an oscillator, for example, and reference numeral 5 is a control circuit for controlling driving of the electronic device. Reference numeral 2 is a main printed board that electrically intervenes between the power supply module 1, the high frequency circuits 3, 4, and the control circuit 5 and connects the circuits.

This electronic device is input to the high frequency circuit 3,
The output is taken out from the high frequency circuit 4. High frequency circuit 3,
4 has a high heat generating element, and the power supply module 1 naturally radiates a large amount of heat.

Therefore, such an electronic device is required to have good heat dissipation of the power supply module and the high frequency circuit, and to be free from noise in the high frequency circuit and the input / output line.

[0006]

2. Description of the Related Art A conventional electronic device is shown in FIGS.
In the figure, 1 is a power supply module, 2 is a main printed circuit board, and 30 is a high frequency circuit printed circuit board on which a high heat generating element 31 is mounted.

Reference numeral 70 denotes a main cover that covers the upper surface and the left and right side surfaces of the electronic device. Reference numeral 100 is a power supply module housing, and 101 is a high frequency circuit printed board housing.

The power supply module housing 100 and the high frequency circuit printed board housing 101 are both molded products made of aluminum or the like by cutting. Then, strip-shaped fixing plate portions having an extended bottom plate are provided on both sides of each housing so as to be fixed to a radiator 150 described later.

Reference numeral 150 is a radiator in which a large number of parallel radiator fins 152 are provided on the back surface side of a rectangular radiator base plate 151 by extruding aluminum or the like. The back surface of the power supply module housing 100 is brought into close contact with the central portion on the front surface side of the radiator 150, and the fixing plate portion is fixed by screwing. Further, the back side of the high-frequency circuit printed board housing 101 is placed on both sides of the power module housing 100 in close contact with each other, and the fixing plate portion is screwed to fix the high-frequency circuit printed board housing 101 to the radiator 150. .

As shown in detail in FIG. 7, the power supply module 1 is mounted in the power supply module housing 100, and the main printed board 2 is horizontally placed in the middle of the power supply module housing 100 so as to cover the power supply module 1. Is stuck to. Then, the terminals of the power supply module 1 are inserted into the through holes of the main printed board 2 and soldered.

A base plate 110 is horizontally fixed to an upper opening of the power supply module housing 100, and a control circuit printed board 111 and a third high frequency circuit housing box 112 are mounted on the base plate 110.

In the third high-frequency circuit housing box 112, the third
The high-frequency circuit printed circuit board is housed and the upper opening is covered with a cover. As shown in FIG. 6, the feedthrough capacitor 55 is attached so as to penetrate the side wall of the third high frequency circuit housing box 112, and one end of the center conductor of the feedthrough capacitor 55 is attached to the third high frequency circuit printed board. Soldered to the pad. An electric wire is connected to the other end of the center conductor of the feedthrough capacitor 55, and the connector attached to the other end of the electric wire is plugged into the printed circuit board connector mounted on the control circuit printed circuit board 111 to generate the third high frequency wave. The circuit printed board and the control circuit printed board 111 are connected.

Further, a printed board connector is mounted on the lower surface of the control circuit printed board 111, another printed board connector is mounted on the upper surface of the main printed board 2, and connectors (not shown) mounted on both ends of the electric wire are attached. The control circuit printed board 111 and the main printed board 2 are connected by plugging in the corresponding printed board connectors.

On the upper surface of the control circuit printed board 111,
A printed board connector is mounted for connection to the high frequency circuit printed board 30 via an electric wire. The high frequency circuit printed board 30 is horizontally inserted and fixed so that the bottom surface of the high heat generating element 31 is in close contact with the bottom plate of the high frequency circuit printed board housing 101, and the opening of the high frequency circuit printed board housing 101 is covered.
Blocked at 119.

As shown in FIG. 7, a feedthrough capacitor 35 is mounted so as to penetrate the side wall of the high frequency circuit printed board housing 101, and one end of the center conductor of the feedthrough capacitor 35 is attached to the high frequency circuit printed board 30. Soldered to the pad. An electric wire is connected to the other end of the center conductor of the feedthrough capacitor 35, and the connector attached to the other end of the electric wire is plugged into the printed board connector mounted on the main printed board 2 to provide the high frequency circuit printed board 30. And the main printed board 2 are connected.

A front cover 60 equipped with an input / output connector 61
Is attached to the front end faces of the power supply module housing 100 and the high frequency circuit printed board housing 101, and the front side of the electronic device is closed with the front cover 60, and the power module housing 100 and the high frequency circuit printed board housing 101 are installed. A rear cover 65 is attached to the end face to close the rear side of the electronic device.

On the other hand, a coaxial cable is led out from the back surface of the input / output connector 61, and the coaxial connector attached to the end of this coaxial cable is plugged into the coaxial connector mounted on the high frequency circuit printed board 30.

These input / output connectors 61 are front covers
The coaxial connector of the coaxial cable connected to the external device is plugged into the front side of the 60. Since the electronic device is configured as described above, the heat of the power supply module and the heat of the high heat generating element mounted in the high frequency circuit are transferred to the heat radiator 150 via the high frequency circuit printed board housing 101 and the power module housing 100. Then, the heat is dissipated to the outside from the heat dissipating fins 152 of the heat dissipating body 150.

Further, since feedthrough capacitors are respectively mounted on the electric wires connecting the main printed circuit board 2 and the high frequency circuit and the electric wires connecting the third high frequency circuit printed circuit board and the control circuit printed circuit board 111, the high frequency circuit is mounted. There is no noise on the circuit.

[0020]

However, in the conventional electronic device, the fixing plate portions of the two high frequency circuit printed circuit board housings and the fixing plate portion of the one power supply module housing are used as the heat dissipation base plate. The high-frequency circuit printed circuit board housing and the power supply module housing each have a fixing plate portion, and a wiring space for electric wires with a feedthrough capacitor attached is required, so that the electronic device is large. There was a fear that it would take shape.

Since the main printed circuit board and the high frequency circuit printed circuit board are connected via the electric wire, there is a problem that the wiring work takes time. Further, since it is a radiator formed by extruding a metal such as aluminum, it is difficult to reduce the arrangement pitch of the radiator fins and increase the radiator area. Therefore, the conventional heat radiator has a large gap and large fins are arranged in parallel, and there is a possibility that the heat radiation efficiency is lowered.

The present invention has been made in view of the above points, and an object thereof is to provide an electronic device in which miniaturization is promoted, assembly time is shortened, and heat dissipation efficiency is high.

[0023]

In order to achieve the above-mentioned object, the present invention, as illustrated in FIGS. 1 and 2, includes a housing 10 having a power module housing 12 and a high frequency circuit housing 13,
The power supply module 1 is fixed to the bottom plate of the power supply module housing 12 so that the back surface is in close contact, and is housed and fixed in the power supply module housing 12 above the power supply module 1, and the terminals of the power supply module 1 are inserted and connected to the through holes. The main printed circuit board 2 and the high frequency circuit printed circuit board 30 that is housed and fixed in the high frequency circuit housing 13 are provided.

Further, a high heat generating element 31 mounted on the high frequency circuit printed board 30 so that the back surface is in close contact with the bottom plate of the high frequency circuit accommodating portion 13, and a sub printed board 80 mounted on the back surface side of the bottom plate 11 of the housing 10. , The sub-printed board 80 is provided so as to penetrate through the bottom plate 11 of the housing 10, and the center conductor is connected to the high frequency circuit 3.
A through capacitor 35 connected to the pad and a heat radiation fin 40 fixed to the back surface of the bottom plate of the housing 10.

The main printed circuit board 2 and the sub printed circuit board 80 are configured so that the printed circuit board connectors mounted on both printed circuit boards are directly plugged in and connected. Further, the heat radiation fin is formed by bending a thin metal plate in a meandering shape.

Alternatively, a housing 10 having a power supply module accommodating portion 12 and a high frequency circuit accommodating portion 13, a power supply module 1 fixed to the bottom plate of the power supply module accommodating portion 12 so that the back surface is in close contact, and a power source protruding upward The main printed board 2 in which the terminals of the module 1 are inserted and connected by soldering into the through holes and housed and fixed in the power supply module housing 12, and the high frequency circuit printed board housed and fixed in the high frequency circuit housing 13
With 30 and.

Further, the high heat generating element 31 mounted on the high frequency circuit printed board 30 so that the back surface is in close contact with the bottom plate of the high frequency circuit housing portion 13 and the side wall of the power supply module housing portion 12 are penetrated, and A through capacitor 35 having one end connected to the pad of the main printed board 2 and the other end connected to the pad of the high-frequency circuit printed board 30, and a radiation fin 40 fixed to the back surface of the bottom plate of the housing 10 were provided. The configuration.

As shown in FIG. 3, a metal thin plate is bent and formed in a meandering shape.
A strip-shaped thin metal plate is inserted and fixed in each of the grooves arranged in parallel on the back surface of the heat dissipation fins 45.

As shown in FIG. 4, instead of the heat radiation fins, the heat radiation fins 15 and the housings arranged in parallel on the back surface of the housing 10 are provided.
10 and 10 are integrally formed by die casting. As illustrated in FIGS. 1 and 2, a sub-housing 50 on which a third high-frequency circuit housing box 52 and a control circuit printed board 51 fixed above the power supply module housing 12 are mounted, and a third high-frequency circuit housing. A third high-frequency circuit printed board 53 which is housed and fixed in the box 52, and one end of the center conductor penetrating the side wall of the third high-frequency circuit housing box 52 is the third high-frequency circuit printed board 53.
Connected to the pad of the control circuit printed board 51 at the other end.
And a feed-through capacitor 55 connected to the pad.

The main printed circuit board 2 and the control circuit printed circuit board 51 are configured such that printed circuit board connectors mounted on both printed circuit boards are directly plugged in and connected.

[0031]

According to the present invention, since the power supply module accommodating portion for accommodating the power supply module and the main printed board and the high frequency circuit accommodating portion for accommodating the high frequency circuit printed board are provided in one housing, the high frequency The electronic device becomes smaller than the conventional one in which the circuit printed board accommodating housing and the power supply module accommodating housing are separately provided, and the respective housings are screwed and fixed to the heat dissipation base plate.

Since the main printed circuit board and the high frequency circuit printed circuit board are connected via the sub printed circuit board and the feedthrough capacitor or only through the feedthrough capacitor, no wiring work is required and the assembly work time is reduced. Is shortened.

The radiating fin according to the present invention is formed by bending a thin metal plate so that it meanders, or by inserting and fixing a strip-shaped thin metal plate in each groove arranged on the back surface of the housing. Since the housing and the housing are integrally die-cast, the arrangement pitch of the heat radiation fins can be reduced, and the heat radiation area is large. Therefore, heat dissipation efficiency is high.

[0034]

The present invention will be described in detail with reference to the drawings. The same reference numerals indicate the same objects throughout the drawings.

FIG. 1 is a perspective view of a first embodiment of the present invention, FIG. 2 is a view of the first embodiment of the present invention, (A) is a front sectional view,
(B) is a side sectional view, FIG. 3 is a sectional view of the second embodiment, and FIG. 4 is a sectional view of the third embodiment.

Reference numeral 10 shown in the drawing is a rectangular bottom plate 11 and four 4 of the bottom plates 11.
It is a housing formed by die-casting a metal such as aluminum, which has four side walls provided on the sides and has an opening at the top. Housing 10
The inside is partitioned by two parallel partition walls, the power supply module accommodating portion 12 is provided in the central portion, and the high frequency circuit accommodating portions 13 are provided on both sides of the power supply module accommodating portion 12, respectively.

Reference numeral 1 is a power supply module with terminals protruding upward. The back surface of the power supply module 1 is brought into close contact with the bottom plate of the power supply module accommodating portion 12, and is housed and fixed in the power supply module accommodating portion 12 using screws. In the embodiment, three power supply modules 1 are arranged in the power supply module accommodating portion 12.

The power supply module accommodating portion 12 is provided with steps inside the four side walls. The main printed board 2 is horizontally inserted into the power supply module accommodating portion 12 so that the side edges are supported by the step, and the main printed board 2 is fixed to the step using screws.

The terminals of the power supply module 1 are inserted into the through holes of the main printed board 2 and soldered to connect the terminals of the power supply module 1 to the predetermined pattern of the main printed board 2.

The high frequency circuit printed board 30 on which the high heat generating element 31 is mounted is inserted into the high frequency circuit accommodating portion 13 so that the back surface of the high heat generating element 31 is in close contact with the bottom plate of the high frequency circuit accommodating portion 13, and is screwed into the high frequency circuit. It is fixed to the bottom plate of the housing portion 13.

The upper opening of each high-frequency circuit housing portion 13 is covered with a cover 39 to shield the high-frequency circuit printed board 30 from electromagnetic waves. Reference numeral 80 is a sub-printed board having a U-shaped plan view for electrically connecting the main printed board 2 and the high-frequency circuit printed board 30.

In order to mount this sub-printed board 80 on the back side of the housing 10, a recess having a U-shaped plan view is provided on the back side of the bottom plate 11, and the sub-printed board 80 is horizontally inserted into this recess. It is fixed to the bottom plate 11 of the housing 10 with screws.

By attaching the sub-print board 80 to the bottom plate 11, the print connector 80a mounted on the upper surface of the head of the sub-print board 80 loosely penetrates the hole provided in the bottom plate of the power supply module accommodating portion 12, and the main print is carried out. Plug in the printed board connector 2a provided on the back side of the board 2 to
And the circuit of the sub-printed board 80 are connected.

Each of the left and right legs of the sub-printed board 80 passes through the bottom plate 11 of the housing 10 so as to penetrate the through capacitor 35.
Is hanging. Specifically, the threaded portion on the outer peripheral surface of the feedthrough capacitor 35 is screwed into a screw hole provided at a position on the bottom plate of the high-frequency circuit housing portion 13 near the power supply module housing portion 12, and the lower part of the center conductor is sub-printed. It is inserted into the through hole of plate 80 and soldered.

Then, the upper part of the center conductor of the sub-printed board 80 is bent toward the high-frequency circuit printed board 30 and its end is soldered to a corresponding pad provided on the surface of the high-frequency printed circuit board 30 to be connected. There is.

Reference numeral 40 denotes a heat radiating fin 40 in which a thin metal plate made of aluminum or the like is bent in a meandering shape such that the U-shape and the inverted U-shape are alternately bent. The radiation fin 40 is fixed to the entire back surface of the bottom plate 11 of the housing 10 by soldering the inverted U-shaped head.

The housing 10 shown in FIGS. 1 and 2 is a bottom plate.
Since a concave portion for inserting and fixing the sub-printed board 80 is provided on the back surface side of 11, heat transfer between the housing 10 and the radiation fin 40 is poor. Therefore, the metal base plate 42 is screwed and fixed to the back surface of the bottom plate 11 of the housing 10, and the heat radiation fins 40 are soldered to the back surface of the metal base plate 42.

Since the electronic device is of a forced cooling type, an air-conditioning cover 41 having a U-shape in front view is attached to the opening side (lower side surface of the figure) of the heat radiation fin 40, and is not shown for feeding from the front to the rear of the figure. The blown air from the cooling fan is prevented from escaping below the radiation fins 40.

The mounting structure of the control circuit printed board and the third high frequency circuit such as the oscillator will be described below. Reference numeral 50 is a sub-casing formed by die casting or the like, which is screwed and fixed to the upper end surface of the side wall of the power supply module housing portion 12 so as to close the upper opening of the power supply module housing portion 12.

Four legs for supporting the four corners of the control circuit printed board 51 are arranged on a part of the upper surface of the sub-housing 50, and the other portion facing the legs has a third high frequency circuit printed board.
There is provided a third high-frequency circuit housing box 52 having an open upper part for horizontally housing and fixing 53.

The control circuit printed board 51 is horizontally placed on the upper end surfaces of the legs, and the four corners of the control circuit printed board 51 are fixed to the legs by using screws. The feedthrough capacitor 55 is attached so as to penetrate the side wall of the third high frequency circuit housing box 52, one end of the center conductor of the feedthrough capacitor 55 is connected to the pad of the third high frequency circuit printed board 53, and the other end is connected. The parts are connected to the pads of the control circuit printed board 51.

After that, the upper opening of the third high-frequency circuit housing box 52 is closed with a cover, and the third high-frequency circuit printed board 53 is formed.
Is electromagnetically shielded. The sub-casing 50 is provided with a hole so that the printed board connector 51b mounted on the lower surface of the control circuit printed board 51 projects below the sub-casing 50.

By mounting the sub-housing 50 on the upper part of the high-frequency circuit housing portion 13, the printed board connector 51b mounted on the control circuit printed board 51 is plugged into the main printed board 2 mounted on the upper surface of the main printed board 2. Then, the circuit of the control circuit printed board 51 and the circuit of the main printed board 2 are connected.

Front cover 60 equipped with input / output connector 61
Is attached to the front end surface of the housing 10, and the front surface side of the electronic device is closed by the front cover 60, and the rear surface cover 65 is attached to the rear end surface of the housing 10 to close the rear surface side of the electronic device.

On the other hand, the coaxial cable is led out from the back surface of the input / output connector 61, and the coaxial connector attached to the end of the coaxial cable is plugged into the coaxial connector mounted on the high frequency circuit printed board 30.

[0056] The main cover 70 has a reverse channel shape when viewed from the front.
Are covered so as to cover the upper part of the housing 10, and the left and right side plates of the main cover 70 are screwed and fixed to the left and right side surfaces of the housing 10 to close the upper surface and the left and right side surfaces of the electronic device.

As described above, according to the present invention, the power supply module housing 12 for housing the power supply module 1 and the main printed board 2 and the high frequency circuit housing 13 for housing the high frequency circuit printed board 30 are provided in one housing. Since it is provided in the, the miniaturization of the electronic device is promoted.

The main printed circuit board 2 and the high frequency circuit printed circuit board 30 are connected via the sub printed circuit board 80 and the feedthrough capacitor 35, and the control circuit printed circuit board 51 and the main printed circuit board 2 are connected via the printed circuit board connector. Therefore, the wiring work for the electric wires is eliminated, and the assembly work time is shortened.

The back surface of the power supply module 1 is the bottom plate 11 of the housing 10.
The back surface of the high heat generating element 31 is also in close contact with the bottom plate 11 of the housing 10. The radiating fin 40 is formed by bending a thin metal plate to meander. Therefore, the arrangement pitch of the radiation fins 40 can be reduced, and a large number of radiation fins 40 are provided.

Therefore, the heat dissipation area is large and the heat dissipation efficiency is high. Also, a feedthrough capacitor 35 is attached to the line connecting the main printed board 2 and the high frequency circuit printed board 30,
Control circuit printed board 51 and third high frequency circuit printed board 53
Since the feedthrough capacitor 55 is mounted on the line connecting between and, noise does not occur in the high frequency circuit.

FIG. 3 shows an embodiment in which the main printed circuit board and the high frequency circuit printed circuit board are connected without a sub printed circuit board. In FIG. 3, a rectangular bottom plate 11 formed by die-casting a metal such as aluminum and four side walls provided on four sides of the bottom plate 11 and having an opening at the top includes a chassis 10
The inside is partitioned by two parallel partition walls, and a power supply module accommodating portion 12 is provided at the center and high frequency circuit accommodating portions 13 are provided on both sides of the power supply module accommodating portion 12.

The bottom plate 11 may not be integrally formed with the side wall or the like, but may be screwed and fixed. The back surface of the power supply module 1 is brought into close contact with the bottom plate of the power supply module accommodating portion 12, and is housed and fixed in the power supply module accommodating portion 12 using screws.

The main printed board 2 is horizontally inserted into the power supply module accommodating portion 12, the main printed board 2 is fixed with screws, and the terminals of the power supply module 1 are inserted into the through holes of the main printed board 2 and soldered. In addition, the terminals of the power supply module 1 and the predetermined pattern of the main printed board 2 are connected.

The high-frequency circuit printed board 30 on which the high-heat generating element 31 is mounted is inserted into the high-frequency circuit accommodating portion 13 so that the back surface of the high-heat generating element 31 is in close contact with the bottom plate of the high-frequency circuit accommodating portion 13, and is screwed into the high-frequency circuit accommodating portion. It is fixed to the bottom plate of 13.

Unlike the embodiment shown in FIG. 1, the rear surface of the bottom plate 11 of the housing 10 is flat without any recess for accommodating the sub-print board. The threaded portion on the outer peripheral surface of the feedthrough capacitor 35 is screwed into the screw hole provided on the side wall of the power supply module accommodating portion 12, and the feedthrough capacitor 35 is mounted so as to penetrate the side wall. One end of the conductor wire is soldered and connected to a predetermined pad of the main printed board 2, and the other end of the center conductor wire is soldered and connected to a predetermined pad of the high frequency circuit printed board 30.

The upper opening of each high-frequency circuit housing portion 13 is covered with a cover 39 to shield the high-frequency circuit printed board 30 from electromagnetic waves. Reference numeral 45 denotes a strip-shaped heat radiation fin made of a thin metal plate such as aluminum, and its length is equal to the length of the housing 10 in the longitudinal direction.

On the back surface of the bottom plate 11 of the housing 10, a large number of closely spaced parallel grooves are provided, and the longitudinal side edges of the heat radiation fins 45 are pressed into each groove (after being inserted into the grooves, soldering is performed to fix them). A large number of heat dissipation fins 45 are arranged on the back surface side of the housing 10.

The structure in which the sub-casing 50 is attached to the upper part of the high-frequency circuit housing 13 and the control circuit printed board 51 and the third high-frequency circuit printed board 53 are mounted on the sub-casing 50 is shown in FIGS.
As described above.

It is also possible to mount the front cover 60 having the input / output connector 61 mounted on the front surface of the housing 10 and the rear cover 65 on the rear surface of the housing 10 to cover the housing 10 with the main cover 70. As described with reference to FIG.

In the electronic device shown in FIG. 4, a large number of parallel heat radiation fins 15 which are die-cast integrally with the housing 10 are arranged on the back surface of the housing 10. The other points are exactly the same as the embodiment shown in FIG.

[0071]

Since the present invention is constituted as described above, it has the following effects.

Since the power supply module accommodating portion for accommodating the power supply module and the main printed circuit board and the high frequency circuit accommodating portion for accommodating the high frequency circuit printed circuit board are provided in one housing, the electronic device is miniaturized. .

Since the main printed circuit board and the high frequency circuit printed circuit board are connected via the sub printed circuit board and the feedthrough capacitor or only through the feedthrough capacitor, no wiring work is required and the assembly work time is reduced. Is short.

In the case where the heat radiation fin and the housing are integrally formed by die casting, the assembling time is particularly short.
The radiating fins are formed by bending a thin metal plate in a meandering manner, or by inserting and fixing strip-shaped thin metal plates in the grooves arranged in parallel on the back surface of the housing, or by die-casting the radiating fins and the housing together. Because it is a thing,
Since the arrangement pitch of the heat radiation fins can be made small and the heat radiation area is large, the heat radiation efficiency is high.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is a diagram of a first embodiment of the present invention, (A) is a front sectional view, and (B) is a side sectional view.

FIG. 3 is a sectional view of a second embodiment.

FIG. 4 is a sectional view of a third embodiment.

FIG. 5 is a block diagram of an electronic device.

FIG. 6 is a perspective view showing a conventional example in a separated form.

FIG. 7 is a sectional view of a conventional example.

[Explanation of symbols]

 1 Power Supply Module 2 Main Printed Circuit Board 3,4 High Frequency Circuit 5 Control Circuit 6 Third High Frequency Circuit 10 Housing 12 Power Supply Module Housing 13 High Frequency Circuit Housing 15,40,45,152 Heat Dissipation Fin 30 High Frequency Circuit Printed Board 31 High Heating Element 35 , 55 Through capacitor 41 Air conditioning cover 42 Metal base plate 50 Sub housing 51,111 Control circuit printed board 52 Third high frequency circuit housing box 53,113 Third high frequency circuit printed board 60 Front cover 65 Rear cover 70 Main cover 80 Sub printed board 100 Power supply Module housing 101 High-frequency circuit printed board housing 150 Heat sink 151 Radiating base plate 152 Radiating fin

Claims (6)

[Claims] 1. A housing having a power supply module accommodating portion and a high-frequency circuit accommodating portion, a power supply module fixed to a bottom plate of the power supply module accommodating portion so that the back surface is in close contact, and the power supply module accommodating portion above the power supply module. A main printed circuit board, which is housed and fixed in the housing, and into which a terminal of the power supply module is inserted and connected to the through hole, a high frequency circuit printed board, which is housed and fixed in the high frequency circuit housing, and a bottom plate of the high frequency circuit housing A high heat generating element mounted on the high-frequency circuit printed board so as to be in close contact, a sub-printed board attached to the back surface side of the bottom plate of the housing, and a sub-printed board vertically pierced through the bottom board of the housing. The main precharger includes a feedthrough capacitor for connecting a conductive wire to a pad of the high frequency circuit, and a heat radiation fin fixed to the back surface of the bottom plate of the housing. Preparative plate and the sub print board, an electronic device, characterized in that intended to be connected by the printed circuit board connector. 2. The main printed circuit board and the high frequency circuit printed circuit board, instead of the sub printed circuit board, have one end of a center conductor connected to a pad of the main printed circuit board and the other end thereof connected to the pad. 2. The electronic device according to claim 1, wherein the electronic device is connected via a feedthrough capacitor which penetrates a side wall of the power supply module housing portion so as to be connected to a pad of the high frequency circuit printed board. 3. The electronic device according to claim 1, wherein the heat dissipation fin is formed by bending a thin metal plate in a meandering shape. 4. A radiation fin, in which a strip-shaped thin metal plate is inserted and fixed in each of the grooves arranged in parallel on the back surface of the housing, in place of the radiation fin according to claim 3. Or the electronic device according to 2. 5. The heat dissipating fin according to claim 3 or 4, in place of the heat dissipating fins, the heat dissipating fins arranged in parallel on the back surface of the housing and the housing being integrally die cast. Item 2. The electronic device according to Item 1 or 2. 6. A sub-housing, which is fixed above the power supply module accommodating portion, on which a third high-frequency circuit accommodating box and a control circuit printed board are mounted, and a sub-housing which is fixedly accommodated in the third high-frequency circuit accommodating box. 3 of the high frequency circuit printed board and the side wall of the third high frequency circuit housing box, one end of the center conductor is connected to the pad of the third high frequency circuit printed board, and the other end is connected to the third high frequency circuit printed board. 2. A feedthrough capacitor connected to a pad of a control circuit printed board, wherein the main printed board and the control circuit printed board are connected to a printed board connector. The electronic device according to 3, 4, or 5.