JPS59759Y2 - 集積回路組込みセラミック基板の破損防止用保護材 - Google Patents
集積回路組込みセラミック基板の破損防止用保護材Info
- Publication number
- JPS59759Y2 JPS59759Y2 JP1979030907U JP3090779U JPS59759Y2 JP S59759 Y2 JPS59759 Y2 JP S59759Y2 JP 1979030907 U JP1979030907 U JP 1979030907U JP 3090779 U JP3090779 U JP 3090779U JP S59759 Y2 JPS59759 Y2 JP S59759Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- ceramic substrate
- protective material
- damage
- preventing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979030907U JPS59759Y2 (ja) | 1979-03-10 | 1979-03-10 | 集積回路組込みセラミック基板の破損防止用保護材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979030907U JPS59759Y2 (ja) | 1979-03-10 | 1979-03-10 | 集積回路組込みセラミック基板の破損防止用保護材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55132938U JPS55132938U (cg-RX-API-DMAC7.html) | 1980-09-20 |
| JPS59759Y2 true JPS59759Y2 (ja) | 1984-01-10 |
Family
ID=28881450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979030907U Expired JPS59759Y2 (ja) | 1979-03-10 | 1979-03-10 | 集積回路組込みセラミック基板の破損防止用保護材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59759Y2 (cg-RX-API-DMAC7.html) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5531827Y2 (cg-RX-API-DMAC7.html) * | 1974-03-08 | 1980-07-29 | ||
| JPS50148076A (cg-RX-API-DMAC7.html) * | 1974-05-20 | 1975-11-27 |
-
1979
- 1979-03-10 JP JP1979030907U patent/JPS59759Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55132938U (cg-RX-API-DMAC7.html) | 1980-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4679118A (en) | Electronic chip-carrier heat sinks | |
| DE68920923T2 (de) | Elektronische Packung mit verbesserter Wärmesenke. | |
| EP1056129A3 (en) | Heat-generating element cooling device | |
| EP1463112A2 (en) | Heat sink with visible logo | |
| DE69416107T2 (de) | Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper | |
| US6501018B2 (en) | EMI gasket having enhanced z-axis compliance | |
| JPS59759Y2 (ja) | 集積回路組込みセラミック基板の破損防止用保護材 | |
| US5263632A (en) | Apparatus for positioning integrated circuit packages for tinning | |
| USD439566S1 (en) | Circuit card cage | |
| US6134112A (en) | Heat sink attachment | |
| JP3914729B2 (ja) | コネクタのナット保持構造 | |
| EP1037518A2 (en) | Heat sink for printed circuit board | |
| US20070217161A1 (en) | Heat sink having protective device for thermal interface material spread thereon | |
| USD437856S1 (en) | Circuit card | |
| JPH08162724A (ja) | プリント基板 | |
| EP1118261B1 (de) | Handhabungs- und montageschutz | |
| JPH11510650A (ja) | 電子部品用パッケージ | |
| JPH0679197U (ja) | 電磁波シールドケースの取付構造 | |
| CN217552172U (zh) | 工装结构 | |
| CN2646763Y (zh) | 散热片组 | |
| CN2544329Y (zh) | 散热片扣件结构 | |
| KR200242914Y1 (ko) | 방열판 고정을 위한 레그 장치 | |
| JP2508674Y2 (ja) | 電子部品のパッケ―ジ構造 | |
| US20010009503A1 (en) | Transmitter-receiver unit that ensures mounting of cover | |
| KR970006979Y1 (ko) | H형 반도체 패키지 |