JPS5973876A - Microconnector for mounting superconductive element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a micro connector for mounting a superconductor that connects a superconducting element and a wiring module of a superconducting computer used at extremely low temperatures.

TECHNICAL BACKGROUND FIG. 1 shows a sectional view of essential parts of this type of microconnector for mounting superconducting elements.

In FIG. 1, the wiring 2 from the superconducting element 1 is connected to a card board (hereinafter referred to as a card) 6. It passes over a substrate called foot 4 and is connected to microbin 5 on foot 4. The microbin 5 is electrically connected to the microbin 5' on the wiring module 9 via the mercury bulb 8 in the micro socket hole 7 drilled in the board 6, and is further connected to the wiring 2 on the wiring module 9. 'It is connected to the. FIG. 2 is an external view of the microbins 5, 5'.

Several tens to hundreds of microbins are attached to the microbin row with high precision, and the entire microconnector requires several thousand micropins. The micro connector constructed in this manner uses micro pins 5, 5' and a mercury bulb 8 for electrical connection, as shown in FIG. The micro pins 5, 5' are made of platinum so as not to form an amalgam since they come into contact with the mercury bulb 8.

Conventional technology and problems Conventional micro pins have a shape as shown in Figure 2.
Moreover, because of their small size, they are difficult to manufacture and expensive. It is still necessary to insert the micro pins 5, 5' into the micro socket holes 7, and for this purpose the board 6
Extremely high precision is required for each component, such as the precision in forming the micro socket hole 7 inside and the precision in planting the micro pins 5, 5' in the foot 4.

Furthermore, the connection between the card 6 and the foot 4 is an L-shaped connection, which has a problem of being weak in strength.

The problem is that the socket holes 7 in the flat board 6 are formed using anisotropic etching of silicon, so the shape is constant, and the pitch between the socket holes 7 cannot be made very dense. was there.

As described above, the structure had many drawbacks in terms of accuracy, mechanical strength, density, etc.

OBJECTS OF THE INVENTION In order to eliminate these drawbacks, the present invention provides a connector part with through wiring (turns) formed in the block or board that becomes the connector, without using micro pins and boards containing mercury bulbs. The purpose is to create a micro connector for mounting superconducting elements, which is characterized by making connections between wiring modules, and which eliminates the need for micro pins and boards, facilitates production, and strengthens mechanical strength by eliminating the L-shaped structure. It is about providing.

The drawings will be explained in detail below.

Examples of the invention FIG. 6 is a sectional view of a main part of an embodiment of the present invention.

1 is a superconducting element, 2.2' is a wiring, 6 is a card, 9 is a wiring module, 10.10' is a solder, and a card 3. A pad portion attached to the surface of the wiring pattern of the wiring module 9, 11 is a connector component, 12.12' is a pad portion with solder adhered to the surface of the connector component 11, and 16 is a through wiring pattern. Note that the band portion 10.1 attached and formed on the wiring surface of the card 6 and the wiring module 9
0' is the pad portion 12.1 of both wirings and the connector component 11.
1 was provided to increase the reliability of connection with 2'. In the micro connector of the present invention, the pad portions 12 and 12' on the connector component 11 are directly connected to the card 6I.
Needless to say, the purpose can be achieved by connecting to the wiring pattern of the wiring module 9. In the present embodiment described below, a case will be described in which pad portions 10 and 10' are attached and formed on the card 6 and the wiring module 9.

Transmission of electrical signals in the connector of this structure is carried out from the superconducting element 1 through the wiring 2 to the pad 10° on the card 6, and then from the pad 12 formed on the card side of the connector part 11 into the connector part 11. It is transmitted to the formed through wiring pattern 13.

Furthermore, the signal is transmitted from the pad 12' on the connector component 11 to the pad 10' on the wiring module 9, then to the wiring 2' on the wiring module 9, and further transmitted to other card parts, and between the superconducting elements. A connection is made. FIG. 4 shows the details of the connection between the card 6 and the connector component 11 in an enlarged manner. The same parts as in Fig. 3 are indicated by the same symbols. As shown in FIG. 6, the through wiring pattern 13 and the pad portion 1
The following features can be obtained by using the connector part 11 having a diameter of 2.12'.

First, by using the connector part 11, the conventional micro pins 5, 5', board 6, and mercury bulb 8 shown in FIGS. 1 and 2, which were difficult to manufacture, are no longer necessary, and manufacturing is easy. It is possible to reduce the price. Also, card 6
The connector parts 11 are pressed onto the respective boards of the wiring module 9 and the wiring module 9, and since it does not have an L-shaped structure like the conventional one, it has the advantage of strong mechanical strength.

Furthermore, the pitch of the through wiring pattern 13 is not limited by the anisotropic etching of the board 6 as in the prior art, so it has the advantage that higher density can be achieved.

An example of the manufacturing method of the connector part 11 is shown in FIGS.
Shown in c and d.

Figure 5 α shows pattern formation on silicon and glass.

A predetermined through wiring pattern 16 is formed on a substrate 14 made of ceramic or the like by, for example, a vacuum evaporation method using a mask or a lift-off technique in phosphorography. Next, as shown in FIG. 5, the substrate 14 having the through wiring pattern 16 formed thereon is bonded together by, for example, a glass bonding method. Next, FIG. 5C shows cutting, polishing, and pad formation, in which the stacked and laminated substrate layers are folded at predetermined positions, for example, by grinding, and the cut end surfaces are cut into microscopic shapes, for example, as an example of semiconductor substrate technology. The connector base is polished by surface polishing using abrasive grains (mechanical chemical boring). 1.1
', u, n' indicate the cutting position. Palladium, solder, etc. are vapor-deposited to form the pad portions 12 and 12' on the exposed portions of the through wiring butter/13Ω on the end face of the connector portion base to form the connector component 11. FIG. 5d shows a state in which the connector component 11 is fixed to the card 6, and the connector component 11 and the card 6 on which the pad portion 10 is formed are aligned and bonded to make the connection.

Similarly, the connector part 11 and the wiring module 9 are connected, and the structure shown in FIG. 6 can be manufactured.

Other manufacturing methods include micro-trouble or laser machining for the block-shaped connector parts 11. It is also possible to form a through-hole wiring pattern by forming an 11 through-hole and melting and pouring the material that will become the wiring pattern into the through-hole.

As described in detail, according to the present invention, there is no need for platinum pins or mercury pins, which are difficult to manufacture, making it easy to manufacture and reducing costs. Furthermore, since the connector section is pressed and fixed onto the board of the card and wiring module, there is an advantage that the card and the foot have stronger mechanical strength than the case where the card and foot have a conventional L-shaped configuration. Furthermore, since the pitch of the through wiring pattern is not limited by the anisotropic etching of the board as in the prior art, there is an advantage that higher density can be achieved.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of the main part of a conventional microconnector for mounting a superconducting element, Fig. 2 is an external view of a micropin used in the microconnector, and Fig. 6 is a main part of an embodiment of the microconnector of the present invention. 4 is an enlarged view of the connection between the micro connector of the present invention and the card board, and FIG. 5 is a cross-sectional view.
b l' l d is an explanatory diagram of an example of the method of manufacturing the micro connector of the present invention. 1... Superconducting element, 2.2'... Wiring, 6... Card, 4... Foot, 5.5'... Micro pin,
6... Board, 7... Micro socket hole part, 8...
...Mercury bulb, 9...Wiring module, 10.10'.
・・Card, upper part of wiring module, 11...
Connector parts, 12.12'...Pad portion on connector parts, 13...Through wiring pattern, 14...Substrate patent applicant Japan ILR, Brazil Telephone Public Corporation Representative Patent Attorney Hisago Tamamushi Department (3 people) Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 3

Claims (1)

[Claims] In a micro connector that connects a wiring pattern on a card board on which a superconducting element is mounted and a wiring pattern of a wiring module, two surfaces facing and adjacent to and orthogonal to the wiring pattern of the card board and the wiring pattern of the wiring module, respectively; A connector component comprising a pad portion formed at a position facing the wiring pattern of the card board and the wiring module on each of the two sides, and a through wiring pattern connecting the pad portions to each other, the card. The wiring pattern of the substrate and the wiring pattern of the wiring module are connected through a pad portion provided opposite to each wiring pattern and a through wiring pattern that connects the pad portions to each other. Micro connector for element mounting.