JPH0379833B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a micro connector for mounting a superconducting element that connects a superconducting element and a wiring module of a superconducting computer used at extremely low temperatures.

Background of the Technology Figure 1 shows a cross-sectional view of the main parts of this type of microconnector for mounting superconducting elements.

In FIG. 1, the wiring 2 from the superconducting element 1 is connected to a card board (hereinafter referred to as a card) 3 and a foot 4.
It passes through a board called , and is connected to a micro pin 5 on the foot 4. The micro pin 5 is electrically connected to the micro pin 5' on the wiring module 9 via the mercury bulb 8 in the micro socket hole 7 drilled in the board 6, and is further connected to the wiring 2' on the wiring module 9. It is connected to the. FIG. 2 is an external view of the micro pins 5, 5'.

Several tens to hundreds of micro pins are attached with high precision to one row of micro pins, and the entire micro connector requires several thousand micro pins. The micro connector with this configuration has micro pins 5 and 5' for electrical connection as shown in Figure 1.
and a mercury bulb 8 are used. Micro pin 5,
5' is made of platinum so as not to form an amalgam since it comes into contact with the mercury bulb 8.

Prior Art and Problems Conventional micro pins have a shape as shown in FIG. 2, and because they are minute, they are difficult to manufacture and expensive. Also, micro pins 5, 5'
It is necessary to insert the micro socket hole 7 into the micro socket hole 7, and for this purpose, the precision of forming the micro socket hole 7 in the board 6 and the micro pin 5,
Each part is required to have extremely high precision, such as the precision with which the foot 5' is planted on the foot 4.

Furthermore, the connection between the card 3 and the foot 4 is an L-shaped connection, which has a problem of being weak in strength.
Furthermore, in forming the socket hole 7 in the board 6,
Since anisotropic etching of silicon is used, the shape is constant, and there is a problem in that the pitches between the socket holes 7 cannot be made very dense.

As described above, the structure had many drawbacks in terms of accuracy, mechanical strength, density, etc.

Purpose of the Invention In order to eliminate these drawbacks, the present invention provides a connection between a card and a wiring module by using a connector component in which a through wiring pattern is formed in a block or board serving as a connector, without using a board containing micro pins and a mercury bulb. It is characterized by making connections, its purpose is to eliminate the need for micro pins and boards,
It is an object of the present invention to provide a micro connector for mounting a superconducting element that is easy to manufacture and has increased mechanical strength by eliminating the L-shaped structure.

The drawings will be explained in detail below.

Embodiment of the Invention FIG. 3 is a sectional view of a main part of an embodiment of the invention.
1 is a superconducting element, 2 and 2' are wiring, 3 is a card,
9 is a wiring module; 10 and 10' are solder cards 3 and pads attached to the surface of the wiring pattern of wiring module 9; 11 is a connector component;
Reference numerals 12 and 12' indicate pad portions on which solder is adhered to the surface of the connector component 11, and 13 indicates a through wiring pattern. In addition, card 3 and wiring module 9
The pad portions 10, 10' formed on the wiring surface of
is the pad part 12 of the two wirings and the connector part 11,
This is provided to increase the reliability of connection with 12'. In addition, in the micro connector of the present invention, the pad portions 12, 1 on the connector component 11
Needless to say, the purpose can be achieved by directly connecting 2' to the wiring pattern of the card 3 and the wiring module 9. In the present embodiment described below, a case will be described in which pad portions 10 and 10' are attached and formed on the card 3 and the wiring module 9.

Transmission of electrical signals in the connector of this structure is from the superconducting element 1 to the pad 10 on the card 3 via the wiring 2.
The signal is then transmitted from the pad 12 formed on the card side of the connector part 11 to the through wiring pattern 13 formed in the connector part 11. Furthermore, the pad circuit 1 on the connector part 11
The signal is transmitted from 2' to the pad 10' on the wiring module 9, then to the wiring 2' on the wiring module 9, and further transmitted to other card sections to connect the superconducting elements. FIG. 4 shows the details of the connection between the card 3 and the connector component 11 in an enlarged manner. The same parts as in Fig. 3 are indicated by the same symbols. As shown in FIG. 3, the following features can be obtained by using a connector component 11 having a through wiring pattern 13 and pad portions 12, 12'.

First, by using the connector part 11, the conventional micro pins 5, 5', board 6, and mercury bulb 8 shown in FIGS. can be reduced. Also, card 3 and wiring module 9
The connector parts 11 are pressed onto each of the circuit boards, and since it does not have an L-shaped structure like the conventional one, it has the advantage of strong mechanical strength.

Furthermore, the pitch of the through wiring pattern 13 is not limited by the anisotropic etching of the board 6 as in the prior art, so it has the advantage that higher density can be achieved.

An example of a method for manufacturing the connector component 11 is shown in FIGS. 5a, b, c, and d.

Figure 5a shows pattern formation on silicon, glass,
A predetermined through wiring pattern 13 is formed on a substrate 14 made of ceramics or the like by, for example, a vacuum evaporation method using a mask or a lift-off technique in lithography. Next, FIG. 5b shows bonding, in which the substrates 14 on which the through wiring patterns 13 are formed are bonded together by, for example, a glass bonding method. Next, FIG. 5c shows cutting, polishing, and pad formation, in which the laminated substrate layers are cut at predetermined positions by, for example, grinding, and the cut end surface is polished with fine abrasive grains, which is an example of semiconductor substrate technology. The connector is polished by surface polishing (mechanical chemical polishing) to form the connector base. ,′,,′ indicate the cutting position. In order to form pad portions 12, 12' on the exposed portions of the through wiring pattern 13 on the end face of the connector base, palladium, solder, etc. are vapor deposited to form the connector component 11. Figure 5 d shows connector part 1
1 is fixed to the card 3, and by aligning and bonding the connector part 11 and the card 3 on which the pad part 10 is formed,
Make the connection. Similarly, the connector component 11 and the wiring module 9 are connected, and the structure shown in FIG. 3 can be manufactured.

In addition, as another manufacturing method, the connector part 11
It is also possible to form a through-wiring pattern by forming through-holes in a block-like object by micro-drilling or laser machining, and melting and pouring the material that will become the wiring pattern into the through-holes.

Effects of the Invention As explained above, according to the present invention, platinum pins and mercury-containing boards, which are difficult to manufacture, are no longer necessary, making manufacture easier and reducing costs. Furthermore, since the connector part is pressed and fixed on the back of the card and wiring module, there is an advantage that the card and the foot have stronger mechanical strength than in the case where the card and the foot have a conventional L-shaped configuration. Furthermore, since the pitch of the through wiring pattern is not limited by the anisotropic etching of the board as in the prior art, there is an advantage that higher density can be achieved.

[Brief explanation of drawings]

Fig. 1 is a sectional view of a main part of a conventional micro connector for mounting a superconducting element, Fig. 2 is an external view of a micro pin used in the micro connector, and Fig. 3 is a main part of an embodiment of a micro connector of the present invention. FIG. 4 is an enlarged view of the connecting portion between the micro connector of the present invention and a card board, and FIGS. 5 a, b, c, and d are explanatory diagrams of an example of the method of manufacturing the micro connector of the present invention. 1...Superconducting element, 2,2'...Wiring, 3...
Card, 4... Foot, 5, 5'... Micro pin, 6... Board, 7... Micro socket hole, 8... Mercury bulb, 9... Wiring module, 1
0, 10'... Card, pad part on wiring module, 11... Connector parts, 12, 12'...
Pad portion on connector component, 13...through wiring pattern, 14...board.

Claims (1)

[Claims] 1. In a micro connector that connects a wiring pattern on a card board on which a superconducting element is mounted and a wiring pattern of a wiring module, there are two adjacent and perpendicular surfaces facing the wiring pattern of the card board and the wiring pattern of the wiring module, respectively. , a connector component comprising a pad portion formed on each of the two sides at a position facing the wiring pattern of the card board and the wiring module, and a through wiring pattern connecting the pad portions to each other; A superconducting element mounting characterized in that the wiring pattern of the wiring pattern of the wiring module and the wiring pattern of the wiring module are connected via a pad portion provided opposite to each wiring pattern and a through wiring pattern that connects the pad portions to each other. micro connector for