JPS5959428A - Sealing device for resin molding - Google Patents

Sealing device for resin molding

Info

Publication number
JPS5959428A
JPS5959428A JP17172482A JP17172482A JPS5959428A JP S5959428 A JPS5959428 A JP S5959428A JP 17172482 A JP17172482 A JP 17172482A JP 17172482 A JP17172482 A JP 17172482A JP S5959428 A JPS5959428 A JP S5959428A
Authority
JP
Japan
Prior art keywords
plunger
resin
mold
force
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17172482A
Other languages
Japanese (ja)
Other versions
JPH0242651B2 (en
Inventor
Takao Fujizu
隆夫 藤津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP17172482A priority Critical patent/JPS5959428A/en
Priority to DE19833335340 priority patent/DE3335340A1/en
Publication of JPS5959428A publication Critical patent/JPS5959428A/en
Publication of JPH0242651B2 publication Critical patent/JPH0242651B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To contrive to reduce plunger stroke, to make the size of device to be small and to prevent the cooling at drawing out of the plunger, by charging resin tablet from the gap between a top force and a bottom force with lead frame set, while receiving the plunger in a metal mold. CONSTITUTION:To charge resin tablets the bodies 11, 12 of a top force and a bottom force are separated along a parting line P L, while moving up and down one of the top force 10 and the bottom force 20. At this point, a plunger 32 is lowered, and an eject pin 35 is kept to be retracted into the top and bottom bodies 11, 21. Next, a lead frame is set in the cavity on the upper surface of the bottom body 21, and resin tablet is charged into a transfer chamber. Then, the top and bottom forces 10, 20 are moved such that they are in contact with each other at the line P L, and mold clamping is achieved after the metal mold closing. Molten resin is supplied into the cavity by the plunger 32 driven, and semiconductor chip is resin-sealed. Accordingly, the drawing out of the plunger is not necessary, and the device is made to become small sized and then the heater in the plunger may be omitted.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は樹脂モールド封止装置に係り、狛に半導体装置
の封止を行う装置べ、にｂ、１する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a resin mold sealing device, and relates to a device for sealing a semiconductor device in a cage.

〔発明の技術的背景〕[Technical background of the invention]

樹脂モールド封止すべ＠物例えば半導体チップを樹脂封
止するには第１図または第２図に示す装置板が用いられ
ている。まず第１図のもので云えば、−ト全県２（＋　
’１−１．ｃ予めセットされている半導体チップ付きの
リードフレーム（図示せす）に止金を１０を当てがって
型締めを行い、半導体チップの周囲に浴融状幅の樹脂を
満たした上で（Ｔ／＝ｌ　１ｌｉｉの硬化成形を行う。2. Description of the Related Art A device plate shown in FIG. 1 or 2 is used to resin-seal an object, such as a semiconductor chip, with a resin mold. First of all, in Figure 1, all prefectures 2 (+
'1-1. c Apply the clamp 10 to the lead frame (shown in the figure) with the semiconductor chip set in advance to clamp the mold, fill the area around the semiconductor chip with resin of a bath-molten width (T /=l 1lii hardening molding is performed.

樹脂は予めタブレット化されたものを図示しない予備加
熱磯でプレヒートして上金型１０の上方から止金に’）
、　１０内のトランスファチャンバに投入し、流動性あ
る間にトランヌファシリンダ４０と協働するプランジャ
３０により加圧して金ＩＪＩ（１，２０の樹脂投入用ポ
ットからランチ、ゲートを介して半導体チップがセット
されている各キャビティに注入し、熱硬化させる。The resin is tabletted in advance, preheated in a preheated stone (not shown), and applied to the clasp from above the upper mold 10.
, 10, and while it is fluid, it is pressurized by the plunger 30 that cooperates with the tranifer cylinder 40 to transfer the gold IJI (launch from the resin injection pot 1, 20, and the semiconductor chip through the gate). Inject it into each cavity where it is set and heat cure it.

第２図のものはトランスファシリンダ４０により多数の
プランジャ３０を作動させるもので、ポットを多数設け
ることによりポットからキャビティに至る経路での樹脂
の無駄な消黄分を減少させる□ようにしたものである。In the one shown in Fig. 2, a large number of plungers 30 are actuated by a transfer cylinder 40, and by providing a large number of pots, unnecessary yellowing of the resin in the path from the pot to the cavity is reduced. be.

これらの装置における金型ＩＱ、２＋１の榴造をより詳
細に示したのが第３図であり、下金型１０は金型本体１
】が受板１２に取付けられ、ｆ金型２０は金型本体２１
が受板２２に取付けられて受板１２と２２とはガイドビ
ン３３、ガイドブツシュ３４により案内されて相互に離
間、−近接し得るようになっている。そして止金賊１０
における金型本体１１および受板Ｊ２を貫通する工うに
シ′リンダ３１が設けられ、このシリンダ３１内をプラ
ンジャ３２がヌトａ−り連動する。また、下金型２０に
は金馴本体２１および受板２２を貫通してエジェクタピ
ン３５が設けられており、このエジェクタビン３５を支
持するエジェクタプレート３６が上金型１０の上昇時に
図示しないヌトソバピンカ上昇することによりばね力に
よって上昇し樹脂成型物を離型させるようになっている
。FIG. 3 shows the mold IQ of these devices in more detail.
] is attached to the receiving plate 12, and the f mold 20 is attached to the mold body 21.
is attached to the receiving plate 22, and the receiving plates 12 and 22 are guided by a guide pin 33 and a guide bush 34 so that they can move away from each other and approach each other. And stopper bandit 10
A cylinder 31 is provided in a hole passing through the mold body 11 and the receiving plate J2, and a plunger 32 is interlocked with the inside of the cylinder 31. In addition, an ejector pin 35 is provided in the lower mold 20 passing through the metal fitting body 21 and the receiving plate 22, and when the ejector plate 36 supporting the ejector pin 35 is raised, the ejector pin 35 is inserted into a nut soba pin (not shown) when the upper mold 10 is raised. By rising, the spring force causes the resin molded product to be released from the mold.

ここで、上記装置に対する樹脂投入についてみると、上
記両装置ともプランジャ３０を上金型１０の上方１で引
き上げた上でシリンダ３１内にタブレットを投入する。Here, regarding the injection of resin into the above-mentioned apparatuses, in both of the above-mentioned apparatuses, the plunger 30 is pulled up above the upper mold 10, and then the tablet is introduced into the cylinder 31.

〔背景技術の問題点〕[Problems with background technology]

しかしながら、このようなフ゛ランジャ市ｊ１１乍を行
わせるにはそのヌトロークがかなり長くなり、この結果
プランジャ３０の動作所要時間が長くなる。However, in order to perform such a plunger movement, the nut stroke is considerably long, and as a result, the time required for operating the plunger 30 becomes long.

このことは一方でトランスファシリンダ４０の長さが火
となり装置の全体寸法を大きくする問題な生じており、
能力でプランジャ３（）が金型から引抜かれＩＣときに
冷却されるので再び金型内の樹脂に接したときその浴１
龍を妨け、このプランジャの冷え対策としてプランジャ
内にヒータを設ける必要がある。On the other hand, this causes the problem that the length of the transfer cylinder 40 increases and increases the overall size of the device.
Plunger 3 () is pulled out of the mold and cooled during the IC process, so when it comes into contact with the resin in the mold again, its bath 1
It is necessary to install a heater inside the plunger to prevent the plunger from getting cold.

〔発明の目的〕[Purpose of the invention]

本発明は上述の点を考慮してなされたもので１、プラン
ジャストロークの少い樹脂モールド装置を提供すること
を目的とする。The present invention has been made in consideration of the above points, and an object of the present invention is to provide a resin molding device with a small plunger stroke.

〔発明の概要〕[Summary of the invention]

この目的達成のため本発明では、プランジャを金似内に
ｊ反答し、樹脂タブレットを上、下金型間を開いてリー
ドフレームと同様に両金型間から装入するような樹脂モ
ールド封止装置を提供するものである。In order to achieve this objective, the present invention employs resin mold sealing in which the plunger is placed in a metal mold, the resin tablet is opened between the upper and lower molds, and the resin tablet is inserted from between both molds in the same way as the lead frame. It provides a stop device.

〔発明の実施例〕[Embodiments of the invention]

以下第４し１訃よび第５図を参照して本発明を実施例に
つき説明する。Embodiments of the present invention will be described below with reference to No. 4 and FIG. 5.

第４図は本発明の一実施例を示したもので、プランジャ
３２ｆ：下金型船内に収容しこのプランジャ３２を下金
型２０外から駆動するものである。この図において第３
図と同一符号は同一要素を示しており、１３は上金型受
板１２が取付けられる上ベース、Ｉ４および２７は上、
下金型受板１２．２２内に設けられたヒータ、２３およ
び２５はヌペーサ、２４は断熱材でおり、ド金型受板２
２はこれらの部材２３〜２５を介して下ベーク２６に取
付けられる。そしてプランジャ３２が下金ヘリ２０内に
設けられた関係で、中央のエジェクタビンは上金型１０
内に設けている。FIG. 4 shows an embodiment of the present invention, in which a plunger 32f is housed inside the lower mold, and this plunger 32 is driven from outside the lower mold 20. In this figure, the third
The same reference numerals as in the figure indicate the same elements, 13 is the upper base to which the upper mold receiving plate 12 is attached, I4 and 27 are the upper,
A heater is provided in the lower mold receiving plate 12.22, 23 and 25 are Nupesa, and 24 is a heat insulating material.
2 is attached to the lower bake 26 via these members 23 to 25. Since the plunger 32 is provided in the lower mold edge 20, the central ejector bin is located in the upper mold 10.
It is located inside.

この金型１０，２０に樹脂タブレット（もしくは粉末樹
脂）を装入するには、上、下金型１０．２０の少くとも
一方を図示上、下方向に移動して上型本体１１と下側本
体２１とをパーティングラインＰＬに沿って離間させる
。この際、プランジャ３２は樹脂タブレツ）ｆ、受入れ
るに充分な寸法のチャンバを形成するように下降させて
おり、またエジェクトピン３５も上、下金製本体１１．
２１に引込んだ状輻となっている。In order to charge resin tablets (or powdered resin) into the molds 10 and 20, at least one of the upper and lower molds 10 and 20 is moved upward and downward in the figure, and the upper mold body 11 and the lower The main body 21 is separated along the parting line PL. At this time, the plunger 32 is lowered to form a chamber of sufficient size to receive the resin tablet (f), and the eject pin 35 is also lowered to form the upper and lower metal bodies 11.
The convergence is retracted to 21.

との状恕で下金９本体２１の上向のキャビティにリード
フレーム（図示せず）をセットし、プランジャ３２上方
に形成されたトランスファシリンダ（内に樹脂タブレッ
トを装入する。A lead frame (not shown) is set in the upward cavity of the main body 21 of the lower metal 9, and a resin tablet is inserted into the transfer cylinder formed above the plunger 32.

次いで上、下金型１０．２０をパーティングラインＰＬ
で接触するように相互に駆動させ金をを（イ１じいわゆ
る型締めを行う。そしてプランジャ３２ヲ駆動して浴融
状態の樹脂をゲートを介してキャビティに送り込みリー
ドフレームに取付けられｌｊ半導体チップを樹脂封入す
る。この後、上、下金型１０゜２０　ｆ　＠間させれば
エジェクタピン３５がばね力により樹脂酸Ｖ、部および
リードフレーム部を押し、各金型本体１１．２１から成
型品を押出す。この押出された成形品を取出し、次のリ
ードフレームのセットおよび樹脂タブレットの装入を行
う。Next, move the upper and lower molds 10.20 to the parting line PL.
The plunger 32 is then driven to send the molten resin into the cavity through the gate, where it is attached to the lead frame and the semiconductor chip is attached to the lead frame. After that, if the upper and lower molds are spaced between 10° and 20°, the ejector pin 35 pushes the resin acid V, part and lead frame part by spring force, and molds from each mold body 11.21. Extrude the product.The extruded molded product is taken out, and the next lead frame is set and a resin tablet is charged.

第５図は本発明の能の実施例を示したもので、このｊ４
台プランジャ３２を駆動するためのシリンダ４０を下金
型費＆２２内に設けている。曲の構成は第４図の実施例
と同様であり、その動作も同様である。Figure 5 shows an embodiment of the function of the present invention, and this j4
A cylinder 40 for driving the base plunger 32 is provided inside the lower mold 22. The structure of the song is the same as that of the embodiment shown in FIG. 4, and its operation is also the same.

〔発明の効果〕〔Effect of the invention〕

本発明は上述のように、プランジャを金４Ｗ内に収容し
樹脂タブレットを上、下金型間から装入するようにした
ため、従来装置のように樹脂装入のためにプランジャを
引抜く必費がなく、したがってプランジャストロークは
樹脂タブレット寸法に応じたもので足シる。この結果、
プランジャの動作所要時間が大幅に短縮できると共に、
装置の小型化が図れ、プランジャ内のヒータ省略が実現
できる。−また樹脂タブレットの装入をリードフレーム
のセットと同時に行うことができるから作業性が改善さ
れる。さらに従来のマルチプランジャ方式の装置では金
型交換時には、複数のプランジャとこれに中がる均圧磯
構の交換を安し畑雑な作業を快したが、本発明では金型
内にプランジャを設けたため、交換作業を些せず、異種
製品への変更が著しく簡単である。As described above, in the present invention, the plunger is housed in the metal 4W and the resin tablet is charged from between the upper and lower molds, so there is no need to pull out the plunger for resin charging as in the conventional device. Therefore, the plunger stroke is determined according to the resin tablet dimensions. As a result,
The time required for plunger operation can be significantly shortened, and
The device can be made smaller and the heater inside the plunger can be omitted. - Also, since the resin tablets can be loaded at the same time as the lead frame is set, work efficiency is improved. Furthermore, with conventional multi-plunger type equipment, when replacing the mold, the replacement of multiple plungers and the pressure-equalizing rock structure in them was cheap and tedious work, but with the present invention, the plunger is installed inside the mold. Because of this, it is extremely easy to change to a different type of product without incurring any replacement work.

【図面の簡単な説明】[Brief explanation of drawings]

＠１図および第２図は従来の樹脂モールド側止装置、の
外ｆａｉ？、を示す図、第３図（ｌ″ｊ：ｉ！１図およ
び第２図の装置の金型構造を示す断面図、第４図および
第５図は本発明の実施例である。 １０・・・上型、１１・・・上金型本体、１２・・・上
金型受板、１３・・・上ベーク、１４．２７・パヒータ
、２０・・・下金型、２Ｘ・・・下金型本体、２２・・
・下金型受板、２３．２５・・・７ペーサ、２４・・・
断熱材、２６・・・下ペース、　３１・・・シリンダ、
３２・・・プランジャ、３３・・・ガイドビン、３４・
・・ガイドブツシュ、３５吻・・エジェクタピン、３６
・・・エジェクタプレート、４０・・・トランヌファシ
リンダ。 第５図 ９り 手続補正書 昭和５７年１１月１日 特許庁長官　若杉和夫殿 １、事件の表示 昭和５７年特許願第１７１７２４号 ２、発明の名称 樹脂モールド封止装置 ３、補正をする者 事件との関係　特許出願人 （３０７）東京芝浦電気株式会社 ７、補正のス・ｊ象 明細書および図面 ８、補正の内容 明細書および図面の浄書（内容に変更なし）。@Figures 1 and 2 are outside of the conventional resin mold side stop device. , FIG. 3 (l″j:i!) A cross-sectional view showing the mold structure of the apparatus in FIGS. 1 and 2, and FIGS. 4 and 5 are examples of the present invention. 10. ... Upper mold, 11... Upper mold body, 12... Upper mold receiving plate, 13... Upper bake, 14.27. Pajita, 20... Lower mold, 2X... Lower Mold body, 22...
・Lower mold receiving plate, 23.25...7 pacer, 24...
Insulation material, 26... Lower pace, 31... Cylinder,
32... Plunger, 33... Guide bin, 34...
...Guide bushing, 35 snout...Ejector pin, 36
... Ejector plate, 40... Trannufa cylinder. Figure 5 9 Procedural amendment November 1, 1980 Director of the Japan Patent Office Mr. Kazuo Wakasugi 1 Indication of the case Patent application No. 171724 of 1981 2 Name of the invention Resin mold sealing device 3 Person making the amendment Relationship to the case Patent applicant (307) Tokyo Shibaura Electric Co., Ltd. 7, amended specification and drawings 8, revised specification and drawings (no change in content).

Claims (1)

【特許請求の範囲】 １、樹脂」ｄ止すべき物を配した上金型と下金型との空
間に樹脂成形材料を装入し、この材料をプランジャによ
って加圧することによ如前記空間の一部をなすキャビテ
ィに前記材料を注入して樹脂成形物を形成する装置にお
いて、前記午型内にプランジャを設は前記両金型を離間
したときの両型対四部から前６己樹脂成形相料を装入す
るようにしたことを特徴とする樹脂モールド封止装匝。 ２、特許請求の範囲第１項記載の装置において、前す己
下金型内に前記プランジャおよびこのプランジャと協働
するトランスファチャンバをそなえた樹脂モールド封止
装置。[Claims] 1. Resin molding material is charged into the space between the upper mold and the lower mold in which the object to be fixed is arranged, and the material is pressurized with a plunger to form the space. In an apparatus for forming a resin molded article by injecting the material into a cavity that forms a part of the mold, a plunger is provided in the mold, and when the two molds are separated, the two molds are molded from the four parts to the front six parts. A resin mold-sealed packaging box characterized by being charged with a complementary material. 2. A resin mold sealing device according to claim 1, wherein the plunger and a transfer chamber cooperating with the plunger are provided in the lower mold.
JP17172482A 1982-09-30 1982-09-30 Sealing device for resin molding Granted JPS5959428A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP17172482A JPS5959428A (en) 1982-09-30 1982-09-30 Sealing device for resin molding
DE19833335340 DE3335340A1 (en) 1982-09-30 1983-09-29 Resin-mould casting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17172482A JPS5959428A (en) 1982-09-30 1982-09-30 Sealing device for resin molding

Publications (2)

Publication Number Publication Date
JPS5959428A true JPS5959428A (en) 1984-04-05
JPH0242651B2 JPH0242651B2 (en) 1990-09-25

Family

ID=15928491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17172482A Granted JPS5959428A (en) 1982-09-30 1982-09-30 Sealing device for resin molding

Country Status (2)

Country Link
JP (1) JPS5959428A (en)
DE (1) DE3335340A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186938U (en) * 1984-11-12 1986-06-07

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575328A (en) * 1984-03-06 1986-03-11 Asm Fico Tooling, B.V. Automatic continuously cycleable molding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186938U (en) * 1984-11-12 1986-06-07
JPH0238447Y2 (en) * 1984-11-12 1990-10-17

Also Published As

Publication number Publication date
JPH0242651B2 (en) 1990-09-25
DE3335340A1 (en) 1984-06-07

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