JPS5821343A - Resin sealing device - Google Patents

Abstract

PURPOSE:To make the pressure of a resin constant and appropriate for an automatic sealing device by a method wherein many rubber materials with built- in semiconductor devices are respectively contained in cavities of lower metal mold for sealing, resin material pellets are supplied, simultaneously an upper metal mold having independent many plungers on the lower surface is pressed on, and heating is performed simultaneously resulting in collective sealing. CONSTITUTION:Many rubber materials 5 with built-in semiconductor devices are contained in a magazine stocker 19 in multi-superposition, and drawn out from the upper stage in order by a lead-out pin 22 and a chucking device 25 being mounted on a pre-heat rail 23 with a built-in heater 24. Next, this rail 23 is moved to the lower metal mold 17 with a built-in heater 24', the rubber materials 5 are dropped one by one into independent cavities provided on the metal mold 17, and resin pellets 18 stored in a hopper 35 are supplied thereinto via a supply block 39. Thereafter, a molding cylinder 30 having many plungers 9 on the lower surface is pressed down, and a fixed resin sealing is performed by contacting each plunger onto independent cavities.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin sealing device, and in particular, the pressure for pushing resin into a plurality of independent resin-filled cavities has conventionally been achieved by connecting a large number of cavities with a runner, and applying pressure once from - to However, there are problems such as the resin in the launch part being wasted and the molding time required for sealing being long. In Japanese Patent Application No. 11771/1983, the ministry proposed that semiconductor devices and the like be encapsulated with resin by individually pushing pellets into each cavity.

The present invention provides an effective configuration for concretely realizing this resin sealing method, and one embodiment thereof will be described below with reference to the accompanying drawings.

First, the means for preheating the comb material 6 into which the semiconductor device is incorporated and the means for supplying it to the sealing mold will be explained. 19 is a magazine stocker in which the comb materials 6 are stacked and stored at a constant pitch; 20 is a motor; 21 is a comb material transfer loader that can move vertically and horizontally; and 122 is a comb material transfer loader 2.
Reference numeral 1 denotes a comb material pull-out pin attached to the comb material pull-out pin, 23 a preheat rail incorporating a heater 24, and 25 a comb material chucking device attached to the comb material transfer loader 21.

Based on the above configuration, the upper and lower parts of the comb material transfer loader 21,
As it moves from side to side, the uppermost com material 6a of the magazine stocker 19 is pulled out onto the preheat rail 23 by the pull-out pin 22. At the same time, the comb material 6b already on the preheat rail 23 and heated by the heater 24 is supplied to the lower mold 17 by the comb material chucking device 26. After the above operations are completed, the magazine stocker 19 is raised by a predetermined pitch by the motor 2o, and the comb material 6 pulled out onto the preheat rail 23 is moved up by the motor 2o.
b is immediately heated by the heater 24 to prepare for the next cycle. Therefore, by operating the comb material transfer loader 21, the two operations of drawing out the comb material 6a from the magazine case 19 and supplying the preheated comb material 5b to the lower mold 17 can be performed simultaneously. Further, there is an effect that the comb material 5b can be prepared for heating during sealing molding. In this example, when supplying the comb material base, it is pulled out from the magazine stocker 19 onto the preheat rail 25 using the comb pull-out pin 22, but it may also be directly supplied to the preheat rail 23 using a conveyor or the like.

Next, the molding means will be explained.

6 is an upper mold, and 17 is a lower mold, each of which has a built-in heater 24'. 26 is a 1-die plate that fixes the lower die plate 17, 27 is a mold clamping cylinder that is attached to the lower die plate 26, and 28 is a tie bar/\-foot, one end of which is fixed to the upper die plate 29. At step C, the lower die plate 26 is slidably guided.

- The upper mold 6 has resin injection holes 16 and heating heaters 24'' corresponding to the number of semiconductor elements incorporated in the comb material 6C, and is fixed to the upper die plate 29.
is a molded cylinder that provides thrust to the plunger 9.

In the above configuration, when the repeated comb material 6c is supplied to the lower mold 17, the comb 1t11.6c is further heated by the heater 24' and then raised by 1 [7. Next, the mold is tightened with dotting L.
The resin material pellet 18 is introduced into the resin material input -/L16 of the upper mold 6, t2, pushin, ;1. After injection, sealing is performed.

Next, a description will be given of a means for taking out the sealed comb material 5c (hereinafter referred to as a comb molded product) from the mold, and a means for taking out the comb molded product 6d from which the gate residue has been removed.

31 is a chucking device for taking out the comb molded product 6C from the lower mold 17; similarly, 32 is a chucking device for taking out the comb molded product 5d from which gate residue has been removed;
33 is a rail for receiving the molding comb material 6d taken out from the lower mold 17; 34 is the chucking device 31', 32;
This is a take-out loader that moves up, down, left and right. In the above configuration, after the sealing molding is completed and the lower mold 17 is lowered, the take-out loader 34 moves into the mold, grips the comb molded product 6C with one chucking device 31, and holds the comb molded product 6C with the other chucking device 31. At #32, the comb molded product 6d from which the gate residue has been removed is grasped on the rail 33 and taken out. Therefore, in one operation of the 20-ter 34, the comb molded product 6C is taken out and the gate residue is removed. Removed comb molded product 5d
can be taken out simultaneously.

Next, the means for supplying the resin pellet 18 will be explained.

35 is a hopper that stores a large number of resin pellets 18;
6 is a fixed pipe chute with both ends open; 37 is a circular plate with a hole capable of intermittent rotation; the hole 38 is arranged to match the lower opening of the pipe chute 36.

39 is a supply block movable by external power and guides the plurality of resin material pellets 18, and 40 is a drive cylinder. In configuration F, the hopper 35 is moved up and down by the drive cylinder 40, and the resin pellets 18 in the hopper 36 are inserted into the pipe chute 36 in alignment.

The resin pellets 18 are separated into units of 1 (vA) by a disk with a hole 37 and sent to a supply block 39 for fl.

When a predetermined number of resin pellets 18 are guided to the supply block 39, the supply block 39 is moved,
The resin pellets 18 are positioned so as to match the resin material injection holes 16 of the upper mold 6, and the resin pellets 18 are simultaneously introduced into the resin material injection holes 16 at a predetermined time.

This apparatus continuously and cyclically performs the individual operations described above, from supplying the comb material 5 and resin pellet 18 to sealing and molding the comb molded product 5c.
This makes it possible to automatically and continuously take out the liquid.

Next, the resin sealing mold will be explained in more detail based on FIGS. 2 to 2B. In the figure, a compression spring 41 is attached to the upper end of the plunger 9, and the plunger 9 can slide on a block 42. Further, the block 42 and the cover 43 are fixed to each other. In the above configuration, after the resin pellet 18 is charged into the resin material injection hole 16 of the upper mold 6, the plunger 9 is lowered together with the block 42 and the cover 43. At this time, there is a state in which the resin pellet 18 is in the middle of descending as shown in FIG. This makes it possible to maintain the same value even when injecting multiple resin pellets 18 at the same time.
It is possible to perform stable sealing molding without variation.

As described above, according to the present invention, there are many keys and bits.

In addition to making it possible to realize an automatic sealing device by keeping the pressing force of the resin constant, it is also possible to continuously
This will greatly contribute to integrated production.

In this example, a single in-line type semiconductor device was molded, but it is also possible to resin-seal a dual-in-line type semiconductor device. Although it has been applied to resin materials for semiconductor devices, it is not necessarily taken into consideration.

[Brief explanation of drawings]

FIG. 1 is an overall perspective view showing an example of a resin weighting device according to the present invention, and FIGS. 2 and 3 are partial sectional views showing actual M rows of the resin sealing mold of the present invention. The state in which the plunger is at the upper limit and the state in which the plunger is in the middle of descent are shown, respectively. A: Cavity, 6: Upper mold, 9
... Plunger, 16 - Resin material injection hole, 17...
... lower mold, 41 ... biasing means, 42 ...
·block. Name of agent: Patent attorney Toshio Nakao and 1 other person'-
16 Figure 2 f78 Figure 3/7 A

Claims (1)

[Claims] A sealing mold consisting of an upper mold and a lower mold forming multiple independent cavities, and can operate independently by fitting into each resin material injection hole provided in the upper mold and communicating with the cavities. a plurality of plungers, a block that presses the plurality of plungers all at once, and an urging force that is interposed between the block and each of the plungers and urges each of the plungers to be pushed into each resin material input hole. Existing Kotsuma #Moldy Tsuma Poison resin sealing device with means.