JPS5958855A - Power semiconductor module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field to which the Invention Pertains] The present invention relates to a power semiconductor module that includes at least two semiconductor elements and has the following features.

a) a semiconductor element is enclosed in a container; b) the container has a bottom plate and a frame positioned above the bottom plate; and C) a substrate made of a thermally conductive and electrically insulating material is disposed on the bottom plate. d) The connecting conductor, the semiconductor element, and the suppressor as the upper connecting body are stacked on the second plate, e) The stacked parts are in contact with each other under pressure, and f) The plate is placed on the suppressor piece. The force is applied by a spring; g) the leaf spring is locked to the bottom plate via a threaded bolt provided between the stacks;

[Prior art and its problems]

Such a semiconductor module is described in DE 27 28 313 A1. The container of this semiconductor module has a connecting body that exists between two semiconductor bodies. The connection has a hole extending to the bottom through which a screw holding one of the leaf springs passes. For the generation of contact pressure, a threaded bolt or screw is screwed into the bottom plate (C-C) until the spring is still in the connection.The height of the connection, the height of the parts stacked on each other and the spring constant are:
When the spring hits the coupling body, the parts that are in contact with each other are adjusted to each other in such a way that the necessary contact pressure is established.

The above-described device 9 is associated with the disadvantage that the spring pressure depends on the tolerance of the thickness of the parts stacked on top of each other and on the manufacturing accuracy of the coupling. Furthermore, since the contact pressure cannot be adjusted individually depending on the type and area of the semiconductor element, the portions to which pressure is applied for each type must be adjusted to each other.

[Purpose of the invention]

The object of the invention is to improve the above-mentioned semiconductor module in such a way that the contact pressure can be adjusted as required.

[Key points of the invention]

The present invention is characterized in that the distance measured in contact with the threaded bolt between the leaf spring and the bottom plate can be adjusted as desired.

[Embodiments of the invention]

The invention will be explained in detail with reference to one embodiment with reference to FIGS. 1 and 2. FIG.

The semiconductor module shown in FIG. 1 has a container having an insulating frame 2 covered with a metal bottom plate 1 and a lid 3. The semiconductor module shown in FIG. There are two substrates 4 above the bottom plate 1. The substrate 4 consists of a material that is thermally conductive, but electrically optimal. On the board is a stack of parts 71, each of which is to be brought into contact with each other under pressure. :It is superimposed C. The laminate on the right side as viewed from the top has 1 continuous contact member 5. upwards from F. Semiconductor body 7° contact electrode 10. It consists of an upper connection contact body 12 and a pressing piece 14. On the left flll+, the laminate is arranged from bottom to top with connecting contacts 6. half? n-terminal body 8. Contact point9. It has an upper connection contact body 11 and a pressing piece 13. The connecting contacts 6 and 12 can for example consist of a single piece of strip-shaped conductor material bent in the middle. Connection contact body 6゜12
and 11,5 are connected to conductor 18 or 19 or 20.

The above-mentioned laminate is pressurized by a leaf spring 15 that is locked to the bottom plate 1 via a screw 16 arranged between the laminates. The spring 15 is supported against a nut 17 which forms a bearing surface for the spring 15.

In order to control the contact pressure, the nut 15 cannot be pressed down by the tightening tool. The tightening tool is placed on surface 22 (FIG. 2) to compress the spring to the desired contact pressure. The surfaces 22 are located on either side of the axis of symmetry when the spring is symmetrically formed and the axis of symmetry passes through the center of the bolt, and are preferably plane.

If the contact pressure is adjusted by the tool, screw 1
Tighten 6 lightly. Then tighten and remove the tool. In order to prevent the nut 17 from rotating, the spring is
It has a flesh bend part 23 next to 2. Alternatively, the spring may have a threaded hole.

The contact pressure is adjusted individually to the semiconductor A body used by varying the distance a.

〔Effect of the invention〕

In the present invention, a laminate including a semiconductor body twisted by upper and lower connection contact members is placed between two laminates on two thermally insulating substrates arranged on the bottom plate of a container. The space between the semiconductor and the connecting body is adjusted so that the distance a between the plate spring and the bottom plate can be adjusted to allow pressure to be applied by the plate spring, which is secured to the bottom plate of the container through the threaded bolt located therein. This makes it possible to adjust the pressure of the pressurized contact between the parts.This allows the pressure of the pressurized contact to be adjusted each time according to the dimensional tolerance of the part and the area of the mold 2 of the semiconductor element, so the output is always optimal. It is possible to create a power semiconductor module with high reliability by making contact under pressure.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a half i of FIG. 1. It is a top view of -C except for the lid of the 7-body mosoyule. 1... 4゛ bottom plate, 4... board, 5+6.11.12
... Connection contact body, 7, 8 ・Semiconductor element body, 13.14
... Pressing piece, 15... Leaf spring, ], 6... Threaded bolt, 22... Plane portion, 23-... Curved portion. Agent, engineer Iwao Yamaguchi IG I IG 2

Claims (1)

[Claims] 1) a) a semiconductor element is enclosed in a container, b) the container has a bottom plate and a frame positioned above the bottom plate, and C) a thermally conductive and electrically conductive material is disposed on the bottom plate. A substrate made of an insulating material is placed, d) a connecting conductor, a semiconductor element, and a suppressing piece as an upper connecting body are stacked on the substrate, e) each stacked part is brought into pressure contact with each other, and f) Force is applied to the pressing piece by a leaf spring, and g) the leaf spring is secured to the bottom plate via a threaded bolt provided between both stacked sides, and the screw between the leaf spring and the bottom plate A power semiconductor module characterized in that the distance measured in contact with the attached bolt is adjustable. 2. In the module according to claim 1,
A power application characterized in that the leaf spring is formed symmetrically, the axis of symmetry passing through the center of the bolt, and the leaf spring has surfaces formed on both sides of the axis of symmetry for mounting a tightening tool. semiconductor module. 3) In the module according to claim 2,
A power semiconductor module, wherein the surface is flat. 4) In the module according to claim 3,
A power semiconductor module characterized in that a leaf spring is fixed by a nut, and the nut is prevented from rotating by curved parts formed on the sides of the flat parts of the leaf spring.