JPH0584048U - Wiring board connection device - Google Patents

Wiring board connection device

Info

Publication number
JPH0584048U
JPH0584048U JP2156292U JP2156292U JPH0584048U JP H0584048 U JPH0584048 U JP H0584048U JP 2156292 U JP2156292 U JP 2156292U JP 2156292 U JP2156292 U JP 2156292U JP H0584048 U JPH0584048 U JP H0584048U
Authority
JP
Japan
Prior art keywords
wiring board
connector
pair
wiring boards
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2156292U
Other languages
Japanese (ja)
Inventor
一臣 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP2156292U priority Critical patent/JPH0584048U/en
Publication of JPH0584048U publication Critical patent/JPH0584048U/en
Withdrawn legal-status Critical Current

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Abstract

(57)【要約】 【目的】 相対向する一対の配線基板を互いに電気的か
つ機械的に容易に連結および離間でき、連結状態で配線
基板の反りおよびうねりに対しても接点同志が良好に接
続されるようにする。 【構成】 少なくとも何れか一方が可撓性を有する一対
の配線基板1,2間にコネクタ5が介在され、これによ
り配線基板1,2の対向する接点3,4が電気的に接続
された配線基板の接続装置において、可撓性を有する配
線基板2の上面に弾性板10が配置され、この弾性板1
0の上面および配線基板1の下面にそれぞれ補強板1
1,12が配置され、ネジ13により補強板11,12
が締め付けられることにより、一対の配線基板1,2が
コネクタ5の両面に圧着される。
(57) [Abstract] [Purpose] A pair of wiring boards facing each other can be easily electrically and mechanically connected and separated from each other, and the contact points are well connected even when the wiring boards are warped and wavy in the connected state. To be done. A wiring in which a connector 5 is interposed between a pair of wiring boards 1 and 2 at least one of which has flexibility, and the contacts 3 and 4 of the wiring boards 1 and 2 facing each other are electrically connected to each other. In the board connecting device, the elastic plate 10 is arranged on the upper surface of the flexible wiring board 2.
0 and the lower surface of the wiring board 1 are provided with reinforcing plates 1 respectively.
1, 12 are arranged, and the reinforcing plates 11 and 12 are fixed by screws 13.
Is tightened, the pair of wiring boards 1 and 2 is pressure-bonded to both surfaces of the connector 5.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

この考案は一対の印刷配線基板を電気的かつ機械的に容易に接続し、または離 間させることができるようにした配線基板の接続装置に関し、特に一方の配線基 板が可撓性材料で構成されている場合に適用して好適なものである。 The present invention relates to a wiring board connecting device capable of electrically and mechanically connecting or separating a pair of printed wiring boards, and in particular, one wiring board is made of a flexible material. It is suitable to be applied when it has been.

【0002】[0002]

【従来の技術】[Prior Art]

従来のこの種の接続装置を図3について説明すると、剛性を有する配線基板1 と可撓性を有する配線基板2とがコネクタ5を介して接続される。コネクタ5は 図3に拡大して示すように、柔軟性を有する樹脂フィルム6に多数の貫通孔7が 形成され、これらの各貫通孔7内に導電性粒子8が1個づつ配置され、この導電 性粒子8と貫通孔7との間には柔軟性のあるシリコン樹脂などの絶縁樹脂層9が 介在されて構成されている。導電性粒子8の径は樹脂フィルム6の厚みより大き く選定される。このコネクタ5を配線基板1と2との間に介在した状態で、配線 基板1および2をコネクタ5の両面に圧着させると、配線基板1,2の接点3, 4がコネクタ5内の導電性粒子8により電気的に接続される。 A conventional connecting device of this type will be described with reference to FIG. 3. A wiring board 1 having rigidity and a wiring board 2 having flexibility are connected via a connector 5. As shown in the enlarged view of FIG. 3, the connector 5 has a large number of through holes 7 formed in a flexible resin film 6, and one conductive particle 8 is arranged in each of these through holes 7. An insulating resin layer 9 such as a flexible silicone resin is interposed between the conductive particles 8 and the through holes 7. The diameter of the conductive particles 8 is selected to be larger than the thickness of the resin film 6. When the wiring boards 1 and 2 are pressure-bonded to both surfaces of the connector 5 with the connector 5 interposed between the wiring boards 1 and 2, the contacts 3 and 4 of the wiring boards 1 and 2 become conductive inside the connector 5. It is electrically connected by the particles 8.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

この場合、導電性粒子8として樹脂本体の表面に金属メッキを施したものを使 用すると、配線基板1,2をコネクタ5に圧着させたときに導電粒子8の樹脂本 体が撓むので、接点3,4とコネクタ5の導電性粒子8との接触の安定性を得る ために、比較的大きな荷重を加えねばならない問題点があり、また配線基板1, 2の接点3,4のピッチが小さくなるとコネクタ5の導電性粒子8の径も小さく しなければならず、配線基板1,2の反りおよびうねりに充分対応できなくなる 問題点があった。また配線基板1,2をコネクタ5に対して均一な圧力をもって 圧着させることが困難であり、全体的に良好な接触状態が得られない問題点もあ った。 In this case, when the resin body whose surface is metal-plated is used as the conductive particles 8, the resin body of the conductive particles 8 bends when the wiring boards 1 and 2 are pressure-bonded to the connector 5. There is a problem that a relatively large load must be applied in order to obtain stability of contact between the contact points 3 and 4 and the conductive particles 8 of the connector 5, and the pitch of the contact points 3 and 4 of the wiring boards 1 and 2 varies. When it becomes smaller, the diameter of the conductive particles 8 of the connector 5 must be made smaller, and there is a problem that it is not possible to sufficiently cope with warpage and undulation of the wiring boards 1 and 2. Further, it is difficult to press the wiring boards 1 and 2 against the connector 5 with a uniform pressure, and there is a problem that a good contact state cannot be obtained as a whole.

【0004】[0004]

【課題を解決するための手段】[Means for Solving the Problems]

上述の課題を解決するためこの考案においては、柔軟性樹脂フィルム6に形成 された複数の貫通孔7内にそれぞれ1個づつ導電性粒子8が配置されて形成され たコネクタ5が、互いに対向し少なくとも何れか一方が可撓性を有する一対の配 線基板1,2間に介在され、これらの対向する接点3,4がコネクタ5の導電性 粒子8により互いに電気的に接続された配線基板の接続装置において、可撓性を 有する配線基板2の背面に配置された弾性板10と、この弾性板10を含み、一 対の配線基板1,2を挟み込む一対の補強板11,12と、この補強板11,1 2を介して一対の配線基板1,2をコネクタ5の両面に圧着するネジなどの圧着 部材13とから構成されたものである。 In order to solve the above-mentioned problems, in the present invention, the connector 5 formed by disposing one conductive particle 8 in each of the plurality of through holes 7 formed in the flexible resin film 6 faces each other. At least one of them is interposed between a pair of wiring boards 1 and 2 having flexibility, and these opposing contacts 3 and 4 are electrically connected to each other by the conductive particles 8 of the connector 5. In the connection device, an elastic plate 10 arranged on the back surface of the flexible wiring board 2, a pair of reinforcing plates 11 and 12 including the elastic plate 10 and sandwiching a pair of wiring boards 1 and 12, and It is composed of a pair of wiring boards 1 and 2 via reinforcing plates 11 and 12, and a crimping member 13 such as a screw for crimping to both surfaces of the connector 5.

【0005】[0005]

【作用】[Action]

この考案では可撓性を有する配線基板2の背面に弾性板10が配置され、一対 の補強板11,12により弾性板10を介して配線基板1,2がコネクタ5の両 面に圧着されており、剛性を有する配線基板1に反りおよびうねりがあってもこ れに対応して適切な圧着力が得られる。 In this invention, an elastic plate 10 is arranged on the back surface of a flexible wiring board 2, and a pair of reinforcing plates 11 and 12 are used to press the wiring boards 1 and 2 onto both surfaces of the connector 5 via the elastic plate 10. Therefore, even if the wiring board 1 having rigidity is warped or undulated, an appropriate crimping force can be obtained in response to this.

【0006】[0006]

【実施例】【Example】

この考案に係わる配線基板の接続装置の一例を図1を参照して説明する。なお この図において図3との対応部分には同一符号を付加してその説明を省略する。 従ってこの例では配線基板1は剛性を有し、配線基板2は可撓性を有する。 この考案では可撓性を有する配線基板2の背面(図では上面)にゴムなどの弾 性板10が配置され、さらにこの弾性板10の背面(図では上面)と配線基板1 の背面(図では下面)にそれぞれ補強板11,12が配置され、補強板11−弾 性板10−配線基板2−コネクタ5−配線基板1を通して形成された通し孔にネ ジ13が挿通され、その先端が補強板12に形成されたネジ孔14に螺入されて 配線基板1,2がコネクタ5の両面に圧着されている。 An example of a wiring board connecting device according to the present invention will be described with reference to FIG. In this figure, the same parts as those in FIG. 3 are designated by the same reference numerals and the description thereof is omitted. Therefore, in this example, the wiring board 1 has rigidity and the wiring board 2 has flexibility. In this invention, an elastic plate 10 such as rubber is arranged on the back surface (top surface in the figure) of the flexible wiring board 2, and the back surface (top surface in the figure) of this elastic plate 10 and the back surface (FIG. Then, the reinforcing plates 11 and 12 are respectively arranged on the lower surface, and the screw 13 is inserted into the through hole formed through the reinforcing plate 11-the elastic plate 10-the wiring board 2-the connector 5-the wiring board 1, and the tip thereof is The wiring boards 1 and 2 are screwed into the screw holes 14 formed in the reinforcing plate 12 and pressure-bonded to both surfaces of the connector 5.

【0007】 この場合コネクタ5の導電性粒子8として樹脂本体の表面に金属メッキを施し たものを使用でき、または金属球それ自体を使用することもできる。また補強板 11,12としては剛性を有する金属板を使用できる。 この構成によれば可撓性を有する配線基板2の背面に弾性板10が配置され、 一対の補強板11,12により弾性板10を介して配線基板1,2がコネクタ5 の両面に圧着されており、従って剛性を有する配線基板1に反りおよびうねりが あっても、これによる圧着力の変化を充分に吸収でき、コネクタ5への適切な圧 着力が得られる。なお、この例では配線基板1は剛性を有するものとして説明し たが、この配線基板1は可撓性を有するものでもよい。In this case, as the conductive particles 8 of the connector 5, a resin body whose surface is plated with metal can be used, or a metal ball itself can be used. Further, as the reinforcing plates 11 and 12, rigid metal plates can be used. According to this structure, the elastic plate 10 is arranged on the back surface of the flexible wiring board 2, and the wiring boards 1 and 2 are pressure-bonded to both surfaces of the connector 5 via the elastic plate 10 by the pair of reinforcing plates 11 and 12. Therefore, even if the wiring board 1 having rigidity has a warp or a swell, the change in the crimping force due to this can be sufficiently absorbed, and an appropriate pressing force to the connector 5 can be obtained. Although the wiring board 1 is described as having rigidity in this example, the wiring board 1 may be flexible.

【0008】[0008]

【考案の効果】[Effect of the device]

この考案に係わる配線基板の接続装置によれば、剛性を有する配線基板1に反 りおよびうねりがあっても、これに対応して可撓性を有する配線基板2が弾性板 10により撓むので、配線基板1の反りおよびうねりによるコネクタ5への圧着 力の変化を吸収でき、コネクタ5への適切な圧着力が得られる効果がある。また コネクタ5の導電性粒子8の大きさにバラツキがあっても、同様の効果が得られ る。 According to the wiring board connecting device according to the present invention, even if the wiring board 1 having rigidity is warped or undulated, the wiring board 2 having flexibility is flexed by the elastic plate 10 in response to this. The change in the crimping force on the connector 5 due to the warp and undulation of the wiring board 1 can be absorbed, and an appropriate crimping force on the connector 5 can be obtained. Even if the size of the conductive particles 8 of the connector 5 varies, the same effect can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】この考案に係わる配線基板の接続装置の一例を
示す断面図。
FIG. 1 is a sectional view showing an example of a wiring board connecting device according to the present invention.

【図2】この考案に適用できるコネクタの一例を示す断
面図。
FIG. 2 is a sectional view showing an example of a connector applicable to the present invention.

【図3】従来の配線基板の接続装置の一例を示す断面
図。
FIG. 3 is a cross-sectional view showing an example of a conventional wiring board connecting device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 柔軟性樹脂フィルムに形成された複数の
貫通孔内にそれぞれ1個づつ導電性粒子が配置されて形
成されたコネクタが、互いに対向し少なくとも何れか一
方が可撓性を有する一対の配線基板間に介在され、これ
らの対向する接点が上記コネクタの導電性粒子により互
いに電気的に接続された配線基板の接続装置において、 上記可撓性を有する配線基板の背面に配置された弾性板
と、 この弾性板を含み、上記一対の配線基板を挟み込む一対
の補強板と、 この補強板を介して上記一対の配線基板を上記コネクタ
の両面に圧着するネジなどの圧着部材と、 から構成された配線基板の接続装置。
1. A pair of connectors formed by arranging one conductive particle in each of a plurality of through holes formed in a flexible resin film and facing each other, and at least one of which has flexibility. A wiring board connecting device in which these opposing contacts are electrically connected to each other by the conductive particles of the connector, and are disposed on the back surface of the flexible wiring board. A plate, a pair of reinforcing plates including the elastic plate and sandwiching the pair of wiring boards, and a crimping member such as a screw for crimping the pair of wiring boards to both sides of the connector via the reinforcing plates. Wiring board connection device.
JP2156292U 1992-04-08 1992-04-08 Wiring board connection device Withdrawn JPH0584048U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2156292U JPH0584048U (en) 1992-04-08 1992-04-08 Wiring board connection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2156292U JPH0584048U (en) 1992-04-08 1992-04-08 Wiring board connection device

Publications (1)

Publication Number Publication Date
JPH0584048U true JPH0584048U (en) 1993-11-12

Family

ID=12058461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2156292U Withdrawn JPH0584048U (en) 1992-04-08 1992-04-08 Wiring board connection device

Country Status (1)

Country Link
JP (1) JPH0584048U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006004921A (en) * 2004-06-14 2006-01-05 Emcore Corp Optical fiber transceiver module having rigid printed board and flexible printed board
KR101235079B1 (en) * 2012-09-28 2013-02-21 주식회사 프로이천 Connecting apparatus and method for electrical connecting between conductive members
JP2013051052A (en) * 2011-08-30 2013-03-14 Denso Corp Detachable connection structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006004921A (en) * 2004-06-14 2006-01-05 Emcore Corp Optical fiber transceiver module having rigid printed board and flexible printed board
JP2013051052A (en) * 2011-08-30 2013-03-14 Denso Corp Detachable connection structure
KR101235079B1 (en) * 2012-09-28 2013-02-21 주식회사 프로이천 Connecting apparatus and method for electrical connecting between conductive members

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19960801