JPH0778645A - Connector - Google Patents

Abstract

PURPOSE:To provide a connector easy to manufacture and excellent in the insulativeness even though terminals installed at the terminal face of any electric/electronic component to be in connection are in narrow-pitch, multi-core arrangement. CONSTITUTION:In such a way as protruding at both surfaces of a resilient sheet 6, projections 11 are formed in rigid attachment in positions mating with the electrodes 2, 3 arranged on the terminals faces of a base board 3 and IC package 4 to be in connection, and a through hole 12 is formed in the center of each projection 11, and through-hole plated electrodes 5 are provided as leading from one top face of each projection 11 to the other top face while penetrating the through hole 12. Thus an intended connector is accomplished. On one surface of this connector, the electrodes 2 of the board 1 are arranged so as to mate with the respective projections 11, while the electrodes 3 of IC package 4 are arranged on the other surface in such a way as mating with the respective projections 11, and each interterminal area is connected electrically by pinching fast the relevant projection 11 by the electrode 3 of the IC package 4 and its mating electrode 2 on the board 1.

Description

Detailed Description of the Invention

[0001]

This invention relates to an IC package, I
Electricity for electrically connecting a planar terminal arranged on the terminal surface of an electric / electronic component such as a C chip, a printed wiring board, or a wiring board to a planar terminal arranged on the corresponding terminal surface of the electric / electronic component. The present invention relates to a connector for connection.

[0002]

2. Description of the Related Art Conventionally, a land grid array (IC
A type of package), IC chips, electrical / electronic components such as flexible printed wiring boards, and electrical / electronic parts such as wiring boards and subcarriers.
An anisotropic conductive film is used as a connector for electrically connecting electronic components. This anisotropic conductive film is configured such that conductive particles are dispersed in a resin adhesive so that when the film is pressed, it conducts only in its thickness direction.

FIG. 3 shows an example of connecting an electrode on a wiring board and an electrode of an IC chip (or IC package) using an anisotropic conductive film. Note that IC chips and I
Since the internal structure of the C package is not the gist of the present invention, in the drawings, these are not shown in cross section, but only the electrodes thereof are shown in cross section. The anisotropic conductive film shown in FIG. 3 has a structure in which conductive particles 8 are dispersed in elastic rubber 7, and as shown in FIG. The electrode surface of the wiring board 1 on which the electrodes 2 are arranged is opposed to the lower surface), and the IC package (or IC chip) 4 is provided on the other surface (upper surface in the figure) of the anisotropic conductive film.
The electrode surfaces on which the electrodes 3 are arranged face each other, and the IC package 4 is pressed against the wiring board 1 side as shown in FIG.
And hold the anisotropic conductive film under pressure.

When this anisotropic conductive film is pressed, it conducts in the thickness direction thereof, and the electrodes 3 of the IC package 4 are made conductive.
Are electrically connected to the electrodes 2 of the wiring board 1 facing each other. Therefore, it functions as an electrical connector. Further, as a special anisotropic conductive film, there is also one in which a conductive sphere 9 having a diameter of several hundred μm is fixed by a resin film 10 as shown in FIG. The conductor balls 9 are arranged and fixed on the resin film 10 so that the heads of both sides of the resin film 10 are exposed. Generally used as the conductor sphere 9 is a metal sphere or a plated elastic sphere. These conductor spheres 9 are terminals such as electrodes, pads, lands, etc. arranged on the terminal surface of the electric / electronic component to be connected. It is arranged in a pattern that matches the pattern of. That is, the resin film 10 is provided at the position corresponding to the terminal arranged on the terminal surface of the electric / electronic component to be connected.
Fixed to.

On one surface (lower surface in the figure) of this special anisotropic conductive film, the electrode 2 of the wiring board 1 is arranged so as to face a predetermined conductive ball 9, as shown in FIG. Then
On the other surface (upper surface in the figure) of the anisotropic conductive film, the electrode 3 of the IC package (or IC chip) 4 is arranged so as to face a predetermined conductor sphere 9, and as shown in FIG. The IC package 4 is pressed to the wiring board 1 side, and a predetermined conductive ball 9 of a special anisotropic conductive film is sandwiched between the electrode 3 of the IC package 4 and the corresponding electrode 2 of the wiring board 1 by pressing. State).

Since the conductor sphere 9 has its head protruding from both sides of the resin film 10, when pressure is applied, the electrode 3 of the IC package 4 and the electrode 2 of the wiring substrate 1 facing the electrode 3 are electrically connected via the conductor sphere 9. Connected to. Therefore, it functions as an electrical connector. Here, in the present specification, components and elements such as an IC package, an IC chip, a printed wiring board (including a flexible one), a wiring board (including a flexible one), a subcarrier, etc. are collectively referred to. Called "electrical / electronic parts",
In addition, a surface on which electrodes of these electric / electronic components are led out or formed, a surface on which electrode terminals are led out or formed, a surface on which connection pads or lands are formed, a surface on which connection terminals are led out or formed, etc. Then, the electrodes, pads, lands, etc. are collectively referred to as "terminals".

[0007]

In the conventional anisotropic conductive film having the structure shown in FIG. 3, since the conductive particles dispersed in the resin adhesive are used for the electrical connection, the conventional anisotropic conductive film is not connected to the terminal surface. When the number of terminals to be arranged increases and the distance between terminals becomes narrower (narrower pitch), there is a serious drawback that a problem occurs in insulation between adjacent terminals.

On the other hand, in the structure shown in FIG. 4, since the electrical connection is made by the conductor balls arranged in a predetermined pattern, the insulation problem does not occur even if the pitch is narrowed. However, there are difficulties in manufacturing, such as the need to use conductor balls that have been accurately classified to make the heights uniform, and especially when the terminals have a narrow pitch and multiple cores, manufacturing becomes extremely difficult. .

The object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, to provide excellent insulation even if the terminals arranged on the terminal surface of the electric / electronic component to be connected have a narrow pitch and a large number of cores, and can be manufactured. An object is to provide a connector for easy electrical connection.

[0010]

According to the present invention, an electrical connecting connector is provided at a position corresponding to the position of the elastic sheet and the planar terminal arranged on the terminal surface of the electric / electronic component to be connected. A projection integrally formed on the elastic sheet so as to project on both surfaces thereof, a through hole formed in the projection, and the other top surface of the projection from one top surface of the projection through the through hole. And a conductive layer formed continuously with the above, and electrically connecting between planar terminals of two electric / electronic components to be connected by using the protrusion as a contact.

[0011]

According to the above construction, the two electrical components to be connected by the through-hole conductive layer formed on the elastic protrusion
Since the planar terminals of the electronic component are electrically connected, the terminals can be electrically connected with high reliability. Further, since the through-hole conductive layer conducts only in the front-back direction (through-hole direction), insulation between adjacent terminals can be sufficiently ensured even if the pitch of the terminals is narrowed. On the other hand, it is extremely easy to form a protrusion on the elastic sheet that matches the pattern of the terminal of the electric / electronic component to be connected and to form a through-hole in this protrusion, which is extremely easy with the current molding technology. Since the formation of the through-hole conductive layer can be easily realized by, for example, an electroless plating method to which a printed circuit board manufacturing technique is applied, no problem in manufacturing occurs even if the terminals have a narrow pitch and a large number of cores.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic perspective view showing an embodiment of an electrical connection connector according to the present invention. The electrical connection connector of this embodiment includes an elastic sheet 6 and planar terminals such as electrodes, electrode lead-out terminals, pads, lands, etc. arranged on the terminal surfaces of electric / electronic components (not shown) to be connected ( At a position corresponding to the position of (not shown), the protrusion 11 formed on the elastic sheet 6 so as to project on both sides thereof.
The through hole 12 formed in the protrusion 11, and the protrusion 1
The conductive layer is formed continuously from one top surface of one of the protrusions through the through hole 12 to the other top surface of the protrusion.

The elastic sheet 6 and the protrusions 11 are integrally formed of the same material, and thus the protrusions 11 have elasticity. The number of the projections 11 is the same as the number of the planar terminals arranged on the terminal surface of the electric / electronic component to be connected, and as described above, these projections 11 have a pattern matching the pattern of the planar terminals on the terminal surface. Arranged. The through hole 12 is formed at the center of each protrusion 11. As shown in FIG. 2, in this embodiment, the inner surface of the through hole 12 as well as the protrusion 11 is formed by the electroless plating method to which the printed circuit board manufacturing technique is applied. Plating is applied to reach the upper and lower surfaces, and a continuous plating electrode (through-hole electrode) 5 is formed from one top surface of the protrusion 11 through the through hole 12 to the other top surface.

An example of connecting the electrodes on the wiring board and the electrodes of the IC package by using the connector having the above structure is shown in FIG.
Shown in. Since the internal structure of the IC package is not the gist of the present invention, in the drawings, these electrodes are not shown in cross section, but only their electrodes are shown in cross section. First, the same figure (a)
One side of this connector as shown in (the bottom side in the figure)
The plurality of electrodes 2 of the wiring board 1 are arranged so as to face the predetermined protrusions 11, and the other surface of the connector (upper surface in the figure)
A plurality of electrodes 3 of the IC package 4 are provided with predetermined projections 11
It is placed so as to face with. Next, as shown in FIG. 2B, the IC package 4 is pressed against the wiring board 1 side,
This pressurized state (a state in which a predetermined protrusion 11 of the connector is sandwiched between the electrode 3 of the IC package 4 and the corresponding electrode 2 of the wiring board 1) is maintained.

Since the protrusion 11 has a through-hole plated electrode 5 and both ends of this electrode 5 are on both top surfaces of the protrusion 11, when the protrusion 11 is pressed, as shown in FIG.
Has a slightly crushed shape, and gives an elastic force that pushes the electrode portions on both top surfaces of the projection 11 outward. Therefore, the plated electrode 5 and the electrode 2 of the wiring board 1 and the electrode 3 of the IC package 4 maintain a very good electrical contact state, and the electrode 2 of the wiring board 1 facing the electrode 3 of the IC package 4 is held. And are electrically connected with high reliability.

As described above, according to the present invention, the two electric / electrical components to be connected by the through-hole electrode 5 formed on the projection 11 having a pattern matching the pattern of the terminals arranged on the terminal surface of the electric / electronic component to be connected. Since the planar terminals of the electronic component are electrically connected to each other, the insulation between adjacent terminals can be sufficiently satisfactorily secured even if the pitch of the terminals is narrowed. Further, forming the protrusion 11 on the elastic sheet 6 that matches the pattern of the terminals arranged on the terminal surface of the electric / electronic component to be connected means that the protrusion 11 and the elastic sheet 6 are integrally formed of the same material. Therefore, the current molding technology is extremely easy, and the formation of the through-hole electrode 5 can be easily realized by an electroless plating method or the like, which causes a manufacturing problem even if the terminals have a narrow pitch and a large number of cores. Does not occur at all.

The above embodiment is merely an example of the present invention. Therefore, the shapes and structures of the connectors, the projections forming the connectors, the through-hole electrodes, etc., the materials, etc. can be variously changed and modified as necessary. It is a thing.

[0018]

As described above, according to the present invention, the through-hole conductive layer is formed on the elastic projection integrally formed on the elastic sheet, and the two electrical layers to be connected by the through-hole conductive layer. / Since the planar terminals of electronic parts are electrically connected, the conductive layer presses against the terminals due to elastic force when pressure is applied, and therefore the terminals are electrically connected with high reliability. You can Also,
The protrusions are arranged in a pattern that matches the pattern of the terminals to be connected, and the through-hole conductive layer conducts only in the front-back direction (through-hole direction). Good insulation can be secured. Further, since the through-hole conductive layer can be formed by, for example, through-hole plating, there is no problem in manufacturing even if the terminals have a narrow pitch and a large number of cores, and mass production is easy. There is a remarkable effect of.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of an electrical connection connector according to the present invention.

2 is a circuit board terminal and IC using the connector of FIG.
It is a figure for demonstrating the aspect which connects the terminal of a package, (a) is a state before a connection, (b) is a schematic sectional drawing which respectively shows a connection state.

3A and 3B are views for explaining a mode in which terminals of a wiring board and terminals of an IC package are connected using a conventional anisotropic conductive film, FIG. 3A is a state before connection, and FIG. It is each a schematic sectional view showing a state.

FIG. 4 is a diagram for explaining a mode in which terminals of a wiring board and terminals of an IC package are connected using a conventional special anisotropic conductive film, (a) is a state before connection, and (b) is a diagram.
FIG. 3 is a schematic cross-sectional view showing a connected state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 2 Wiring board electrode 3 IC package electrode 4 IC package 5 Plated electrode 6 Elastic sheet 7 Elastic rubber 8 Conductive particles 9 Conductor ball 10 Resin film 11 Protrusion 12 Through hole

Claims (1)

[Claims] 1. A terminal surface on which planar terminals of electric / electronic components such as IC packages, IC chips, printed wiring boards, and wiring boards are arranged, and terminals on which corresponding planar terminals of electric / electronic components are arranged. An electrical connector for electrically connecting between the planar terminals of these terminal surfaces, which is disposed between the elastic sheet and the terminal surface of the electric / electronic component to be connected. At the position corresponding to the position of the terminal,
A protrusion integrally formed on the elastic sheet so as to project on both sides thereof, a through hole formed in the protrusion, and the other top of the protrusion from one top surface of the protrusion through the through hole. A through-hole conductive layer formed continuously on the surface, and electrically connecting between planar terminals of two electric / electronic parts by using the protrusion as a contact.