JPS5957492A - Method of electrically connecting flexible board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a flexible substrate for electrically connecting a conductive layer and a second conductive layer of a broom 1 in one or more flexible substrates. Related to electrical connection method.

[Technical background of the invention]

Conventionally, as a method for electrically connecting the front and back sides of a flexible substrate having a special conductive layer on both sides, for example, the method shown in FIG. 1 or 2 has been used.
There was a method as shown in the figure.

In the method shown in FIG. 1, a through hole 3 is formed in lands m2a and 2b facing each other on the front and back sides of the flexible substrate 1, and conductive plating (through hole plating) 4 is applied to the inner wall of the through hole 3. Further, in the method shown in FIG. 2, a through hole 3 is formed in the land portions 2h and 2b facing each other on the front and back sides of the flexible substrate 1, a wiring such as copper m5 is passed through the through hole 3, and the end of the copper 1iJ5 is passed through the through hole 3. The land portions are soldered to 2m and 2bK, respectively.

[Problems with background technology]

However, all of the above methods had the following drawbacks. That is, in the method shown in FIG. 1, since through-hole plating is applied, the flexible substrate becomes more expensive and takes longer to manufacture than a flexible substrate that does not undergo plating treatment using M[i. Furthermore, the method shown in FIG. 2 requires a process of inserting the copper wire 5 into the through hole 3 and bending the copper thread 7g 5, resulting in poor workability.

[Purpose of the invention]

This invention was made in view of the above circumstances, and its purpose is to easily connect M1' between the front and back conductor layers without through-hole plating and (1) forming a through hole for raising the T1 wire.
It is an object of the present invention to provide a method for electrically connecting a flexible board, which enables electrical connection, shortens the manufacturing period and work hours, and provides an inexpensive flexible board.

[Summary of the Invention] That is, the method for electrically connecting a flexible substrate according to the present invention includes, for example, when connecting land portions on the front and back sides of a double-sided flexible substrate, a U-shaped electrical connection is made to the flexible substrate, for example. A needle is press-fitted and passed through, and its tip is bent to connect the front and back land portions using the electrical connection needle.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIG. m). In FIG. 3, 11 indicates table #-[opposed land portion 1
The land portions 12h and 12b of this substrate 11 are connected by, for example, a U-shaped electrical connection needle 13 with a bent tip, and a solder 14. The connection is firmly fixed.

Electrical connection between the front and back sides of the flexible substrate 11 is performed in the following manner. That is, first, the surface land portion 12a of the flexible substrate 11 on which conductor layers are formed on both sides.
and back surface land portions 12b are formed to face each other. and,
The U-shaped electric and air connection needle 13 has a surface land part in 12 colors.

The flexible substrate 1) and the back surface land portion 12b are pressed into the flexible substrate 1) and the rear surface land portion 12b in order, and the tip thereof is penetrated. For example, a stapler can be used as the electrical connection needle 13, and as shown in FIG. By using this stapler 15, an electrical connection needle 13Fi having a penetration of 1.5 m is formed, and its tip is attached to the back runt 9 portion 12b.
It is bent inward to form a shape that sandwiches the front and back sides of the flexible substrate 1. I tried my best and finally '@
1. Connecting needle 13 and land portions 12m and 12b on the front and back surfaces
Connect and fix with solder 14+1 key. Thereby, the front and back sides of the flexible substrate 1 are electrically connected.

That is, in this method, holes are made using the electrical connection needles 13 themselves without forming through holes in the flexible substrate 11 in advance, and by changing the width, length, and material of the electrical connection needles 13 , land portions 12 & 12 on front and back surfaces
It is possible to control the size of b, the thickness of the flexible substrate 1, the bending length of the leading part of the electrical connection needle 13, and the insertability.

According to this method, there is no need to form through holes in the flexible substrate 1 in advance, through-hole plating as shown in Fig.
This makes it possible to obtain an inexpensive flexible substrate. The electrical connection needle 13 is the most familiar example, using a stapler used for the purpose of fixing paper, and as a device for press-fitting this needle into the flexible substrate 1. Since the stapler 15 can be used, the cost can be reduced. Furthermore, the stapler 15 is easy to operate, and since the flexible substrate 1 is thin, it can be used easily and safely with light force.

In the above embodiment, only the land portions 12h and 12b on the front and back surfaces of the flexible substrate 11 are electrically connected, but as shown in FIG. By changing the surface land area 12m
, 12a can also be done at the same time. Note that 16 is a wiring turn on the flexible board 11, and this wiring turn 16 and electrical connection needle 13
Insulation from the flexible substrate 1 can be achieved, for example, by attaching an insulating cover to the flexible substrate 1 or by applying insulation treatment to the lower surface of the electrical connection needle 13.

In the embodiments of FIGS. 3 and 5, the electrical connection needle 1
3 was used for electrical connection between the front and back sides of the double-sided flexible substrate 11, but in the case of a single-sided flexible substrate 2 as shown in FIG. 6, it can be used for jumper wiring.

Further, as shown in FIG. 7, two single-sided flexible substrates 2 are superimposed and fixed by electrical connection needles 13, and each surface land portion 121k+1
It is also possible to make an electrical connection between 2a. In addition, the fifth
Since the same effect as the embodiment shown in FIG. 3 can be obtained in any of the embodiments shown in FIGS.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to easily carry out the heating process between the first conductive layer and the second conductive layer in a plurality of flexible substrates. , it is possible to shorten the manufacturing period and the number of work steps, and also to produce an inexpensive flexible substrate 'k (4+).

[Brief explanation of drawings]

1 and 2 are sectional views showing a conventional method for electrically connecting a flexible substrate, FIG. 3 is a sectional view showing an electrically connecting method for a flexible substrate according to an embodiment of the present invention, and FIG. 4 is a side view of a suppression press-fitting machine used in the method of FIG. 3, and FIGS. 5 to 5 are sectional views showing other embodiments of the present invention. DESCRIPTION OF SYMBOLS 11... Double-sided flexible board, 12a... Front surface land part, 12b... Back surface land part, 13... Electrical connection needle, 14... Solder, 21... Single-sided flexible board.

Claims (3)

[Claims] (1) In a method for electrically connecting a flexible substrate in which a first conductive layer and a second conductive layer are electrically connected in one or more flexible substrates, the flexible substrate When the 1F1' electrical connection needle is passed through the predetermined position, the tip thereof is bent and the electrical connection needle is inserted into the conductive layer of 1 and the second conductive layer. A method for electrically connecting a flexible substrate, the method comprising electrically connecting a flexible substrate to a body layer. (2) The method for electrically connecting a flexible substrate according to claim 1, wherein the electrical connecting needle has a U-shape. (3) The flexible substrate according to claim 1 or 2, wherein the connection portion between the electrical connection needle and the first conductor layer or the second four-conductor layer is soldered. electrical connection method.