JPS5954462A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5954462A JPS5954462A JP16228182A JP16228182A JPS5954462A JP S5954462 A JPS5954462 A JP S5954462A JP 16228182 A JP16228182 A JP 16228182A JP 16228182 A JP16228182 A JP 16228182A JP S5954462 A JPS5954462 A JP S5954462A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jig
- feed
- ribbon
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
本発明（：シ、半導体装置の製，；ｉ：ｉ方法に係り、
特に連続的に供給されるリードフレーム上にＭ数の半導
体ぺ１／ノトがソルダ−を介し“Ｃ載置され、このベレ
ノトトにＩＪ−１−が固定される複合半導体装置の前記
ソルダの供給方法を改良（、７だ半導体装置の製造方法
に関−４゛る。[Detailed Description of the Invention] The present invention relates to a method for manufacturing a semiconductor device,
In particular, the solder supply method for a composite semiconductor device in which M number of semiconductor plates are placed on a lead frame which is continuously supplied via solder, and an IJ-1 is fixed to the lead frame. Improvements (Regarding the manufacturing method of semiconductor devices)
従来、コノ種ノ゛ＩＬ）ｒＩ−休装置は、第Ｊ 図Ｋ
ｙ）： −４− Ｊ、うれ：して系１１Ｌンてら７する
。Conventionally, the Kono species (IL) rI-deactivation device is shown in Figure J.K.
y): -4- J, Ure: then system 11L turn 7.
すなわち、所定のノ１り状Ｋ ｒＪち抜か′Ｉｌたリー
ドフレーム１に切欠部２ヶ打才イ）伎゛Ｕタ決め用の刀
−ボノ治具；３ろでの−１−１、９二のカーボン治具３
の１・υ大部２ＶＸ真空ビン１ニノト等を用し・て円形
のソルダを各半Ｎｌ 体ベレツトｆσに人ハ、その１−
ｒ回ＩＪ． ＜ 白’． ７ト１。That is, there are two notches in the lead frame 1 which has been punched out in a predetermined shape. Second carbon jig 3
1. Using a large 2V
r times IJ. <White'. 7to1.
セノト等を川（・て゛１４導体ベレノト，５をのせ、サ
１′）にその上（・で１１面にソノし夕゛をクラノトし
たり− ド６を入れる。Place the senoth, etc. on the river (14 conductor berenoth, 5, and 1') on top of it (on the 11th side with ・) and place the evening on the 11th side and place the do 6.
に記の状ＫＪ，！ビ′Ｃ加熱でい等を；、＋１ｒ ３７
，ｉ ３させるとソルダ４が溶融し、１ノ−１・゛ル−
ノ， Ｉ Ｋ ’Ｉ’＝＞１体ベレノト５およびリー
ド（ｊが固着され、第２図に示すーｊ、ラな半製品がで
きる６。Letter KJ,! Bi'C heating, etc.;, +1r 37
, i 3, the solder 4 melts and becomes 1 no.
ノ, I K 'I'=> 1 body Berenot 5 and Lee
The semi-finished product shown in Figure 2 is formed.
〔背景技術の間ＩＭ，１．′．ｉ．Ｊ
しかるに、上記の場合、リ− ドフレ 人１に半導体ぺ
ｊ／ノト！ｊを１．’ｉｌ定するためのソルダ４ろ′１
′モ空ピンセノト等のＲ：ｉ 、１”！を用い１個４０
に手作業゛Ｃ人Ｊ［るために非ｔｉｌ： ｉｉ、的であ
り、かつリ １・買ノーノ、１の所定の位置に重数に位
置決めして置くことが困離″（−１土／、−たとえ、ｆ
ｉｌ置決めしＣ置いても容易に位（Ｖｌ −４’ Ｊｔ
する欠点があった。[Background technology IM, 1. '． i. J However, in the above case, there is a semiconductor computer for Lidfre person 1! j as 1. Solder 4 for fixing 'il'1
'R:i, 1''!
It is difficult to manually position and place the parts in the predetermined positions and in large numbers. ,-even if f
It is easy to position (Vl -4' Jt
There was a drawback.
１発明の１−１的」
本発明は、１．記の事情に基づき／Ｉｊ１、されたもの
で、特（・こ図示のような半導体ベレットを２個使用す
る複合゛１パ勇体装置６の１ｆｒｌ＼′１時に事ｊげ７
． ；ソルダの供給力ＪＪ ：ｔ、、；よひソルダの位
置決めを・自動的Ｕ（二行える」、うｉｙ ＋、 ／、
−゛Ｉ′、導体装置の製造ノｊ法イｅ ４７〜供するこ
とを目的と−Ｊる。1-1 of the invention” The present invention has the following features: 1. Based on the circumstances described above, it was made especially for the case of a complex one-power device 6 using two semiconductor pellets as shown in the figure.
．． ；Solder supply force JJ ：t、、；Solder positioning can be carried out automatically
-I', for the purpose of providing a method for manufacturing a conductor device.
［発明の概要〕
すなわち、本発明は、繰り出しボビンに巻回された帯状
のリボンソルダを送りロールによりガイド部をイ１Ｊる
カーボン治具」二に供給し、カッタ装置により短間状に
切断し２、前記ガイド部を介１−．てフｊ７−ム＋の所
定位置に自動的に位置決めされて、短冊状のソルダが供
給されるようにし、ノルダ挿入作猶の労力な軽減し／１
−１−とを特徴とする半導体装置の製造方法である。[Summary of the Invention] That is, the present invention provides a ribbon solder wound around a feeding bobbin, which is fed to a carbon jig with a guide portion by a feed roll, and cut into short pieces by a cutter device. , through the guide portion 1-. The solder strip is automatically positioned at a predetermined position on the frame and the solder strip is supplied, reducing the labor required for inserting the solder.
-1- A method for manufacturing a semiconductor device, characterized by: -1-.
（発明の実施例〕
以Ｆに４・発明の一実施例に・′−〕〜、図面な参照！
−て説明ずイ２．。(Embodiment of the Invention) Hereinafter, 4. An Embodiment of the Invention.
- No explanation 2. .
本発明υ、’ Ｉｌｌい−，１）ソルダは第：３図にＴ
：、−，４−’ 、、ｌ、′）に繰り出しボヒ／・＋
（１＋、で蓚回さねた帯状のリボ、／ソＪｌダＩＬろ、
・短間状の小片ソルダー２に切断１．−（用いろ。The present invention υ,'Illii-,1) The solder is shown in Figure 3.
:, -,4-',,l,')
(1+, the belt-shaped ribbon that turned around, / So Jl Da IL Ro,
・Cut into short pieces of solder 2 1. - (Use it.
すなわち、；：’ｐ； ４図に示すように、所定（１）
形状乙・（−１′Ｊ［・抜℃・／、−り トル
型１６か１°，）成て）カ ボー／治具１４内に収容６
＼ね、、ご−の治具１４（土カッタ装置１７の下部にス
ｉ・）・２１８を介１，て位置決め固定されイ）１。That is, ;:'p; As shown in Figure 4, the predetermined (1)
Shape: (-1'J [-pull ℃/, -liter-shaped 16° or 1°,) formed)] Cover/stored in jig 14 6
The jig 14 (positioned and fixed at the bottom of the soil cutter device 17 via 218) 1).
カーボン治具１４の上型１． ５ （ｔ’ｔ−、、 ’
ｔ．Ｉ、リ− ド−ル−ム１３の半導体ベレット（図示
−）↓ず）が載置。される位置に対応し，て長手方向い
一複数のガイド部Ｔ９が形成されている。Upper mold 1 of carbon jig 14. 5 (t't-,,'
t. I, the semiconductor pellet (not shown) in lead room 13 is placed. A plurality of guide portions T9 are formed in the longitudinal direction corresponding to the positions where the guide portions T9 are positioned.
この方イト部１９は、たとえば第４ ｔＭの断面図に示
ずよう（ＣＦ部が縮径Ｊるテーバ形状，になし、後述す
る切断後（１）小片ツル々゛１２がリードルム１３寸−
のＪソＩ′Ｊ１１１′白に自動的にイ＼ン置決めされて
）Ｊ．５に構成されている，。This side part 19 has a tapered shape in which the CF part has a reduced diameter, for example, as shown in the 4th tM cross-sectional view.
J so I'J111' is automatically positioned in white) J. It is composed of 5.
カッタ装買１７は、表面に凹凸を形成しまた送り［’．
Ｉーール２０，２Ｏｆｆよって繰り出されたリボンソル
ダ１１を鉛直力向に往復動すイ）カッタ刃２１にょ１：
） Ｊ’．９−ｒ定長さの知イ１１）状の小片ソルダＬ
２に切断する。The cutter mounting 17 forms unevenness on the surface and feeds ['.
A) Cutter blade 21 that reciprocates the ribbon solder 11 fed out by the I-rolls 20, 2Off in the direction of vertical force.
) J'. 9-r Fixed length small piece solder L
Cut into 2.
切断さＪｔた小片ソルダ１２は表面が凹凸状（こなって
（・イ）。小片ソルダ１２の大ぎさば、半導体ペレット
２個分を溶着−Ｃ′きる大きさとしている。The surface of the solder piece 12 that has been cut is uneven (concave and convex).The size of the solder piece 12 is large enough to weld two semiconductor pellets -C'.
ト記力，ノ，り装置Ｉ７で切断さ１また小Ｊ７ノルダ１
２は、トノｊｉ′こ自然落下し、カーボン治具１４のメ
ｊイ ド部１９に案内され、リ− ドル−ノ、１． ３
−）−（・（−導びかＪ（ろ１。It is cut by the cutting device I7 and the small J7 cutter 1.
2 naturally falls from the top and is guided to the maid part 19 of the carbon jig 14, leading to the top, 1. 3
-)-(・(-Guidance or J(ro1.
１−・記のカッタ装置西”Ｌ ７ 、ｔ６ 、１：ひリ
ボノソルダＩＬの繰り出し機構部は、リードル ］・の
連数に対妃；シて設けら直、たとえば［（）連のリ−
ドフレーノ、の場合には、ぞねに対応した幅のカット装
置お」、びリボノソルダの繰り出し機構部が設けられる
。1--The feed mechanism section of the cutter device West "L7, t6, 1: The feed-out mechanism section of the reed solder IL is installed directly opposite the reeds of the reeds, for example, the reeds of the reeds of reeds.
In the case of Dofreno, a cutting device with a width corresponding to the width and a mechanism for feeding out the ribono solder are provided.
リードノ１〜′−人１３＋に１−記のようε・ｃｌ〜て
小片ツル々゛１２が供給され、次いで従来と同様の方法
により半導体ベレットおよびリード（図示防ず）が順次
供給さね、最終的に加熱炉等を通過させ、第２図に示す
ような半製品が完成−・Ｉイ）３、［発明の効＜ｉｙ
］
以十のようυて不発明は、ガイド部を設けたノｌーボン
治け１−（・こ繰り出しボビンに゛巻回４〉ね人−リボ
ノソルダを送りロールにより供給し，、カッタ装［バに
て短冊状の表面凹凸の小片ソルダー
小片ソルダを自然落丁によりカ ボン治具のガイド部を
介Ｉ〜でリ ドフレ ）、−１置フ）１−リ１′ｊド位
置（・ニー供給し得るようにシ，，たので、ソルダ供給
の労力、１１、５間な著しく軽減ｌ−，、生産能率の向
Ｉ化な図りイ（）イ）、、庄だ、第２ Ｍ Ｖ ｚｉ．
−、ｌ Ｊ： ’Ｉ ７４： ｉｉｉ ｒｐ ｌ′”、
Ｑ体裟ｉＦ７’， ’ｊ： 、’ ”り作−１゛ル場＆
ｉｒ ｉｌｌ：、ｉ＋ｔ４常、２個ノノルタハＩ，ｒ：
４１／．−彎とするが、不発明では１個の小片ソルダー
（′Ｘｌ済ツメ、、部品の削減及び））Ｌｉミグ価の低
減（Ｃ，１、す、製造）１；ミ価の低減を図’ｌ ｒ！
）るとともにソルタ゛の表面を凹凸い′形成したのて゛
リードノ１ノーノ・と冶（↓のスギマからソルダが移動
しないのでｆ〃置ず」しが減少し、安宇１〜た品質の腹
合半導体装置を得ることが゛（′−きテ）１、As shown in 1-, small pieces of vines 12 are supplied to the leads 1 to 13+, and then semiconductor pellets and leads (not shown) are sequentially supplied in the same manner as in the past. The semi-finished product as shown in Fig. 2 is completed by passing through a heating furnace etc.
] As described above, the invention is based on a soldering device provided with a guide portion (1), which is supplied with ribbon solder by a feeding roll, and which is wound around a feeding bobbin. At the point, a small strip of solder with an uneven surface is passed through the guide part of the carbon jig by natural falling off, and then it is fed to the position (-knee). As a result, the labor for supplying solder was significantly reduced between 11 and 5, and the aim was to improve production efficiency.
-, l J: 'I 74: iii rp l''',
Q body iF7', 'j: ,'"Resaku-1゛ field &
ir ill:, i+t4 always, 2 nonortaha I, r:
41/. - However, in the uninvention, one small piece of solder ('Xl pre-finished tabs, , parts reduction and)) Reduction of Li MIG value (C, 1, S, Manufacture) 1; l r!
At the same time, the surface of the solder is made uneven so that the solder does not move from the lead solder. To obtain ゛('-kitte)1,
第１図ＧＪ”、従来で１）゛１４導体装置の製ｉｉ’ｉ
力θ、４−・小−・１一部切欠斜睨図、第２図は、１記
方法で製作された半導体装置の生製品を示ず一部切欠平
面図、第３図は、Ａ−：発明に用いるリボンソルダを示
−１″斜視、第４図に１、本発明の一実施例を示す概略
構成図で、心、る３゜
１０パ・繰り出しボビン、１１・・・リボンソルダ、１
２ ・小１ ’ｌ” ’、／ ルグ、 ■：３・・
リードル−ツ１．１４・・ツノ １１．／冶Ｌ−（、１
７・ カッタ装置、１９ ・カイ１部
出願代叩人 ブ１゛理−ト 菊 池 ｈ−部第 ｌ 図
第 ２ 圀Fig. 1 GJ'', Conventionally 1) Manufacturing of 14 conductor device
Force θ, 4-・Small-・1 Partially cutaway perspective view, FIG. : Shows the ribbon solder used in the invention - 1'' perspective, Fig. 4 is a schematic configuration diagram showing one embodiment of the invention, center, 3 degrees 10 parts, feeding bobbin, 11... Ribbon solder, 1
2 ・Elementary 1 'l''', / rug, ■: 3...
Reedolts 1.14... Horns 11. /JiL-(,1
7. Cutter device, 19. Kai 1st part application fee maker B1.
Claims (1)
゛／ソルダを送りロール（４−よりガイド部な有する冶
呉上に１１（給し、力、ツタ装置に６１、す／Ｌｉ、１
曲状に切断して小片ソルダを形成し、この小片ソルダを
前（ｉ［’！ガ・イド部な介し−７” ＩＪ−ドフレー
ムの所”；Ｓｌ で）’ｒ置（４−自動的に供給される
ように１７たことを！１♀徴とする１を導体装置の製造
Ｌｊ法。Feed bobbin l (-1% j) Feed a strip of glue/solder with a spacing of 11 to a feed roll (4-11 (feed, force, force, to the ivy device 61, S/Li, 1
Cut into a curved shape to form a small piece of solder, and place this small piece of solder in the front (i Lj method for manufacturing conductor devices with 1♀ characteristic as being supplied to 17!
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16228182A JPS5954462A (en) | 1982-09-20 | 1982-09-20 | Production of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16228182A JPS5954462A (en) | 1982-09-20 | 1982-09-20 | Production of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5954462A true JPS5954462A (en) | 1984-03-29 |
Family
ID=15751490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16228182A Pending JPS5954462A (en) | 1982-09-20 | 1982-09-20 | Production of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954462A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06210446A (en) * | 1993-01-18 | 1994-08-02 | Sansha Electric Mfg Co Ltd | Device for cutting beltlike older |
| FR2988633A1 (en) * | 2012-03-30 | 2013-10-04 | Faurecia Interieur Ind | Assembling cross-piece of instrument panel of car and part of car, by depositing filler material on mounting surface, positioning first and second parts so that surface of second part is opposite to mounting surface, and heating material |
| US20230018636A1 (en) * | 2020-04-03 | 2023-01-19 | Hirata Corporation | Solder supply unit, solder piece manufacturing device, part mounting device, and production system |
-
1982
- 1982-09-20 JP JP16228182A patent/JPS5954462A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06210446A (en) * | 1993-01-18 | 1994-08-02 | Sansha Electric Mfg Co Ltd | Device for cutting beltlike older |
| FR2988633A1 (en) * | 2012-03-30 | 2013-10-04 | Faurecia Interieur Ind | Assembling cross-piece of instrument panel of car and part of car, by depositing filler material on mounting surface, positioning first and second parts so that surface of second part is opposite to mounting surface, and heating material |
| US20230018636A1 (en) * | 2020-04-03 | 2023-01-19 | Hirata Corporation | Solder supply unit, solder piece manufacturing device, part mounting device, and production system |
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