JPS5953109A - Driller for printed circuit board - Google Patents
Driller for printed circuit boardInfo
- Publication number
- JPS5953109A JPS5953109A JP15896382A JP15896382A JPS5953109A JP S5953109 A JPS5953109 A JP S5953109A JP 15896382 A JP15896382 A JP 15896382A JP 15896382 A JP15896382 A JP 15896382A JP S5953109 A JPS5953109 A JP S5953109A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- sensor
- drill
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Drilling And Boring (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はプリント基板上にプリントされたマークを読取
り、ドリルで孔を穿設するプリント基板の孔明は装置に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for drilling holes in a printed circuit board by reading marks printed on the printed circuit board and drilling holes therein.
プリント配線基板は、一枚の基板に複数個分のプリント
配線を行い、最終工程で裁断して単品に分離することが
多い。この裁断時にはプリント基板に設けたマークを検
出して行う。本発明のプリント基板の孔明は装置はかか
る用途に用いられる。In the case of printed wiring boards, multiple pieces of printed wiring are often printed on a single board, and the boards are cut and separated into individual parts in the final process. This cutting is done by detecting marks provided on the printed circuit board. The printed circuit board forming apparatus of the present invention is used for such applications.
プリント基板は製作工程の途上で受けるストレスや、プ
リント基板をＸＹテーブルに載置した際の自重によるた
わみ等で、プリント基板は第２図に示す如く、波状に湾
曲して取付けられている。The printed circuit board is bent in a wavy manner as shown in FIG. 2 due to the stress that the printed circuit board receives during the manufacturing process and the deflection due to its own weight when the printed circuit board is placed on an XY table.
本発明はプリント基板を上下のパッドリングで湾曲部を
補正し、プリント基板の表面とセンサとの距離を一定に
することにより、基板上のマークを正確に捉えるように
したことを特徴とするプリント基板の孔明は装置である
。The present invention is characterized in that the curved portion of the printed circuit board is corrected using upper and lower pad rings, and the distance between the surface of the printed circuit board and the sensor is kept constant, so that marks on the circuit board can be accurately captured. The substrate hole is a device.
プリント基板の孔明は位置を検出するオプチカルセンサ
と孔明けを行うドリルとはプリント基板を挾んで上下の
同一線上に配設され、プリント基板の変形を補正する上
下バットリングはセンサ及びドリルと同心円上に配設さ
れている。For drilling holes in a printed circuit board, an optical sensor that detects the position and a drill that performs the drilling are placed on the same line above and below, sandwiching the printed circuit board, and upper and lower butt rings that correct for deformation of the printed circuit board are placed concentrically with the sensor and the drill. It is located in
本発明の実施例を図面に基づき説明すると、１がプリン
ト基板であり、このプリント基板１は端縁部２がＸＹテ
ーブル６上に載置されている。フ。An embodiment of the present invention will be described based on the drawings. Reference numeral 1 denotes a printed circuit board, and the edge portion 2 of this printed circuit board 1 is placed on an XY table 6. centre.
リント基板１はＸＹテーブル６上に配設された保持装置
４で固定されている。ＸＹテーブル３の中央部は空洞５
になっているので前述の如くプリント基板１は波形状で
ＸＹテーブル３に載置固定されている。６はＸＹテーブ
ルの中心部で、この中心線上にドリル及びセンサの中心
が設定されている。なお、７は基板上にプリントされた
孔明はマークであり、このマーク位置をセンサが検知し
てドリルで孔明けを行う。The lint board 1 is fixed by a holding device 4 disposed on an XY table 6. The center of the XY table 3 is a cavity 5
Therefore, as described above, the printed circuit board 1 is placed and fixed on the XY table 3 in a wave shape. 6 is the center of the XY table, and the centers of the drill and sensor are set on this center line. Note that 7 is a mark printed on the board, and a sensor detects the position of this mark to drill a hole with a drill.
第３図は上下のパッド装置１０．３０により、第２図の
如く湾曲８していたプリント基板１を補正した状態を示
す。上下の・フッドリング１１．６１の先端部同士の間
隙はプリント基板１の厚みよりＱ、ｌｌ＃Ｉｍ程度広く
なっている。FIG. 3 shows a state in which the printed circuit board 1, which was curved 8 as shown in FIG. 2, has been corrected by the upper and lower pad devices 10.30. The gap between the tips of the upper and lower hood rings 11.61 is wider than the thickness of the printed circuit board 1 by about Q, 1#Im.
第４図及び第５図は上下の・（ソド装置を示した図面で
ある。プリント基板１を中心に上下に同一線」二に配設
されている。ダウン・（ソド装置１０はダウ／パッドリ
ング１１とリング駆動装置で構成され、パッド１１はプ
リント基板１の孔明けを行うドリル１２と同心円上に配
設されている。バットリング１１の外周部には凹溝１６
が形成された案内ブロック１４が取着され、主基板１５
に固着されたガイドレール１６に案内されながらパッド
リング１１は上下にスライドする。パッド１１をスライ
ドさせる機溝は、湾曲したパッドツヤ−フレバー１７の
レバービン１８がパッドの溝に挿入され、レバー１７の
他端部はエアシリンダー１９に接続されている。エアシ
リンダー１９は主基板１５に固着されたシリンダーホル
ダー２０に取付けられている。２１はレバー１７の支点
ピンであり主基板１５に固着きれた軸受け２２で保持さ
れている。4 and 5 are drawings showing the upper and lower drying devices. They are arranged in the same line vertically with the printed circuit board 1 at the center. Consisting of a ring 11 and a ring drive device, the pad 11 is arranged concentrically with a drill 12 for drilling holes in the printed circuit board 1.A groove 16 is formed on the outer periphery of the butt ring 11.
A guide block 14 is attached to the main board 15.
The pad ring 11 slides up and down while being guided by a guide rail 16 fixed to the pad ring 11. A lever pin 18 of a curved pad gloss lever 17 is inserted into the groove in which the pad 11 is slid, and the other end of the lever 17 is connected to an air cylinder 19. The air cylinder 19 is attached to a cylinder holder 20 fixed to the main board 15. Reference numeral 21 is a fulcrum pin of the lever 17, which is held by a bearing 22 firmly fixed to the main board 15.
ドリル１２はエアシリンダー（図示せず）で上下に移動
可能で専用モーターでプリント基板１に孔明けを行う。The drill 12 is movable up and down using an air cylinder (not shown), and drills holes in the printed circuit board 1 using a dedicated motor.
アッパーパッド装置３０はプリント基板１の湾曲部８を
補正するだめのアッパーパッド３１とこのアッパーパッ
ド３１を駆動するエアシリンダー６２で構成され、パッ
ド３１と同心円上にセンサ３３が設けられている。セン
サ３６は当初にプリント基板１からの高さＨを設定すれ
ば、同一厚のプリント基板を用いる限シ、位置はそのま
までよい。セ／す３３はオプチカルセンサで反射光を受
光してマーク７を読取り検出している。The upper pad device 30 includes an upper pad 31 for correcting the curved portion 8 of the printed circuit board 1 and an air cylinder 62 for driving the upper pad 31, and a sensor 33 is provided concentrically with the pad 31. If the height H of the sensor 36 from the printed circuit board 1 is initially set, the position may remain unchanged as long as printed circuit boards of the same thickness are used. The center 33 receives reflected light with an optical sensor to read and detect the mark 7.
パッド６１はスライドブロック３４に固着さヘエアシリ
ンダー３２によってスライドブロック３４が上下に移動
し、パッド３１はプリント基板１の湾曲部８を補正する
。３５はアッパーバット装置６０及びセ／す３３を保持
するフレームである。The pad 61 is fixed to the slide block 34, and the slide block 34 is moved up and down by the air cylinder 32, and the pad 31 corrects the curved portion 8 of the printed circuit board 1. 35 is a frame that holds the upper bat device 60 and the seat 33.
本発明の作用を述べると、プリント基板１の孔明は位置
はテープに記録されているので、所定孔明は位置の近く
迄コンピュータの連動作用によシＸＹテーブル３が移動
して停止する。プリント基板１は外周部を基準にしてパ
ターンがプリントされるが、印刷する際にずれが生じ、
個々にばらつくので、テープを用いたのみでは位置の設
定は不正確になる。テープでの操作によってマーク７が
近く迄移動し終ったら、上下のバット１１．３１をエア
シリンダー１９．３２を作動することにより移動させて
、プリント基板１の湾曲部８を修正する。パッドの先端
部ヘッドには摩擦抵抗の低い合成樹脂を用いているので
接触してもプリント基板１のすベシが良い。上下のパッ
ド１１．３１によシ補正されたことにより、基板面から
のセンサヘッド迄の高さＨは一定の高さに補正されたこ
とにより、プリント基板１上のマーク７を正確に検出で
き、マーク７の位置がずれていればＸＹテーブルの微調
整が行われマーク７の中心とセンサ３６の中心が一致し
てここでＸＹテーブルが完全に停止する。その後ドリル
１２が回転しながら上昇しプリント基板１の下方から孔
明けを行う。プリント基板１上に設けられた孔明は用の
マークを検出しながら、次々と孔明けを行い、全てのマ
ーク７に孔明けを行って完了する。To describe the operation of the present invention, since the position of the perforation of the printed circuit board 1 is recorded on the tape, the XY table 3, which is used for computer interlocking operation, moves until a predetermined perforation is near the position and then stops. A pattern is printed on the printed circuit board 1 based on the outer periphery, but a shift occurs during printing,
Since the positions vary from person to person, positioning will be inaccurate if only a tape is used. When the mark 7 has been moved close by the tape operation, the upper and lower butts 11.31 are moved by operating the air cylinder 19.32 to correct the curved portion 8 of the printed circuit board 1. Since synthetic resin with low frictional resistance is used for the head of the tip end of the pad, the surface of the printed circuit board 1 is good even when it comes into contact with the pad. Since the height H from the board surface to the sensor head is corrected by the upper and lower pads 11.31, it is possible to accurately detect the mark 7 on the printed board 1. If the mark 7 is out of position, the XY table is finely adjusted so that the center of the mark 7 coincides with the center of the sensor 36, and the XY table stops completely. Thereafter, the drill 12 rotates and ascends to drill holes in the printed circuit board 1 from below. The holes provided on the printed circuit board 1 are drilled one after another while detecting the marks for use, until all the marks 7 have been drilled.
本発明は以上に述べた如き装置であって、従来マークの
位置を目視作業によって行っていたときには±０．２順
の精度であったものを、プリント基板の湾曲部を補正し
、オプチカルセンサでマークの ゛中心を正確に検出
する方式を採用したことにより±０．０５ｍｍまで精度
を向上することができた。The present invention is a device as described above, which corrects the curved portion of the printed circuit board and uses an optical sensor to correct the curved portion of the printed circuit board. By adopting a method that accurately detects the center of the mark, we were able to improve accuracy to ±0.05 mm.
第１図はＸＹテーブルにプリント基板が載置された平面
図、第２図は同側面断面図、第３図は湾曲状のプリント
基板が上下のパッドで補正されたことを示す断面図、第
４図は本装置の正面図、第５図は同側面図、第６図はダ
ウンパッド装置の平面図、第７図はアッパーバンド装置
の側面図である。
図面において、１はプリント基板、３はＸＹテーブル、
４はプリント基板の保持装置、７はプリントされたマー
ク、８はプリント基板の湾曲部、１０はダウンパッド装
置、１１はダウンパッド、１２はドリル、１９はエアン
リンダ、３０はアッパーパット装置、３１はアソハーハ
ソド、６２はエアンリンダ、６６はセンサ。
特許出願人
日立コンデンサ株式会社
７−
↓
第２図Figure 1 is a plan view of a printed circuit board placed on an XY table, Figure 2 is a cross-sectional side view of the same, Figure 3 is a cross-sectional view showing a curved printed circuit board corrected by upper and lower pads, 4 is a front view of the device, FIG. 5 is a side view thereof, FIG. 6 is a plan view of the down pad device, and FIG. 7 is a side view of the upper band device. In the drawing, 1 is a printed circuit board, 3 is an XY table,
4 is a holding device for the printed circuit board, 7 is a printed mark, 8 is a curved portion of the printed circuit board, 10 is a down pad device, 11 is a down pad, 12 is a drill, 19 is an air cylinder, 30 is an upper pad device, 31 is a 62 is air cylinder, 66 is sensor. Patent applicant Hitachi Capacitor Co., Ltd. 7- ↓ Figure 2
Claims (1)
、プリント基板を載置し水平方向に移動可能なるＸＹテ
ーブルと、プリント基板の下方に位置し上下に移動可能
なるドリル装置左、このドリルと同心円上に配設された
ダウンパッドリングをプリント基板の位置まで上昇させ
るダウンパッド装置と、プリント基板にプリントされた
孔明はマークを読取るセンサと、とのセンサと同心」二
に配設されたアッパーパッドをプリント基板の位置捷で
下降させるアッパーパッド装置とを有したことを特徴と
するプリント基板の孔明は装置。(1) A holding device that holds the edge of the printed circuit board, an XY table on which the printed circuit board is placed and can be moved horizontally, and a drill device that is located below the printed circuit board and can be moved up and down.This drill is shown on the left. A down pad device that raises a down pad ring disposed concentrically with the printed circuit board to the position of the printed circuit board, a sensor that reads the mark printed on the printed circuit board, and a sensor disposed concentrically with the sensor. An apparatus for manufacturing a printed circuit board, comprising an upper pad device for lowering an upper pad by positioning the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15896382A JPS5953109A (en) | 1982-09-14 | 1982-09-14 | Driller for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15896382A JPS5953109A (en) | 1982-09-14 | 1982-09-14 | Driller for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5953109A true JPS5953109A (en) | 1984-03-27 |
Family
ID=15683182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15896382A Pending JPS5953109A (en) | 1982-09-14 | 1982-09-14 | Driller for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5953109A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63126359U (en) * | 1987-02-09 | 1988-08-18 | ||
| JPH0215907A (en) * | 1988-06-30 | 1990-01-19 | Ushio Kk | Driving mechanism of drilling machine |
| US5275517A (en) * | 1992-08-26 | 1994-01-04 | Ozerine Turnipseed | Riston cutting machine |
-
1982
- 1982-09-14 JP JP15896382A patent/JPS5953109A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63126359U (en) * | 1987-02-09 | 1988-08-18 | ||
| JPH056296Y2 (en) * | 1987-02-09 | 1993-02-18 | ||
| JPH0215907A (en) * | 1988-06-30 | 1990-01-19 | Ushio Kk | Driving mechanism of drilling machine |
| US5275517A (en) * | 1992-08-26 | 1994-01-04 | Ozerine Turnipseed | Riston cutting machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0393299A (en) | Method and apparatus for mounting parts | |
| KR0134917B1 (en) | Method and apparatus for perforating printed circuit board | |
| JPS5953109A (en) | Driller for printed circuit board | |
| JPH0794846A (en) | Pcb machine | |
| US4419803A (en) | Method of forming a tool assembly | |
| JPS6255320B2 (en) | ||
| JPS61203207A (en) | Drilling machine | |
| JPH04294949A (en) | Work clamp device for print base punch | |
| JP4060503B2 (en) | Surface mount component mounting machine and surface mount component mounting method | |
| JP2740141B2 (en) | Perforator | |
| JP3499080B2 (en) | Drilling apparatus for printed circuit board and drilling method using the same | |
| US4806051A (en) | Method for forming a template | |
| JPH0661696A (en) | Method and apparatus for automatically inserting electronic component equipped with lead wire | |
| CN114919008B (en) | Full-automatic PCB board drilling equipment based on machine vision | |
| CN118234142B (en) | Resin plug hole air guide plate and processing method and device thereof | |
| JPH0346884Y2 (en) | ||
| JPS6358994A (en) | Chip mounter | |
| JPH04355379A (en) | Apparatus for inspecting printed circuit board | |
| JP2500511B2 (en) | Printed circuit board drilling equipment | |
| US20220234217A1 (en) | Nozzle replacement table unit | |
| JPS61125200A (en) | Method of positioning printed substrate | |
| KR960008976Y1 (en) | Scale marking apparatus for sleeve | |
| US4123064A (en) | Predetermined index gauge for locating a selected record band on a gramaphone record | |
| JPH02145204A (en) | Method and device for holding printed wiring plate | |
| JPH0341517Y2 (en) |