JP2500511B2 - Printed circuit board drilling equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punching device for making holes in a printed circuit board.

[0002]

2. Description of the Related Art As a device for punching a printed circuit board, an image of a punching mark formed on the printed circuit board is imaged by using X-rays, and the printed circuit board is positioned based on the image information to determine a predetermined position of the printed circuit board. There is a device in which a hole is bored in the hole, an image of the bored portion of the hole is picked up using X-rays, and the amount of displacement of the hole can be detected based on the image information (actual fairness 3- 9932).

In this type of punching device, some of the energy loss of the X-ray transmitted through the printed circuit board is converted into a signal, and based on this signal, the mark for punching and the portion where the hole is punched are imaged, and the X-ray is drawn. The image becomes darker in the area where the energy loss of
The image is bright in the portion where the X-ray energy loss is small.

[0004]

However, in the conventional structure, when the mark for punching is imaged, X
The energy of the line is totally lost and the mark for perforation is clearly imaged, but when imaging the part where the hole is drilled, there is no loss of X-ray energy at the part where the hole is drilled. There is a problem in that the image of the holed portion becomes extremely bright, halation occurs, the outline of the hole becomes unclear, and the positional shift amount of the hole cannot be accurately detected.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a device for punching a printed circuit board, which is capable of clearly capturing an image of a holed portion without causing halation.

[0006]

According to the present invention, a mark for perforation formed on a printed circuit board is imaged by using X-rays, the printed circuit board is positioned based on the image information, and the printed circuit board is positioned at a predetermined position on the printed circuit board. A hole punching device capable of forming a hole, imaging the hole of the hole using X-rays, and detecting the amount of positional deviation of the hole based on the image information. And an X-ray filter that absorbs the X-ray filter, the X-ray filter is positioned at the retracted position when the mark is imaged to move the X-ray filter to the advanced position and the retracted position with respect to the X-ray optical path, and when the hole is drilled. And a filter driving means for positioning the X-ray filter at the advanced position when imaging the drilled portion.

[0007]

According to the present invention, when an image of the hole-drilled portion is imaged, the X-ray filter is positioned at the advance position of the X-ray into the optical path by the filter driving means, and the hole-drilled portion is halated by the X-ray filter. A clear image can be obtained without causing Further, at the time of capturing an image of the perforation mark and at the time of perforating the perforation, the filter driving means positions the X-ray filter in the retracted position from the optical path of the X-rays, and the X-ray filter captures the image of the perforation mark. It does not hinder the drilling operation of the hole.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed circuit board punching device to which the present invention is applied will be described with reference to the drawings. In this punching device, as shown in FIG. 1, a machine base 2 is fixedly installed on an upper part of a frame 1, a work table 3 and an X-ray generator 4 are provided above the machine base 2, and the machine base is also provided. A drilling mechanism 5, an X-ray camera 6, and an X-ray filter 7 are provided below the unit 2.

The work table 3 is mounted and fixed on the upper surface of the machine base 2. The multi-layer board 8 as a printed board is placed on the upper surface of the work table 3 and holes are bored at predetermined portions of the multi-layer board 8. It can be installed. The work table 3 is provided with a clamp means (not shown) so that the multilayer board 8 can be clamped and fixed at an appropriate position by the clamp means.

The multi-layer substrate 8 is formed by superposing a plurality of substrates, and a perforation mark 9 as shown in FIG. 2 is formed by copper foil between the substrates at a predetermined portion to be perforated. The mark 9 has a structure in which a circular mark 9b is provided inside a ring-shaped mark 9a concentrically with the mark 9a, and a hole is formed at the center position of the mark 9b.

The X-ray generator 4 is fixed to the machine base 2 via the support block 10 so as to face the work table 3 above the work table 3 so that X-rays can be transmitted to a predetermined portion of the multilayer substrate 8. Has become. The X-rays transmitted from the X-ray generator 4 through the multi-layer substrate 8 have no energy loss,
It is designed to be transmitted below. That is, the work table 3 and the machine base 2 are respectively formed with through holes 3a and 2a at positions facing the X-ray generator 4, and X-rays are transmitted to the lower side of the machine base 2 through the through holes 3a and 2a. It has become so.

The through holes 3a and 2a are also used for punching the multilayer substrate 8 by the punching mechanism 5. Through the through holes 3a and 2a, from below the machine base 2 through the punching mechanism 5, the multilayer holes are formed. A hole can be formed in the substrate 8.

The perforating mechanism 5 is attached to the frame 1 via a support bracket 11. The boring mechanism 5 has a base 1 mounted on a support bracket 11 so as to be slidable in the left-right direction in FIG.
2 and the base 12 attached to the support bracket 11
The cylinder 13 that slides and drives the base 12, as shown in FIG.
X-table 14 slidably mounted in the left-right direction, a motor (not shown) for slidingly driving the X-table 14, a Y-table 15 slidably mounted on the X-table 14 in the direction perpendicular to the plane of FIG. A motor (not shown) for slidingly driving the table 15, a slider 16 attached to the Y table 15 so as to be capable of moving up and down,
A cylinder 17 for slidingly driving the slider 16, a spindle motor 18 attached to the slider 16, and a collet chuck 1 mounted on an upper end drive shaft of the spindle motor 18.
And a drill 20 mounted via 9.

Then, by driving the base 12, the X table 14 and the Y table 15 to slide, the drill 20 faces the through hole 3a of the work table 3 below the machine base 2 as shown by the chain double-dashed line in FIG. It can be moved to any position. From the state in which the drill 20 faces the through hole 3a of the work table 3 below the machine base 2, the drill 20 is rotated by the slide drive of the slider 16 and the spindle motor 18 while rotating through the through holes 3a and 2a. A position that can move back and forth to a position that penetrates the substrate 8 and that is retracted laterally so that the drill 20 and the spindle motor 18 are not positioned on the optical path L of the X-rays from the X-ray generator 4 by the slide drive of the base 12. It is possible to move backward (to the position indicated by the solid line in FIG. 1).

The X-ray camera 6 is fixed to the frame 1 below the punching mechanism 5. The X-ray camera 6 faces the through hole 3a of the work table 3 and can receive the X-ray from the X-ray generator 4. Further, the X-ray camera 6 is connected to the monitor 21, and when the X-rays are radiated from the X-ray generator 4, some of the energy loss of the X-rays is converted into a signal,
Based on this signal, the portion of the multilayer substrate 8 facing the through hole 3a can be imaged on the monitor 21. Monitor 2
In No. 1, the image becomes dark in the portion where the X-ray energy loss is large, and the image becomes bright in the portion where the X-ray energy loss is small.

The X-ray filter 7 absorbs a part of the X-ray energy, and an aluminum plate or the like can be applied. This X-ray filter 7 includes a machine base 2 and a drilling mechanism 5
It is attached to the frame 1 via a support bracket 22 between and. The support bracket 22 is fixed to the frame 1 and slidably supports the X-ray filter 7 in parallel with the work table 3, and slides the X-ray filter 7 to the optical path L of X-rays from the X-ray generator 4. It is possible to move forward and backward. A cylinder 23 as a filter driving means for slidingly driving the X-ray filter 7 is attached to the support bracket 22, and the X-ray filter 14 is advanced to the optical path L of the X-ray from the X-ray generator 4 by the cylinder 23. It can be slid to a position (a position shown by a chain double-dashed line in FIG. 1) and a retracted position (a position shown by a solid line in FIG. 1).

Next, the operation will be described. When forming a hole in the multilayer substrate 8, the drilling mechanism 5 is driven in advance to retract the drill 20 and the spindle motor 18 below the machine base 2 from a position facing the through hole 3a of the work table 3 to the side thereof. 1 (the solid line position in FIG. 1), the cylinder 23 is driven to move the X-ray filter 14 from the optical path L of the X-rays from the X-ray generator 4 to the retracted position (the position shown by the solid line in FIG. 1). ), The multi-layer substrate 8 is placed on the work table 3 in this state, and then the X-ray generator 4 is driven to image the mark 9 of the multi-layer substrate 8 on the monitor 21, and based on this image information. The multilayer substrate 8 is positioned so that the mark 9 on the multilayer substrate 8 faces the through hole 3a of the work table 3.

After positioning the multilayer substrate 8, the multilayer substrate 8 is clamped and fixed to the work table 3 by the clamp means,
In this state, the drilling mechanism 5 is driven to move the drill 20 to the through hole 3a of the work table 3 as shown by the chain double-dashed line in FIG.
If it is moved to a position opposite to, and then moved to a position that penetrates the multilayer substrate 8 through the through holes 3a and 2a while rotating the drill 20, a hole is formed at the center position of the mark 9b of the multilayer substrate 8. .

After drilling the holes, the drilling mechanism 5 is driven to retract the drill 20 to the lower position of the machine base 2 (the position shown by the chain double-dashed line in FIG. 1), and then the drill 20 and the spindle motor. 18 is retracted from a position facing the through hole 3a of the work table 3 to a position retracted to the side thereof (a position shown by a solid line in FIG. 1), and in this state, the cylinder 23 is driven to move the X-ray filter 7 to the X position. If the X-ray generator 4 is driven again and the perforated portion of the multilayer substrate 8 is imaged on the monitor 21, the X-ray generator 4 is driven again to slide to the position where the line advances to the optical path L (the position shown by the chain double-dashed line in FIG. 1). , The multilayer substrate 8 based on this image information
It is possible to detect the amount of positional deviation of the hole formed in the.

Here, since the X-ray filter 7 is positioned at the advance position of the X-ray to the optical path L (the position shown by the chain double-dashed line in FIG. 1) when the hole 21 is imaged on the monitor 21. As a result, a part of the X-ray energy is lost at the holed portion, and the holed portion can be clearly imaged without halation on the monitor 21. That is, when the X-ray filter 7 is not provided, the amount of signal in the holed portion becomes extremely large as shown by the chain double-dashed line in FIG. 3, and the image in the holed portion becomes extremely bright. However, halation occurs at the holed portion and the outline of the hole becomes unclear. However, when the X-ray filter 7 is provided, a part of the X-ray energy is generated at the holed portion by the X-ray filter 7. As a result, the amount of signal in the holed portion is reduced as shown by the solid line in FIG. 3, halation is prevented in the holed portion, and the outline of the hole becomes clear. .

Further, the mark 9 on the multilayer substrate 8 is monitored 21
The X-ray filter 7 is located at the retracted position (the position shown by the solid line in FIG. 1) from the optical path L of the X-rays when the image is taken in and when the hole is formed in the multilayer substrate 8. 7 does not hinder the imaging operation of the mark 9 and the hole drilling operation of the multilayer substrate 8, whereby the signal amount at the portion where the mark 9 is formed is displaced as shown in FIG. The image of the mark 9 can be clearly imaged, and holes can be surely formed in the multilayer substrate 8.

3 and 4, reference numeral 30 is an image picked up by the monitor 21, and its ring-shaped portion 30a.
Corresponds to the mark 9a, the circular portion 30b inside the ring-shaped portion 30a corresponds to the mark 9b, and the hollow portion 30c inside the circular portion 30b corresponds to the hole formed in the multilayer substrate 8. .

Therefore, when the multi-layer substrate 8 is positioned, the mark 9 of the multi-layer substrate 8 is clearly imaged on the monitor 21 so that the multi-layer substrate 8 can be accurately positioned. Is clearly imaged on the monitor 21, and the accuracy of detecting the positional deviation amount of the hole is improved.

Further, since halation is prevented when the hole 21 is imaged on the monitor 21, the X-ray camera 6
The durable life is improved and it is economical.

Although the X-ray filter 7 is provided between the machine base 2 and the perforating mechanism 5 in the above embodiment, the X-ray filter 7 is not limited to this, and the work table 3 and the X-ray generator 4 are provided.
Or between the punching mechanism 5 and the X-ray camera 6.

Further, in the above embodiment, the X-ray filter 7 is slidably driven, but the present invention is not limited to this, and the X-ray filter 7 is rotationally driven to the optical path L of the X-ray from the X-ray generator 4. It may be moved to the advanced position and the retracted position.

[0027]

As described above, according to the hole punching device for a printed circuit board according to the present invention, it is possible to clearly perform image processing on a holed portion without causing halation, and thereby, the positional deviation amount of the hole can be reduced. It has an excellent effect that the detection accuracy is improved and the durability life of the X-ray camera and the like is also improved.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a device for punching a printed circuit board to which the present invention is applied.

FIG. 2 is a plan view of a multilayer substrate.

FIG. 3 is a graph showing a displacement of a signal amount when an image of a holed portion is imaged.

FIG. 4 is a graph showing displacement of signal amount when an image of a mark on a multilayer substrate is imaged.

[Explanation of symbols]

 7 X-ray filter 8 Multilayer substrate 23 Cylinder (filter driving means)

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H05K 3/46 6921-4E H05K 3/46 Y

Claims (1)

(57) [Claims] 1. An image of a perforation mark formed on a printed circuit board is imaged using X-rays, the printed circuit board is positioned based on the image information, and a hole is formed at a predetermined position of the printed circuit board. A hole punching device capable of picking up an image of the perforated portion of the hole using X-rays and detecting the positional displacement amount of the hole based on the image information, and absorbing a part of the energy of the X-rays. The X-ray filter and the X-ray filter are moved to the retracted position when the mark is imaged and when the hole is drilled in order to move the X-ray filter to the advanced position and the retracted position with respect to the X-ray optical path. And a filter driving means for positioning the X-ray filter at the advanced position when imaging the perforated portion of the hole, and a punching device for a printed circuit board.