JPH0596413A - Processing of printed circuit board - Google Patents

Abstract

PURPOSE:To improve working efficiency by dividing the whole area of a printed circuit board into a plural number of areas including respectively two or more of positioning marks in the line and the row directions, computing mark average line and row pitches in a specified processing area under a three-point sensing method and processing the whole area by way of transferring the printed area in accordance with this. CONSTITUTION:Positions of a plural number of positioning marks 70 arranged in a matrix shape of a printed board W are computed by an image processing device. The whole area of this printed board W is divided into a plural number of areas W1-W4 so that more than two each of the positioning marks 70 are included in the line and the row directions in each of the divided areas W1-W4 respectively. Thereafter, average line and row pitches of the positioning marks 70 in a specified area are computed under a three-point sensing method. In accordance with this, the printed board W is transferred relatively crosswise against a processing (drilling) means and is processed in the specified area. This procedure is repeated for each of the remaining processed areas and the whole area is processed. Accordingly, error of drilling processing precision is lessened, and processing precision and working efficiency are improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing method based on a positioning mark printed in advance on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, when the same processing is applied to a plurality of places on one printed circuit board, a positioning mark serving as a reference is formed in advance to indicate a processing position. In particular,
When a large number of parts (wiring boards) are taken from a single printed circuit board by press punching, etc., a positioning mark is printed in advance on this printed circuit board, and a reference hole is made at the position of this mark. .. Then, after fixing the printed circuit board with a jig or the like using this hole as a reference, the outer shape of the desired component (wiring board) is processed by punching or the like. Further, when the reference hole cannot be formed, the position of the mark is detected by image processing or the like, and the position where processing such as press punching should be performed is calculated based on the position of the mark to perform the processing.

In any of the above cases, the position of the mark is detected. As a method for detecting the mark position, either the so-called all-point sensing method or the three-point sensing method is generally used. The all-point sensing method is a method of detecting the positions of all the positioning marks on the printed circuit board by image recognition, and based on this, processing such as drilling is performed one by one.

On the other hand, the three-point sensing method uses three of the marks located at the lateral and vertical ends of the printed circuit board (for example, the marks located at the upper left end, the upper right end, and the lower right end). ), The distance between a pair of marks located at both ends in the horizontal direction (the distance between the mark at the upper left end and the mark at the upper right end) is obtained, and this distance and the number of mark rows The average column pitch is calculated based on and, and the distance between the pair of marks located at both ends in the vertical direction (the distance between the mark at the upper right end and the mark at the lower right end)
Then, the average line pitch is calculated based on this distance and the number of lines of the mark. Then, it is considered that the marks are arranged in a matrix on the printed circuit board at equal intervals according to the average row pitch and the average column pitch. After detecting the position of the mark in this way, processing such as drilling is performed.

[0005]

Usually, the wiring pattern on the printed circuit board is formed by screen printing at the same time as the positioning marks. Therefore, a printing error may occur due to the mask extending in the squeezing direction during printing. There is no problem because the mask stretches little and the printing error is small near the printing start point (reference side edge), but as the distance from the printing start point to the printing end point increases, the deformation of the mask increases and the printing error increases.
Further, even when performing offset printing, there is a possibility that a printing error will increase from the print start point to the print end point. In this way, if a printing error or the like occurs or the printed circuit board after printing is deformed by heat or the like, an error occurs in the positions of the positioning mark and the wiring pattern.
The mark and the wiring pattern have substantially uniform errors.
Therefore, when the position of each mark can be accurately detected when processing this printed circuit board, processing such as press punching can be performed at a desired position to obtain a desired component (wiring board). If the position cannot be detected accurately, the processing is performed in a state where the positional error of the wiring pattern is ignored, and the desired processing cannot be performed, resulting in the production of defective parts.

When the all-point sensing method is used, the mark position can be accurately detected even if there is an error in the mark position, but since all the marks are image-recognized to detect the position, it is troublesome. There is a drawback that it takes time and the working time becomes long.

On the other hand, if the three-point sensing method is used,
Since it is necessary to detect the positions of only three marks on one printed circuit board by image recognition, the efficiency is high and the working time is short. However, it is not possible to deal with the case where the marks are irregularly arranged due to a printing error or the like, the position of the actually formed marks cannot be accurately detected, and a defective part is manufactured. When the printed circuit board is made small to reduce printing errors, the number of parts obtained from one board is reduced, and the work efficiency is reduced. As described above, conventionally, it has not been possible to achieve both high accuracy in detecting the position of a mark including a position error and improvement in working efficiency.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method of processing a printed circuit board which can detect the position as efficiently as possible in a short time while maintaining the necessary and sufficient accuracy even when the position of the positioning mark includes an error. To provide.

[0009]

According to the present invention, the position of a mark on a printed circuit board having a plurality of positioning marks arranged in a matrix is calculated by using an image pickup means and an image processing device, and this calculation is performed. A method of processing a printed circuit board, wherein a predetermined processing is performed on the printed circuit board by a processing means with reference to the position of the formed mark, wherein at least two or more processed areas are provided in the entire area of the printed circuit board in the row and column directions. (A) For a specific processing area, the average row pitch and the average column pitch of the marks in the area are calculated by a three-point sensing method, and (B) the calculated average row pitch and average column pitch. Based on and
The printed circuit board is moved vertically and horizontally relative to the processing means to perform a predetermined processing on a specific processing area. It is characterized in that the cycle of (A) and (B) is repeated for each of the remaining processing areas to perform processing in all areas.

This is particularly effective when a drilling means is used as the processing means and a reference hole is formed at the mark position.

By reducing the processing area of the printed board as it moves away from the reference side edge, the printed board has a large mark position error in a small area and a small mark position error. It is desirable to divide into a large-area processing region.

[0012]

With respect to the printing error that occurs in the positioning mark and the wiring pattern of the printed circuit board, there is a tendency that the error is small near the print start portion (reference side edge) and large near the print end portion. Therefore, according to this tendency, the printed circuit board is divided so that the small error portion is the large area processing area and the large error portion is the small area processing area. By performing the mark position detection, the image recognition process requires a relatively small number of times. Then, it is possible to detect the position with high efficiency and high accuracy, and based on that, it is possible to perform high accuracy machining.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show the entire substrate processing apparatus used in this embodiment. This device has a fixed table 10
0, an XY table portion 101, a gripping means 102, and a punching means 103. Then, the printed circuit board (work) W supplied from a supply unit (not shown) is transferred to XY
After being conveyed to the processing position by the table portion 101 and the gripping means 102, the reference hole is made at the mark position by the hole making means 103.

The detailed structure of this substrate processing apparatus will be described below. The structure of the XY table unit 101 is as follows. A support column 2 is erected on the Y-axis base 1, and one end of a Y-axis screw 4 is rotatably supported on the support column 2 via a bearing 3. The other end of the Y-axis screw 4 is
It is connected to the drive shaft of the motor 6 via the coupling 5. The motor 6 is fixed to the side plate 9 by the cover 7 and the mounting plate 8, and the side plate 9 is fixed to the Y-axis base 1.
The axial screw 4 is supported substantially horizontally. A nut 10 is screwed into the Y-axis screw 4, and a nut holder 11 is integrally fixed to the nut 10.
A Y-axis table 12 is fixed to the upper surface of the nut holder 11. The Y-axis table 12 is short in the Y-axis direction (vertical direction in FIG. 1) and long in the X-axis direction (horizontal direction in FIG. 1). Further, two rail guides (not shown) are provided on the lower surface of the Y-axis table 12 and can slide on the two rails 13 on the Y-axis base 1.

An X-axis base 15 is attached to the upper surface of the Y-axis table 12 via two attachment blocks 14. Similarly to the Y-axis base 1, one end of the X-axis screw 18 is rotatably supported by the support column 16 and the bearing 17, and the other end of the X-axis screw 18 is connected to the motor 20 via the coupling 19. ing. The motor 20 has a cover 21, a mounting plate 22, and a side plate 23, and
It is fixed to the shaft base 15 and the X-axis screw 18 is supported substantially horizontally. A nut 24 is screwed into the X-axis screw 18, and a nut holder 25 is integrally fixed to the nut 24. An X-axis table 26 is fixed to the upper surface of the nut holder 25. The X-axis table 26 has an upper plate 26a and a lower plate 26b fixed to each other. A rail guide 26c is provided on the lower surface of the lower plate 26b, and can slide on the rail 27 on the X-axis base 15. A top cover 28 is inserted into the hole 26d of the X-axis table 26. This top cover 28
Is not fixed to the X-axis table 26, but extends to the side of the X-axis table 26, and both ends are fixed to the side plates 23 and 29. Therefore, the X-axis table 26 is slidable with respect to the front cover 28.

A fixed table 100 is fixed to the side plate 29 via a collar 30. Fixed table 100
Two long holes 31 are provided in the XY table portion 10 so that the mounting block 14 penetrates the long holes 31.
1 is provided. Therefore, the Y-axis table 12 is movable in the Y-axis direction within the range of the long hole 31, and the X-axis table 26 is movable in the X-axis direction above the fixed table 100.

With the above structure, when the Y-axis screw 4 is rotated by being driven by the motor 6, the nut 10 screwed on the Y-axis screw moves in the Y-axis direction and the Y-axis table 12 moves. .. Also, driven by the motor 20,
When the X-axis screw 18 rotates, the nut 24 screwed on the X-axis screw moves in the X-axis direction, and the X-axis table 26 moves. Thus, the X-axis table 26 can be moved in the XY directions by the motors 6 and 20.

Next, the grip means 102 will be described. X
A cylinder mounting plate 32 is fixed to the upper surface of the front end (right side in FIG. 2) of the shaft table 26, and a cylinder 33 is mounted on the upper portion thereof.
Are mounted face down. Also, the X-axis table 2
A slider 35 is mounted in front of 6 via a mounting plate 34 so as to be vertically movable.

In front of the slider 35, a fixing claw 36 having the following structure is provided. The drive shaft of the cylinder 33 is fixed to the upper surface of the slider 35. A chuck body 39 is provided in front of the slider 35 via mounting plates 37 and 38.
Is attached. A cylinder 40 is attached to the upper portion of the cylinder 40 so as to face downward. A rod 41 is fixed to the shaft of the cylinder 40, and an upper claw 42 is attached to the rod 41. The upper claw 42 swings about the rotation center 42a in accordance with the vertical movement of the rod 41. A lower claw 44 fixed by a fixing piece 43 is provided below the chuck body 39. In this embodiment, the slider 35 is provided with two fixing claws 36 having the above-mentioned configuration.

Next, the punching means 103 will be described with reference to FIG. Support plates 46 and 47 having a hole in the center are fixed to the leg portion 45, and a motor holding member 48 is fixed to one end portion (left side in FIG. 3) of the motor holding member 48. The motor 49 is held by. A lead screw 51 is connected to the drive shaft of the motor 49 via a coupling 50, and the lead screw 51 is rotatably supported by a support plate 47. A base plate 52 is provided above the lead screw 51.
The nut 53 fixed to the lower surface of the base plate 52 is screwed onto the lead screw 51. With such a configuration, the drive of the motor 49 causes the lead screw 51 to rotate, and the base plate 52 moves integrally with the nut 53 in the horizontal direction in FIG.

On the base plate 52, an image pickup means for displaying an image of an object which is irradiated with electromagnetic waves is provided with the support plates 54, 5.
It is fixed through 5,56. Since X-rays are used as electromagnetic waves in this embodiment, an X-ray camera 57 is used as an image pickup means. The X-ray camera 57 is the image processing device 5.
8 (see FIG. 4).

On the base plate 52, a drilling unit 61 is provided via a holding frame 59 and a chip cover 60.
Is attached. The drilling unit 61 includes a spindle motor 61a, a collet chuck 61b fixed to the upper end of the spindle motor 61a, and a drill (drilling member) 61c held by the collet chuck 61b. Then, by driving the spindle motor 61a, the drill 61c ascends while rotating to make a hole in the printed circuit board W. The piercing unit 61 can be moved by an XY table mechanism (not shown), and the piercing position can be finely adjusted.

With the above construction, the X-ray camera 57 and the punching unit 61 are integrated with the base plate 52 in FIG.
It is movable in the left-right direction (X-axis direction). The main body case is provided with a fixed table 100 on which a printed circuit board W, which is a member to be punched, is placed.
A hole 62 is formed in the fixed table 100. Then, above the fixed table 100, an X-ray generation device (electromagnetic wave irradiation means) that can face the X-ray camera 57 or the punching unit 61 via the hole 62 and the printed circuit board W.
63 are provided. That is, FIG. 3 shows the X-ray camera 5.
7 is in a state of facing the X-ray generator 63 through the hole 62 and the printed circuit board W, and from this state, the motor 49
Is operated to move the base plate 52, so that the punching unit 61 can be opposed to the X-ray generator 63 via the hole 62 and the printed circuit board W.

The structure of the electric circuit of this processing apparatus is shown in FIG. That is, a control circuit (hereinafter referred to as "CPU") 64 for controlling the operation of the entire processing apparatus, an image processing apparatus 58, a calculation circuit 65, a storage circuit 66, and a keyboard for the user to input punching conditions and the like. An input device 67 including (not shown) and the like is connected. The above-mentioned motors 6, 20, 49 and the spindle motor 61a are also connected to the CPU 64, and the operations of the Y-axis table 12, the X-axis table 26, the base plate 52, and the punching member 61c are controlled respectively. The image processing device 58
Is for inputting image data obtained by the X-ray generator (electromagnetic wave irradiation means) 63 and the X-ray camera (imaging means) 57.

A method of making a reference hole in the printed circuit board W by using the mark position detecting method according to the present invention by the processing apparatus having the above configuration will be described below with reference to the flow chart shown in FIG.

FIG. 6 shows an overall view of the printed circuit board W, of which a portion W'indicated by a one-dot chain line is enlarged and shown in FIG. This printed circuit board W is for obtaining a plurality of parts (wiring boards), and wiring patterns 68 (see FIG. 7) having the same shape are formed at a plurality of positions at regular intervals by printing or the like. Two or more desired wiring boards are formed by punching out the outer shape 69a indicated by the two-dot chain line or making the component mounting holes 69b. Therefore, positioning marks 70 are provided in the vicinity of each wiring pattern in order to indicate the processing position when performing the processing such as the press punching. In this embodiment, a hole is formed at the position of the positioning mark 70 to serve as a reference hole for press punching in the subsequent process. Usually, such a positioning mark 70 is formed by printing simultaneously with the wiring pattern. In the present embodiment, the positioning mark 70 is a double circle in which a concentric circular ring 72 is provided outside the central circle (black circle) 71 in order to facilitate the measurement of the positional error of the printed circuit board described later. is there.

First, the user actually measures the position error of the mark on the printed circuit board W on which the wiring pattern 68 and the positioning mark 70 are formed (a). More specifically, before starting the work, holes 73 are actually made at all points on one printed circuit board by using the same three-point sensing method as the conventional one. According to this, since all the marks 70 on the printed circuit board are perforated assuming that they are all arranged in a matrix at equal intervals, as described above as a conventional problem, the mark position based on the printing error or the like. However, the position of the mark 70 and the actually opened hole 73 are deviated from each other in the portion where the printing error is large (see FIG. 8). This state is image-recognized, and the center of the hole 73 and the center of the mark 70 which are actually opened are obtained, and the error is calculated. When obtaining the center of the mark 70, most of the center circle 71 of the mark is hidden by the hole 73, so the center of the ring 72 is obtained.

An example of the method of obtaining the center of the mark by the image processing as described above will be described with reference to FIG. First,
X-axis 74a and Y preset in the X-ray camera 57
Four intersections 72 between the axis 74b and the outer peripheral portion of the ring 72 of the imaged mark 70 (a boundary line where the contrast changes)
Recognize a, 72b, 72c, 72d. Then, X at intersections 72a and 72c of the outer periphery of the ring 72 and the X axis 74a.
The X coordinate of the center point 72e of the circular ring 72 is divided into two equal parts, and the Y coordinate of the intersection points 72b and 72d with the Y axis 74b is divided into two parts and the Y coordinate of the central point 72e of the circular ring 72 is divided. The coordinates of the center point 72e are detected by dividing. Similarly, the coordinates of the center point of the hole 73 are obtained. The position error of the mark is measured based on the difference between the two coordinates.

After measuring the position error for all points on the printed circuit board, based on the measurement result,
The portions where the marks 70 are arranged at relatively equal intervals are divided into a plurality of processing areas (see FIG. 6). That is, a portion where the printing error is small and the intervals between the marks 70 are uniform is defined as a large-area processing region, and is divided into smaller-area processing regions as the printing error gradually increases and the variation in the intervals between the marks 70 increases. To go. In this way, the printed circuit board W is divided into four processing regions W1, W2, W3 and W4 (b). At this time, the mark 7 is set in each processing area.
The number of rows and the number of columns of 0 are obtained respectively. The division method and the like are set by operating the input device 67 (see FIG. 4), and the number of rows and the number of columns of the marks 70 in each processing area are stored in the storage circuit 66.

Then, the printed circuit board W is set in the processing apparatus shown in FIGS. That is, the printed board W is held by the fixing claws 36 of the holding means C, the motors 6 and 20 are driven, and the printed board W is moved by the XY table mechanism 101, and the initial position of the first region W1 is punched. It faces 103 (d).

Then, the positioning mark 70a located at the upper left end portion in the processing area W1 is irradiated with X-rays from the X-ray generator 63, and the X-ray image is picked up by the X-ray camera 57. At this time, since the contrast of the mark 70a is different from that of the other part, the center point of the mark 70a is recognized based on the image. The method of obtaining this center point is substantially the same as the method in the above step (a), and as shown in FIG. 9, the X coordinate of the intersection points 71a and 71c of the outer peripheral portion of the center circle 71 and the X axis 74a is set to two. The X coordinate X1 of the center point 71e of the center circle 71 is divided into equal parts, and the Y coordinate Y1 of the intersection points 71b and 71d with the Y axis 74b is equally divided into two to obtain the Y coordinate of the center point 71e of the center circle 71. The center coordinates (X1, Y1) are detected by dividing.

After obtaining the center coordinates (X1, Y1) of the upper left mark 70a by the image recognition method as described above,
The printed board W is moved to move the center coordinates (X2, Y2) of the mark 70b located at the upper right end in the processing area W1.
2) Then, the center coordinates (X3, Y3) of the mark 70c located at the lower right end are obtained (e).

After the center coordinates of the marks 70a, 70b, 70c are obtained, the distance between the marks located at both ends in the horizontal direction is calculated, and the number of columns of the marks in the area W1 is read from the storage circuit 66, The arithmetic circuit 65 calculates the average column pitch based on these data. More specifically, since the marks located at both ends in the horizontal direction within the processing region W1 are 70a and 70b, the difference | X2-X1 | between the X coordinates of these center points is obtained. Since four columns of marks are arranged in this region W1, a value obtained by dividing | X2-X1 | by (4-1), that is, |
X2-X1 | / 3 is the average row pitch of the marks 70 in the processing area W1.

Similarly, the distance | Y3-Y2 | between the center points of the marks 70b and 70c located at both ends in the vertical direction is calculated,
Since the number of lines of the mark 70 is four, the processing area W1
The average row pitch | Y3-Y2 | / 3 of the marks 70 inside is obtained. As a result, it is considered that the marks 70 are arranged in a matrix in the processing region W1 at the column pitch | X2-X1 | / 3 and the row pitch | Y3-Y2 | / 3 (f).
In this method, the conventional three-point sensing method is performed on the processing region W1.

Next, in the processing area W1, the center point 66a of the mark 70a to be processed first is the punching means 103.
The printed circuit board W is moved so as to come to the position. At the same time, the base plate 52 is moved by driving the motor 49 (see FIG. 3) so that the drill 61c faces the center point 71e of the mark 70a (g). Then, the spindle motor 61a is driven to drive the printed circuit board W by the drill 61c.
Make a reference hole in (h).

Then, it is judged whether or not all the holes of the mark 70 in the processing area W1 have been drilled (i). If the drilling of all points has not been completed, the average sequence obtained in step (f) Based on pitch and average row pitch,
The printed circuit board W is moved so that the drill 61c faces the next mark 70 (g). For example, when a mark 70d next to the right of the mark 70a is punched, |
The printed circuit board is moved in the left-right direction by X2-X1 | / 3. Then, drilling is performed at that position with the drill 61c (h). When steps (g), (h), and (i) are repeated until the mark 70b at the right end of the processing region W1 is drilled, the mark 70e therebelow is drilled. Therefore, | Y3-Y2 | / 3 Then, the printed circuit board W is vertically moved (g) to make a hole (h). Thus, the average pitches | X2-X1 | / 3 and | Y3-Y2 | /
While moving the printed circuit board W vertically and horizontally based on 3,
Drilling holes at the positions of the mark 70 in sequence, and processing area W1
When it is determined that all the marks in the inside have been drilled (i), it is confirmed whether or not there is a processing area on the printed circuit board W which has not yet been drilled (j), and the printed circuit board W is moved. Then, the initial position of the processing region W2 to be drilled next is made to face the drilling means 103 (d). At this time, the base plate 52 is moved by the motor 49 so that the X-ray camera 57 faces the hole 62 (see FIG. 3).

Then, as in the case of the processing area W1, the center coordinates (X4, Y4), (X5, Y5), (X6, Y6) of the three points 70f, 70g, 70h of the processing area W2 are obtained (e). .. In the processing area W2, 3 in the X-axis direction.
Since four marks are arranged in the Y-axis direction, the average column pitch of the marks 70 in the processing region W2 | X5-X4 |
/ 2 and the average row pitch | Y6-Y5 | / 3 are calculated (f).

As in the case of the processing region W1, the printed circuit board is moved based on the average column pitch and the average row pitch obtained in step (f) (g), and holes are sequentially drilled (h). Then, when it is judged that the drilling of all the marks in the processing region W2 is completed (i), the process moves to the initial position of the next processing region W3 (d),
The positions of the three points 70i, 70j, 70k are detected (e), the average column pitch | X8-X7 | / 2 and the average row pitch | Y9-Y8 | are obtained (f), and then steps (g) to (i). repeat. After that, after moving to the initial position of the next processing area W4 (d), three points 70m, 70
Position detection of n and 70p is performed (e), average column pitch |
X11-X10 | / 2 and average row pitch | Y12-Y1
1 | is obtained (f), and steps (g) to (i) are repeated. In this way, all the marks 7 in the final processing area W4 are
When it is confirmed that the drilling of 0 is completed (j), this printed circuit board W is removed because the drilling is completed (k).

By the way, when the printed circuit boards W are mass-produced, that is, when the printing process of the mark and the wiring pattern is performed under the same processing conditions, the printing errors are considered to be substantially equal. Therefore, when processing a plurality of these printed circuit boards, it is not necessary to measure the printing error and set the processing area for each one, so that steps (a) and (b) are omitted. (C) to step (k) are repeated. In this way, when it is detected that the drilling of all the printed circuit boards having the similar printing error (mark position error) is completed (m), the drilling process is ended.

Although not described in detail, actually, each component (wiring board, etc.) is obtained by performing press punching or the like based on the reference hole formed in the above process.

In the above-mentioned embodiment, in order to measure the actual printing error, one printed board is made a hole by the three-point sensing method, but the present invention is not limited to this. As a method of making a hole for trial, it may be possible to use NC control. Further, in the case of screen printing, it is known that the print error increases as the distance from the print start point (the reference side edge) increases. Therefore, the print error tendency based on the characteristics of the printing machine is empirically obtained. In the case of a printed circuit board with a total length of 600 mm, the first area is 300 to 470 m within 300 mm from the printing start point.
m is the second region, 470 to 550 mm is the third region, 5
For example, setting 50 to 600 mm as the fourth area,
It is also possible to determine the method of setting the processing area in advance. According to this, the step (a) is not required, the work is extremely simplified, and full automation is possible.

Further, the center position detecting method by image processing described in the above embodiments is only an example, and other methods such as a method for obtaining the center of the area of the mark and a method for obtaining the center more surely by using a double circle. For example, any method generally used for obtaining the center position is adopted.

As described above, according to the present invention, the printed circuit board is appropriately divided in consideration of the position error of the mark due to the printing error and the like, and the divided three processing areas are independently processed by the same three-point sensing method as in the prior art. Since the mark position is detected by performing the above, and is used as a processing reference, the processing accuracy can be improved as compared with the conventional simple three-point sensing method.
Work efficiency can be improved compared to the all-point sensing method.
That is, by appropriately setting the division method, the balance between the processing accuracy and the work efficiency can be freely selected. This makes it possible to flexibly handle both extremely high processing accuracy even if it is slightly inefficient, and conversely, when strict processing accuracy is not required but work efficiency is desired. You can do what you want.

Further, a plurality of printed boards provided with positioning marks and wiring patterns under the same conditions can be processed extremely efficiently.

The present invention is not limited to the method of the above embodiment, and various applications are possible. For example, in the present embodiment, the reference hole is formed at the position of the positioning mark, but without forming the reference hole, the processing reference position is calculated based on the detected mark position, and processing such as press punching of the component outline is immediately performed. May be given.

[0046]

As described above, according to the present invention, the processing accuracy is improved as compared with the conventional three-point sensing method for one printed circuit board, and the working efficiency is higher than the all-point sensing method. Therefore, the work can be simplified and shortened as much as possible while maintaining necessary and sufficient processing accuracy. Then, by appropriately setting the dividing method, it is possible to perform optimum machining according to various work conditions, and it becomes possible for the user to perform the work as he or she desires.

[Brief description of drawings]

FIG. 1 is a partially cutaway plan view of an embodiment of a processing apparatus to which the present invention is applied.

FIG. 2 is a side sectional view of a processing device.

FIG. 3 is a front sectional view of a boring means of a processing device.

FIG. 4 is a block diagram of a processing device.

FIG. 5 is a flowchart showing a processing procedure of the present invention.

FIG. 6 is a plan view of a printed circuit board.

7 is a partially enlarged view of FIG. 7.

FIG. 8 is an explanatory diagram showing an example of a mark center position detecting method.

FIG. 9 is an explanatory diagram showing another example of the mark center position detection method.

[Explanation of symbols]

 W Printed circuit board W1, W2, W3, W4 Processing area 57 X-ray camera (imaging means) 58 Image processing device 70 Positioning mark 103 Drilling means (processing means)

Claims (4)

[Claims] 1. A position of the mark on a printed circuit board having a plurality of positioning marks arranged in a matrix is calculated by using an image pickup means and an image processing device, and the calculated position of the mark is calculated. A method of processing a printed circuit board, wherein a predetermined processing is performed on the printed circuit board by a processing means as a reference, wherein a plurality of processing areas including the entire area of the printed circuit board each including at least two marks in the row and column directions are provided. (A) For a specific processing region, the average row pitch and the average column pitch of the marks in the area are calculated by a three-point sensing method, and (B) the calculated average row pitch and average. Based on the row pitch, the printed circuit board is vertically and horizontally moved relative to the processing means to perform a predetermined processing on the specific processing area. ) The (A), (cycles B) repeatedly at the remaining machining area, machining a PCB, characterized in that for machining the entire area. 2. The method for processing a printed circuit board according to claim 1, wherein the processing means is a hole forming means, and the processing is to form a reference hole at the position of the mark. 3. The method for processing a printed circuit board according to claim 1, wherein the processing area is made smaller as the distance from the reference side edge increases. 4. The printed circuit board is divided so that a portion having a large error in the mark position is a small area processing region and a portion having a small error in the mark position is a large area processing region. The method for processing a printed circuit board according to claim 1 or 2.