JPS5951551A - Mounting apparatus of integrated circuit - Google Patents

Mounting apparatus of integrated circuit

Info

Publication number
JPS5951551A
JPS5951551A JP16248582A JP16248582A JPS5951551A JP S5951551 A JPS5951551 A JP S5951551A JP 16248582 A JP16248582 A JP 16248582A JP 16248582 A JP16248582 A JP 16248582A JP S5951551 A JPS5951551 A JP S5951551A
Authority
JP
Japan
Prior art keywords
shell
mold
degrees
metal
bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16248582A
Other languages
Japanese (ja)
Other versions
JPS6229907B2 (en
Inventor
Nobumoto Ikehara
池原 総司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEIEI KOSAN KK
Original Assignee
SEIEI KOSAN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEIEI KOSAN KK filed Critical SEIEI KOSAN KK
Priority to JP16248582A priority Critical patent/JPS5951551A/en
Publication of JPS5951551A publication Critical patent/JPS5951551A/en
Publication of JPS6229907B2 publication Critical patent/JPS6229907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Abstract

PURPOSE:To efficiently and securely seal a package by pushing out the shells from the lowest one, engaging it with the shoot bracket by pushing it, placing the shell opposing to the metal die through rotation and thereafter pressingly engaging it with the shell engaging part of metal force. CONSTITUTION:The lead frames LF housed in a magazine 1 are sequentially pushed out from the lowest one by a pusher, then supplied to a table 2 and then carried to a metal die. A shell S pushed out from a shell hopper 3 is pushed to the shoot brackets 23, 33 and is placed opposing to the metal forces 52, 62 after the welding surface is rotated for 90 degrees. It is then pushed out and is engaged with the shell engaging part. The metal forces 52, 62 are preliminarily heated and is then rotated further for 90 degrees. The dies are heated by a hot blower 76. Thereby the welding surface is fused and is then rotated for 90 degrees again. Thereby, the shell engaging parts are opposed face to face in both sides of lead frame LF. Here, the cylinders 58, 68 operate, causing a top force and a bottom force to slide in such a direction as they come close along the guide post 56.

Description

【発明の詳細な説明】 本発明は集積回路製造の最終工程であろバック゛−シン
グ(実装)を行な5八二めの集積回路実装装置?−1に
関するもので、極めて効率よくハ・つ確実にパッケージ
刺入をなしうろ集積回路実装装置?提供する・ことを目
的と1−ろものてル)ろ。
DETAILED DESCRIPTION OF THE INVENTION The present invention is a 582nd integrated circuit mounting apparatus that performs backing (mounting) in the final process of integrated circuit manufacturing. Regarding 1, is it an integrated circuit mounting device that can insert packages extremely efficiently and reliably? The purpose is to provide.

不発明はシェルホッパー内のノエルケ最]段のものから
押し出してシー−ドブラケットに押し嵌める機構と、シ
ーートブラケツl−’Y 90度回転させて金型Vc、
対向さぜ1こ後金型に向けて前進させ、シェル火シュー
トブラケットから押し出して金型のシェル11u装部に
押し1θ?める機構と、金型790度ずつ回転させ、そ
の都度リードフレームの両側から金型ケ近接させて実装
火打なう機構とをこの順に連接してなる集積回路実装装
置であって、図面はその実施例を示すものである。先ず
第1図に従って本発明の詳細な説明するに、マガジンl
内に多数段積収納され1こり一ドフレームIJFは、最
十段のものから順にフッシー1・−によって押し出され
、テーブル21に送られ搬送される。−力シエルホッパ
ー:’I 内K 収納され1こシェルSは、最下段のも
のかり「ダルマ落し一1式に供出され、ノロー+−ブラ
ケノl−23に押し嵌められろ。次いで/ユートブラク
ノト237’J・(10度旋回して金型52に相対し1
こ状態で前−進し、シェルSを十字状の金型52に押し
嵌めろ。
The uninvented feature is a mechanism that pushes out the Noelke from the highest stage in the shell hopper and presses it into the seed bracket, and a mechanism that rotates the sheet bracket l-'Y 90 degrees to form the mold Vc.
After facing each other, move it forward toward the mold, push it out from the shell chute bracket, and push it into the shell 11u mounting part of the mold. This is an integrated circuit mounting device consisting of a mechanism that rotates the mold by 790 degrees and a mechanism that brings the mold close to each other from both sides of the lead frame and hits the mounting device in this order. This shows an example. First, a detailed explanation of the present invention will be given with reference to FIG.
A large number of single-frame IJFs stored in stacks are pushed out by the hooks 1-- in order from the tenth stage, and sent to the table 21 for conveyance. - Power shell hopper: 'I Inner K The one shell S that is stored is delivered to Daruma Otoshi 11 and pushed into Noro + - Brackeno L-23. Next / Utobraknoto 237' J.(Turn 10 degrees and face the mold 52 1
In this state, move forward and press fit the shell S into the cross-shaped mold 52.

金型52は00度ずつ回転し、その間にホソトブロフレ
、75.76によりて/エルSの表面(合着面)を加熱
溶融させる。以上の′ンエルホツ、s −3TJ土の構
成はテーブル2の下側にも設けろ。そして、金型52、
(+2は90度回転づ゛る毎に1)−1・゛フレームL
、 l” i挾んで近接し、シェルS > IJ −1
−゛フレームL I・”の両側から1土着してノくノケ
ージングを終了′1−ろ。以上の一連の動作か途qノれ
なく行なわれる。次に第2図以下に依って谷部θ)構成
につ・キ詳述する。3は上側のシエルホノノく−て、シ
ェルS乞窒多数積層収納する。4(」、7にソ7<−ブ
ラケットで、7エルホノノよ一37ガイト゛ベース5+
、に保持子7)。6はガイドベース5o、)i’111
1I K固定し1こシリンダー支持アングル又、こft
に7リンダーホルダー7ケ介1−てシIJンタ゛−87
定着1−ろ。1〕はシリンダー日ソド4スルダ−で、こ
れにガイドベース5中ケ移動するスライドガイド10に
固定づ−ろ。スライド板1()には、ノjイIパベース
5と一体とブエつ1こ押え板11−にに若−[−突+1
i−j−る突条l(1:+ゲ設け、それにフェノレ7ト
ノノ:−3内最ト段のシェルS7押送させ6,12は一
/fイドベース5ケチープル2土に固定丁イ)1こめの
ブラケットである。以」−の構成と同様の構成乞テーブ
ル2の1:側にも設置′1−ろ1、即ち、+3はシエル
ホ゛ツバ−11/1はホッパーブラケット、15はガイ
ドベース、16はシリンダー支持アングル、17はシリ
ンダーホルダー、18はシリンダー、19はシリンダー
ロッ゛ドホルダー、20 &!スライド板、20 ;1
は突条、21は押え板、そして22は以上の構成をテー
ブル2の下側に固定するlこめのハンガーブラケットで
ある。なお、第2図及び第:J)図に46いてはテーブ
ル2の上側の構成はシェルSを縦方向に1汽い1こ場合
を、ま1こ、下側の構成はシェルSv(負方向に置い1
こ場合を示しているか、ンエルホソパー3.13の設置
方向ケ変えるとともに、スライド板10.20及び押え
板11.21を変換しさえ1−れば縦型、横型のいすi
t O)場合にも適用しつるものである。2:3は上側
シコーートブラケソトで、スライド板JOによってンエ
ルポノバー3下底部から押し出されてくる/エルSヶ受
は入れろ挿入ガイド2/1乞設けろ。25はIn人ガイ
ド24内に+++tっTこシェルS火脚し出1−とと6
に、金型の141型に押し11)(めるfこめのキック
フレー・1・で、/リンダー20によって駆動される(
第4図参照)。27.28はバネ掛ビンで、両名間にノ
(半用0ケ川は渡丁、7シリンダー26が後退し1こ際
キックプレー1・25は、こ−0)バネ2()に−二っ
て力−二〇位1直に引き戻されろ。その際キックフレー
ト25ケ定位置に”停止さぜろ1こめに、キックフレー
1・25にストッパーピン:30を取り伺けろ11:$
ロー1、l 1+1117ユートブラケソト2;3を9
0度回転3さ()、イ)ロー、タリーアクチュエータで
、フィードフレ l−32に固定する。なお、前述のシ
リンダー2(’+もこのフィードプレー1− :32に
取り付ける。3;1ば」二側シュ。−1−ブラケット2
:4同様の(イ4成としに下側ンユー1−ブラケットで
、挿入ガイド;つ/1、キックプレート;つ5、シリン
ダー:□36、バネ掛ヒン、〕くネ、ストツノニーピン
及びロータリーアクチ・、エータ旧も同様に設ける1、
そして、シリンダー:30とロー・クリ−アクチュエー
タ41乞フイードプレー1・32に矩着する。42はフ
ィードプレー1・32ケ軸11:3.11・1に泪って
スライド駆動するシリンダーで(第ll I’ll f
=こおいて左右方向)、ブラケット・15を介(−でス
ライドベース46に固定]、2、まムニ、フ゛ラケット
47ケ介してそのシリンダー ロッドアノイードフレー
ト32に固定1−る1、(−記11b <31.l/l
(土、それぞ」tスライドベース46に設け1こ支承部
拐/18によってスライドベース46上に保持される。
The mold 52 is rotated by 00 degrees, and during this time, the surface of the /L S (bonding surface) is heated and melted by the Hosotobrofle 75.76. The above configuration of s-3TJ soil should also be provided on the underside of table 2. And the mold 52,
(+2 is 1 for every 90 degree rotation) -1・゛Frame L
, l”i sandwiched and close, shell S > IJ −1
- Finish the casing by landing on both sides of the frame ``1''. The above series of operations are carried out seamlessly. Next, as shown in Figure 2 and below, the trough θ ) The configuration will be explained in detail. 3 is the upper shell hole, and a large number of shells S is stacked and stored. 4 ('', 7 is the 7 <- bracket, 7 El hole is 137 guides, base 5 +
, retainer 7). 6 is guide base 5o, )i'111
1I K fixed, 1 cylinder support angle, ft
7 Linder Holder 7 Cases 1-87
Fixation 1-ro. 1] is a cylinder cylinder 4 cylinder, to which a guide base 5 is fixed to a moving slide guide 10. On the slide plate 1 (), there is a presser plate 11 that is integral with the base 5 and a presser plate 11- [-[-touch +1].
i-j-ru protrusion l (1: +ge provided, and the topmost shell S7 in -3 is pushed and 6, 12 is fixed on the 1/f side base 5 Kechi pull 2 earth) 1 piece This is the bracket. The structure is similar to that shown below, and it is also installed on the 1: side of the table 2. is the cylinder holder, 18 is the cylinder, 19 is the cylinder rod holder, 20 &! Slide plate, 20; 1
2 is a protrusion, 21 is a presser plate, and 22 is a full hanger bracket for fixing the above structure to the lower side of the table 2. In addition, in Figures 2 and 46, the upper side of the table 2 has the shell S in the vertical direction, and the lower side has the shell Sv in the negative direction. Place 1
In this case, as long as you change the installation direction of Erhoso Parr 3.13 and convert the slide plate 10.20 and presser plate 11.21, you can create a vertical or horizontal chair.
It also applies to cases of t O). 2:3 is the upper side bracket, and it is pushed out from the bottom of the Nerponover 3 by the slide plate JO. 25 is in the In person guide 24 +++t Tko shell S fire legs 1- and 6
Then, press into the mold 141 type 11) (with the kick frame 1) driven by the /linder 20 (
(See Figure 4). 27. 28 is a spring-loaded bottle, and between both people (half-time 0 ke river is watari, 7 cylinders 26 are retreated, 1 this kick play 1 25 is this - 0) spring 2 () - 2 is power - 20th place 1 Be pulled back to direct. At that time, place the kickflakes 25 in place and stop them.At this time, pick up the stopper pins:30 on the kickflakes 1 and 25.11:$
Rho 1, l 1 + 1117 Utobrake Sotho 2; 3 to 9
Rotate 0 degrees 3 (), A) Fix to feed frame l-32 using the low and tally actuators. In addition, the aforementioned cylinder 2 ('+ is also attached to this feed play 1-:32.
: 4 Similar (A 4 configuration, lower side 1-bracket, insertion guide; 1/1, kick plate; 5, cylinder: □36, spring hook, 4 brackets, knee pin and rotary actuator). Eta old is also provided in the same way 1,
Then, the cylinder 30 and low crease actuator 41 are connected to the feed plate 1 and 32. 42 is a cylinder that slides and drives feed play 1 and 32 shafts 11:3, 11 and 1 (No. ll I'll f
= left and right direction), via bracket 15 (fixed to slide base 46 with -), 2, fixed to cylinder rod anoid plate 32 via bracket 47; 11b <31.l/l
(The soil, respectively) is provided on the slide base 46 and is held on the slide base 46 by a bearing part 18.

スライドベース110はステーl19でテーブル2土に
固定し、マ1こ、フィ−ドフレート:J)2はそれに取
り伺げfこスライドガイド50を介して軸=I3、旧に
宿って摺動OJ能に1−る。51はセンサーである。次
いで第5図乃至第8図に示J−金型部の機構について説
明1゛ろに、52は十字状にシェル嵌装部52.Iケ配
置し1こ金型で、ロータリーアクチーエータ5:3に、
にって90度ずつ回転する。J:5 i厄する1、即ら
、ロータリーアクチーエータは5)0度ずつ1反回転−
づ−るよ5に設定し、一方第81ン1に示すよ5フ3(
ラチェット機F1ηを金型52の1!j1転軸5・1に
配イ1iii L、1しIシく(矢印方向)のときのみ
ラチェ′ノド爪5.しjか回転+l(1に噛合して金型
52ケ5)()度回転させ、反転のときにはりと回りづ
−るようにな丁。55は金型521/こ置屋1〜Lこア
ッパーダイで、テーブル2馨貫いて\7一般し1こツノ
イドボスト5Gに清って眉降し、以て金型52ケ眉降さ
ぜろ。57はガイドボスト56一ヒ部に固定しLニアツ
バ−プレートて、その」Lにアッパーダイ55 %’ 
Rj究させるKめのシ1ノンダー58を定置丁イ〕。5
0はアッパープレート57を貫いてアッパーダイ55に
連結したシリンダーロッドであく)。
The slide base 110 is fixed to the soil of the table 2 with the stay 19, and the feed plate: J) 2 is attached to it via the slide guide 50, and the sliding OJ function is attached to the shaft = I3 and the former. 1-ru. 51 is a sensor. Next, the mechanism of the J-mold part shown in FIGS. 5 to 8 will be explained. 52 is a cross-shaped shell fitting part 52. Rotary actuator 5:3 with I arrangement and one mold,
Rotate 90 degrees at a time. J: 5 i trouble 1, that is, the rotary actuator is 5) 1 counter-rotation in 0 degree increments -
Set the number 5 to 5, and set the number 5 to 3 (as shown in the 81st page 1).
Ratchet machine F1η is 1 of 52 molds! The ratchet' throat pawl 5. is arranged on the j1 rotating shaft 5.1 only when L, 1 and I are in the direction of the arrow. Rotate + l (1) and rotate the mold 52 pieces (5) ( ) degrees, so that when it is reversed, it will rotate. 55 is a mold 521/kokiya 1~L upper die, pass through the table 2, \7 general, clean one tsunoid boss 5G and lower the eyebrows, and then lower the eyebrows of mold 52. 57 is fixed to one part of the guide boss 56, and the upper die 55% is attached to the L near plate.
The K-th 1 non-der 58 is fixed for Rj]. 5
0 is a cylinder rod that passes through the upper plate 57 and is connected to the upper die 55).

60はアッパーダイ55が下降−3−ろ際のストッパー
、6目エアツバ−ダイ55が上昇−ツ−4)際のストッ
パーである。以十のものと同様の構成をテーブル2のF
側にも設@する。即ち、62は金型、02aはシェル嵌
装部、63ハロータリーアクチユエータ、()・1は金
型fi2のIす1転軸、65はロワーダイ、67はロワ
ーフレー1・、(う8シエ/リンダ−160はシリンダ
ーロッド、70.71はそれぞれストッパ〜である。7
2は上側リンク、7:3は下側リンつて、調整板7・1
乞以て連結し、金型52ど金型52か近接、離隔′1−
る際のバランス調整を行なう1,75.76は金l)す
52.62のノニル嵌装部52,1、(]2,1に収ま
っ1こシェルSの表面ケ加熱溶融さぜイ)1こめのホノ
]・ブロワ−である。
Reference numeral 60 designates a stopper when the upper die 55 is lowered (3), and a stopper when the 6th air tube die 55 is raised (4). F of Table 2 has a configuration similar to that of
Also set @ on the side. In other words, 62 is the mold, 02a is the shell fitting part, 63 is the rotary actuator, ().1 is the I-1 rotation axis of the mold fi2, 65 is the lower die, 67 is the lower frame 1, (8) /The cylinder 160 is a cylinder rod, and 70.71 are stoppers.7
2 is the upper link, 7:3 is the lower link, adjustment plate 7.1
The molds 52 and the molds 52 are closely connected and separated from each other.
1, 75.76 is gold l) Nonyl fitting part 52, 1, (] 2, 1 is heated and melted on the surface of shell S) 1 It is a blower.

本発明の作用につき説明づ−るに、マガジン1内に収納
され1こリードフレーム1ノ1−は、最下段のものから
順にプッシャーによって押し出され、テーブル2上に供
給されて金型部−・〜と搬送される。、、’ETこ、/
エルホッパー3 、I:’l内に積層され1こ7エルS
は、シリンダー8、+8が作動して/リンダーロンドホ
ルダー〇、円を介しスライド板10.20が前進駆動さ
れることKより、スライド板10.20の突条H1a、
20ンiによって7エルホノパー3、+3から1ダルマ
落j、1式に押し出されろ。そして、シェルS &t、
すΣに突条H1:+ 、 2(1;1に押送されてシュ
ートブラケノl’ 2:’3、;う:うの挿入ガイド2
1、:34内へ押し込まれる11次−・て/リンダー8
、+8が後退りるとともにロータリーアクチュエータ3
1、/11が作動1.、シェルSの溶治面乞9υ度回転
させて金型52、(52vこ対向さ−IL−る。
To explain the operation of the present invention, one lead frame 1 No. 1 stored in a magazine 1 is pushed out by a pusher in order from the lowest one, and is supplied onto a table 2 to be placed in a mold section. ~ will be transported. ,,'ETko,/
L hopper 3, I:'l stacked in 1 7 L S
Since the cylinders 8 and +8 are activated and the slide plate 10.20 is driven forward through the Linderrond holder 〇 and circle, the protrusion H1a of the slide plate 10.20,
By 20n i, 7 Elhonopa 3, +3 to 1 Daruma drop j, pushed out to 1 set. And Shell S&T,
The protrusion H1: +, 2 (1; 1 is pushed into the chute bracket L' 2: '3,; U: Insertion guide 2)
1,: 11th order pushed into 34-te/Rinder 8
, +8 moves back and rotary actuator 3
1, /11 is activated 1. Then, the melting surface of the shell S is rotated 9υ degrees to face the mold 52 (52v).

続いてシリンダー112が作動し、グラクノト・17?
介してその/リンダーロノトゲ固定しlニフィ−ドグレ
ート32?、輔4:つ、44 VCfa ッて金型側(
第4図において右方向)へ移動さぜ、/z−l−グラタ
ンl−231,つ;うケそれぞれ金ノ一り52、(32
のシェル11′3ミ装部52;1、h2 ;lに近接さ
ぜろ。そご−Cシリンダー力)、3(!が作動し、シリ
ンダーロッドがキックシレー1・25、;う5を押圧1
−ろことにより、ギックル−1・25、;35がシュー
トブラクノト2;3、:3;3から7エルSY押し出し
てシェル嵌装部52;I、62J1に嵌め込む3.その
際シェルの溶着H:<ISがシェル1茨装部5221、
h2 ’;+から若干はみ出1こ状態となる。シリンダ
ー2()、36が後退丁イ)と、バネ2()によってキ
ックシレート25.35がノ1:のイ1ン1直に戻され
、庄fこ、シリンダー42が後;11 t、てフィード
プレー1−32も引き戻される。−当金71.す!’i
2.62はロータリーアクチュエータ53.6:3によ
って90度回転させられ、ホットブロワ−57によって
予備加熱され、史に00度回転させられてホットブロワ
−70に」ニリ本加熱され、合着面が溶融する。そして
四[!l(l 1現回転1−ろことにより、リードフレ
ーム、+、+rを挾んてシェル嵌装部52η、t’i2
;lが向き合う。そこでシリンダー58、(う8が作動
し、それぞれシリンダーロッド59.09 ’;f介し
てアッパーダイ55、ロワーダイ(55ケガイドボスト
5(jに渚って両者近接方向にスライド移動さぜイ)、
その結果ノニル嵌装部52 a 、(52srがリー 
ドフレームL ]”(f挾んで近接し、それぞれのシェ
ルSが溶着合体し、シリンダーロッド59.6(lが後
退して金型52.62も元の位置に戻され、パッケージ
ングが終了J−る。以」二の過程は各ノニル嵌装部52
21、f]2 ;l ′njに行なわれるので、金型5
2、(〕2が()()度回転J−る毎に1回パンケージ
ングが行なわれることになる。
Next, cylinder 112 operates, and Gakunoto 17?
Through that / Linderononotge fixed lnified Great 32? , 4: 44 VCfa and the mold side (
Move to the right (in Fig. 4) /z-l-gratin l-231, tsu;
The shell 11'3 is close to the mounting portion 52;1, h2;l. Sogo-C cylinder force), 3 (! is activated, and the cylinder rod presses the kick cylinder 1, 25, ;U5 1
- By means of the lever, Gickle-1, 25, ;35 pushes out 7 LSY from the shoot braknoto, 2,3, :3;3, and fits into the shell fitting part 52;I, 62J1.3. At that time, shell welding H:<IS is shell 1 thorn welding part 5221,
h2': It is in a state where it slightly protrudes from +. Cylinders 2 () and 36 are moved backwards, and spring 2 () returns the kick rate 25.35 to the position of 1:1, and cylinder 42 is moved back; The feed play 1-32 is also pulled back. -Cash 71. vinegar! 'i
2.62 is rotated 90 degrees by a rotary actuator 53.6:3, preheated by a hot blower 57, rotated 00 degrees and heated by a hot blower 70 until the bonding surface is heated. melt. And four [! l (l 1 Current rotation 1 - The lead frame, +, +r are sandwiched between the shell fitting portions 52η, t'i2
;l faces. Then, the cylinder 58 (8) is activated, and the upper die 55, the lower die (55) and the lower die (55) are moved in the direction of proximity to each other through the cylinder rods 59 and 59', respectively.
As a result, the nonyl fitting part 52a (52sr is the lead)
The cylinder rod 59.6 (l) is moved back and the mold 52.62 is also returned to its original position, and the packaging is completed. The second process is for each nonyl fitting part 52.
21,f]2;l'nj, so mold 5
2. Pancaging will be performed once every () () degree rotation of 2.

本発明は一1二述L−7,−IIjlつであって、バノ
ケーンング作業欠流れ作業的に効率」二<、;7かも、
市価に行ないつる効果があり、1,81等のh;産に好
適なものである。
The present invention has the following features: L-7, -IIjl The present invention has two aspects, and is more efficient in terms of the efficiency of Banokening work flow.
It has a vine effect at a lower market price and is suitable for producing h;

【図面の簡単な説明】[Brief explanation of drawings]

第1渚は本発明の概略説明図、第2図は/エル押出機構
とンー−1−グラタン]・iτ1♂の((°♂J成’、
l’ 7J’: −j図、第:3図(Jニジニル押出イ
幾構を示″J1則面図、第4図はシー−ドブラケット部
の’:trf成を示1−側面図、第5図は金型部の構成
を示す正面Iン1、第(5図その平面図、第7図はその
11i11面図1、第81/1は金型を回転させるロー
タリーアクチーエータにおけるラチェット機構を示す図
でル)イ)。 特許出願人 精栄工産株式会初 代理人弁理−1齋 藤 1’i’i  男第4団 才J図
The first beach is a schematic explanatory diagram of the present invention, and the second figure is the /el extrusion mechanism and the
l'7J': -J figure, Figure 3 (J1 law plane view showing the geometry of Jniginyl extrusion, Figure 4 shows the ':trf configuration of the seed bracket part 1-Side view, Figure 3) Figure 5 shows the configuration of the mold part from the front side (I-1), Figure 5 is its plan view, Figure 7 is its 11i11 side view 1, and Figure 81/1 is the ratchet mechanism in the rotary actuator that rotates the mold. This is a diagram showing (l) b). Patent applicant Seiei Kosan Co., Ltd.'s first patent attorney - 1 Saito 1'i'i Male 4th group Sai J figure

Claims (1)

【特許請求の範囲】[Claims] ノニルポツパー内のシェルを最斗段のものから押し出し
て/ニートブラケットに押(、嵌めろ機1’i7)と、
/ニー1−ブラケットを90度回転さlヒて金型に対向
さぜ1こ後金型に向けて前進させ、シェル’、c7j、
−)ブラケットから押し出して金型のシェル嵌装部に押
し嵌める機構と、金ハリケ1)()度ずつ回転させ、そ
の都度リードフレームの両側から金型を近接させて実装
を行なう機構と馨この順に連接してなる集積回路実装装
置3、
Push out the shell inside the nonyl popper from the topmost one and push it into the neat bracket (fitting machine 1'i7).
/ Knee 1 - Rotate the bracket 90 degrees so that it faces the mold, and then move it forward toward the mold, shell', c7j,
-) A mechanism that pushes the lead frame out of the bracket and presses it into the shell fitting part of the mold, and a mechanism that rotates the metal lead frame by 1) () degrees and brings the mold close to each other from both sides of the lead frame each time for mounting. an integrated circuit mounting device 3 connected in sequence;
JP16248582A 1982-09-17 1982-09-17 Mounting apparatus of integrated circuit Granted JPS5951551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16248582A JPS5951551A (en) 1982-09-17 1982-09-17 Mounting apparatus of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16248582A JPS5951551A (en) 1982-09-17 1982-09-17 Mounting apparatus of integrated circuit

Publications (2)

Publication Number Publication Date
JPS5951551A true JPS5951551A (en) 1984-03-26
JPS6229907B2 JPS6229907B2 (en) 1987-06-29

Family

ID=15755507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16248582A Granted JPS5951551A (en) 1982-09-17 1982-09-17 Mounting apparatus of integrated circuit

Country Status (1)

Country Link
JP (1) JPS5951551A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like

Also Published As

Publication number Publication date
JPS6229907B2 (en) 1987-06-29

Similar Documents

Publication Publication Date Title
US3770098A (en) Apparatus for removing bodies from a molding machine and transporting the bodies
CN101462317B (en) Color printing film imbedding device of in-mold label
TW317532B (en)
CN112677647A (en) A turning device for canning two sides printing
JPS5951551A (en) Mounting apparatus of integrated circuit
TW200422155A (en) Method and apparatus for fabricating cellular structural panels
US4349127A (en) Device for affixing garments onto hangers
US2932428A (en) Slug feeder
US2266087A (en) End label attachment
TW200900177A (en) Method and device for forming color metal zipper
US1332538A (en) Assembling-machine
US2214478A (en) Label cutting and packing machine
CN214730027U (en) Food packaging machine
RU2125095C1 (en) Stamp
US936480A (en) Pamphlet-coverer.
US3592356A (en) Apparatus for automatically differentiating and feeding flexible workpieces one at a time from a stack
US2627150A (en) Package forming and sealing machine
CN108910160A (en) A kind of medicine box opens box grabbing device, blanking device and mounted box automated package equipment
CN108910182A (en) A kind of medicine specification folds blanking device and mounted box automated package equipment
CN220448316U (en) Heat sealing mechanism of mouth dissolving film agent packaging machine
CN216782653U (en) Photocuring 3D printer with automatic material conveying mechanism
TW528703B (en) Label insertion mechanism for an in-mold label
CN208746398U (en) A kind of efficient film sealing machine
US914358A (en) Machine for making fruit-baskets.
US3109642A (en) Apparatus for folding transparency mounts