JPS594879B2 - How to mount chip parts - Google Patents
How to mount chip partsInfo
- Publication number
- JPS594879B2 JPS594879B2 JP53089049A JP8904978A JPS594879B2 JP S594879 B2 JPS594879 B2 JP S594879B2 JP 53089049 A JP53089049 A JP 53089049A JP 8904978 A JP8904978 A JP 8904978A JP S594879 B2 JPS594879 B2 JP S594879B2
- Authority
- JP
- Japan
- Prior art keywords
- support base
- base plate
- chip component
- hole
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【発明の詳細な説明】
本発明は導体層を有する支持ベース板上に抵抗・コンデ
ンサなどのリード線を有しないチップ部品を接着剤でも
つて仮固定し、上記支持ベース板の導体層に上記チップ
部品の電極を半田付けするチップ部品の実装方法に関し
、とくに上記支持ベース板への上記チップ部品の仮固定
時の熱的ショックを軽減することを目的とするものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention temporarily fixes chip components such as resistors and capacitors without lead wires on a support base plate having a conductive layer with an adhesive, and then attaches the chips to the conductor layer of the support base plate. The present invention relates to a method for mounting chip components in which electrodes of components are soldered, and is particularly aimed at reducing thermal shock during temporary fixing of the chip components to the support base plate.
一般に支持ベース板に設けた導体層に対してリード線を
有しないチップ部品を半田付けする場合には、上記支持
ベース板上の所要箇所に熱硬化性の樹脂接着剤を配設し
、この接着剤でもつて上記チップ部品を仮固定した状態
で上記支持ベース板５ の単体層に対して上記チップ部
品の電極を半田付けするようにしていた。しかしながら
、チップ部品の支持ベース板への仮固定に際して熱硬化
性の樹脂接着剤を使用する場合には、上記接着剤の加熱
硬化時に上記チップ部品や上記支持ベース板が１０１５
０℃程度の高温雰囲気にさらされるため、上記チップ部
品や上記支持ベース板が熱収縮し、寸法精度が低下する
という欠点があり、また、上記接着剤力坊口熱硬化中に
流れるためにチップ部品が移動し、支持ベース板の所要
位置にチップ部品を１５正確に取付けることができなく
なるという欠点があつた。本発明はこのような従来の欠
点を解消するものであり、従来の熱硬化性の樹脂接着剤
に代つて最近考案された光硬化性の樹脂接着剤を用い、
支持２０ベース板に熱を加えることなくチップ部品を支
持ベース板に確実に仮固定することができるチップ部品
の実装方法を提供するものである。Generally, when soldering a chip component that does not have lead wires to a conductor layer provided on a support base plate, a thermosetting resin adhesive is placed at the required locations on the support base plate, and the adhesive The electrodes of the chip component are soldered to the single layer of the support base plate 5 while the chip component is temporarily fixed with a chemical agent. However, when a thermosetting resin adhesive is used to temporarily fix the chip component to the support base plate, the chip component or the support base plate may
Since the chip parts and the support base plate are exposed to a high temperature atmosphere of about 0°C, there is a drawback that the chip parts and the support base plate shrink due to heat, resulting in a decrease in dimensional accuracy. There was a drawback that the parts moved and it became impossible to accurately attach the chip parts to the required positions on the support base plate. The present invention solves these conventional drawbacks by using a recently devised photocurable resin adhesive in place of the conventional thermosetting resin adhesive.
To provide a method for mounting a chip component that can reliably temporarily fix the chip component to a support base plate without applying heat to the support 20 base plate.
以下、本発明の一実施例におけるチップ部品の実装方法
を説明する。A method for mounting chip components in an embodiment of the present invention will be described below.
２５第１図は本発明の一実施例におけるチップ部品の実
装方法を示す印刷配線板の断面図であり、図中、１は紙
基材フェノール樹脂積層板からなる支持ベース板であり
、その片面には導体層２として公知のエッチング法にて
銅箔パターンが形成され３０ている。25 FIG. 1 is a cross-sectional view of a printed wiring board showing a method for mounting chip components in an embodiment of the present invention. A copper foil pattern 30 is formed as the conductor layer 2 by a known etching method.
また、上記支持ベース板１には公知のパンチング法にて
チップ部品取付用の透孔３が設けられている。４はチッ
プ部品の支持ベースとしての透光性フィルムであり、ポ
リエステルフィルムが使用される。Further, the support base plate 1 is provided with through holes 3 for mounting chip components by a known punching method. 4 is a transparent film as a support base for the chip component, and a polyester film is used.
この透光性フィルム４の片面には３５光硬化性の樹脂接
着剤５が公知のスクリーン印刷法にて形成されている。
そして、上記光硬化性の樹脂接着剤５としてはエポキシ
アクリレイト系の樹脂にアジン化ベンゾフエノンを２．
０％添加したものが使用される。６は上記支持ベース板
１の透孔３に定置されたチツプ部品であり、上記透光性
フイルム４の接着剤５はチツプ部品６に透孔３を介して
接触している０そして本実施例ではチツプ部品６として
は、支持体７の表面に抵抗体膜８が設けられその表面に
電極９が設けられたチツプ抵抗が使用される。A 35 photocurable resin adhesive 5 is formed on one side of the transparent film 4 by a known screen printing method.
As the photocurable resin adhesive 5, azinated benzophenone is added to an epoxy acrylate resin.
0% added is used. Reference numeral 6 denotes a chip component placed in the through hole 3 of the support base plate 1, and the adhesive 5 of the transparent film 4 is in contact with the chip component 6 through the through hole 3. As the chip component 6, a chip resistor is used in which a resistor film 8 is provided on the surface of a support 7 and an electrode 9 is provided on the surface of the resistor film 8.
１０はチツプ部品６を接着剤５により仮固定した後、チ
ツプ部品６の電極９と上記支持ベース板１の導体層２と
を電気的に接続するための半田層である。Reference numeral 10 denotes a solder layer for electrically connecting the electrode 9 of the chip component 6 and the conductor layer 2 of the support base plate 1 after the chip component 6 is temporarily fixed with the adhesive 5.
ここに、上記チツプ部品６は上記透光性フイルム４に設
けた光硬化性の樹脂接着剤５の粘着性をもつて上記透光
性フイルム４に定置した状態において、上記支持ベース
板１の透孔３に定置し、上記透光性フイルム４ど上記支
持ベース板１とを重ね合せ、上記透光性フイルム４測す
なわち、導体層２が形成されていない側からの光照射に
よつて上記光硬化性の樹脂接着剤５が硬化されることを
もつて上記支持ベース板１の透孔３内に仮固定される。Here, while the chip component 6 is fixed on the transparent film 4 with the adhesiveness of the photocurable resin adhesive 5 provided on the transparent film 4, the chip component 6 is attached to the transparent support base plate 1. The transparent film 4 is placed in the hole 3, and the support base plate 1 and the transparent film 4 are placed one on top of the other, and the transparent film 4 is irradiated with light from the side on which the conductor layer 2 is not formed. When the curable resin adhesive 5 is cured, it is temporarily fixed in the through hole 3 of the support base plate 1.
この際、２００ワツト／２．５ｃｍの光照射源を５０ｍ
ｍの間隔で２本設置し、毎分３ｍの移動速度による硬化
条件で上記光硬化性の樹脂接着剤５を硬化させると、接
着強さはＪＩＳ規格の引き離し法において支持ベース板
１と透光性フイルム４との間で１．９〜２．２ＫＰ／？
、透光性フイルム４とチツプ部品６の支持体ｒとの間で
１．１〜１．４ＫＰ／儂であり、上記チツプ部品６の上
記支持ベース板１の導体層２への半田付け時に上記チツ
プ部品６が脱落するようなこともなかつた。なお、上記
の実施例では支持ベース板１の透孔３内にチツプ部品６
を光硬化性樹脂接着剤５でもつて仮固定するに際して透
光性フイルム４を利用したが、この透光性フイルム４を
利用しない場合には第２図に示すように導体層２を有す
る支持ベース板１の所要位置に透孔１１を設け、この透
孔１１を盲目状態とするように光硬性の樹脂接着剤５を
配設し、そして、この接着剤５でもつてチツプ部品６を
仮固定するに際して上記透孔１１を利用して光照射する
ようにすればよい。At this time, a 200 watt/2.5 cm light irradiation source was placed at a distance of 50 m.
When two adhesives are installed at an interval of m and the photocurable resin adhesive 5 is cured under the curing conditions at a moving speed of 3 m/min, the adhesive strength will be the same as that of the support base plate 1 in the JIS standard peel-off method. 1.9 to 2.2 KP/? between sex film 4?
, between the translucent film 4 and the support r of the chip component 6 is 1.1 to 1.4 KP/me, and when the chip component 6 is soldered to the conductor layer 2 of the support base plate 1, the There was no possibility that the chip component 6 would fall off. In the above embodiment, the chip part 6 is placed inside the through hole 3 of the support base plate 1.
A translucent film 4 was used to temporarily fix the material with a photocurable resin adhesive 5. However, when this translucent film 4 is not used, a supporting base having a conductive layer 2 as shown in FIG. A through hole 11 is provided at a required position in the plate 1, a light hardening resin adhesive 5 is placed so as to blind the through hole 11, and the chip component 6 is temporarily fixed with this adhesive 5. At this time, the light may be irradiated using the through hole 11.
また、光硬化性樹脂接着剤５としてはエポキシアクリレ
イト以外にもポリウレタンアクリレイト、ポリエステル
アクリレイトなどのものが使用でき、また、チツプ部品
６としてはフオルステライト、ムライト、アルミナなど
の磁器板にグレーズ抵抗体、酸化錫、カーボン、ニクロ
ムなどの抵抗膜を設けたチツプ抵抗、チタン、チタン酸
バリウムなどの誘電体磁器の単層あるいは複層のチツブ
コンデンサ、フエライトリングコア、フエライトなどの
磁性体などが用いられる。また、支持ベース板１として
は紙基材フエノール樹脂積層板以外にも紙基材エポキシ
樹脂積層板、ガラス布基材エポキシ樹脂積層板、ガラス
布基材ポリイミド樹脂積層板などを用いることができる
。また、チツプ部品の支持ベースとしての透光性フイル
ムとしてはポリテトラフロロエチレン、ポリカーボネイ
トポリエチレン、ポリ塩化ビニル、ポリサルフオン、ポ
リイミドなどを用いることができる。以上のように本発
明によれば、チツプ部品を支持ベース板に仮固定するに
際して、光硬化性の樹脂接着剤を支持ベース板の導体層
を形成しない面に設けて使用し、同じく支持ベース板の
導体層を形成しない面に光照射することにより、従来熱
硬化性の樹脂接着剤を用いて仮固定する場合のように加
熱硬化過程を必要とせず、支持ベース板、チツプ部品に
対する熱的シヨツクを与えることがなく、また樹脂流れ
によるチツプ部品に位置ずれも防止することができ、ま
た照射光に対して光硬化性樹脂が導電層などの影になる
ことがなく、短時間で確実な仮固定が完了するなど優れ
た効果が得られるものである。In addition, as the photocurable resin adhesive 5, other than epoxy acrylate, polyurethane acrylate, polyester acrylate, etc. can be used, and as the chip part 6, glaze is applied to a porcelain plate such as forsterite, mullite, or alumina. Resistors, chip resistors with resistive films made of tin oxide, carbon, nichrome, etc., single-layer or multi-layer chip capacitors made of dielectric ceramics such as titanium, barium titanate, ferrite ring cores, magnetic materials such as ferrite, etc. used. In addition to the paper-based phenolic resin laminate, the support base plate 1 may also be a paper-based epoxy resin laminate, a glass cloth-based epoxy resin laminate, a glass cloth-based polyimide resin laminate, or the like. Further, as the light-transmitting film used as a support base for chip parts, polytetrafluoroethylene, polycarbonate polyethylene, polyvinyl chloride, polysulfone, polyimide, etc. can be used. As described above, according to the present invention, when temporarily fixing a chip component to a support base plate, a photocurable resin adhesive is provided on the surface of the support base plate on which the conductive layer is not formed, and the same is applied to the support base plate. By irradiating light onto the surface on which the conductive layer is not formed, it is possible to create a thermal shock for supporting base plates and chip parts without requiring a heat curing process, which is required for temporary fixing using conventional thermosetting resin adhesives. It also prevents the chip components from shifting due to resin flow, and the photocurable resin does not shadow the conductive layer when exposed to the irradiated light, making it possible to quickly and reliably create a temporary structure. Excellent effects such as complete fixation can be obtained.
第１図は本発明の一実施例におけるチツプ部品の実装方
法を示す支持ベース板の断面図、第２図は本発明の他の
実施例におけるチツプ部品の実装方法を示す支持ベース
板の断面図である。
１・・・・・・支持ベース板、２・・・・・・導体層、
３・・・・・・透孔、４・・・・・・透光性フイルム、
５・・・・・・光硬化性樹脂接着剤、６・・・・・・チ
ツプ部品、１０・・・・・・半田、１１・・・・・・透
孔。FIG. 1 is a cross-sectional view of a support base plate showing a method for mounting chip components in one embodiment of the present invention, and FIG. 2 is a cross-sectional view of a support base plate showing a method for mounting chip components in another embodiment of the present invention. It is. 1... Support base plate, 2... Conductor layer,
3...Transparent hole, 4...Transparent film,
5...Photocurable resin adhesive, 6...Chip parts, 10...Solder, 11...Through hole.
Claims (1)
方の面の上記透孔の周辺に導体層を形成し、上記透孔内
または透孔の上記導体層を形成した側にチップ部品を配
置するとともに、上記透孔の導体層を形成しない側に設
ける光硬化性樹脂接着剤を上記透孔を介して上記チップ
部品と接触させ、上記支持ベース板の導体層を形成しな
い側から光照射し、上記光硬化性樹脂接着剤を硬化して
上記チップ部品を上記支持ベース板に仮固定した後、上
記導体層と上記チップ部品とを電気的に接続するチップ
部品の実装方法。1 A through hole is provided in the support base plate, a conductor layer is formed around the through hole on one side of the support base plate, and a chip component is placed in the through hole or on the side of the through hole where the conductor layer is formed. At the same time, a photocurable resin adhesive provided on the side of the through hole where the conductive layer is not formed is brought into contact with the chip component through the through hole, and light is irradiated from the side of the support base plate where the conductive layer is not formed. and a method for mounting a chip component, which comprises curing the photocurable resin adhesive to temporarily fix the chip component to the support base plate, and then electrically connecting the conductor layer and the chip component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53089049A JPS594879B2 (en) | 1978-07-20 | 1978-07-20 | How to mount chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53089049A JPS594879B2 (en) | 1978-07-20 | 1978-07-20 | How to mount chip parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5565491A JPS5565491A (en) | 1980-05-16 |
| JPS594879B2 true JPS594879B2 (en) | 1984-02-01 |
Family
ID=13960017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53089049A Expired JPS594879B2 (en) | 1978-07-20 | 1978-07-20 | How to mount chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS594879B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57162388A (en) * | 1981-03-30 | 1982-10-06 | Matsushita Electric Works Ltd | Method of securing electronic part |
| JPH05191029A (en) * | 1992-01-13 | 1993-07-30 | Matsushita Electric Ind Co Ltd | Method of manufacturing printed board circuit device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5280157A (en) * | 1975-12-26 | 1977-07-05 | Seiko Epson Corp | Electronic watch |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5617982Y2 (en) * | 1975-01-20 | 1981-04-27 |
-
1978
- 1978-07-20 JP JP53089049A patent/JPS594879B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5280157A (en) * | 1975-12-26 | 1977-07-05 | Seiko Epson Corp | Electronic watch |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5565491A (en) | 1980-05-16 |
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