JPH05191029A - Method of manufacturing printed board circuit device - Google Patents

Abstract

PURPOSE:To facilitate the tack fixation of an electronic part on a printed board within a short time in relation to the title manufacturing method of printed board circuit device. CONSTITUTION:When a hole 12 is formed in an electronic part mounting part of a printed board 10, the part near this hole 12 is coated with a bonding agent 6 so as to mount the electronic part, the bonding agent 6 is pressed down by the electronic part to be spread out externally so that the bonding agent 6 may be set by filling up the hole 12 with the bonding agent 6 and irradiating the rear surface of the printed board 10 with light so as to tack-fix the electronic part on the printed board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed circuit board circuit device in which various electronic components are soldered to a printed circuit board to form an electric circuit.

[0002]

1 and 2 show a microcomputer soldered to a printed circuit board. In FIGS. 1 and 2, 1 is a microcomputer, 2 is a package of the microcomputer 1, 3 is a plurality of terminal pins protruding from each side surface of the package 2, and each terminal pin 3 is bent. FIG. 6 is a conventional printed circuit board 4 on which the microcomputer shown in FIGS. 1 and 2 is mounted.
Shows a part of. A conductor pattern 5 to which the terminal pins 3 of the microcomputer 1 are soldered is formed on the mount portion on the upper surface of the printed board 4.

7 (A), (B), (C), (D),
(E) shows a conventional process in which the microcomputer 1 shown in FIGS. 1 and 2 is mounted on the printed board 4 shown in FIG. 6 and soldered to the conductor pattern 5. FIG. 7 (A)
In FIG. 7, 4 is a printed circuit board, and 5 is a conductor pattern formed on the upper surface of the printed circuit board 4. When the microcomputer 1 is soldered to the printed circuit board 4 shown in FIG. As shown in FIG. 7B, the adhesive 6 is applied to the microcomputer mount portion on the upper surface of the printed board 4. Reference numeral 7 is a nozzle for applying the adhesive 6. Next, as shown in FIG. 7C, the microcomputer 1 is mounted on the upper surface of the printed board 4. At this time, the adhesive 6 applied on the printed circuit board 4 is pressed by the lower surface of the microcomputer 1 and spread outward. Next, as shown in FIG. 7D, the printed board 4 is placed in a heating furnace 8 and heated to cure the adhesive 6, and the microcomputer 1 is temporarily fixed to the printed board 4. After that, the printed circuit board 4 on which the microcomputer 1 is temporarily fixed is put into a solder bath, thereby
As shown in (E), the terminal pin 3 of the microcomputer 1 and the conductor pattern 5 of the printed board 4 are connected by solder 9. It should be noted that FIG. 7D merely shows that the printed circuit board 4 is housed in the heating furnace 8 and does not show the structure and size of the heating furnace 8.

[0004]

However, in the above-mentioned conventional example, since the printed circuit board 4 coated with the adhesive 6 is placed in a heating furnace in a state where the microcomputer 1 is mounted to cure the adhesive 6, the adhesive is There is a problem that it takes a long time to cure 6 and a large-scale facility (heating furnace 8) is required to cure the adhesive 6.

The present invention solves the above-mentioned problems of the prior art, and is directed to a printed circuit board device capable of curing an adhesive in a short time and requiring no large-scale equipment for curing the adhesive. A manufacturing method is provided.

[0006]

The first invention of the present invention is as follows:
In order to achieve the above object, a step of forming a hole in an electronic component mounting portion of a printed circuit board, a step of applying an adhesive agent in the vicinity of the hole of the printed circuit board, and an electronic part in the adhesive agent application portion of the printed circuit board. The step of mounting the component, and the step of temporarily fixing the electronic component to the printed circuit board by irradiating a light beam from the side of the printed circuit board where the electronic component is not mounted, including the inside of the hole, to cure the adhesive. And a step of soldering the terminal of the electronic component and the conductor pattern of the printed circuit board.

According to a second aspect of the present invention, when an electronic component is mounted on a printed circuit board, the mounted electronic component presses the adhesive applied to the printed circuit board to spread the adhesive outward. The adhesive is filled in the holes formed in the printed circuit board.

[0008]

According to the first aspect of the present invention, the adhesive is cured by irradiating the holes formed in the printed circuit board with a light beam to cure the adhesive in a short time. Therefore, the electronic components can be temporarily fixed in a short time.

According to the second aspect of the invention, the adhesive applied to the printed circuit board is pressed by the electronic component mounted on the printed circuit board to be expanded and filled into the hole, so that the light beam is passed through the hole. The adhesive can be directly irradiated, and the adhesive can be cured in a shorter time.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be explained together. FIG. 3 shows a printed circuit board 10 on which the microcomputer 1 shown in FIGS. 1 and 2 is mounted. In FIG. 3, 11 is a conductor pattern formed on the microcomputer mount portion of the printed circuit board 10, 12 is a hole formed in the center of the microcomputer mount portion of the printed circuit board 10, and in this embodiment, 4
Two holes 12 are formed.

Next, the manufacturing method of this embodiment will be described with reference to FIGS.
It will be described together with (E). FIG. 4A shows a printed circuit board 1.
A cross section of 0 is shown. Reference numeral 11 is a conductor pattern formed on the upper surface of the printed board 10, and 12 is a hole formed in the printed board 10. Printed circuit board 1 shown in FIG.
When soldering the microcomputer 1 to 0, first, as shown in FIG. 4B, the adhesive 6 is supplied from the nozzle 7 and applied onto the upper surface of the printed circuit board 10. The adhesive 6 is applied to the four holes 12 as shown by the broken line 13 in FIG.
It is the center of the area surrounded by. Next, as shown in FIG. 4C, the microcomputer 1 is mounted on the upper surface of the printed board 10. At this time, the adhesive 6 is pressed by the lower surface of the microcomputer 1 to be mounted, spreads outward, and a part of the adhesive 6 is filled in the hole 12. Next, as shown in FIG. 4D, the light beam 14 is applied from the lower surface side of the printed circuit board 10. The irradiation range of the light beam 14 is a range including four holes 12, and the light beam 14 irradiated on the hole 12 is
By this, the adhesive 6 filled in the holes 12 is cured, and the microcomputer 1 is temporarily fixed to the printed circuit board 10. By passing the printed circuit board 10 on which the microcomputer 1 is temporarily fixed in this way through the solder bath,
As shown in (E), the terminal pin 3 of the microcomputer 1 and the conductor pattern 11 of the printed board 10 are soldered 15
Are connected by.

As described above, in the above-described embodiment, the hole 12 is formed in the microcomputer mount portion of the printed circuit board 10, and the adhesive 6 is hardened by irradiating the inside of the hole 12 with a light beam to harden the adhesive 6. It takes less time. Further, in the above-described embodiment, the conventional large-scale heating furnace 8 is not necessary, and a small light beam generator such as an ultraviolet ray generator or a laser beam generator may be used. Although the above embodiment is an example in which the microcomputer 1 is temporarily fixed to the printed circuit board, the present invention is not limited to the microcomputer, but other semiconductor elements, other electronic components such as chip resistors are temporarily fixed to the printed circuit board. It is also effective when you do.

According to the experiments conducted by the present inventors, in the above-described conventional example, it was necessary to heat the adhesive in the heating furnace for 3 minutes to cure the adhesive. When the holes 12 are formed in the printed board 10 and an ultraviolet curable resin adhesive is used as the adhesive and the ultraviolet rays are irradiated from the lower surface of the printed board 10, the adhesive can be cured in about 20 seconds.

5A and 5B respectively show another embodiment of the present invention. The embodiment shown in FIG. 5A is an example in which one hole 12 is formed in the electronic component mounting portion of the printed board and the adhesive 6 is applied in the vicinity of this hole 12.
Further, the embodiment shown in FIG. 5B is an example in which the hole 12 is formed in the electronic component mounting portion of the printed board and the adhesive 6 is applied so as to include a part of the hole 12.

[0015]

According to the first aspect of the present invention, it is possible to irradiate a light beam to the adhesive application portion or its vicinity through a hole formed in a printed circuit board.
The adhesive can be cured in a short time, and electronic components can be temporarily fixed in a short time without using large-scale equipment. According to the second aspect of the invention, when mounting the electronic component, the holes in the printed circuit board can be filled with the adhesive, so that light rays can be directly irradiated through the holes, and the adhesive is cured in a shorter time. Is something that can be done.

[Brief description of drawings]

FIG. 1 is a top view of an electronic component used in a first embodiment of the present invention.

FIG. 2 is a side view of the electronic component of the embodiment.

FIG. 3 is a top view of a part of a printed circuit board used in the embodiment.

4A is a side sectional view in the first step of the same embodiment, FIG. 4B is a side sectional view in the second step, and FIG. 4C is a side sectional view in the third step. Side sectional view of the process (E) Side sectional view of the same fifth process

FIG. 5A is a perspective view of an essential part of a second embodiment of the present invention. FIG. 5B is a perspective view of an essential part of a third embodiment of the present invention.

FIG. 6 is a top view of a part of a conventional printed circuit board.

FIG. 7A is a side sectional view in the first step of the conventional example, FIG. 7B is a side sectional view of the second step, and FIG. 7C is a side sectional view in the third step. Side sectional view of the process (E) Side sectional view of the same fifth process

[Explanation of symbols]

 1 Microcomputer 2 Package 3 Terminal Pin 6 Adhesive 7 Nozzle 9 Solder 10 Printed Circuit Board 11 Conductor Pattern 12 Hole 14 Ray 15 Solder

Claims (4)

[Claims] 1. A step of forming a hole in an electronic component mounting portion of a printed circuit board, a step of applying an adhesive agent in the vicinity of the hole of the printed circuit board, and mounting an electronic component on the adhesive agent applied portion of the printed circuit board. And a step of temporarily fixing the electronic component to the printed circuit board by irradiating a light beam from the side where the electronic component of the printed circuit board is not mounted, including the inside of the hole, to cure the adhesive. A method for manufacturing a printed circuit board device, which comprises a step of soldering a terminal of an electronic component and a conductor pattern of the printed board. 2. When mounting an electronic component on a printed circuit board, the adhesive applied to the printed circuit board is pressed by the mounted electronic component to spread the adhesive outward, and the adhesive is formed on the printed circuit board. The method of manufacturing a printed circuit board device according to claim 1, wherein the holes are filled. 3. The ultraviolet curable adhesive is applied to the vicinity of the hole of the printed board, and the ultraviolet ray is irradiated into the hole of the printed board to cure the ultraviolet curable adhesive. Method of manufacturing printed circuit board device. 4. The print according to claim 1, wherein a plurality of holes are formed in the electronic component mount portion of the printed circuit board, and an adhesive is applied to a region surrounded by the plurality of holes of the printed circuit board. Manufacturing method of substrate circuit device.