JPS5946413B2 - Capacitor terminal bonding method and device for carrying out the method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a capacitor terminal bonding method and an apparatus for carrying out the method, and more specifically, the present invention relates to a capacitor terminal bonding method and an apparatus for carrying out the method. The present invention relates to improvements in a terminal bonding method suitable for bonding molten metal to both end surfaces of a capacitor to form terminals, or soldering lead wires to both end surfaces of a capacitor, and an apparatus for carrying out the method.

Conventionally, the terminal bonding method for capacitors as described above is as follows:
A method as shown in Japanese Patent Application Laid-open No. 53-49252 has been developed.

That is, the end face of a capacitor, which is made by winding a thin film of electrical insulating material on which metal is vapor-deposited, is brought into contact with the molten surface of the metal used for soldering, and vibration is applied in that state, and the end face of the capacitor is This is a method in which terminals are formed on the end faces by gluing them together and then leaving them to cool.

Alternatively, the lead wire is immersed in the metal used for soldering, and the end face of the capacitor is brought into contact with the molten surface of the metal used for soldering, and vibration is applied in this state, and then the capacitor and the lead wire are melted. This is a method of emitting heat from the surface, allowing it to cool, and then joining the lead wire to the end surface.

FIG. 6 shows an example of an apparatus for carrying out the latter of the above methods.

The number W is the capacitor, W is the end face of the capacitor, S is the molten or semi-molten solder, 1' is the solder tank that accommodates the above solder S, L is the lead wire, and 2' is the capacitor W. The means for clamping are each shown.

To simply illustrate the above method with reference to the figure, the clamping means 2' for clamping the capacitor W is positioned from the position in the previous process to a position above the solder bath 1', and then the lead wire is attached to the end surface of the capacitor W. After that, the solder bath 1' is raised U according to a predetermined stroke, the lead wire is immersed in the solder S, and the capacitor end face W is placed in contact with the solder S. Contact.

And solder bath 1' or clamping means 2'...
...That is, vibration is applied to the capacitor W, and a lead wire is connected to the end surface W.

This method is superior in various respects to the bonding method commonly known as the metallicon method, but it has the advantage of reducing the contact depth H of the capacitor end surface W to the solder S (distance between the solder liquid level S' and the capacitor end surface W). ) may differ depending on each joining.

For example, sometimes it is too shallow, as shown by the solid line, and sometimes it is too shallow, as shown by the one-dot and two-dot chain lines, and on the other hand, it is too deep.

In this way, the contact depth H varies frequently, and if the proper contact depth cannot be obtained at any time, the soldering metal S will be too small or too large, and the lead wire will be firmly attached to the end surface W. They are not bonded, and the end result is uneven quality of the product.

One of the reasons why the contact depth H becomes non-uniform each time as described above is that the level of the clamping means 2 is determined, and the upper limit level of the rise of the solder bath 1' that rises by a determined stroke is determined. Therefore, even though the relative distance between the clamping means 2' and the solder bath 1' is fixed, the clamping height of the capacitor W by the clamping means 2 is different as shown by the solid line, the one-dot chain line, or the two-dot chain line. This is to put it away.

This is because when setting the capacitor W to the clamping means 2 in order to clamp it, the setting height differs.

Another reason is that there is variation in the height direction due to winding misalignment during the winding process of the capacitor W itself.

For example, as shown in FIG. 7, the height of one capacitor W is h, and the height of the other capacitor W is d, which is longer than h.

Further, after forming a terminal on the end face of one capacitor W or joining a lead wire, the liquid level S' of the solder becomes disordered.

Therefore, if the next capacitor W is soldered in this disordered state, the resulting product will be defective.

The present invention has been made in view of operational considerations, and the first and third inventions of the present application are such that the end face of the capacitor is brought into contact with the molten surface of the metal used for soldering, and the capacitor is clamped in that state. For soldering, vibration is applied to a solder tank containing metal, and a terminal is formed on the end face of the capacitor, or a lead wire is brought into contact with the end face of the capacitor.
For soldering, a clamping means can be used to bring both of them into contact with the molten surface of the metal used for soldering, and clamp the capacitor in that state, or a clamping means can be used to apply vibration to the solder bath that houses the metal used for soldering, and a lead wire can be attached to the end face of the capacitor. In the capacitor terminal adhesion method, before the process of bringing the end faces of the capacitor into contact with the molten surface of the soldering metal, both end faces of the capacitor are held together while the capacitor is clamped by the clamping means. After sandwiching the capacitor with the upper and lower holding means, the capacitor is unclamped by the clamping means for an instantaneous period, and during the unclamping period, the clamping height of the capacitor is adjusted to the capacitor end face by the force balance of the upper and lower holding means. Soldering is a capacitor terminal bonding method and device that includes a step of setting the height so that the distance between the molten metal surfaces is always constant, and its purpose is to clamp the capacitor. When setting the capacitors, even if the clamping heights of the capacitors are different due to differences in the set height of the capacitors or due to variations in height due to miswinding of the capacitors themselves, the bonding process may be affected. The purpose of soldering the end faces of the capacitor is to ensure that the depth of contact with the metal is always at a predetermined optimum constant level, thereby obtaining a homogeneous and high quality product.

The second invention of the present application is that in the first invention, the soldering is performed after the process is completed, and then the soldering is performed before the process of bringing the capacitor to be processed into contact with the molten surface of the metal for soldering. Soldering, which is housed in a tank, is a capacitor terminal bonding method that involves smoothing the top surface of the metal using a heated soldering iron tip or a soldering iron tip made of a heat insulating material, and is used for the purpose of soldering. The molten surface that was disturbed during the previous soldering process is corrected to smooth it before the soldering process of the next capacitor, and the soldering of the end face of the capacitor is performed so that the depth of contact with the metal is always constant. This is to better ensure accuracy.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows the operation of soldering a lead wire to the end surface W of a capacitor W.

First, the clamping means 1 capable of firmly clamping the capacitor W is rotated from the previous process position and positioned above the solder bath 2.

At the time of rotational positioning, the solder bath 2 is at its lower limit.

Then, the lead wire is positioned facing the capacitor end surface W and is temporarily fixed by a holding means (not shown), and then the solder bath 2 is moved upward according to a predetermined stroke by the advance movement of the air cylinder 3.

At the upper limit of movement, the lead wire is immersed in the molten or semi-molten solder S in the storage tank 4 constituting the solder tank 2, and the end surface W of the capacitor W comes into contact with it.

The figure shows the state where it has moved upward.

Then, the pie break 5 is lowered according to a predetermined stroke by the advance movement of the air cylinder 6, and the clamping means 1 is vibrated.

The state shown in the figure shows the state in which it is moving downward and is being vibrated.

Due to the vibration, the solder S in the solder storage tank 4 aggregates at the contact portion between the capacitor end surface W and the lead wire, and the lead wire is bonded to the capacitor end surface W.

After that, Tatanu 2 and Piebreak-5 returned to their original positions.
The bonding process is completed after necessary cooling.

FIG. 4 shows a capacitor W with lead wires bonded to the end faces w and W' of the capacitor.

In the above, a pie break is applied to the clamping means 1.
5 shows an example in which the capacitor W is vibrated in the molten solder S by applying vibration to the clamping means 1, but it is also possible to incorporate a vibrator into the clamping means 1 itself and use it as a vibrating body, or Vibrations may be applied to the solder bath 2.

The above describes a conventional method of bonding capacitor terminals using vibration, but in this case, as mentioned above, the contact depth of the capacitor end surface W with the molten solder S varies each time.
There was a risk that this would lead to non-uniformity in quality.

Therefore, the first invention of the present application has the following improvements.

That is, as shown in FIG. 2, the end surface W of the capacitor W is soldered S.
Before the step of bringing the capacitor into contact with the inside, while the capacitor W is being clamped by the clamping means 1, both end faces W and W of the capacitor W are
``'' is sandwiched between the upper and lower presser holes 8, and then, for an instant, the capacitor W is unclamped by the clamping means 1, and during the unclamping, the force of the upper and lower pressers 7 and 8 is released. A step is added in which the clamping height of the capacitor W is set to a height such that the distance K between the capacitor end face W and the molten liquid surface 87 of the solder S is always constant by balancing.

More specifically, the clamping means 1 for clamping the capacitor W is positioned between the upper and lower holding means 7 and 8.

In this case, the upper and lower holding means 7 and 8 are at their upper and lower limits of movement.

Then, the upper and lower pressing means 7 and 8 move downward and upward.

That is, the upper cylinder piston 9 of the upper holding means 7 and the lower cylinder piston 10 of the lower holding means 8 move forward toward the upper surface W' and lower surface W of the capacitor W.

A head 12 is attached to the upper cylinder piston 9 via a spring 11.
A head 14 is also attached to the other lower cylinder piston 10 via a spring 13, and the capacitor W is sandwiched between the heads 12 and 14.

In the sandwiched state, the clamping of the coidenser W by the clamping means 1 is released.

An example of the clamping means 1 is shown in FIG.

That is, as shown in the partial plan view of FIG.
5, a pair of chuck pieces 16 and 17 are pivotally supported so as to be openable and closable in opposing positions, and chuck grooves are provided on opposing surfaces of the pair of chuck pieces 16 and 17 to define the chuck portion 18 of the capacitor W. 19 and 20, and a compression spring 21 for urging both chuck pieces 16 and 17 away from each other is arranged so that the chuck pieces 16 and 17 can come into contact with tail tapered surfaces 22 and 23. An opening/closing piece 24 is arranged.

The opening/closing piece 24 is connected to the tapered surface 22 by an opening/closing means (not shown).
and 23, the pair of chuck pieces 16 and 17 are opened by the force of the compression spring 21, and at that time the capacitor W
is unclamped, and the heads 1 of the upper and lower holding means 7 and 8
Becomes free between 2 and 14.

Since the tension of the spring 13 for the head 14 is set to be stronger than the tension of the spring 11 for the head 12, the height of the head 14 via the spring 13 determines the clamping height of the capacitor W.

For example, suppose that the initial clamping height of the capacitor W by the clamping means 1 is as indicated by the dashed-dotted line in FIG. do.

In this case, as mentioned above, the capacitor W is sandwiched between the heads 12 and 14 of the upper and lower holding means 7 and 8, and the moment the clamping by the clamping means 1 is released, the tension of the spring 13 for the head 14 is released. Since this is stronger than the tension of the spring 11 for the head 12, the head 14 moves upward and pushes up the capacitor W, and the head 12 retreats by the amount of the upward movement.

Since the epiorbital height of the head 14 is predetermined, the capacitor W is placed at the predetermined height position as shown by the solid line.
is located.

The height position is such that the separation distance between the capacitor end surface W' and the molten liquid surface 87 of the solder S is always constant, and the soldering of the capacitor end surface W' is performed at a predetermined optimum value for the metal S. This determines the contact depth.

When the height adjustment is completed in this way, the opening/closing piece 24 of the clamping means 1 returns to its original position and comes into pressure contact with the tapered surfaces 22 and 23, the pair of chuck pieces 16 and 17 close, and the capacitor W returns to the adjusted height position. is firmly clamped.

and the cylinder pistons 9, 1 of the upper and lower holding means 7 and 8.
0 goes backwards and returns.

After that, clamping means 1 for clamping the capacitor W
is rotated to a position above the solder bath 2 and below the pie break 5 as shown in FIG.
comes into contact with the molten liquid surface S' of the solder S.

As stated earlier.

In this case, in the pre-process, the distance between the capacitor end face W and the molten liquid surface 87 of the solder S before upward movement is determined to be a constant optimum height, and the air cylinder of the solder tank 2 is 3 is also constant, the capacitor end face W' comes into contact with the soldering metal S while maintaining a predetermined optimum contact depth.

In the above example, the clamp height of the capacitor W before height adjustment is lower than the optimal position, and from that state it is adjusted to the optimal height. Even if the position is higher than the above position, in that case, the upper presser means 7
Since the capacitor W is pushed down by the head 12 of the upper holding means 8 and set at the optimum height by the head 14 of the upper holding means 8, a constant and optimum contact depth is similarly ensured, and the height of the capacitor W is also prevented by the winding misalignment. The same applies even if they are different individually.

Thus, in the upper part, a means using a spring is shown as a means for adjusting the clamp height of the capacitor W, but similar advantages can be obtained by using hydraulic pressure or pneumatic pressure instead of a spring.

The third invention of the present application relates to a height adjusting means using the above-mentioned spring, and when the spring is used in this way, the configuration becomes simple.

In addition to having a simple configuration, the height adjustment can be performed with better accuracy, and since no large load is applied to the capacitor, the capacitor W is not damaged.

Next, an embodiment of the second invention of the present application will be described in detail with reference to FIG.

After the capacitor end surface W' is brought into contact with the surface of the molten solder S and vibration is applied to form a terminal, or after a lead wire is brought into contact with the capacitor end surface W' and the end surface W' is placed together with the lead wire.
After contacting the molten liquid surface of the solder S and applying vibration to join a lead wire to the end surface, the molten liquid surface of the solder S is disturbed in a concave shape.

Therefore, if the next capacitor W is soldered in this disordered state, the contact depth of the end face W' with the molten liquid surface will not be as deep as planned, and a good product will not be obtained. do not have.

The surface of the melt must be kept smooth and at the same level at all times.

In order to meet this requirement, the present invention solders one capacitor after the completion of the soldering process, and then solders the capacitor W to be processed before the process of bringing the capacitor W to be processed into contact with the molten liquid surface S' of the solder S.
The soldering metal S stored in the storage tank 4 of the solder tank 2
The melted upper surface of the soldering iron is smoothed using a heated soldering iron tip 25 or a soldering iron tip 25 made of a heat insulating material.

That is, when one capacitor W is soldered in the manner shown in FIG. 1, the solder bath 2 returns to its lower limit of motion and descends.

During the descent, a fixed amount of solder is supplied into the solder storage tank 4 by solder fixed quantity supply means (not shown).

Since a heater 26 is built in the lower part of the solder storage tank 4, the supplied solder immediately becomes molten or semi-molten and becomes together with the remaining solder S.

Next, the air cylinder piston 27 advances, and the heated soldering iron tip 25 disposed at the tip of the piston reciprocates once on the upper surface of the solder S.

Since the soldering iron tip 25 is heated, the solder S in a bath-molten or semi-molten state is absorbed and does not bite the soldering iron tip 25.

Therefore, as the soldering iron tip 25 moves to the upper surface of the solder S, 1. The upper surface of the solder S is smoothed and the melt surface S is horizontal.
′.

Once a smooth molten liquid surface is formed on the top surface of the solder S,
The clamping means 1 for clamping the capacitor W whose clamp height has been adjusted as described above is located above the solder bath 2 and below the pie break 5, and then the solder bath 2 is placed in a predetermined position. Then, the vibrator moves downward, resulting in the mode shown in FIG. 1, and the soldering process is performed as described above.

At the upper limit of the solder tank 2 mentioned above, the solder S in the solder storage tank 4
Since the molten liquid surface g of , is smoothed at the same level, the contact depth of the capacitor end face W' with the solder liquid surface is more accurately ensured, and the soldering accuracy is further guaranteed. It is.

Although the soldering iron tip 25 on the upper side is shown as having been heated in advance, the same effect can be obtained even if the soldering iron tip 25 is made of a heat insulating material.

As detailed above, according to the first invention of the present application, soldering is carried out by bringing the end face of the capacitor into contact with the molten surface of the metal and applying vibration in that state to form a terminal on the end face of the capacitor. A capacitor terminal bonding method in which a lead wire is placed in contact with the capacitor end face, both are brought into contact with the molten surface of the soldering metal, and vibration is applied in this state to join the lead wire to the capacitor end face. Before the process of bringing the end face of the capacitor into contact with the molten surface of the metal used for soldering, while the capacitor is clamped by the clamping means, both end faces of the capacitor are sandwiched between the upper and lower holding means, and then instantaneously During the unclamping period, the capacitor is unclamped by the clamping means, and during the unclamping period,
We added a process to set the clamp height of the capacitor at a height that maintains a constant distance between the end face of the capacitor and the surface of the molten metal used for soldering, by balancing the forces of the upper and lower holding means. Even if the clamp height of the capacitor varies due to various initial set heights or variations in the height direction due to miswinding of the capacitor itself, it is possible to Since the soldering process is adjusted, the contact depth of the soldering on the end face of the capacitor with the metal is always at a predetermined optimum constant level, and a homogeneous and high quality product can be obtained. According to the third aspect of the present invention, one of the holding means has a head installed via a spring at the tip of the air cylinder piston that advances a certain distance so that the capacitor clamped by the clamping means is placed inside; The other holding means, which has a head attached via a spring, is disposed at the tip of the air cylinder piston that advances a certain distance,
The tension of the spring of the lower holding means is set to be stronger than the tension of the spring of the upper holding means, and the height of the protrusion of the head of the lower holding means is the clamping height of the capacitor since it is clamped by the clamping means. As a result, the clamp height of the capacitor can be adjusted with a simple configuration, and a large load is not applied to the capacitor.
It is possible to adjust the clamp height of the capacitor W without damaging it, and is suitable as a means for implementing the first invention, and furthermore, according to the second invention of the present application, the clamp height can be adjusted without damaging the capacitor W.
In the invention, after the soldering process is completed, and before the process of bringing the capacitor to be soldered into contact with the molten surface of the metal to be soldered, the solder contained in the solder tank is used. We have added a step to smooth the top surface of the metal using a heated iron tip or a tip made of insulating material, so the solder is smoothed out without sticking to the soldering iron tip, and the solder is smoothed by the soldering iron tip. Since the top surface of the solder forms a smooth surface of the molten liquid, when the end face of the capacitor comes into contact with the molten liquid surface, the depth of contact is more accurately ensured, further guaranteeing the accuracy of soldering. .

[Brief explanation of the drawing]

1 to 5 of the accompanying drawings show embodiments of the present invention.
The figure shows a lead wire being temporarily clamped to the end surface of a capacitor that is clamped by a clamping means, and both of them being brought into contact with the surface of the molten metal used for soldering. Figure 2 shows the solder bath at the lower limit of movement, and the clamp height of the capacitor clamped by the clamping means is being adjusted in relation to it. 3 is a partial plan view showing an example of the clamping means, FIG. 4 is a perspective view showing a row of capacitors to which lead wires are connected, and FIG. FIG. 3 is a diagram illustrating a process of forming a smooth melt surface by smoothing the melt surface.
Next, Figure 6 shows how the contact depth of the capacitor end face with the molten liquid surface often varies during the operation of conventional soldering, and Figure 7 shows how the contact depth of the capacitor end face with the molten liquid surface often changes during capacitor processing. It is a figure explaining the point that height differs.

Claims (1)

[Claims] 1. Soldering involves bringing the end face of a capacitor into contact with the molten surface of the metal to be used, applying vibration in that state to form a terminal on the end face of the capacitor, or connecting lead wires to the end face of the capacitor, In the capacitor terminal adhesion method, the end faces of the capacitor are soldered, in which both are brought into contact with the molten surface of the metal used for soldering, and vibration is applied in that state to join the lead wires to the end faces of the capacitor. Before the step of bringing the capacitor into contact with the molten surface of the metal, both end surfaces of the capacitor are sandwiched between upper and lower holding means while the capacitor is clamped by the clamping means, and then the capacitor is clamped by the clamping means for an instant. During unclamping, the clamping height of the capacitor is adjusted by balancing the force of the upper and lower holding means to a height such that the separation distance between the end face of the capacitor and the surface of the molten metal used for soldering is always constant. A capacitor terminal adhesion method having the process specified in . 2. For soldering, contact the end face of the capacitor on the molten surface of the metal and apply vibration in that state to form a terminal on the end face of the capacitor, or connect the lead wire to the end face of the capacitor and solder both. In the capacitor terminal adhesion method, the lead wire is connected to the end face of the capacitor by contacting it with the molten surface of the work metal and applying vibration in that state. Before the step of bringing the capacitor into contact with the capacitor, both end faces of the capacitor are sandwiched between upper and lower holding means while the capacitor is clamped by the clamping means, and then the clamping of the capacitor by the clamping means is released for an instant, and then the capacitor is clamped. A capacitor that has a process of determining the clamping height of the capacitor by balancing the force of the upper and lower holding means during unclamping to a height such that the separation distance between the end face of the capacitor and the molten surface of the soldering metal is always constant. In the terminal adhesion method, 1
After the soldering process for two capacitors is completed, and before the process of bringing the next capacitor to be soldered into contact with the molten surface of the soldering metal, place the top surface of the soldering metal contained in the solder bath in contact with the molten surface of the soldering metal. A capacitor terminal bonding method comprising the step of smoothing with a heated iron tip or an iron tip made of an insulating material to form a smooth molten liquid surface. 3. For soldering, contact the end face of the capacitor with the molten surface of the metal and apply vibration in that state to form a terminal on the end face of the capacitor, or connect the lead wire to the end face of the capacitor and solder both. In the capacitor terminal adhesion method, the lead wire is connected to the end face of the capacitor by contacting it with the molten surface of the work metal and applying vibration in that state. Before the process of bringing the capacitor into contact with the capacitor, both end faces of the capacitor are sandwiched between the upper and lower holding means while the capacitor is kept clamped by the clamping means, and then the clamping of the capacitor by the clamping means is released for an instant, and the capacitor is unclamped. A capacitor that has a process of determining the clamp height of the capacitor between the clamps by balancing the force of the upper and lower holding means to a height such that the separation distance between the end face of the capacitor and the surface of the molten metal used for soldering is always constant. In an apparatus for carrying out the terminal adhesion method, one end surface of the capacitor is held by a spring at the tip of an air cylinder piston that advances a certain distance, with the capacitor clamped by the clamping means inside. An upper holding means is provided with a head, and a lower holding means is provided with a head that presses the other end surface of the capacitor via a spring at the tip of an air cylinder piston that advances a certain stroke. The tension of the spring of the means is set to be stronger than the tension of the spring of the upper holding means, and the protruding height of the head of the lower holding means is set as the clamping height of the capacitor clamped by the clamping means. A device that does this.