JPS5946115B2 - Multilayer stamp circuit and its manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention generally relates to a stamp circuit and a method for manufacturing the same, in which a metal foil is pressed onto a substrate using a stamping die and a desired circuit pattern is punched out at the same time, and more specifically, The present invention relates to a multilayer stamp circuit having other circuit turns that cross over a part of a required circuit pattern formed on such a stamp circuit, and a method for manufacturing the same.

Stamp circuits are manufactured by overlapping a metal foil such as copper foil with an appropriate surface treatment on an insulating substrate, and pressing this metal foil against the substrate with a stamping die to stamp out a desired circuit pattern. Although it is generally known that the stamping die itself is composed of a set of closed-loop blades that match the circuit pattern, it maintains an insulating state with respect to a part of the circuit pattern, for example. It is impossible to create other circuit no-turns that intersect with each other by such a series of steps in the conventional method.

Therefore, if a complicated circuit configuration is required due to improved packaging density, etc., a part of one circuit pattern as described above may be crossed with the other circuit pattern under insulation. There is an extremely great need for this. An object of the present invention is to provide a stamp circuit having the above-mentioned crossover circuit pattern as a part of a required circuit pattern, and at the same time to provide a suitable manufacturing method therefor. According to the invention,
In order to manufacture a multilayer stamp circuit in which a circuit pattern formed on an insulating substrate is crossed over to a desired part and another circuit pattern is provided with an insulating adhesive layer interposed, first, a metal foil is insulated with a stamping die. After punching and forming the required circuit pattern by pressing it onto the standard substrate, holes are pre-drilled at predetermined portions to provide cross-circuit turns in the corresponding portions of the circuit pattern that need to intersect. Prepare another metal foil having an insulating adhesive layer on the back side and place it over the circuit pattern, and finally use another stamping die that does not have a part corresponding to the cross pattern. The steps of pressing the other metal foil onto the substrate and punching out a desired cross-circuit pattern can be carried out simply and quickly.

The accompanying drawings illustrate an embodiment of the present invention in order to explain the invention in more detail, and as shown in FIG. A required circuit pattern 11 formed on the substrate 10 was obtained by placing a stamping die (not shown) equipped with a closed loop blade formed to match the shape of the circuit pattern 11 on the substrate 10 ( The circuit pattern 11 is punched out by pressing the metal foil with heat (not shown) and shearing the metal foil with the blade of the stamping die. 10.

In the present invention, another metal foil 12 prepared in advance is superimposed and placed on the stamp circuit S/C having the required circuit pattern 11 formed as described above.

This gold leaf 12 has a suitable insulating adhesive layer 13 on its back surface, and as shown in the figure, the above-mentioned circuit pattern 1
Cross pattern 12A that should intersect at any point in 1
In order to provide this, both sides of the cross pattern 12A are perforated to form approximately semicircular holes 12B of appropriate size. Therefore, when the metal foil 12 is placed over the circuit pattern 11 of the stamp circuit S/C, the cross pattern 12A is arranged to intersect with the adhesive layer 13 so as to cross a part of the circuit pattern 11. It will be done. After completing the process of placing the gold leaf 12, the stamping die 14 shown in FIG. 2 starts the pressing process of the gold leaf 12. Since the cross cutting blade part 15 for the cross circuit nog turn is formed in a protruding manner except for the recessed part 15A provided at the location corresponding to the pattern 12A,
As shown in FIGS. 3 and 4, when pressing the gold foil 12 with the stamping die 14, the circuit pattern 11
Without cutting or the like, the cross pattern 12A superimposed on the cross pattern 12A is not pressed by the recessed part 15A, and pattern portions 12C are punched out to form continuous pattern portions 12C at both ends of the cross pattern 12A at the crossing blade part 15. will be bonded to the substrate 10. Since the outline of the pattern portion 12C thus formed reaches the hole 12B, by removing the remaining part of the gold foil 12, a multilayer stamp circuit M/C as shown in FIG. can be obtained. As shown in the figure, the obtained multilayer stamp circuit MS/C includes a cross circuit pattern consisting of a cross pattern 12A that crosses over the required circuit pattern 11, and pattern portions 12C that are continuous at both ends of the cross pattern 12A. In addition, electrical insulation between the required circuit pattern 11 and the cross pattern 12A is well ensured by the adhesive layer 13 interposed between these two patterns. here,
The stamping die 14 having the intersecting blade portion 15 for forming the intersecting circuit pattern can be manufactured in the same manner as a stamping die for punching out the desired circuit pattern 11 by means such as photo etching.

The above-mentioned multilayer stamp circuit according to the present invention has a cross-circuit pattern that maintains an insulated state at the necessary parts of the required circuit pattern, and this reduces the complexity that arises as the density of component mounting increases. It is possible to provide a more compact and high-quality circuit board even for specific circuit configuration specifications.

In addition, such a multilayer stamp circuit can be manufactured extremely easily and quickly, and therefore products can be supplied at low cost, making it ideal as a stamp circuit.

[Brief explanation of drawings]

Fig. 1 is a conceptual perspective view showing a state in which a metal foil for forming a cross-circuit pattern is placed on a stamp circuit on which a desired circuit pattern has been formed, and Fig. 2 is a conceptual enlargement of a stamping die for punching a cross-circuit pattern. A perspective view, FIG. 3 is an explanatory diagram showing the punching process of the cross circuit pattern, FIG. 4 is a conceptual enlarged plan view of the cross circuit pattern obtained by punching, and FIG. 5 is a concept of the completed multilayer stamp circuit. FIG. 10...Insulating substrate, 11...Required circuit pattern, 12...Kinji foil, 12A...
...Cross pattern, 12B...Through hole, 12C
...Pattern part, 15...Cross blade part, 15A...Recessed part.

Claims (1)

[Scope of Claims] 1. A multilayer stamp circuit characterized in that a circuit pattern formed on an insulating substrate is provided with another circuit pattern in a crossover manner at a required portion with an intervening insulating adhesive layer. 2. A metal foil is pressed onto an insulating substrate using a stamping die to form a desired circuit pattern, and then an insulating adhesive layer is provided on the back side, and a cross is formed at the desired intersection with the above circuit pattern. After placing another metal foil with pre-perforated holes in predetermined portions to form a pattern on the circuit pattern, another stamping die is used to stamp the other metal foil except for the areas corresponding to the cross pattern. A method for manufacturing a multilayer stamp circuit, characterized in that a desired cross-circuit pattern is punched out by pressing the stamp onto the insulating substrate.