JPS5942065U - Mounting device for small electronic components - Google Patents
Mounting device for small electronic componentsInfo
- Publication number
- JPS5942065U JPS5942065U JP13950282U JP13950282U JPS5942065U JP S5942065 U JPS5942065 U JP S5942065U JP 13950282 U JP13950282 U JP 13950282U JP 13950282 U JP13950282 U JP 13950282U JP S5942065 U JPS5942065 U JP S5942065U
- Authority
- JP
- Japan
- Prior art keywords
- small electronic
- electronic component
- mounting device
- electronic components
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の小型電子部品の取付装置の断側面図、第
2図は本考案の小型電子部品の取付装置における一実施
例の断側面図である。
1・・・基材、2・・・接着剤、3・・・印刷配線基板
、4・・・導体層、5・・・電極、6・・・半田、7・
・・導体、8・・・抵抗、9・・・コンデンサ。FIG. 1 is a sectional side view of a conventional small electronic component mounting device, and FIG. 2 is a sectional side view of an embodiment of the small electronic component mounting device of the present invention. DESCRIPTION OF SYMBOLS 1... Base material, 2... Adhesive, 3... Printed wiring board, 4... Conductor layer, 5... Electrode, 6... Solder, 7...
...Conductor, 8...Resistor, 9...Capacitor.
Claims (2)
した小型電子部品を使用し、この小型電子部品の上記導
体、抵抗、コンデンサ等の形成されている面を直接接着
剤を用いて印刷配線基板に接着し、上記印刷配線基板の
導体層に上記小型電子部品の゛各電極を半田付けして成
る小型電子部品の取付装置。(1) Use a small electronic component with conductors, resistors, capacitors, etc. formed directly on the surface of the base material, and print directly using adhesive on the surface of the small electronic component on which the conductors, resistors, capacitors, etc. are formed. A mounting device for a small electronic component, which is bonded to a wiring board, and each electrode of the small electronic component is soldered to a conductive layer of the printed wiring board.
、抵抗、コンデンサ等の外周を覆い保護するように構成
した実用新案登録請求の範囲第1項記載の小型電子部品
の取付装置。(2) A mounting device for a small electronic component according to claim 1, which is configured to cover and protect the outer periphery of the conductor, resistor, capacitor, etc. constituting the small electronic component with an adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13950282U JPS5942065U (en) | 1982-09-13 | 1982-09-13 | Mounting device for small electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13950282U JPS5942065U (en) | 1982-09-13 | 1982-09-13 | Mounting device for small electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5942065U true JPS5942065U (en) | 1984-03-17 |
Family
ID=30312651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13950282U Pending JPS5942065U (en) | 1982-09-13 | 1982-09-13 | Mounting device for small electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5942065U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5148155A (en) * | 1974-10-22 | 1976-04-24 | Matsushita Electric Ind Co Ltd | Chokogatateikososhi nyoru shusekikairono seizoho |
-
1982
- 1982-09-13 JP JP13950282U patent/JPS5942065U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5148155A (en) * | 1974-10-22 | 1976-04-24 | Matsushita Electric Ind Co Ltd | Chokogatateikososhi nyoru shusekikairono seizoho |
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