JPS5939779A - セラミックスと金属の結合方法 - Google Patents
セラミックスと金属の結合方法Info
- Publication number
- JPS5939779A JPS5939779A JP14832982A JP14832982A JPS5939779A JP S5939779 A JPS5939779 A JP S5939779A JP 14832982 A JP14832982 A JP 14832982A JP 14832982 A JP14832982 A JP 14832982A JP S5939779 A JPS5939779 A JP S5939779A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal
- iron
- alumina
- ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title claims description 39
- 229910052751 metal Inorganic materials 0.000 title claims description 39
- 239000000919 ceramic Substances 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 20
- 239000002131 composite material Substances 0.000 title claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
- 229910052802 copper Inorganic materials 0.000 claims description 42
- 239000010949 copper Substances 0.000 claims description 42
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 33
- 229910052742 iron Inorganic materials 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 230000001590 oxidative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 229910001651 emery Inorganic materials 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910020598 Co Fe Inorganic materials 0.000 description 1
- 229910002519 Co-Fe Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 229910001691 hercynite Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14832982A JPS5939779A (ja) | 1982-08-25 | 1982-08-25 | セラミックスと金属の結合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14832982A JPS5939779A (ja) | 1982-08-25 | 1982-08-25 | セラミックスと金属の結合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5939779A true JPS5939779A (ja) | 1984-03-05 |
| JPH0364474B2 JPH0364474B2 (enrdf_load_stackoverflow) | 1991-10-07 |
Family
ID=15450336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14832982A Granted JPS5939779A (ja) | 1982-08-25 | 1982-08-25 | セラミックスと金属の結合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5939779A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6077181A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | セラミツクス−金属接合体 |
| JPS60231472A (ja) * | 1984-04-26 | 1985-11-18 | 住友電気工業株式会社 | セラミツクスと金属の接合体及びその接合方法 |
| JP2015224151A (ja) * | 2014-05-27 | 2015-12-14 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
| JP2019073437A (ja) * | 2018-12-11 | 2019-05-16 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5659682A (en) * | 1979-10-20 | 1981-05-23 | Kogyo Gijutsuin | Manufacture of composite material consisting of ceramic and metal |
-
1982
- 1982-08-25 JP JP14832982A patent/JPS5939779A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5659682A (en) * | 1979-10-20 | 1981-05-23 | Kogyo Gijutsuin | Manufacture of composite material consisting of ceramic and metal |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6077181A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | セラミツクス−金属接合体 |
| JPS60231472A (ja) * | 1984-04-26 | 1985-11-18 | 住友電気工業株式会社 | セラミツクスと金属の接合体及びその接合方法 |
| JP2015224151A (ja) * | 2014-05-27 | 2015-12-14 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
| JP2019073437A (ja) * | 2018-12-11 | 2019-05-16 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0364474B2 (enrdf_load_stackoverflow) | 1991-10-07 |
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