JPS5939728Y2 - light emitting diode display device - Google Patents
light emitting diode display deviceInfo
- Publication number
- JPS5939728Y2 JPS5939728Y2 JP1980055360U JP5536080U JPS5939728Y2 JP S5939728 Y2 JPS5939728 Y2 JP S5939728Y2 JP 1980055360 U JP1980055360 U JP 1980055360U JP 5536080 U JP5536080 U JP 5536080U JP S5939728 Y2 JPS5939728 Y2 JP S5939728Y2
- Authority
- JP
- Japan
- Prior art keywords
- diodes
- light emitting
- display device
- emitting diode
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【考案の詳細な説明】
本案は異なる発光色を有するダイオードを多数面上に配
して、カラー図面を表示する表示装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a display device that displays color drawings by arranging diodes having different emission colors on multiple surfaces.
単色発光ダイオードをマトリックス状に配して文字図形
を表示する表示装置でのダイオードの配置はダイオード
を所定位置に固着するだけで良いがカラー表示では、異
色発光ダイオードを夫々色別に所定位置に配置する必要
があり、色違いによる誤配置が生じる。In a display device in which monochromatic light emitting diodes are arranged in a matrix to display characters and figures, diodes can be arranged by simply fixing the diodes in a predetermined position, but in color display, different color light emitting diodes are arranged in predetermined positions for each color. This may result in incorrect placement due to different colors.
発光ダイオード白身には発光色によって異なる電極パタ
ーンを設けであるので、ダイオードを間違える事はない
が、設置する場所を間遠やすい。Since the white body of the light emitting diode is provided with different electrode patterns depending on the color of the light emitted, it is impossible to mistake the diode, but it is easy to install it in a far away place.
本案は、かかる間違いの生じない表示装置に関する。The present invention relates to a display device that does not cause such errors.
図に於て、1はセラミック、表面を、酸化したアルミニ
ウム又は電子部品を配置するプリント基板等からなる絶
縁基板、2は前記基板1表面に配設した複数の共通電路
で、銅メッキ、金の蒸着或はプリント基板で通常用いら
れる銅箔の蝕刻等で作られる。In the figure, 1 is a ceramic insulating board whose surface is made of oxidized aluminum or a printed circuit board on which electronic components are placed, and 2 is a plurality of common electric circuits arranged on the surface of the board 1, which are plated with copper or gold. It is made by vapor deposition or etching of copper foil commonly used in printed circuit boards.
この共通電路2の表面は最終的に発光ダイオードのペレ
ットを鑞着しやすいように金メッキを施す。The surface of this common electrical circuit 2 is plated with gold to make it easier to finally solder the pellets of the light emitting diodes.
3,3は緑色を発するGapからなるダイオードのペレ
ットで下面は全面に、上面は円形状に電極6,6が設け
られていて、下面電極7゜7を前記電路2に鑞付してい
る。Reference numerals 3 and 3 denote diode pellets made of GAP that emit green light, and electrodes 6, 6 are provided on the entire lower surface and circularly on the upper surface, and the lower surface electrodes 7.7 are brazed to the electric circuit 2.
8,8は赤色を発するGapからなるダイオードのペレ
ットで下面は全面に上面は十字形状に電極9,9が設け
られていて、下面電極10.10を前記電路2に鑞付し
ている。Reference numerals 8 and 8 refer to diode pellets made of GAP that emit red light, and electrodes 9, 9 are provided on the entire lower surface and in the shape of a cross on the upper surface, and the lower surface electrodes 10 and 10 are brazed to the electric circuit 2.
11は前記電路2の表面を覆った有色被膜で通常は黒色
樹脂が用いられる。11 is a colored film that covers the surface of the electric circuit 2, and is usually made of black resin.
この被膜は前記ダイオードペレット3,8を電路2に配
置する前にペレットが配置される所定区画12を残して
被覆される。This coating is applied before placing the diode pellets 3, 8 in the electrical circuit 2, leaving a predetermined section 12 in which the pellets are placed.
而してこの区画12はダイオードの発光色に異ならしめ
て置く、例えば緑色ダイオードを配する区画は赤色ダイ
オードを配する区画に比し幾分大きめにして置く。The sections 12 are arranged to have different colors of emitted light from the diodes; for example, the section in which green diodes are arranged is somewhat larger than the section in which red diodes are arranged.
13は緑色ダイオードのペレット6の上面電極3同志を
、14は赤色発光ダイオードのペレット8の上面電極9
同志を接続するリード線である。13 is the top electrode 3 of the pellet 6 of the green diode, and 14 is the top electrode 9 of the pellet 8 of the red light emitting diode.
This is the lead wire that connects the comrades.
本案は上記した構造であるから発光の異なるダイオード
を配置する際に、配置する電路上に被膜が被覆されてい
ない区画を探し、次いでその区画形状で配置すべきダイ
オードが決定されるので、ダイオードペレットの配置を
間違う事がない。Since this project has the above-mentioned structure, when arranging diodes with different light emission, it searches for a section where no film is coated on the conductor to be placed, and then the diodes to be placed are determined based on the shape of the section, so the diode pellets There is no wrong placement.
しかも、そのために特別の手段を構する必要はな〈従来
用いでいた共通電路の反射光を防ぐために必要であった
電路上の被膜の形状を変えるだけであるから原価上昇を
きたさない。Moreover, there is no need to provide any special means for this purpose (it only requires changing the shape of the coating on the electrical circuit, which was necessary to prevent the reflected light from the conventional common electrical circuit), so there is no increase in cost.
第1図は本発明装置の平面図、第2図はダイオードを配
置する前の基板の平面図、第3図は、第1図A−A断面
図、第4図は第1図B−B断面図である。
1・・・・・・絶縁性基板 2・・・・・・電路、12
・・・・・・区画、6.8・・・・・・発光ダイオード
ペレット。Fig. 1 is a plan view of the device of the present invention, Fig. 2 is a plan view of the substrate before arranging the diode, Fig. 3 is a sectional view taken along the line A-A in Fig. 1, and Fig. 4 is a cross-sectional view taken along the line B-B in Fig. 1. FIG. 1... Insulating substrate 2... Electric circuit, 12
....compartment, 6.8 ....light-emitting diode pellet.
Claims (1)
ダイオードを多数配置した発光ダイオード表示装置に於
て、前記ダイオードの共通電路への配置前に該電路面を
、前記ダイオードが配置される所定区画を残して有色被
膜で覆い、且該区画の形状は夫々に配置されるダイオー
ドの発光色毎に異ならしめた表示装置。In a light emitting diode display device in which a large number of different color light emitting diodes are arranged on a plurality of common electric paths arranged on a plane of an insulating substrate, the diodes are arranged on the electric path surface before the diodes are arranged on the common electric path. A display device in which a predetermined section is left and covered with a colored film, and the shape of the section is made different depending on the color of light emitted by the diodes arranged in each section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980055360U JPS5939728Y2 (en) | 1980-04-22 | 1980-04-22 | light emitting diode display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980055360U JPS5939728Y2 (en) | 1980-04-22 | 1980-04-22 | light emitting diode display device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56156080U JPS56156080U (en) | 1981-11-20 |
JPS5939728Y2 true JPS5939728Y2 (en) | 1984-11-07 |
Family
ID=29650025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980055360U Expired JPS5939728Y2 (en) | 1980-04-22 | 1980-04-22 | light emitting diode display device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5939728Y2 (en) |
-
1980
- 1980-04-22 JP JP1980055360U patent/JPS5939728Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS56156080U (en) | 1981-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5942770A (en) | Light-emitting diode chip component and a light-emitting device | |
JP3535602B2 (en) | Surface mount type LED | |
JP2002368279A (en) | Chip light emitting diode | |
CN110993777B (en) | Display driving board, preparation method thereof and display device | |
JPH09148629A (en) | Led dot matrix indicator | |
US20090154176A1 (en) | Electronic component and method for manufacturing same | |
WO2006075290A1 (en) | Lighting arrangement | |
JPS5939728Y2 (en) | light emitting diode display device | |
JP2001352105A (en) | Surface mounting light emitting element | |
JPH04113466U (en) | Chip type light emitting diode | |
JPH05235413A (en) | Illuminant | |
JPH06310763A (en) | Led lamp | |
JPH0870141A (en) | Led lamp | |
JPH0661609A (en) | Circuit board | |
JP3194480B2 (en) | Light emitting diode lamp and display panel | |
CN216013569U (en) | LED test board and test device | |
JPH0524947Y2 (en) | ||
JP2582865Y2 (en) | display | |
JPH0416457Y2 (en) | ||
JPH0339818Y2 (en) | ||
JPH0328529Y2 (en) | ||
JPH0211032B2 (en) | ||
JPS63283051A (en) | Substrate for hybrid integrated circuit device | |
JPS58199576A (en) | Light emitting diode indicator | |
JP2781062B2 (en) | Surface treatment method for printed wiring board |