JPS5938077A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS5938077A
JPS5938077A JP57148158A JP14815882A JPS5938077A JP S5938077 A JPS5938077 A JP S5938077A JP 57148158 A JP57148158 A JP 57148158A JP 14815882 A JP14815882 A JP 14815882A JP S5938077 A JPS5938077 A JP S5938077A
Authority
JP
Japan
Prior art keywords
substrate
common electrode
thermal head
auxiliary electrode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57148158A
Other languages
Japanese (ja)
Inventor
Takayuki Yamaguchi
隆行 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP57148158A priority Critical patent/JPS5938077A/en
Publication of JPS5938077A publication Critical patent/JPS5938077A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To obtain a high print quality at a low cost by connecting one terminal of heat generating resistor elements to a common electrode in parallel with an auxiliary electrode formed on a substrate after they are arranged on the substrate in numerous trains. CONSTITUTION:An auxiliary electrode substrate 11 is made thinner than the part at the center of a substrate 1 for a thermal head while a slant surface 3a is formed on the section intended for a common electrode 3 on the substrate 1 so that the common electrode 3 on the substrate 1 and an auxiliary electrode 10 on the auxiliary electrode substrate 11 contact each other at the position lower than the top of the substrate 1. Both the electrodes 3 and 10 are connected together electrically with a solder 12 along the entire length of the common electrode at the joint thereof 3 and 10. The lowered position of the auxiliary electrode 10 makes the top of the welded section so lower than that of the thermal head to prevent the projection of the welded section from the top of the thermal head even when the solder 12 swells.

Description

【発明の詳細な説明】 この発明はプリンタ、ファクシミリなどに用いられ、電
気信号として送られてくる情報を感熱記録紙上に文字、
記号又は画像に変換するためのサーマルヘッドに関する
DETAILED DESCRIPTION OF THE INVENTION This invention is used in printers, facsimile machines, etc. to convert information sent as electrical signals into letters and letters on thermal recording paper.
This invention relates to a thermal head for converting symbols or images.

第1図はサーマルヘッドの一例を示し、1はグレーズド
セラミック基板で、セラミック基板1上には発熱抵抗体
素子2が多数配設されている。発熱抵抗体素子2の一端
は共通電極3に接続され、共通電極3には電、課電圧が
印加されている。また、発熱抵抗体素子2の他端はテー
プキャリア4の一端とボンディングされ、テープキャリ
ア4に塔載された駆動回路としてのIC(SS l、h
4s I、LSIなどの集積回路)5に接続され、lc
5はテープキャリアの他端のボンディングを経て印刷配
線板6上の配線に接続されて外部端子へとつながってい
る。7はセラミック基板1及び印刷配線板6を接着して
支持すると共に、発熱抵抗体素子6の放熱器としても使
用する金属の支持板である。
FIG. 1 shows an example of a thermal head, in which 1 is a glazed ceramic substrate, and a large number of heating resistor elements 2 are arranged on the ceramic substrate 1. One end of the heating resistor element 2 is connected to a common electrode 3, and an electric current or applied voltage is applied to the common electrode 3. Further, the other end of the heating resistor element 2 is bonded to one end of the tape carrier 4, and an IC (SS l, h
4s I, integrated circuit such as LSI) connected to 5, lc
5 is connected to the wiring on the printed wiring board 6 through bonding at the other end of the tape carrier, and is connected to an external terminal. Reference numeral 7 denotes a metal support plate that adheres and supports the ceramic substrate 1 and the printed wiring board 6 and is also used as a heat sink for the heating resistor element 6.

この種の従来のサーマルヘッドは、」二連のように一条
の共通電極3に並列接続されており、かつ製造工程との
関係からAu等の高価な金属を用いるために共通電極3
を十分に厚くすることは出来ない。
This type of conventional thermal head is connected in parallel to a single common electrode 3 like a double series, and because an expensive metal such as Au is used due to the manufacturing process, the common electrode 3
cannot be made thick enough.

一方、サーマルヘッドが長尺化するとともに、高速印字
のために全ドツトを一括印字するような場合には、共通
電極3に流れる電流が大きくなり、共通電極3の中央部
分での電圧降下が生じ、印字濃度の低下を来たすという
欠点がある。
On the other hand, when the thermal head becomes longer and all dots are printed at once for high-speed printing, the current flowing through the common electrode 3 increases, causing a voltage drop at the center of the common electrode 3. , which has the disadvantage of causing a decrease in print density.

たとえば4ドツト/寵でA4サイズ1行分を全部熱に印
字する場合、共通電極には約30A程の電流が流れて、
共通電極の中央部では両端部に比へて数十%の電圧降下
が起り、濃度不足となる。
For example, when printing one line of A4 size paper thermally with 4 dots per line, a current of about 30A flows through the common electrode.
At the center of the common electrode, a voltage drop of several tens of percent occurs compared to both ends, resulting in insufficient concentration.

これを避けるために全発熱抵抗体素子に印加する電力を
高くすると、両端部で電力過剰となり、発熱抵抗体素子
の寿命低下を来たす。
In order to avoid this, if the power applied to all the heating resistor elements is increased, the power will be excessive at both ends, which will shorten the life of the heating resistor elements.

上述の問題を解決するために、共通電極の厚さと幅を増
加することは、上述のように経済的な面から不適当であ
る。
In order to solve the above-mentioned problems, increasing the thickness and width of the common electrode is economically inappropriate as described above.

この発明は上述の問題を解決するためになされたもので
あって、発熱抵抗体素子の一方の端子を共通接続した形
式のサーマルヘッドにおいて、補助電極を並設すること
により、長尺、高速印字のサーマルヘッドにおいても、
安価にがっ高い印字品質を得ることができるサーマルヘ
ッドを提供することを目的とするものである。
This invention was made in order to solve the above-mentioned problem, and by installing auxiliary electrodes in parallel in a thermal head in which one terminal of the heating resistor elements is commonly connected, it is possible to print long lengths and at high speed. Even in the thermal head of
It is an object of the present invention to provide a thermal head that can obtain high printing quality at low cost.

以下にこの発明の実施例を図面とともに説明する。なお
各図において、第1図と均等な部分には同一の符号を伺
した。
Examples of the present invention will be described below with reference to the drawings. In each figure, parts that are equivalent to those in Figure 1 are given the same reference numerals.

第2図と第3図において10は共通電極3に平行に設け
られた補助電極である。この補助電極1゜は、たとえば
、当該サーマルヘッドの基板1とは別体のガラスエポキ
シ樹脂にてなる補助電極用基板11上にCu箔を帯状に
形成したプリント基板を用いる。このCu箔は共通電極
3のAu膜の厚さの10倍以上、たとえば35 pm程
度以」−とするのが好ましい。
In FIGS. 2 and 3, 10 is an auxiliary electrode provided parallel to the common electrode 3. In FIG. This auxiliary electrode 1° uses, for example, a printed circuit board in which a Cu foil is formed in a band shape on an auxiliary electrode substrate 11 made of glass epoxy resin that is separate from the substrate 1 of the thermal head. The thickness of this Cu foil is preferably 10 times or more than the thickness of the Au film of the common electrode 3, for example, about 35 pm or more.

補助電極用基板11は、サーマルヘッドの基板1の中央
部の厚さよりも簿【シ、かつ基板1の、共通電極3を設
ける部分は斜面3aを形成して、基板上1の共通電極3
と補助電極用基板111−の補助電極10とは、基板1
の上面よりも低い位置で相互に接するように構成してお
り、この両電極3と10の接合部分で共通電極の全長に
−(1−〕でハンダ12により両電極3と10とを電気
的に接続している。
The auxiliary electrode substrate 11 has a thickness smaller than that of the central part of the substrate 1 of the thermal head, and the portion of the substrate 1 where the common electrode 3 is provided forms a slope 3a, so that the common electrode 3 on the substrate 1
The auxiliary electrode 10 of the auxiliary electrode substrate 111- is the substrate 1
The electrodes 3 and 10 are configured so that they touch each other at a position lower than the top surface, and the electrodes 3 and 10 are electrically connected to each other by solder 12 along the entire length of the common electrode at the joint between the electrodes 3 and 10. is connected to.

上述のように、補助電極lOの位置を低くすることによ
って、ハンダ12が盛り上った場合でも、コノハンダ部
分の上面がサーマルヘラF 、1 +T+i J、リモ
低りナリ、ハンダ部分がサーマルヘラl’ 1tInよ
り突出することを防止できる。
As described above, by lowering the position of the auxiliary electrode IO, even if the solder 12 bulges up, the upper surface of the solder part is lower than the thermal spatula F, 1 + T+i J, the remote is low, and the solder part is the thermal spatula l' 1tIn. It can prevent it from protruding further.

なお補助電極10としては、プリント基板形式のものに
代えて、通常の金属電線を共通電極に並列に接着しても
よい。
As the auxiliary electrode 10, instead of a printed circuit board type one, a normal metal wire may be bonded in parallel to the common electrode.

また補助電極10はCuに限らず、他の安価な導電率の
比較的高い材料を用いてもよい。
Further, the auxiliary electrode 10 is not limited to Cu, and other inexpensive materials with relatively high conductivity may be used.

また補助電極1oと共通電極3とは随意の方法で電気的
に接続すればよい。
Further, the auxiliary electrode 1o and the common electrode 3 may be electrically connected by any method.

上述のように補助電極10を共通電極3に並列接続する
ことによって、共通電極側での電圧降下が少なくなり、
サーマルヘッドを長尺化した場合、あるいは印字速度を
速くするために、各発熱抵抗体素子を同時駆動した場合
でも、各発熱抵抗体素子質な印字を行なうことができる
By connecting the auxiliary electrode 10 to the common electrode 3 in parallel as described above, the voltage drop on the common electrode side is reduced.
Even when the thermal head is made longer, or when each heating resistor element is driven simultaneously to increase the printing speed, it is possible to perform printing that is consistent with each heating resistor element.

第4図はこの発明を、サーマルヘッドの発熱抵抗体素子
の両側に駆動回路としてのlc5を設けた形式のいわゆ
る振り分は型のものにおいて、共通電極3a 、3bに
それぞれ補助電極10a、10bを並列に設けた実施例
を示す。
FIG. 4 shows the present invention in a so-called distribution type in which LC5 as a drive circuit is provided on both sides of a heating resistor element of a thermal head, and auxiliary electrodes 10a and 10b are provided on common electrodes 3a and 3b, respectively. An example of parallel arrangement is shown.

他の構成は第3図のものと同様である。The other configurations are the same as those in FIG.

以上詳述したようにこの発明は発熱抵抗体素子の一方端
子を共通電極に接続したサーマルヘッドにおいて、共通
電極に並列に補助電極を設けたから、共通電極内での電
圧降下が少なくなり、長尺で、かつ各発熱抵抗体素子を
同時駆動する場合においても、均質な画像濃度の印字を
得ることができる。また補助電極は安価な導体を用いる
ことができるから、サーマルヘッドのコスト1−昇を抑
えることができる。
As detailed above, this invention provides a thermal head in which one terminal of a heating resistor element is connected to a common electrode, and since an auxiliary electrode is provided in parallel to the common electrode, the voltage drop within the common electrode is reduced, and a long Even when each heating resistor element is driven simultaneously, printing with uniform image density can be obtained. Furthermore, since an inexpensive conductor can be used for the auxiliary electrode, an increase in the cost of the thermal head can be suppressed.

【図面の簡単な説明】 第1図は従来のサーマルヘッドの一例を示す平面図、第
2図はこの発明の一実施例を示すSI1面図、1・基板
、3 共通電極、10・・補助電極、12・・・ハンダ
。 特許出願人 株式会社 リ コ − 代理人弁珈士青山 葆外2名
[Brief Description of the Drawings] Fig. 1 is a plan view showing an example of a conventional thermal head, Fig. 2 is a plan view of SI showing an embodiment of the present invention, 1. Substrate, 3. Common electrode, 10.. Auxiliary. Electrode, 12...Solder. Patent applicant Ricoh Co., Ltd. − Attorney attorney Aoyama Hougai (2)

Claims (1)

【特許請求の範囲】[Claims] (1)発熱抵抗体素子を多数列状に基板上に配設し、か
つ各発熱抵抗体素子の一方の端子を上記基板上に形成し
た共通電極に接続したサーマルヘッドにおいて、共通電
極に並列に補助電極を接続したことを特徴とするサーマ
ルヘッド。
(1) In a thermal head in which heating resistor elements are arranged in multiple rows on a substrate, and one terminal of each heating resistor element is connected to a common electrode formed on the substrate, the heating resistor elements are arranged in parallel to the common electrode. A thermal head characterized by connecting an auxiliary electrode.
JP57148158A 1982-08-25 1982-08-25 Thermal head Pending JPS5938077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57148158A JPS5938077A (en) 1982-08-25 1982-08-25 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57148158A JPS5938077A (en) 1982-08-25 1982-08-25 Thermal head

Publications (1)

Publication Number Publication Date
JPS5938077A true JPS5938077A (en) 1984-03-01

Family

ID=15446551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57148158A Pending JPS5938077A (en) 1982-08-25 1982-08-25 Thermal head

Country Status (1)

Country Link
JP (1) JPS5938077A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04339667A (en) * 1991-06-27 1992-11-26 Mitsubishi Electric Corp Manufacture of thermal head

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54162168A (en) * 1978-06-13 1979-12-22 Tokyo Shibaura Electric Co Thin film hybrid circuit
JPS56150576A (en) * 1980-04-23 1981-11-21 Ricoh Co Ltd Thermal head
JPS5724276A (en) * 1980-07-18 1982-02-08 Toshiba Corp Thermal head

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54162168A (en) * 1978-06-13 1979-12-22 Tokyo Shibaura Electric Co Thin film hybrid circuit
JPS56150576A (en) * 1980-04-23 1981-11-21 Ricoh Co Ltd Thermal head
JPS5724276A (en) * 1980-07-18 1982-02-08 Toshiba Corp Thermal head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04339667A (en) * 1991-06-27 1992-11-26 Mitsubishi Electric Corp Manufacture of thermal head

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