JPS5935940A - Extra-high molecular weight polyethylene laminate - Google Patents

Extra-high molecular weight polyethylene laminate

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Publication number
JPS5935940A
JPS5935940A JP14469382A JP14469382A JPS5935940A JP S5935940 A JPS5935940 A JP S5935940A JP 14469382 A JP14469382 A JP 14469382A JP 14469382 A JP14469382 A JP 14469382A JP S5935940 A JPS5935940 A JP S5935940A
Authority
JP
Japan
Prior art keywords
layer
thermoplastic resin
laminate
molecular weight
high molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14469382A
Other languages
Japanese (ja)
Other versions
JPS6412230B2 (en
Inventor
小南 直也
松岡 弘市
木下 全弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Yukizai Corp
Original Assignee
Asahi Organic Chemicals Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Organic Chemicals Industry Co Ltd filed Critical Asahi Organic Chemicals Industry Co Ltd
Priority to JP14469382A priority Critical patent/JPS5935940A/en
Publication of JPS5935940A publication Critical patent/JPS5935940A/en
Publication of JPS6412230B2 publication Critical patent/JPS6412230B2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (1)発明の分野 本発明は超高分子量ポリエチレン(以下UHP Eと称
す)とUHP E以外の熱可塑性樹脂とを溶融接合して
得られる積層体に関するものであシ、その積層体はそシ
が小さいことを慣″徴とするものである。
Detailed Description of the Invention (1) Field of the Invention The present invention relates to a laminate obtained by melt-bonding ultra-high molecular weight polyethylene (hereinafter referred to as UHP E) and a thermoplastic resin other than UHP E. , the laminate is characterized by a small thickness.

(2)技術の背景 UHPEはすべてのプラスチックの中で最高のIi(摩
耗性を有し、また、低温耐衝撃性、摺動性、消音性等に
おいても優れた物性を有するので、ボッバー、シュータ
ーノライニング、コンベア、スクリーー、ピッカー等広
範囲な用途に使用されている。また今後その需要が大き
く伸びるものと期待されている。
(2) Background of the technology UHPE has the highest Ii (abrasion resistance) of all plastics, and also has excellent physical properties such as low-temperature impact resistance, sliding properties, and sound deadening properties, so it is used in bobbers, shooters, etc. It is used in a wide range of applications such as liners, conveyors, scree, pickers, etc. Demand is expected to increase significantly in the future.

(3)従来技術 本発明者等は、UHPEの優れた物性に着目し、それら
の物性を損うことなく、UHP Eの欠点である耐熱性
、剛性環の物性を向上させ、更に低コスト化を目的とし
てUHPEとUHPE以外の熱可塑性樹脂とよシなる積
層体の基本的接合技術を発明したC特願昭57−348
76、同57−38753 。
(3) Prior art The present inventors focused on the excellent physical properties of UHPE, and improved the heat resistance and rigid ring physical properties, which are disadvantages of UHPE, without impairing those physical properties, and further reduced costs. C Patent Application 1983-348 for inventing a basic bonding technology for UHPE and other laminates made of thermoplastic resins other than UHPE.
76, 57-38753.

同57−45328 )。57-45328).

しかしながら、これらの先願発明により、第1胎がUH
PE X第2層がUHPE以外の熱可塑性樹脂から々る
広幅かつ薄肉の積層体を得る場合、熱可塑性11r1脂
の多くは成形収縮率がUHPEと異Aるので、平板な積
層体が得られず、そりを生じるという欠点を崩していた
。そこで、同様の接合方法でそシの生じ彦い平板な積層
体を得るために研究を行ない、第2層がUHPEの成形
収縮率に近似した成形収縮率を有する熱可塑性樹脂まだ
はエラストマーである場合に限り、そりの小さい積層体
が得られることを見出した。更に、他の広い範囲の熱可
塑性樹脂を使用しても、そりのない積層体が得られるよ
う研究した結果、第1層がUHPE 、第3層がUHP
E以外の熱可塑性樹脂からなる積層体において、第1層
と第3層との中間に介在する第2層として、クリープが
小さく、かつ成形収縮率が両層より小さく、シかも剛性
の大きな形成層を設けることにより、クリープが小さく
、がっそシが小さい積層体が得られることを見い出し、
前記出願に続いて特許出願した。
However, due to these prior inventions, the first fetus was UH.
When obtaining a wide and thin laminate in which the PE However, the disadvantage of causing warping was destroyed. Therefore, we conducted research to obtain a flat laminate with no warpage using a similar bonding method, and found that the second layer is a thermoplastic resin or elastomer with a mold shrinkage rate close to that of UHPE. It has been found that a laminate with small warpage can be obtained only in certain cases. Furthermore, as a result of research to ensure that warpage-free laminates can be obtained even when using a wide range of other thermoplastic resins, we found that the first layer is made of UHPE and the third layer is made of UHP.
In a laminate made of a thermoplastic resin other than E, the second layer interposed between the first layer and the third layer has low creep, a mold shrinkage rate lower than both layers, and a high rigidity. It was discovered that by providing layers, a laminate with low creep and low stiffness can be obtained.
Following the above application, a patent application was filed.

しかし、この先願においては、第2層が多孔または孔隙
を有する層状体に充填した熱可塑性樹脂、または粉粒体
を混合して含む熱可塑性樹脂、または熱硬化性1つ1脂
から々る。そのため混合体を使用する場合はそれらを混
合する煩雑さ、捷た熱硬化性樹脂を使用する場合は、第
1層のU)]’PEおよび第3層のUHPE以外の熱可
塑性樹脂を溶融すると同時に、熱硬化性樹脂組成物を硬
化させなければなら力い煩雑さを伴っていた。
However, in this prior application, the second layer is made of a thermoplastic resin filled in a layered body having pores or pores, a thermoplastic resin containing a mixture of powder and granules, or a thermosetting resin. Therefore, when using a mixture, it is complicated to mix them, and when using a crushed thermosetting resin, it is difficult to melt thermoplastic resins other than U)]' PE for the first layer and UHPE for the third layer. At the same time, the thermosetting resin composition must be cured, which is very complicated.

(4)発明の目的 本発明の目的は、第1層がUHPE 、第3層がUHP
E Jツタ)の熱可塑性樹脂からなシ、これらの間に、
第2層として、熱可塑性樹脂に粉粒体を混合すること、
捷たは熱可塑性樹脂の溶融と同時に熱硬化性樹脂を硬化
させることを必要としない層を介在させた、そシの小さ
いUHPE積層体を提供することである。
(4) Purpose of the invention The purpose of the present invention is that the first layer is UHPE and the third layer is UHP.
E J ivy) thermoplastic resin, between these,
As a second layer, mixing powder with a thermoplastic resin;
Another object of the present invention is to provide a small UHPE laminate with a layer that does not require curing of a thermosetting resin at the same time as melting of a thermoplastic resin.

(5)発明の構成 本発明の上記目的は、UHPE層とUHPE以外の熱可
塑性樹脂゛層とを含む積層体であって、UHP Eの結
晶融点以上、かつ300℃以下の温度、5に97m2以
上、かつ500kg/crn2以下の圧力で成形するこ
とにより得られる、第1層がUHPE、第3層がUHP
E以外の熱可塑性樹脂からカシ、これらの間に第2層と
して、曲げ弾性率が5,000にγ論2」ソ上であシ、
かつ成形収縮率が第3層の熱可塑性樹脂よシ小さい熱可
塑性樹脂を介在させたことを特徴とするUHPE稙層体
に」:って達成することができる。
(5) Structure of the Invention The above-mentioned object of the present invention is to provide a laminate including a UHPE layer and a thermoplastic resin layer other than UHPE, which is heated at a temperature of at least the crystal melting point of UHPE and at most 300°C, and at a temperature of 5 to 97 m2. The first layer is UHPE and the third layer is UHP, obtained by molding at a pressure of above and 500 kg/crn2 or less.
Oak is made of thermoplastic resin other than E, and as a second layer between these, the bending elastic modulus is 5,000 gamma theory 2''.
This can be achieved by a UHPE thin layered body characterized by interposing a thermoplastic resin having a molding shrinkage rate smaller than that of the third layer thermoplastic resin.

ここで成形収縮率とは、圧縮用金型に重合体を入れ、1
00kg/crn の圧力下に15分間で室温から20
0℃まで昇温後、同じ温度、圧力に20分間保持し、次
に同じ圧力下に15分間で室温まで冷却して得た成形体
(150X150X5mm)を成形後、温度20℃、相
対湿度65%の室内で24時間放置した後、測定した縦
横方向の平均収縮率のことである。
Here, the molding shrinkage rate means that the polymer is placed in a compression mold,
20 kg/crn pressure from room temperature in 15 minutes
After raising the temperature to 0°C, hold at the same temperature and pressure for 20 minutes, then cool to room temperature for 15 minutes under the same pressure. After molding, mold the obtained molded product (150 x 150 x 5 mm) at a temperature of 20°C and a relative humidity of 65%. It is the average shrinkage rate in the vertical and horizontal directions measured after being left in a room for 24 hours.

本発明において、第1層のUHPEは粘度平均分子量が
50万以上、好ましくは100万以上のものを主成分と
して含有するポリエチレン組成物をいう。UHPEの結
晶融点および成形収縮率は、それぞれ125〜145℃
および10〜30である。
In the present invention, the UHPE of the first layer refers to a polyethylene composition containing as a main component a viscosity average molecular weight of 500,000 or more, preferably 1,000,000 or more. The crystal melting point and molding shrinkage rate of UHPE are 125-145°C, respectively.
and 10-30.

IJHPE2への添加剤としては、パラフィンワックス
、低分子量ポリエチレンワックス等の脂肪族炭化水素、
シクロインテン、シクロペンタジェン等の脂環族炭化水
素、セチルアルコール、ステアリルアルコール等の高級
アルコール、オレイン酸ブチル等の脂肪族エステル、ス
テアリン酸亜鉛等の高級脂肪酸金属塩等の可塑剤、滑剤
、界面活性剤、および、場合によシシリカ粉、炭酸カル
シウム、アルミナ、水酸化アルミニウム、カーピンブラ
ック叫の充填材、着色剤等があわ、これら添加剤を牟独
あるいは混合して含むものも使用することができる。ま
た、UHPEの使用時の形状としては、粉末、成形体の
いずれでもよい。
Additives to IJHPE2 include aliphatic hydrocarbons such as paraffin wax and low molecular weight polyethylene wax;
Plasticizers, lubricants, and interfaces such as alicyclic hydrocarbons such as cyclointene and cyclopentadiene, higher alcohols such as cetyl alcohol and stearyl alcohol, aliphatic esters such as butyl oleate, and higher fatty acid metal salts such as zinc stearate. Activators and, if necessary, silica powder, calcium carbonate, alumina, aluminum hydroxide, carpin black fillers, coloring agents, etc., and products containing these additives alone or in mixtures may also be used. Can be done. Further, the shape of UHPE when used may be either a powder or a molded body.

本発明において、第3層の熱可塑性樹脂は、成形収縮率
が10%以上30係以下、好ましくは12%以上25%
以下の結晶性の樹脂であり、高。
In the present invention, the thermoplastic resin of the third layer has a molding shrinkage rate of 10% to 30%, preferably 12% to 25%.
Less crystalline resin and higher.

中または低密度ぼりエチレン、ポリプロピレン、ポリベ
ンテナマー等のポリオレフィン、ナイロン6、ナイロン
11、ナイロン12、ナイロン6・6、ナイロン6・1
0等のホモポリアミドまたはコーリアミド、ぼりエチレ
ンテレフタレート、ポリブチレンテレフタレート等の飽
和ポリエステル、ポリアセタール等がある。
Polyolefins such as medium or low density ethylene, polypropylene, polybentenamer, nylon 6, nylon 11, nylon 12, nylon 6.6, nylon 6.1
Examples include homopolyamide or coryamide such as No. 0, saturated polyester such as polyethylene terephthalate and polybutylene terephthalate, and polyacetal.

さらにこれらの樹脂にガラスファイバー、カーボンファ
イバー、炭酸カルシウム、シリカ粉、アルミナ、水酸化
アルミニウム等の充填材、あるいは可塑剤、安定剤、滑
剤、着色剤、帯電防止剤等の添加剤を含むものも、成形
収縮率が上記範囲内であれば、使用することができる。
Furthermore, these resins may contain fillers such as glass fiber, carbon fiber, calcium carbonate, silica powder, alumina, aluminum hydroxide, etc., or additives such as plasticizers, stabilizers, lubricants, colorants, and antistatic agents. , can be used as long as the molding shrinkage rate is within the above range.

壕だ使用時の形状は粉末、顆粒、成形体のいずれでもよ
い。
When used in a trench, the shape may be powder, granule, or molded body.

本発明において、第2Nの熱可塑性樹脂は第1層のUH
PEおよび第3層のUHPE以外の熱可塑性樹脂が成形
後収縮しようとする力を抑制するので、積層体のそりが
少々い。このような熱可塑性樹脂は第1層および第3層
の樹脂よシも成形収縮率が小さく、かつ大きな剛性が必
要である。もし、第2層がスチレン系エラストマーまた
は7J?リプタジエンのように室温で軟かく、かつ剛性
の小さいものであれば、成形収縮率が第3層の熱可塑性
樹脂の成形収縮率より小さいにもかかわらず積層体にそ
りを生じる。
In the present invention, the second N thermoplastic resin is the UH of the first layer.
The thermoplastic resin other than PE and UHPE in the third layer suppresses the shrinkage force after molding, so the laminate is slightly warped. Such a thermoplastic resin must have a lower molding shrinkage rate and greater rigidity than the resins of the first and third layers. What if the second layer is styrene elastomer or 7J? If the material is soft at room temperature and has low rigidity, such as liptadiene, the laminate will warp even though the molding shrinkage rate is lower than that of the third layer thermoplastic resin.

本発明において、第2層の熱可塑性樹脂は、曲げ弾性率
が5,000に9//crn2以上、好ましくは、10
、000 kg/cm2以上の剛性を有し、かつ成形収
縮率が10チよシ小さく、好ましくは08%より小さい
非品性の樹脂であり、アクリロニトリル−スチレン共重
合体、アクリロニトリル−ブタジェン−スチレン共重合
体、ポリカーボネート、ポリスチレン、ポリメチルメタ
アクリレート、ポリスエニレンオキサイド、ポリ塩化ビ
ニル、または塩素化ポリ塩化ビニル等が適描である。
In the present invention, the thermoplastic resin of the second layer has a flexural modulus of 9//crn2 or more of 5,000, preferably 10
,000 kg/cm2 or more in rigidity, and a molding shrinkage rate of 10 times smaller, preferably less than 0.8%, and is a non-quality resin that is acrylonitrile-styrene copolymer, acrylonitrile-butadiene-styrene copolymer, etc. Suitable examples include polymers, polycarbonate, polystyrene, polymethyl methacrylate, polyenylene oxide, polyvinyl chloride, or chlorinated polyvinyl chloride.

さらに、これらの樹脂にガラスファイバー、カーボンフ
ァイバー、炭酸カルシウム、シリカ粉、アルミナ、水酸
化アルミニウム等の充填材、あるいは可塑剤、安定剤、
滑剤、着色剤、帯電防止剤等の添加剤を少量會むものも
使用することができる。1だ使用時の形状は、粉末、顆
粒、成形体のいずれでもよい。
Furthermore, fillers such as glass fiber, carbon fiber, calcium carbonate, silica powder, alumina, aluminum hydroxide, plasticizers, stabilizers, etc. are added to these resins.
Those containing small amounts of additives such as lubricants, colorants, and antistatic agents can also be used. The shape at the time of single use may be any one of powder, granule, and molded body.

なお、第2層の熱可塑性樹脂は厚さが積層体全体の厚さ
に対し5%以上、かつ95チ以下が好ましく、さらに好
ましくけ10%以上、かつ50チ以下である。第2層の
厚さの割合が5チより少ないと、第2層の効果が十分に
発揮されず、そりが生じゃすくなり、95%より多いと
、積層体全体に占めるUHPEの厚さが薄く々p、UH
PEの特徴を十分に活かした積層体にはなりにくく々る
The thickness of the second layer thermoplastic resin is preferably 5% or more and 95 inches or less, more preferably 10% or more and 50 inches or less of the thickness of the entire laminate. If the ratio of the thickness of the second layer is less than 5 inches, the effect of the second layer will not be fully exhibited and warping will occur easily, and if it is more than 95%, the thickness of UHPE in the entire laminate will increase. Thin Kupp, UH
It is difficult to create a laminate that takes full advantage of the characteristics of PE.

本発明の積層体を得る方法としては、圧縮成形法、トラ
ンスファー成形法、射出成形法、押出成形法等が使用で
きるが、1例として圧縮成形法について説明する。
As a method for obtaining the laminate of the present invention, a compression molding method, a transfer molding method, an injection molding method, an extrusion molding method, etc. can be used, and the compression molding method will be explained as an example.

圧縮用金型にまず第1層のUHP E粉末を入れ、次に
第2層の熱可塑性樹脂粉末を入れ、さらに第3層の熱可
塑性樹脂粉末を入れる。この3層組成物をUHPEの結
晶融点および熱可塑性樹脂の融点以上、かつ300℃以
下の成形温度、および5kg/crn2以上、かツ50
0 kg7cm” w下の圧力で、5〜60分間加熱加
圧後、室温まで5〜60分間で冷却することにより本発
明の積層体を得る。ここで、成形温度がIJHPEの結
晶融点および熱可塑性樹脂の融点よシ低いときは、十分
な接合力が得られず、寸だ300℃よシ高い温度ではU
HPEが熱分解して分子量が低下し、物性が低下するの
で好捷しくんい。また、成形圧力が5 kg7cm2よ
シ低いときは、成形に要する時間が著しく長くなシ、か
つ接合力が弱いので、好ましくない。500kg/cT
n2より高くしても成形時間は短縮されないので好まし
くかい。さらに、加熱加圧時間が5分より短かいときは
、UHPEの十分なシンタリングが行表われなかったり
、熱可塑性樹脂の溶融が不十分に々る場合があシ、60
分よシ長くすると、熱可塑性樹脂が熱分解しやすく、し
かもコスト高となるため好ましくない。
First, a first layer of UHP E powder is placed in a compression mold, then a second layer of thermoplastic resin powder, and then a third layer of thermoplastic resin powder. This three-layer composition was heated at a molding temperature of higher than the crystalline melting point of UHPE and the melting point of the thermoplastic resin and lower than 300°C, and at a molding temperature of 5 kg/crn2 or higher, and
The laminate of the present invention is obtained by heating and pressurizing for 5 to 60 minutes at a pressure of 0 kg 7 cm" W and then cooling to room temperature for 5 to 60 minutes. Here, the laminate of the present invention is obtained when the molding temperature is the same as the crystal melting point and thermoplasticity of IJHPE. When the temperature is lower than the melting point of the resin, sufficient bonding force cannot be obtained, and at temperatures as high as 300℃, the U
HPE is thermally decomposed, its molecular weight decreases, and physical properties deteriorate, so it is difficult to clean. Further, when the molding pressure is lower than 5 kg7cm2, the time required for molding is extremely long and the bonding force is weak, which is not preferable. 500kg/cT
Even if it is higher than n2, the molding time will not be shortened, so it is preferable. Furthermore, if the heating and pressurizing time is shorter than 5 minutes, the UHPE may not be sufficiently sintered or the thermoplastic resin may not be sufficiently melted.
If the length is too long, the thermoplastic resin will be easily thermally decomposed and the cost will increase, which is not preferable.

(6)実施例および比較例 次に実施例によって本発明をさらに具体的に説明し、比
較例と対比して本発明の効果を示す。
(6) Examples and Comparative Examples Next, the present invention will be explained in more detail by Examples, and the effects of the present invention will be shown in comparison with Comparative Examples.

実施例1 圧縮成形用金型(1,50X150X50間)にUHP
E粉末(三井石油化学工業社製ハイゼックスミリオン2
40M)4:lを挿入し、はぼ均一にならし、その上に
第2層としてポリ塩化ビニル粉末33gを同様に入れて
、はぼ均一にガらし、さらにその上に第3層としてポリ
プロピレン粉末41gを入れ同様に均一にならした。こ
の組成物を100 kvcIn2の加圧下に15分間で
室温から190℃まで昇温後、そのまま20分間保持し
た。その後冷却プレスで100 kg7cm2の加圧下
に15分間で室温まで冷却することにより厚み5簡の積
層体を得た。得られた積層体のそシは03間であった。
Example 1 UHP for compression molding mold (between 1,50 x 150 x 50)
E powder (Hizex Million 2 manufactured by Mitsui Petrochemical Industries, Ltd.)
40M) 4:l, smooth it evenly, add 33g of polyvinyl chloride powder as a second layer on top of it, and smooth it evenly, then add polypropylene as a third layer on top of it. 41 g of powder was added and leveled uniformly in the same manner. This composition was heated from room temperature to 190°C over 15 minutes under a pressure of 100 kvcIn2, and then held as such for 20 minutes. Thereafter, the mixture was cooled to room temperature in 15 minutes under a pressure of 100 kg 7 cm 2 using a cooling press to obtain a laminate having a thickness of 5 sheets. The thickness of the obtained laminate was 0.3 mm.

そり測定方法は積層体(150X150X5膿)を成形
後、温度20℃、相対湿度65チの室内で24時間放置
した後、水平基板上にUHPE側を下にして載置し、水
平基板からの最大高さt(第1図)を測定した。
The warpage measurement method is to mold a laminate (150 x 150 The height t (Figure 1) was measured.

実施例2〜4 実施例1において第2層のポリ塩化ビニル粉末の代わり
に表−1に示す熱可塑性樹脂を用い、表−1に示す成形
温度で成形した以外は実施例1と同様の方法でそれぞれ
の積層体を得た。
Examples 2 to 4 The same method as in Example 1 except that the thermoplastic resin shown in Table 1 was used instead of the polyvinyl chloride powder of the second layer in Example 1, and molding was performed at the molding temperature shown in Table 1. Each laminate was obtained.

(ll) 実施例5〜6 実施例1において第3層のポリプロピレン粉末の代わり
に表−1に示す熱可塑性樹脂を使用し、表−1に示す成
形温度で成形した以外は実施例1と同様の方法でそれぞ
れの積層体を得た。
(ll) Examples 5 to 6 Same as Example 1 except that the thermoplastic resin shown in Table 1 was used instead of the polypropylene powder of the third layer in Example 1, and the molding was performed at the molding temperature shown in Table 1. Each laminate was obtained using the method described above.

実施例2〜6で得られた積層体のそシの測定結果は表−
1に示す通シであった。
The measurement results of the thickness of the laminates obtained in Examples 2 to 6 are shown in Table-
The rules were as shown in 1.

比較例1 実施例1の第2層ポリ塩化ビニル粉末を使用せず、かつ
、ポリゾロピリン粉末の量を61gとしたこと以外は、
実施例1と同様の成形条件で成形し、厚み5叫の積層体
を得た。
Comparative Example 1 The second layer of Example 1 except that the polyvinyl chloride powder was not used and the amount of polyzolopyrine powder was 61 g.
Molding was carried out under the same molding conditions as in Example 1 to obtain a laminate having a thickness of 5 mm.

比較例2,3 比較例1においてポリプロピレン粉末の代わりに表−1
に示す熱可塑性樹脂を使用し、表−1に示す成形温度で
成形した以外は、比較例1と同様の方法で積層体を得た
Comparative Examples 2 and 3 Table 1 was used instead of polypropylene powder in Comparative Example 1.
A laminate was obtained in the same manner as in Comparative Example 1, except that the thermoplastic resin shown in Table 1 was used and molded at the molding temperature shown in Table 1.

比較例1〜3で得られた積層体のそシの測定結果は表−
1に示す通シであった。
The measurement results of the thickness of the laminates obtained in Comparative Examples 1 to 3 are shown in Table-
The rules were as shown in 1.

(12) 表−1 υよひてU)MXF口已した〇 (7)発明の効果 本発明により得られるUHPB積層体はそりが小さいの
で、従来のUH,PE単独の成形体と同様に、保管、内
張り等の作業性がより、シかも平らな内張りとすること
ができる。また、耐摩耗性、摺動性、低温耐衝撃性およ
び消音性等が要求される部分のみにUHPEを使用すれ
ばよく、そのため従来長時間のシンタリングによって得
られていたU)−IP E単独の成形体と同一の肉厚形
状を有する積層体を短い成形サイクルで成形でき、しか
も高価なUHPEの使用量を大幅に減らすことができる
ので、コストを低下することができる。さらに用途、目
的に応じて第2層、第3層を選択できるので、耐熱性、
寸法安定性、耐クリープ性、剛性等の物性をも向上させ
ることが可能である。また、ライニングを行う場合、ラ
イニング面の材質に合わせて樹脂を選択できるので、施
行が簡便であることも本発明の効果の1つである。本発
明により得られる積層体は上記効果を有しているので、
セメント、石炭、鉱石、砂、穀物、たばこ、塩、砂糖等
のホッノや−、サイロ、バンカー、シーート等のライニ
ングおよびトラック荷台、冷凍庫などの内張りVC利用
できる。
(12) Table-1 υYohiteU) MXF (7) Effects of the invention Since the UHPB laminate obtained by the present invention has small warpage, it has the same effect as the conventional molded product of UH and PE alone. The workability of storage and lining is improved, and the lining can be made flat. In addition, it is only necessary to use UHPE in areas that require wear resistance, sliding properties, low-temperature impact resistance, sound dampening properties, etc., and therefore UHPE can be used only in areas that require wear resistance, sliding properties, low-temperature impact resistance, and sound damping properties. A laminate having the same wall thickness as the molded product can be molded in a short molding cycle, and the amount of expensive UHPE used can be significantly reduced, so costs can be reduced. Furthermore, the second and third layers can be selected depending on the application and purpose, so heat resistance,
It is also possible to improve physical properties such as dimensional stability, creep resistance, and rigidity. Another advantage of the present invention is that when lining is performed, the resin can be selected depending on the material of the lining surface, making the process easy. Since the laminate obtained by the present invention has the above effects,
VC can be used for the lining of cement, coal, ore, sand, grain, tobacco, salt, sugar, etc., silos, bunkers, sheets, etc., and the lining of truck beds, freezers, etc.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はそりの測定個所を示した図である。 a・・・積層体(150X1.50X5筋)b・・・水
平基板 C・・・そり寸法(咽) 特許出願人 旭有機羽工業株式会社 特許出願代理人 弁理士  青 木   朗 弁理士  西 舘 和 之 弁理士  寺 1)  豊 弁理士  山 口 昭 之
FIG. 1 is a diagram showing the locations where warpage was measured. a... Laminated body (150 x 1.50 x 5 stripes) b... Horizontal substrate C... Warp dimensions (throat) Patent applicant Asahi Organic Feather Industry Co., Ltd. Patent application representative Patent attorney Akira Aoki Patent attorney Kazu Nishidate Patent Attorney Tera 1) Yutaka Patent Attorney Akiyuki Yamaguchi

Claims (1)

【特許請求の範囲】 1 超高分子量ポリエチレン層と超高分子量ポリエチレ
ン以外の熱可塑性樹脂層とを含む積層体であって、超高
分子量ポリエチレンの結晶融点シ上、かつ300℃以下
の温度、5 kli’/an2以上、かつ500 kg
7cm2以下の圧力で成形することにより得られる、第
1層が超高分子量ポリエチレン、第3層が超高分子量ポ
リエチレン以外の熱可塑性樹脂からなり、これらの間に
第2層として、曲げ弾性率が5,000kg、る肩板上
であり、かつ成形収縮率が第3層の熱可塑性樹脂よシ小
さい熱可塑性樹脂を介在させたことを特徴とする超高分
子量ポリエチレン積層体。 2 第3層の熱可塑性樹脂は成形収縮率が10%以上か
つ3.0%以下である、特許請求の範囲第1項記載の積
層体。 3 第3層の熱可塑性樹脂は成形収縮率が1.2チ以上
かつ25%以下である、特許請求の範囲第2項記載の積
層体。 4、第3層の熱可塑性樹脂がぼりオレフィン。 ホモポリアミド、コポリアミド、飽和ぼりエステル、も
しくはポリアセタールまたはこれらの混合物である、特
許請求の範囲第1項記載の積層体。 5 第2層の熱可塑性樹脂は成形収縮率が10%より小
さい、特許請求の範囲第1項記載の積層体。 6 第2層の熱可塑性樹脂は成形収縮率が0.8%よシ
小さい、特許請求の範囲第4項記載の積層体。 7 第2層の熱可塑性樹脂がアクリロニトリル−スチレ
ン共重合体、アクリロニトリル−ブタジェン−スチレン
共重合体、ポリカーボネート、?リスチレン、ポリメチ
ルメタアクリレート、ポリフェニレンオキサイド、ポリ
塩化ビニルもシくハ塩素化ポリ塩化ビニルまたはこれら
の混合物である、特許請求の範囲第1項記載の積層体。
[Scope of Claims] 1. A laminate comprising an ultra-high molecular weight polyethylene layer and a thermoplastic resin layer other than ultra-high molecular weight polyethylene, the temperature being above the crystal melting point of ultra-high molecular weight polyethylene and below 300°C; kli'/an2 or more and 500 kg
The first layer is made of ultra-high molecular weight polyethylene, the third layer is made of a thermoplastic resin other than ultra-high molecular weight polyethylene, and the second layer is made of a thermoplastic resin other than ultra-high molecular weight polyethylene, which is obtained by molding at a pressure of 7 cm2 or less. 1. An ultra-high molecular weight polyethylene laminate, characterized in that it has a shoulder plate weighing 5,000 kg, and has a thermoplastic resin interposed therein which has a smaller mold shrinkage rate than the thermoplastic resin of the third layer. 2. The laminate according to claim 1, wherein the thermoplastic resin of the third layer has a molding shrinkage rate of 10% or more and 3.0% or less. 3. The laminate according to claim 2, wherein the thermoplastic resin of the third layer has a molding shrinkage rate of 1.2 inches or more and 25% or less. 4. Third layer thermoplastic resin olefin. The laminate according to claim 1, which is a homopolyamide, a copolyamide, a saturated polyester, or a polyacetal, or a mixture thereof. 5. The laminate according to claim 1, wherein the thermoplastic resin of the second layer has a molding shrinkage rate of less than 10%. 6. The laminate according to claim 4, wherein the thermoplastic resin of the second layer has a molding shrinkage rate of less than 0.8%. 7 The thermoplastic resin of the second layer is acrylonitrile-styrene copolymer, acrylonitrile-butadiene-styrene copolymer, polycarbonate,? The laminate according to claim 1, wherein the laminate is listyrene, polymethyl methacrylate, polyphenylene oxide, polyvinyl chloride, chlorinated polyvinyl chloride, or a mixture thereof.
JP14469382A 1982-08-23 1982-08-23 Extra-high molecular weight polyethylene laminate Granted JPS5935940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14469382A JPS5935940A (en) 1982-08-23 1982-08-23 Extra-high molecular weight polyethylene laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14469382A JPS5935940A (en) 1982-08-23 1982-08-23 Extra-high molecular weight polyethylene laminate

Publications (2)

Publication Number Publication Date
JPS5935940A true JPS5935940A (en) 1984-02-27
JPS6412230B2 JPS6412230B2 (en) 1989-02-28

Family

ID=15368069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14469382A Granted JPS5935940A (en) 1982-08-23 1982-08-23 Extra-high molecular weight polyethylene laminate

Country Status (1)

Country Link
JP (1) JPS5935940A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0397013A2 (en) * 1989-05-08 1990-11-14 Nippon Oil Co., Ltd. Laminate of ultra-high-molecular-weight polyethylene

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0397013A2 (en) * 1989-05-08 1990-11-14 Nippon Oil Co., Ltd. Laminate of ultra-high-molecular-weight polyethylene
US5445883A (en) * 1989-05-08 1995-08-29 Nippon Oil Co., Ltd. Laminate

Also Published As

Publication number Publication date
JPS6412230B2 (en) 1989-02-28

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