JPS5934152Y2 - Dot indicator using light emitting diodes - Google Patents
Dot indicator using light emitting diodesInfo
- Publication number
- JPS5934152Y2 JPS5934152Y2 JP1979087187U JP8718779U JPS5934152Y2 JP S5934152 Y2 JPS5934152 Y2 JP S5934152Y2 JP 1979087187 U JP1979087187 U JP 1979087187U JP 8718779 U JP8718779 U JP 8718779U JP S5934152 Y2 JPS5934152 Y2 JP S5934152Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light
- emitting diodes
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
【考案の詳細な説明】
本案は特にガリウム燐（ＧａＰ）の発光ダイオードによ
る点状表示器に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a dot display using a gallium phosphide (GaP) light emitting diode.
従来、カメラや携帯型音響機器などに用いられ、点灯し
ている発光ダイオードを直接見て信号の大きさなどを知
るいわゆる点状表示器においては光のクロストークをな
くする為の遮光枠やマスク板を用いていたために発光ダ
イオードの点灯の仕方はあまり関係しなかった。Conventionally, so-called dot displays, which are used in cameras and portable audio equipment, and allow you to see the signal size by directly looking at the lit light emitting diode, require a light-shielding frame or mask to eliminate optical crosstalk. Since a board was used, the way the light emitting diodes were turned on did not matter much.
しかし、発光ダイオードの出す光の量は発光ダイオード
を流れる電流の大きさで制御出来る為、遮光枠を用いな
くとも発光量を少なめにすればよい。However, since the amount of light emitted by the light emitting diode can be controlled by the magnitude of the current flowing through the light emitting diode, the amount of light emitted can be reduced even without using a light shielding frame.
ところが、第１図に示すように発光ダイオード１７の光
は基板１１に設けられたプリントパターン１２．１２の
うちリード部１４に添って光がのびたり、あるいはワイ
ヤボンド部１５の端部１６で光が反射する為、発光して
いる様子は同図Ｃに示すように光の尾２４や光の島２６
が見えるため、点状発光としてきれいな形状とはならな
い本案はこのような光の尾や光の島を生じない点状発光
を得ることのできる発光ダイオードによる点状表示器に
関するもので、以下実施例に基づいて本案を詳細に説明
する。However, as shown in FIG. Because the light is reflected, the appearance of the light emitting light appears as a tail of light 24 or an island of light 26 as shown in Figure C.
The present invention is related to a dot display using a light emitting diode that can obtain dot light emission without producing such tails or islands of light. The main proposal will be explained in detail based on the following.
まず本案は、ＧａＡＳやＧａＡｓＰのようにＰＮ接合部
の近傍しか光が放出しないものはもちろん、素子が透明
な為、素子全体が光って見えるＧａＰにおいても、発光
ダイオード（素子）の光の放出は、露出したＰＮ接合を
含む面が最も多く、ＰＮ接合と交わる稜線方向が最も少
ないという事に着目して行なわれたものである。First of all, this proposal is based on the fact that the light emitted by the light emitting diode (element) is not limited to GaAS and GaAsP, which only emit light near the PN junction, but also to GaP, where the entire device appears to glow because the device is transparent. This was done by focusing on the fact that the number of exposed surfaces including the PN junction is the largest, and the number of exposed surfaces in the direction of the ridge line that intersects with the PN junction is the least.
第２図ａ、ｂはそれぞれ本案の実施例の側面図と正面図
、同図Ｃはま上からみたときの光の拡がりのようすを示
した説明図である。FIGS. 2A and 2B are a side view and a front view of the embodiment of the present invention, respectively, and FIG. 2C is an explanatory diagram showing how light spreads when viewed from above.
図において１はエポキシ、ベータ、セラミック等の基板
で、表面にプリントパターン２，２が設けである。In the figure, 1 is a substrate made of epoxy, beta, ceramic, etc., and printed patterns 2, 2 are provided on the surface thereof.
このプリントパターン２，２のうち、３は四角形をなし
た載置部で、この上に発光ダイオードを取りつける。Of these printed patterns 2, 2, 3 is a rectangular mounting section, on which a light emitting diode is attached.
又、４はリード部で、四角形をなした載置部３の１つの
角から延びている。Further, 4 is a lead portion, which extends from one corner of the rectangular mounting portion 3.
さらに５は先端をとがらせたワイヤボンド部で、この頂
点６と載置部３の１つの角とが対向している。Further, reference numeral 5 denotes a wire bond portion with a sharp tip, and this apex 6 and one corner of the mounting portion 3 are opposed to each other.
７はＧａＰ等の四角形をなした発光ダイオードで、銀ペ
ースト等の導電性接着剤８を用いて載置部３の上に固着
しである。Reference numeral 7 denotes a square light emitting diode made of GaP or the like, which is fixed onto the mounting section 3 using a conductive adhesive 8 such as silver paste.
この時発光ダイオード７のＰＮＮ接合部交わる稜線９，
９がリード部４やワイヤボンド部５の方向を向く、即ち
載置部３の対角線と発光ダイオード７の対角線が略一致
する事が必要である。At this time, the ridge line 9 that intersects the PNN junction of the light emitting diode 7,
9 must face the direction of the lead part 4 and the wire bond part 5, that is, the diagonal line of the mounting part 3 and the diagonal line of the light emitting diode 7 must substantially match.
１０は金線等の金属細線で、発光ダイオード７とワイヤ
ボンド部５とを結んでいる。Reference numeral 10 is a thin metal wire such as a gold wire, which connects the light emitting diode 7 and the wire bond portion 5.
本案はこのような構造となっているがら、リート部４の
延在する方向にはあまり光が放出されず実用上問題とす
る程にはプリントパターンが光らない。Although the present invention has such a structure, not much light is emitted in the direction in which the reed portion 4 extends, and the printed pattern does not shine to the extent that it causes a practical problem.
又ワイヤボンド部５も発光ダイオードに対向する端面が
ないようにしである。Further, the wire bonding portion 5 is also designed so that there is no end face facing the light emitting diode.
このため従来のように光の尾や光の島が出来ない。For this reason, tails of light and islands of light cannot be created as in the past.
以上の如く本案は四角形をなした載置部と、その四角形
の１つの角から延びるリード部と、他の角に対向する頂
点を有するワイヤボンド部とをプリントパターンとして
有する基板と、この基板の前記載置部の上に対角線が略
一致するように固着された四角な発光ダイオードと、こ
の発光ダイオードと前記ワイヤボンド部とを配線する金
属細線とを具備したものであるから、形状のきれいな点
状発光が得られ、発光ダイオードを直視するレベルメー
タ、チューニングメータおよび各種ゲーム器等の表示盤
に利用出来る。As described above, the present invention includes a substrate having a printed pattern of a rectangular mounting portion, a lead portion extending from one corner of the rectangle, and a wire bonding portion having an apex opposite to the other corner; Since it includes a square light emitting diode fixed on the mounting part so that its diagonal lines substantially coincide with each other, and a thin metal wire wiring this light emitting diode and the wire bonding part, it has a clean shape. It can be used for level meters, tuning meters, and display boards of various game machines, etc., which can be used to directly view light-emitting diodes.
尚本考案は上記実施例に限られるものではなく本案の主
旨を逸脱しない範囲で応用できる。It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be applied without departing from the spirit of the present invention.
第１図は従来の発光ダイオード取付を示す側面図ａと平
面図すおよびこの時の集光のようすを示す説明図Ｃであ
り、第２図は本案実施例の側面図ａと平面図すおよび発
光のようすを示す説明図Ｃである。
１・・・・・・基板、３・・・・・・載置部、４・・・
・・・リード部、５・・・・・・ワイヤボンド部、７・
・・・・・発光ダイオード、１０・・・・・・金属細線
。Fig. 1 is a side view a showing a conventional light emitting diode installation, a plan view, and an explanatory drawing C showing how light is collected in this case, and Fig. 2 is a side view a and a plan view of the embodiment of the present invention. It is explanatory drawing C which shows the state of light emission. 1... Board, 3... Placement part, 4...
...Lead part, 5...Wire bond part, 7.
...Light emitting diode, 10...Metal thin wire.
Claims (1)
るリード部と他の角に対向する頂点を有するワイヤボン
ド部とプリントパターンとして有する基板と、この基板
の前記載置部の上に対角線が略一致するように固着され
た四角な発光ダイオードと、発光ダイオードと前記ワイ
ヤボンド部とを配線する金属細線とを具備した発光ダイ
オードによる点状表示器。A substrate having a rectangular mounting portion, a lead portion extending from one corner of the rectangle, a wire bonding portion having an apex opposite to the other corner, and a printed pattern, and a diagonal line on the said mounting portion of this substrate. A dotted display device using a light emitting diode, comprising a rectangular light emitting diode fixed so that the light emitting diodes and the wire bonding portion substantially coincide with each other, and a thin metal wire wiring the light emitting diode and the wire bonding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979087187U JPS5934152Y2 (en) | 1979-06-25 | 1979-06-25 | Dot indicator using light emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979087187U JPS5934152Y2 (en) | 1979-06-25 | 1979-06-25 | Dot indicator using light emitting diodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS564276U JPS564276U (en) | 1981-01-14 |
| JPS5934152Y2 true JPS5934152Y2 (en) | 1984-09-21 |
Family
ID=29320420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979087187U Expired JPS5934152Y2 (en) | 1979-06-25 | 1979-06-25 | Dot indicator using light emitting diodes |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5934152Y2 (en) |
-
1979
- 1979-06-25 JP JP1979087187U patent/JPS5934152Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS564276U (en) | 1981-01-14 |
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