JPS5933856A - Inserting method for lead frame substrate - Google Patents
Inserting method for lead frame substrateInfo
- Publication number
- JPS5933856A JPS5933856A JP14319682A JP14319682A JPS5933856A JP S5933856 A JPS5933856 A JP S5933856A JP 14319682 A JP14319682 A JP 14319682A JP 14319682 A JP14319682 A JP 14319682A JP S5933856 A JPS5933856 A JP S5933856A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- frame
- board
- lead
- frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
Description
【発明の詳細な説明】
この発明は、リードフレームの基板接続部を回路基板の
端子接続部に自動で挿入するリードフレーム基板挿入方
法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame board insertion method for automatically inserting a board connection part of a lead frame into a terminal connection part of a circuit board.
従来、回路基板にリードフレームを取り付けるに際して
は９手作業おるいは簡単な挿入治具によって行なってい
た。Conventionally, when attaching a lead frame to a circuit board, it has been carried out by nine manual operations or by using a simple insertion jig.
回路基板はその破損し易い材質のため、クランプするこ
とができず、回路基板とリードフレームの、互いの位置
がずれ易い欠点があった。通常、リードフレームは回路
基板の左右両側に取り付けて使用するので、回路基板の
両側に、同時にリードフレーム命取り付ける方法もある
が、やはり、左右のピッチや高部が合わない等の欠点が
あった。Since the circuit board is made of a material that is easily damaged, it cannot be clamped, and the circuit board and the lead frame have the drawback of being easily misaligned with each other. Normally, lead frames are attached to both the left and right sides of the circuit board, so there is a method of attaching the lead frames to both sides of the circuit board at the same time, but this still has drawbacks such as the left and right pitches and heights not matching. .
この発明は、上記欠点に着目してなされたものであり、
回路基板の左右両側の端子接続部に挿入するそれぞれの
リードフレームを１片側ずつ、互いの位動゛合せをして
挿入することにより、上記欠点を解決することを目的と
している。This invention was made by focusing on the above-mentioned drawbacks,
It is an object of the present invention to solve the above-mentioned drawbacks by inserting each lead frame, one side at a time, into the terminal connection portions on both the left and right sides of the circuit board, with the positions aligned with each other.
以下にこの発明の一実施例を図面に基づいて説明する。An embodiment of the present invention will be described below based on the drawings.
第１図において、１ａ、ｌｂは左右のリードフレーム２
ａ 、２ｂを巻回したドラム、３は不要ビンカット機構
で、カッターを取り付けたエアーシリンダ４，４を備え
ている。５はリードフレーム２ａの基板接続部に回路基
板６の端子接続部を挿入させる第１のフレーム基板挿入
機構としてのエアーシリンダ、７は前記リードフレーム
２ａを取り付けた回路基板６の反対１（１ｊの端子接続
部にＩＪ−ドフレーム２ｂの基板接続部を挿入させる第
２のフレーム基板挿入機構としてのエアーシリンダ、８
はフレーム駆動部で、左右のリードフレーム２ａ１２ｂ
に所定の間隔をもって設けた複数の案内孔に係合し、パ
ルスモータ９によって両リードフレーム２ａ 、２ｂを
同一方向に送給するように構成しである。In Fig. 1, 1a and lb are left and right lead frames 2.
A and 2b are wound on the drum, and 3 is an unnecessary bottle cutting mechanism, which is equipped with air cylinders 4 and 4 equipped with cutters. 5 is an air cylinder as a first frame board insertion mechanism for inserting the terminal connection part of the circuit board 6 into the board connection part of the lead frame 2a, and 7 is the opposite side of the circuit board 6 to which the lead frame 2a is attached (1j). Air cylinder 8 as a second frame board insertion mechanism for inserting the board connection part of the IJ-do frame 2b into the terminal connection part
is the frame drive unit, and the left and right lead frames 2a12b
The lead frames 2a and 2b are engaged with a plurality of guide holes provided at predetermined intervals, and are configured to feed both lead frames 2a and 2b in the same direction by a pulse motor 9.
パルスモータ９を駆動部せて、左右のリードフレーム２
ａ ｌ ２ｂをそれぞれのドラムｌ ａ ＋ ｌ ｂか
ら送給し、エアーシリンダ４．４に取り伺けたカッター
で不要ピンを切断しておく。そして、最初にエアーシリ
ンダ５によってリードフレーム２ａの基板接続部に回路
基板６の端子接続部を挿入する。つぎに、エアーシリン
ダ７によって、上記リードフレーム２ａを取り付けた回
路基板６の反対側の端子接続部にリードフレーム２ｂの
基板接続部を挿入する。回路基板６と、それぞれのり−
）’７Ｌ／−ム２ａ 、２ｂの付属合せは、フレーム駆
動源としてパルスモータ９を使用しているので正確に制
御することができ乞。Drive the pulse motor 9 and connect the left and right lead frames 2.
A l 2b is fed from each drum l a + l b, and unnecessary pins are cut off with a cutter that can be accessed by the air cylinder 4.4. First, the air cylinder 5 inserts the terminal connection portion of the circuit board 6 into the board connection portion of the lead frame 2a. Next, using the air cylinder 7, the board connecting portion of the lead frame 2b is inserted into the terminal connecting portion on the opposite side of the circuit board 6 to which the lead frame 2a is attached. The circuit board 6 and each glue
)'7L/- The combination of the arms 2a and 2b uses a pulse motor 9 as the frame drive source, so it can be controlled accurately.
このようにして、回路基板６の左右両側にリードフレー
ム２ａ 、２ｂ全自動で取シ付けることができる。回路
基板６０寸法が異なる場合は、エア３−
一シリンダ５，７の固定位置を、その回路基板６に合せ
て調整すればよい。In this way, the lead frames 2a and 2b can be attached to both the left and right sides of the circuit board 6 in a fully automatic manner. If the dimensions of the circuit board 60 are different, the fixing positions of the air cylinders 5 and 7 may be adjusted to match the circuit board 6.
また、同寸法の回路基板が続く場合は、この挿入ライン
の後に定寸カット装置を設けて、順次リードフレームを
切断し、さらに次の半田伺等の作業ラインに送ることも
可能である。Furthermore, if circuit boards of the same size continue, it is also possible to install a fixed-size cutting device after this insertion line to sequentially cut the lead frames and send them to the next work line such as soldering.
なお、回路基板の供給は、自動にしても、手作業によっ
てもよく、左右のリードフレームは何れを先に回路基板
に取り付けてもよい。Note that the circuit board may be supplied automatically or manually, and either of the left and right lead frames may be attached to the circuit board first.
また、第２図、第３図に示すように、回路基板６とリー
ドフレーム２ａ、２ｂとの位置合せを、それぞれのフレ
ーム基′＆挿入機構に位置決めピンｌＯａ、ＩＯｂを設
け、この位置決めピｙｌＱａ。Further, as shown in FIGS. 2 and 3, positioning pins lOa and IOb are provided in the frame base and insertion mechanism to align the circuit board 6 and the lead frames 2a and 2b. .
１０ｂをリードフレーム２ａ 、２ｂＫ設けた案内孔に
係合させて行うこともでき、この場合には、より確実に
互いの位置合せを行なうことができる。10b may be engaged with guide holes provided in lead frames 2a and 2bK. In this case, mutual alignment can be performed more reliably.
また、後に挿入するリードフレームは、第４図に示すよ
うに基板接続部を回路基板６と反対側に傾斜させながら
送給すれば、回路基板６と接触することがなくガリ、リ
ードフレームが多少変形し４−
でいても安全である。In addition, if the lead frame to be inserted later is fed while tilting the board connection part to the side opposite to the circuit board 6 as shown in FIG. 4, it will not come into contact with the circuit board 6 and the lead frame will be slightly damaged. It is safe even if it is deformed.
以上述べたようにこの発明によれば、回路基板の左右両
側の端子接続部に挿入するそれぞれのリードフレームを
、片側ずつ、互いの位置合せをして挿入するようにした
ので、自動でリードフレームを回路基板に取り付けるこ
とができるという効果があシ、したがって作業ラインの
自動化ができるという効果がある。As described above, according to the present invention, each lead frame to be inserted into the terminal connection portions on both the left and right sides of the circuit board is inserted one side at a time while aligning each other, so that the lead frames are automatically inserted. This has the advantage that it can be attached to a circuit board, and therefore the work line can be automated.
第１図はこの発明の一実施例による挿入装置の上面図、
第２図および第３図は、位置決めピンの説明図、第４図
はリードフレームと回路基板の挿入角度を示した図であ
る。
Ｉａ、Ｉｂ・・・・・・・・・ドラム
２ａ ｒ ｚｂ・・・・・・・・・リードフレーム５・
・・・・・・・・第１のフレーム基板挿入機構としての
エアーシリンダ
６・・・・・・・・・回路基板
７・・・・・・・・・第２のフレーム基板挿入機構とし
てのエアーシリンダ
８・・・・・・・・・フレーム駆ｔｄＪ部ｌＱａ、ｌＯ
ｂ・・・・・・・・・位置決めピン７−
特開昭５９−３３８５Ｇ （４）FIG. 1 is a top view of an insertion device according to an embodiment of the present invention;
2 and 3 are explanatory views of the positioning pins, and FIG. 4 is a view showing the insertion angle of the lead frame and the circuit board. Ia, Ib...Drum 2a r zb...Lead frame 5.
......Air cylinder 6 as a first frame board insertion mechanism...Circuit board 7......As a second frame board insertion mechanism Air cylinder 8... Frame drive tdJ section lQa, lO
b・・・・・・・・・Positioning pin 7- JP-A-59-3385G (4)
Claims (3)
た複数の案内孔に、フレーム駆動部を係合させて左右の
ドラムからそれぞれの前記リードフレームを同一方向に
送給するようにし、最初にこれらの左右のリードフレー
ムのうち、何れか一方のリードフレームの基板接続部と
、その一方のリードフレームと同側に設けられた回路基
板の端子接続部とを互いの位置合せを行なった後、第１
のフレーム基板挿入機構によって互いに挿入させ、つぎ
に、残りの他方のリードフレームの基板接続部と、その
他方のリードフレームと同側に設けられた回路基板の端
子接続部とを互いの位置合せを行なった後、第２のフレ
ーム基板挿入機構によって互いに挿入させることを特徴
とするリードフレーム基板挿入方法。(1) The frame drive unit is engaged with a plurality of guide holes provided at predetermined intervals in the left and right lead frames, so that the lead frames are fed in the same direction from the left and right drums, and these lead frames are first fed. After aligning the board connection part of one of the left and right lead frames with the terminal connection part of the circuit board provided on the same side as that one lead frame, 1
Then, align the board connecting portion of the remaining lead frame with the terminal connecting portion of the circuit board provided on the same side as the other lead frame. A method for inserting a lead frame board, the method comprising: inserting the lead frame boards into each other by a second frame board inserting mechanism.
挿入機構に設けた位置決めピンを、そのリードフレーム
に設けた案内孔に係合することにより行なうことを特徴
とする特許請求の範囲第１項記載のリードフレーム基板
挿入方法。(2) The lead frame is aligned by engaging a positioning pin provided in the frame board insertion mechanism with a guide hole provided in the lead frame. How to insert lead frame board.
接続部を回路基板と反対側に傾斜させながら送給するこ
とを特徴とする特許請求の範囲第１項記載のフレーム基
板挿入方法。(3) The method for inserting a frame board according to claim 1, characterized in that, when feeding the lead frame to be inserted later, the lead frame is fed while tilting the board connecting portion to the side opposite to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14319682A JPS5933856A (en) | 1982-08-20 | 1982-08-20 | Inserting method for lead frame substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14319682A JPS5933856A (en) | 1982-08-20 | 1982-08-20 | Inserting method for lead frame substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5933856A true JPS5933856A (en) | 1984-02-23 |
Family
ID=15333100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14319682A Pending JPS5933856A (en) | 1982-08-20 | 1982-08-20 | Inserting method for lead frame substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5933856A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5142765A (en) * | 1990-12-07 | 1992-09-01 | Rohm Co., Ltd. | Lead mounting apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143195A (en) * | 1981-01-29 | 1982-09-04 | Westinghouse Electric Corp | Large scale centrifugal fan apparatus |
-
1982
- 1982-08-20 JP JP14319682A patent/JPS5933856A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143195A (en) * | 1981-01-29 | 1982-09-04 | Westinghouse Electric Corp | Large scale centrifugal fan apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5142765A (en) * | 1990-12-07 | 1992-09-01 | Rohm Co., Ltd. | Lead mounting apparatus |
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