JPS5933453A - Resist applying device - Google Patents

Abstract

PURPOSE:To prevent the unevenness of application, by providing a semiconductor wafer storing vessel rotatably and generating an air current between a wafer and the inside wall of the vessel to prevent a thin film of a resist from being formed. CONSTITUTION:An upper cup 21 as the semiconductor wafer storing vessel is connected on a lower cup 22 through a bearing 23 and is rotated by coupling gears 24 and 26 and a driving motor 25. Plural blades 321-3212 are attached to the inside wall of the upper part of the upper cup 21. A water 29 is held by a vacuum chuck 28 and is rotated by a motor 27, and the upper cup 21 is rotated in the same direction, and a resist liquid is discharged from a nozzle 30 to form a film; and in this case, an air curtain 34 of an air current is generated as shown in Fig. Consequently, the scattered resist strikes against the curtain 34 and is discharged downward. Thereforce, the rebound of the resist from the wall face and the formation of a resist film are prevented to prevent the unevenness of application.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to PEP (Pho) in the manufacturing process of semiconductor devices.
The present invention relates to a resist coating device used in the Engraving Process.

[Technical background of the invention]

In the resist coating process during PEP, a silicon oxide film 2 with a thickness of 2,000 to 4,000 μm is formed on the surface of a silicon wafer 1 in a high-temperature oxidizing atmosphere as shown in FIG. A predetermined number of sheets are stored in a storage 4a on a resist coating stand 4 equipped with a resist coating device W3 as shown in FIG. A resist film 5 having a thickness of 5,000 to 2 onno'i is formed on the silicon oxide film 2. Next, the silicon wafer 1 on which the resist P5 has been formed is taken out from the resist coating device 3 and placed on the resist coating stand 4. The silicon wafer 1 is placed on a heating table 6 to volatilize the solvent such as xylene that has adhered to the silicon wafer I during the formation of the resist film 5. After that, the silicon wafer 1 is placed in the storage 4c on the resist coating stand 4. It is for storage.

By the way, the resist coating device 3 conventionally has a structure as shown in FIG. 3. This cyst coating device is held by a vacuum chuck 12 attached to the tip of a drive shaft 11g of a drive motor 11, and discharges resist liquid from the tip of a nozzle 13 onto the rotating silicon wafer 1. Note that 14 is a semiconductor wafer storage container (hereinafter referred to as a cup) that stores the silicon wafer 1. The inner wall of this cup 14 has a number of poles of blades 15 as shown in FIG. ~15° - Installed with an appropriate angle.゛This one feather 15. ~15. ! This is to prevent the resist scattered during coating from bouncing off the inner wall of the cup 14 and the solid resist 16 from riding on the flat resist film 5 as shown in FIG. . In this case, the resist advances as shown in a-+b along the direction of rotation of the silicon wafer 1 (indicated by arrow A), for example, as shown in FIG.
5, it is rebound toward the wall surface of the cup 14. Therefore, it is possible to prevent the scattered resist from bouncing back onto the silicon wafer 1.

[Problems with Background Art] In the conventional resist coating apparatus, when the silicon wafer 1 is rotated at high speed and resist is coated, it is possible to prevent the resist from rebounding to a large extent.

However, the long time (24 hours continuous operation), 8 speed (6
000r, p, m, ), or when the exhaust volume is reduced or the exhaust is stopped, a thin resist film 17 as shown in FIG. 6 is formed between the silicon wafer 1 and the cup 14. (In FIG. 6, arrow B indicates the exhaust direction.) - When such a thin film 17 is formed, the scattered resist and dust are repelled by this thin film 17 and adhere to the silicon wafer l, resulting in uneven coating of the resist film 5. If this uneven coating occurs, it will adversely affect the silicon wafer 11, such as making pattern formation during PEP unstable. Also,
The thin film 17 causes the resist to bounce back onto the silicon wafer 1 and causes variations in the thickness of the resist film 5.

[Purpose of the invention]

This invention was made in view of the above-mentioned circumstances, and its purpose is to prevent the resist from rebounding from the cup to the semiconductor wafer during coating, and to eliminate the vf11% of the resist that is formed in the cup, so that the resist film does not form in the middle. Fushina et al. and the addition of garbage to Resist IIQ.
An object of the present invention is to provide a resist coating device that can smoothly form a pattern therein.

[Summary of the invention]

This invention enables a semiconductor wafer container to be rotated, which has conventionally been fixed, at a resist coating position of 1 p, in which a semiconductor wafer is completely rotated and a resist solution is discharged to the north of the semiconductor wafer to form a resist film. It forms an air flow (air curtain) that blocks the gap between the semiconductor wafer and the inner wall surface of the semiconductor wafer storage container.
This air flow causes the scattered resist and dust to be discharged.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 7, 21 is an upper cup and 22 is a lower cup. The lower cup 22 is fixed.
and the upper cup 21 are connected by a bearing 23.

The upper cup 21 has a connecting gear 2 over its entire outer circumference.
4 is formed. A connecting gear 26 attached to a shaft 25a of a drive motor 25 meshes with this connecting gear 24.

That is, the rotation of the drive motor 25 is caused by the connection gears 26 and 24.
This causes the upper cup 21 to rotate on the T-cup 22, and the rotation can be set arbitrarily by changing the rotation direction and speed of the drive motor 25. ing. lower cup 22
A drive motor 27 is disposed at the center of the upper cup 21, and a vacuum chuck 28 is attached to the tip of the shaft 27a of the drive motor 27 at the center of the upper cup 21. This vacuum chuck 28 has a silicon wafer 29
is held, and a nostle 30 is placed above this silicon wafer 29. An exhaust hole 3I is formed in the lower cup 22 and extends downward into the inner space of the upper cup 21.

On the upper horizontal piece 211L and the inner wall surface of the seventh cup 21,
As shown in FIG. 8, a plurality of blades 32. ~32□ is installed. The plurality of blades 32, - 32, 1 are each inclined at 45 degrees with respect to the center of the upper cup 21, and are also inclined at 45 degrees downward from the upper horizontal piece 21a, as shown in FIG. There is. Moreover, the blades 321 to 32 of the upper horizontal piece 21a. ! A plurality of intake holes 33. ~33
, t are formed.

This resist coating device forms a resist film on the silicon wafer 29 by discharging resist liquid from a nozzle 30 while rotating the silicon wafer 29 held by the X-empty chuck 28 at a desired speed by a drive motor 27. However, at the same time, the drive motor 25 connects the connecting gear 24.
For example, attach the upper cup 2I to the silicon wafer 2 through the
9 to form an air flow (air curtain 34) as shown by the broken line in FIG. That is, due to the rotation of the upper cup 21, the intake holes of the upper horizontal piece 21&, 93. ~331. The air flowing in from the lower cup 22 passes through the exhaust hole 33 provided in the lower cup 22 and is exhausted as shown by arrow C, thereby forming an air flow around the rotating silicon wafer 29. The amount and speed of this air curtain 74 can be varied by changing the rotational speed of one hip 21. Therefore, in this resist coating device ζ, the resist that is not coated on the silicon wafer 29 and is scattered is removed by this air curtain. 34 and the exhaust hole 3 along with the flow of air.
It is discharged downward from 1. Thereby, it is possible to prevent the resist from rebounding from the wall surface of the upper cup 21, which occurs in the conventional apparatus, and also to prevent the formation of a thin film of 1/cyst.

In the above embodiment, the means for transmitting the rotational force of the drive motor 25 to the upper cup 21 was explained as the connecting gears 24 and 26, but the means is not limited to this, and other means such as a belt may also be used. Alternatively, the upper cup 2I may be rotated directly by the drive motor 25.

Furthermore, in this resist coating device, the bearing 23 needs to be appropriately sealed to prevent dust from entering from the outside. Furthermore, the intake hole 33 of the upper cup 21
I~33. It is important that the outside air flowing in from t is not contaminated, and the resist coating equipment is installed in a clean room.
It is necessary to control the amount of garbage.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to prevent splashing from the cup onto the semiconductor wafer during resist coating, and
Since the formation of a thin resist film inside the cup can be prevented, uneven coating of the resist film and adhesion of dust to the resist film can be prevented, and pattern formation during PEP can be made smooth.

[Brief explanation of the drawing]

Figure 1 (al, (bl) is a sectional view showing the resist coating process, Figure 2 is a schematic diagram showing the overall configuration of a resist coating device, Figure 3 is a configuration diagram of a conventional resist coating device, and Figure 4 is a schematic diagram showing the overall configuration of a resist coating device. FIG. 5 is a cross-sectional view showing the state of resist application by the device shown in FIG. 3. FIG. 6 is a plan view showing how the blades are installed in the device shown in FIG. 3. FIG. FIG. 7 is a configuration diagram of a resist coating device according to an embodiment of the present invention, FIG. 8 is a plan configuration diagram showing how the blades are installed in the device of FIG. 7, and FIG. It is a side configuration diagram. 21... Upper cup, 22... Lower cup, 23...
Bearing, 24.26...Connection gear, 25.27.
...Drive motor, 29...Silicon wafer, 30...
- Nozzle, 31...Exhaust hole, 32. ~32, feather, 3
3, ~33. ! ...Intake hole.

Claims (1)

[Claims] a semiconductor wafer storage container, a means for holding a semiconductor wafer in the semiconductor wafer storage container and rotating the semiconductor wafer at a predetermined speed, and a means for discharging a resist solution onto the semiconductor wafer to form a resist film; means for rotating the semiconductor wafer storage container at a predetermined speed to form an air flow that interrupts the rotating semiconductor wafer and an inner wall surface of the semiconductor wafer storage container; and means for discharging the air flow. A resist coating device characterized by comprising: