JPS5933122Y2 - Laminated busbar for printed circuit boards - Google Patents

Laminated busbar for printed circuit boards

Info

Publication number
JPS5933122Y2
JPS5933122Y2 JP7170377U JP7170377U JPS5933122Y2 JP S5933122 Y2 JPS5933122 Y2 JP S5933122Y2 JP 7170377 U JP7170377 U JP 7170377U JP 7170377 U JP7170377 U JP 7170377U JP S5933122 Y2 JPS5933122 Y2 JP S5933122Y2
Authority
JP
Japan
Prior art keywords
printed circuit
laminated busbar
circuit boards
laminated
busbar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7170377U
Other languages
Japanese (ja)
Other versions
JPS53164660U (en
Inventor
泰雄 小笠原
義和 市山
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP7170377U priority Critical patent/JPS5933122Y2/en
Publication of JPS53164660U publication Critical patent/JPS53164660U/ja
Application granted granted Critical
Publication of JPS5933122Y2 publication Critical patent/JPS5933122Y2/en
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案はプリント基板上に実装する電源供給用積層ブス
バーに関するものである。
[Detailed Description of the Invention] The present invention relates to a power supply laminated busbar mounted on a printed circuit board.

従来プリント基板上に、デュアルインラインパッケージ
ICなどの電子回路部品を所要数実装し、これら電子回
路部品に積層ブスバーを用いて所要電源を供給する場合
、当該電子回路内に発生する電気雑音が電源ラインおよ
び接地ラインへ流入することを阻止するための電源バイ
パス用コンデンサは別途用意され、専用の実装穴を使用
して実装されていた。
Conventionally, when a required number of electronic circuit components such as dual in-line packaged ICs are mounted on a printed circuit board and the required power is supplied to these electronic circuit components using a laminated busbar, the electrical noise generated within the electronic circuit is transmitted to the power supply line. A power supply bypass capacitor was prepared separately to prevent it from flowing into the ground line, and was mounted using a dedicated mounting hole.

そのため信号用プリント配線が部分的に密集したり、そ
の結果配線自体を屈曲して設けざるを得ないことが多々
あり、また部品実装の有効面積に制約を与えていた。
As a result, the printed wiring for signals often becomes densely packed in some areas, and as a result, the wiring itself has to be bent in many cases, which also limits the effective area for mounting components.

さらに他の電子回路内において発生した電気雑音が上記
積層ブスバーを通じて当該電子回路内に流入して悪影響
を与えることすらあった。
Furthermore, electrical noise generated in other electronic circuits may flow into the electronic circuit through the laminated bus bar and have an adverse effect.

本考案は上記問題点を効果的に解決し、実装上容易でか
つ当該電子回路の信号用プリント配線に全く影響を及ぼ
すことがなく、また当該電子回路内および他の電子回路
内において発生する電気雑音をいちはやく阻止すること
ができるプリント基板用積層ブスバーを提供することを
目的としたものである。
The present invention effectively solves the above-mentioned problems, is easy to implement, does not affect the signal printed wiring of the electronic circuit at all, and is designed to reduce the amount of electricity generated within the electronic circuit and other electronic circuits. The object of the present invention is to provide a laminated busbar for printed circuit boards that can quickly block noise.

本考案によれば、一方を接地した1対の電源供給用ブス
バーの単位長さ当りの静電容量を従来のものよりはるか
に大きくするために、片面に櫛状突出板を有する電極板
を1対、前記突出板が互いに入り組み、かつその屈曲状
隙間に板状の絶縁物質を挾持し、その結果本ブスバーに
バイパスコンデンサの作用を持たせ、プリント基板上に
実装容易なるごとくに構成することによりその目的を達
成することができる。
According to the present invention, in order to greatly increase the capacitance per unit length of a pair of power supply bus bars with one side grounded, one electrode plate having a comb-shaped protruding plate on one side is used. In contrast, the protruding plates are intertwined with each other, and a plate-shaped insulating material is sandwiched between the protruding plates, and as a result, the busbar has the function of a bypass capacitor, and is configured to be easily mounted on a printed circuit board. This goal can be achieved by

以下、本考案を図面により説明する。The present invention will be explained below with reference to the drawings.

第1図は従来のプリント基板用積層ブスバーの構造例を
示す一部を破断した斜視図である。
FIG. 1 is a partially cutaway perspective view showing an example of the structure of a conventional laminated bus bar for printed circuit boards.

第1図に示すごとく、従来のプリント基板用積層ブスバ
ー5は、本積層ブスバーの長手方向と直角の方向に突き
出して所要の間隔および個数をもって一体形成された端
子部1および1′を具備した電源のブスバーを兼ねる電
極板2および2′が絶縁物質3をはさみ込み、これらが
樹脂等の外装材4により被覆された上、実装に供し得る
寸法の帯状に構成されたものである。
As shown in FIG. 1, the conventional laminated busbar 5 for printed circuit boards is a power source equipped with terminal portions 1 and 1' integrally formed with a required interval and number of terminals that protrude in a direction perpendicular to the longitudinal direction of the laminated busbar. Electrode plates 2 and 2', which also serve as busbars, sandwich an insulating material 3, which is covered with an exterior material 4 such as resin, and is formed into a band shape with a size suitable for mounting.

このようにして形成された積層ブスバー5においては単
位長さ当りの静電容量はおよそ数百PFのオーダーとな
り、本積層ブスバー5に電源バイパス用コンデンサの役
割を果し得るには不十分である。
In the laminated busbar 5 formed in this way, the capacitance per unit length is on the order of several hundred PF, which is insufficient for the laminated busbar 5 to play the role of a power supply bypass capacitor. .

そこで第2図に示すごとく、本考案の一実施例のプリン
ト基板用積層ブスバー1は、本積層ブスバーの長手方向
と直角の方向に突き出して所要の間隔および個数をもっ
て一体形成された端子部1および1′を具備した電源の
ブスバーを兼ネル電極板2および2′のそれぞれ片面に
櫛状の突出板6および6′を設け、それらを互いに入り
組渣せてできる屈曲状の隙間に板状の絶縁物質3をはさ
み込み、これらを樹脂等の外装材4により被覆した上、
実装に供し得る寸法の帯状に構成したものである。
Therefore, as shown in FIG. 2, a laminated busbar 1 for a printed circuit board according to an embodiment of the present invention has a terminal portion 1 and a terminal portion 1 which are integrally formed with the required spacing and number of pieces and protrude in a direction perpendicular to the longitudinal direction of the laminated busbar. Comb-shaped protruding plates 6 and 6' are provided on one side of the flannel electrode plates 2 and 2', respectively, and plate-shaped protruding plates 6 and 6' are installed in the bent gaps created by inserting and assembling them into each other. After sandwiching an insulating material 3 and covering these with an exterior material 4 such as resin,
It is configured in a band shape with dimensions suitable for mounting.

このようにして形成されたプリント基板用積層ブスバー
1における単位長さ当りの静電容量は、従来のプリント
基板用積層ブスバー5におけるものの数百倍以上に為す
ことが十分可能となる。
The capacitance per unit length of the laminated busbar 1 for printed circuit boards formed in this way can be several hundred times or more that of the conventional laminated busbar 5 for printed circuit boards.

その結果本積層ブスバーIは電源線路に高い分布静電容
量をもったコンデンサを構成するので、電源線路のイン
ピーダンスをより低減せしめることに有利であり、渣た
当該電子回路内で発生する電気雑音が他の電子回路内に
流入することを阻止できることはもちろんの事、逆に他
の電子回路内で発生した電気雑音が当該電子回路内に流
入して悪影響を及ぼす事をいちはやく阻止することが可
能である。
As a result, this multilayer busbar I forms a capacitor with high distributed capacitance in the power supply line, which is advantageous in further reducing the impedance of the power supply line, and reduces residual electrical noise generated in the electronic circuit. Not only can it prevent the electrical noise from flowing into other electronic circuits, but it can also quickly prevent electrical noise generated in other electronic circuits from flowing into the electronic circuit and having a negative impact. be.

筐た本積層ブスバー7を使用することにより、新たに電
源バイパス用コンデンサを設ける必要がなく、シたがっ
て上記電源バイパス用コンデンサ専用の実装穴も設ける
必要がなくなるので、当該電子回路の信号用プリント配
線に全く支障をきたすことがなくなるとともに、部品実
装の有効面積を拡大することができる。
By using the main laminated busbar 7 in the housing, there is no need to newly install a power supply bypass capacitor, and therefore there is no need to provide a mounting hole dedicated to the power supply bypass capacitor, so the signal print of the electronic circuit can be There is no problem with wiring at all, and the effective area for mounting components can be expanded.

さらに、プリント基板の製作および部品実装の工程で工
数が削減でき、本積層ブスバー7自体も構造が簡単であ
るため安価に大量生産しうるものである。
Furthermore, the number of man-hours can be reduced in the process of manufacturing printed circuit boards and mounting components, and the laminated bus bar 7 itself has a simple structure, so it can be mass-produced at low cost.

本積層ブスバー1は、特にデュアルラインパッケージ型
のICを多数使用するコンピュータ用のプリント基板な
どに使用すると大いにその有効性を発揮しうるものであ
る。
The present laminated busbar 1 can be particularly effective when used in printed circuit boards for computers that use a large number of dual-line packaged ICs.

さらに本積層ブスバー7において、より大きな静電容量
を必要とする場合には、本実施例の絶縁物質3のかわり
にセラミックやタンタルなどの高誘電体物質を使用する
ことによりその目的を達成することができる。
Furthermore, if a larger capacitance is required in this laminated bus bar 7, this purpose can be achieved by using a high dielectric material such as ceramic or tantalum in place of the insulating material 3 of this embodiment. I can do it.

以上本考案について詳細に説明したが、使用材料その他
車考案の趣旨を逸脱しない範囲での変形、変更が行い得
ることは勿論である。
Although the present invention has been described in detail above, it goes without saying that the materials used and other modifications and changes may be made without departing from the spirit of the vehicle invention.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の積層ブスバーの構造例を示す一部を破断
した斜視図であり、第2図は本考案の一実施例を示す一
部を破断した斜視図である。 図において、1,1′・・・・・・端子部、2,2′・
・・・・・電極板、3・・・・・・絶縁物質、4・・・
・・・外装材、5・・・・・・従来のプリント基板用積
層ブスバー、6.6’・・・・・・突出板、I・・・・
・・本考案の一実施例のプリント基板用積層ブスバーで
ある。
FIG. 1 is a partially cutaway perspective view showing an example of the structure of a conventional laminated bus bar, and FIG. 2 is a partially cutaway perspective view showing an embodiment of the present invention. In the figure, 1, 1'...terminal section, 2, 2'...
... Electrode plate, 3 ... Insulating material, 4 ...
...Exterior material, 5...Conventional laminated bus bar for printed circuit board, 6.6'...Protruding plate, I...
...A laminated bus bar for printed circuit boards according to an embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板上に実装する電源供給用積層ブスバーにお
いて、片面に櫛状の突出板を具備する電極板のl対を前
記突出板が入り組みかつその間に板状の絶縁物質を屈曲
状に挾持して構成したことを特徴とするプリント基板用
積層ブスバー
A laminated busbar for power supply mounted on a printed circuit board includes l pairs of electrode plates each having a comb-shaped protruding plate on one side, the protruding plates are intertwined, and a plate-shaped insulating material is sandwiched between them in a bent manner. A laminated busbar for printed circuit boards characterized by the following structure:
JP7170377U 1977-06-01 1977-06-01 Laminated busbar for printed circuit boards Expired JPS5933122Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7170377U JPS5933122Y2 (en) 1977-06-01 1977-06-01 Laminated busbar for printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7170377U JPS5933122Y2 (en) 1977-06-01 1977-06-01 Laminated busbar for printed circuit boards

Publications (2)

Publication Number Publication Date
JPS53164660U JPS53164660U (en) 1978-12-23
JPS5933122Y2 true JPS5933122Y2 (en) 1984-09-17

Family

ID=28982714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7170377U Expired JPS5933122Y2 (en) 1977-06-01 1977-06-01 Laminated busbar for printed circuit boards

Country Status (1)

Country Link
JP (1) JPS5933122Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5301514B2 (en) * 2010-09-28 2013-09-25 株式会社神戸製鋼所 Busbar, busbar manufacturing method, busbar and connector

Also Published As

Publication number Publication date
JPS53164660U (en) 1978-12-23

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