JPS5931039A - Conveyor of semiconductor wafer and operation thereof - Google Patents
Conveyor of semiconductor wafer and operation thereofInfo
- Publication number
- JPS5931039A JPS5931039A JP19909382A JP19909382A JPS5931039A JP S5931039 A JPS5931039 A JP S5931039A JP 19909382 A JP19909382 A JP 19909382A JP 19909382 A JP19909382 A JP 19909382A JP S5931039 A JPS5931039 A JP S5931039A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- nozzle
- transport
- chemical solution
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
Description
【発明の詳細な説明】
［発”明の技術分野］
本発明は、半導体ウェファ−の搬送方法及び搬送装置に
係わり、特に、液体を搬送媒体として用い先生導体ウェ
ファ−の搬送方法および装置に関するものである。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a method and device for transporting a semiconductor wafer, and particularly to a method and device for transporting a conductor wafer using a liquid as a transport medium. It is.
［発明の技術的背景と七の問題点］
半導体ウェファ−の洗浄およびスクラブに伴う半導体ウ
ェファ−の搬送方法としては、一般に次のような方法が
知られている。[Technical Background of the Invention and No. 7 Problems] The following method is generally known as a method for transporting a semiconductor wafer during cleaning and scrubbing of the semiconductor wafer.
（１）ウェファ−を搭載するキャリア毎に搬送するバッ
チ・キャリア方式。(1) Batch carrier method in which each carrier carrying a wafer is transported.
（２）チャック等によってウェファ−を１枚づつ掴み搬
送する方法。(2) A method in which wafers are grabbed and transported one by one using a chuck or the like.
（３）ローラ、ガイド等の間を後方から板等で押して１
枚づつ搬送する方法、。(3) Push between the rollers, guides, etc. from behind with a plate, etc.
A method of transporting sheets one by one.
ところで、上記の洗浄およびスクラブはその効果を高め
るために、強酸、強アルカリ等による薬品処理を伴う場
合がある。By the way, the above-mentioned cleaning and scrubbing may be accompanied by chemical treatment with strong acid, strong alkali, etc. in order to enhance their effectiveness.
しかし、ト記のバッチ・キャリア方式以外の方法は、チ
ャック、ローラーおよびガイド等の材質で耐薬品性訃よ
び機械的強度をかね備えたものがほとんど存在しないた
め、薬品処理を伴う場合には採用されていない。However, methods other than the batch-carrier method mentioned above are not used when chemical treatment is involved, as there are almost no materials for chucks, rollers, guides, etc. that have both chemical resistance and mechanical strength. It has not been.
また、半導体ウェファ−は薄くもろいため、チャック、
ローラーおよびガイドによる方法では、ウェファ−を破
損させる確率が高く、かつ今後増々ウェファ−の大口径
化が進むにつれて破損させずにウェファ−を搬送させる
ことが困難になってく る。In addition, since semiconductor wafers are thin and brittle, chucks and
The method using rollers and guides has a high probability of damaging the wafer, and as the diameter of the wafer continues to increase, it will become difficult to transport the wafer without damaging it.
一方、バッチ・キャリア方式は、上記の欠へである耐薬
品性等の問題およびウェファ−破損の問題は生ずること
が少ないが、搬送するウェファ−の体積、重量より極め
て大なるキャリア（テフロン製）を使用するだめ、ウェ
ファ−を洗浄すると同時にキャリアも洗浄するとさとな
り、ウェファ−のみを洗浄する場合に比べて薬品使用量
が必然的に増大する。従って、ウェファ−が大口径化す
るにつれ一〇この差は大となるという難点がある。On the other hand, with the batch carrier method, the above-mentioned problems such as chemical resistance and wafer damage rarely occur, but the carrier (made of Teflon) is much larger than the volume and weight of the wafers being transported. If the carrier is cleaned at the same time as the wafer, the amount of chemicals used will inevitably increase compared to when cleaning only the wafer. Therefore, as the diameter of the wafer becomes larger, this difference becomes larger.
また、洗浄効果を高めるためには、洗浄剤である水また
は薬品がウェファ−表面を流れて汚れを押し流す速量を
高める必要がある。しかし、バッチ方式ではキャリア全
体を水または薬品中に浸漬し揺動し、或いはボイリング
したり、または超音波を与える等の方法しか存在せず、
洗浄効果を急速に高めることは困難である。Furthermore, in order to improve the cleaning effect, it is necessary to increase the rate at which the cleaning agent, water or chemicals, flows over the wafer surface and sweeps away dirt. However, in the batch method, there are only methods such as immersing the entire carrier in water or chemicals, shaking it, boiling it, or applying ultrasonic waves.
It is difficult to rapidly increase the cleaning effect.
［発明の目的］
本発明は、以上の難点を解消すべくなされたもので、搬
送トラックに配置されたノズルから噴射する液体によシ
ウエファーを搬送し、まだは搬送中に同時に洗浄および
スクラブを行なうようにした半導体ウェファ−の搬送方
法および搬送装置を提供することを目的とする。[Object of the Invention] The present invention has been made in order to solve the above-mentioned difficulties, and the wafer is transported by liquid sprayed from a nozzle arranged on a transport truck, and cleaning and scrubbing are performed simultaneously during transport. It is an object of the present invention to provide a method and a device for transporting a semiconductor wafer.
［発明の概要］
本発明はガイドによって形成された搬送トラックに円形
板状の半導体ウェファ−を垂直配置し、このウェファ−
の両面に、進行方向に傾斜させて液体を噴射し前記ウェ
ファ−を回転させて搬送する半導体ウェファ−の搬送方
法と、半導体ウェファ−が垂直配置されるガイドによっ
て形成された搬送トラックと、前記トラックに清って進
行方向に傾斜して多数並設された前記ウェファ−の両面
に液体を噴射させるノズルとを備えたことを特徴とする
半導体ウェファ−の搬送装置である。[Summary of the Invention] The present invention vertically arranges a circular plate-shaped semiconductor wafer on a transport track formed by a guide, and
A method for transporting a semiconductor wafer, in which a liquid is sprayed on both sides of the wafer at an angle in the direction of travel, and the wafer is rotated and transported; a transport track formed by a guide on which the semiconductor wafer is vertically arranged; This is a semiconductor wafer conveyance apparatus characterized in that it is equipped with a plurality of nozzles arranged in parallel at an angle in the direction of travel for injecting liquid onto both sides of the wafer.
［発明の実施例］ 以下図面に基づき、本発明の実施例を詳細に述べる。[Embodiments of the invention] Embodiments of the present invention will be described in detail below based on the drawings.
第１図に示すように、ガイド１によって形成された搬送
トラック２の入口近傍には、ローディングエレベータ３
が配置され、その上に、洗浄および搬送すべきウェファ
−を収納したキャリア４が載置されている。一方、搬送
トラック２の出口近傍には、アンローディングエレベー
タ５が配置され、その上に搬送されて来たウェファ−を
収納するキャリア６が載置されている。As shown in FIG. 1, a loading elevator 3 is located near the entrance of the transport track 2 formed by the guide 1.
A carrier 4 containing wafers to be cleaned and transported is placed thereon. On the other hand, an unloading elevator 5 is arranged near the exit of the transport truck 2, and a carrier 6 for storing the transported wafers is placed on the unloading elevator 5.
前記のように配列された搬送装置の搬送トラック２上に
は、ウェファ−を搬送する過程において洗浄液をウェフ
ァ−に噴射して薬品処理およびスクラブを行なうノズル
列が設けられている。このノズル列は、搬送トラックの
入口側から順に配列された、薬液ノズル７、第１のスク
ラブ用の薬液ノズル８、水洗用の水ノズル９、第２のス
クラブ用の薬液ノズル１０．水洗用の水ノズル１１およ
び乾燥用のエアプローノズル１２から構成されている。On the transport track 2 of the transport device arranged as described above, a nozzle array is provided for spraying a cleaning liquid onto the wafer to perform chemical treatment and scrubbing during the process of transporting the wafer. This nozzle row consists of a chemical nozzle 7, a first scrubbing chemical nozzle 8, a washing water nozzle 9, a second scrubbing chemical nozzle 10, which are arranged in order from the entrance side of the transport truck. It consists of a water nozzle 11 for washing and an air nozzle 12 for drying.
そして薬液ノズル８の下方には、第１のスクラブ用ブラ
シ１３がモータ等の駆動装置１４に連結され、薬液ノズ
ル１０の下方には、第２のスクラブ用ブラシ１３’が配
置されている（駆動装置は図示せず）。Below the chemical liquid nozzle 8, a first scrubbing brush 13 is connected to a drive device 14 such as a motor, and below the chemical liquid nozzle 10, a second scrubbing brush 13' is arranged (drive (Apparatus not shown).
また、それぞれのノズルは、薬液ポンプ１５ 、１６を
介して薬液タンク１７ 、１８または、水タンク（図示
せず）に接続されている。また、１９は上下運動と往復
運動を伴なうフックでウェファ−をキャリア６に収納す
るためのものである。Further, each nozzle is connected to chemical liquid tanks 17 and 18 or a water tank (not shown) via chemical liquid pumps 15 and 16. Further, 19 is a hook that moves up and down and reciprocates, and is used to store the wafer in the carrier 6.
なお、第１図に示す実施例において、ノズル、ブラシ、
ポンプおよび（または）タンクの個数およびその配置は
、搬送過程中に洗浄作業が施される被搬送物または被洗
浄物であるウェファ−の種類、寸法等によって、適宜変
更することができる。In addition, in the embodiment shown in FIG. 1, the nozzle, brush,
The number and arrangement of pumps and/or tanks can be changed as appropriate depending on the type, size, etc. of the object to be transported or the wafer to be cleaned during the transport process.
ここで、第２〜６図を参照して搬送トラックについて説
明すると、搬送トラック２は、第２図に示す搬送ブロッ
ク２０（切断した手分のみ図示）を第４図のように連結
して構成されている。ブロック加は、１体２１の側面に
、ガイド２２ 、２２’が設けられて、筐体２１の上面
に溝が形成されて、その溝の底面（・てノズル列２３．
２３’が平行に配置されて構成されている。ノズル列２
３．２３’には、第３図に示すように、多数のノズル冴
・・・が、ウェファ−２５の進行方向あに対して傾斜し
て並設されている。Here, the conveyance truck will be explained with reference to FIGS. 2 to 6. The conveyance truck 2 is constructed by connecting the conveyance blocks 20 shown in FIG. 2 (only the cut pieces are shown) as shown in FIG. has been done. In the block assembly, guides 22 and 22' are provided on the side surface of one body 21, and a groove is formed on the upper surface of the housing 21, and the bottom surface of the groove (the nozzle row 23.
23' are arranged in parallel. Nozzle row 2
3.23', as shown in FIG. 3, a large number of nozzles are arranged in parallel with respect to the traveling direction of the wafer 25.
而して、給水管２７から給水された水は、筐体２１の空
洞部に充満し、ノズル冴・・より噴射されて、水平配置
されたウェファ−底面を押圧し、ウェファ−を浮上させ
ると共にこれを搬送方向に推進させる。なお、四は排水
管である。The water supplied from the water supply pipe 27 fills the cavity of the casing 21, is sprayed from the nozzle, presses the bottom surface of the horizontally arranged wafer, and causes the wafer to float. This is propelled in the transport direction. Note that 4 is a drain pipe.
一方、上記搬送過程に於いて、ウェファ−５の上面は、
薬液ノズル７からの薬液によって洗浄され、薬液ノズル
８からの薬液を介してスクラブ用ブラシ１３によってス
クラブされ、以下同様に水洗、薬液スクラブ、水洗され
、最後に、エアプローノズル１２からのエアによって乾
燥される。On the other hand, in the above transfer process, the upper surface of the wafer 5 is
It is cleaned with the chemical liquid from the chemical liquid nozzle 7, scrubbed with the scrubbing brush 13 through the chemical liquid from the chemical liquid nozzle 8, and then washed with water, chemical liquid scrubbed, and washed with water in the same manner, and finally dried with air from the air blower nozzle 12. be done.
また、第４図に示す第２ブロツク加のように給水をｆｊ
Ｐ 正させればウェファ−の搬送も停止される。Also, as shown in the second block addition shown in Fig. 4, the water supply is fj
If P is corrected, wafer transport will also be stopped.
第１ブロツク３１はウェファ−搬連中の状態を示してい
る。The first block 31 shows the state of the wafer transport crew.
またウェファ−の両面洗浄およびスクラブを必要とする
ときは、次のような垂直型搬送ブロックを連結した搬送
トラックが使用され、ウェファ−は、円形板状とされ、
搬送トラックに垂直に配］ｄされて搬送される。すなわ
ち、第５図および第５図■−■線Ｖｆｒ面斜視図である
第６図に示すように、ブロック３２の上側には、ウェフ
ァ−を支える溝３３を有するガイド詞が設けられている
。このガイド調は、その内部に存在する空洞３５を介し
て給水管３６に接続されており、＄３３には３個のノズ
ル列３７゜開、３９がウェファ−の進行方向３９′に対
して傾斜してノズル４０・・・が設けられている（第６
図）。そして、上記ガイド３４の真下にはガイド調と同
一外形のガイド４１がガイド３２の配置と対象に配置さ
れている０ガイド４１に設けられたノズル列４２ 、４
３ 、４４はガイド調に設けられたノズル列と配置カＳ
異り、ウェファ−の進行方向に対して垂直である。When cleaning and scrubbing both sides of the wafer is required, a transport truck with connected vertical transport blocks as shown below is used, and the wafer is shaped like a circular plate.
It is arranged perpendicularly to the transport truck and transported. That is, as shown in FIG. 5 and FIG. 6, which is a perspective view taken along the line Vfr of FIG. This guide line is connected to a water supply pipe 36 through a cavity 35 existing inside it, and at $33, three nozzle rows are opened at 37 degrees, and 39 is inclined with respect to the wafer traveling direction 39'. and a nozzle 40 (sixth
figure). Directly below the guide 34, a guide 41 having the same external shape as the guide tone is arranged symmetrically with the arrangement of the guide 32. Nozzle rows 42, 4 are provided on the guide 41.
3 and 44 are the nozzle rows and arrangement cues provided in a guide manner.
However, it is perpendicular to the direction of wafer movement.
而して、ガイド３４ 、４１の溝３３ 、３３’に支え
られたウェファ−画面には、給水管３６ 、４５より給
水された水がノズルより噴射され、ノズル列３７ 、３
１’ｌ 、 ３９より噴射される水の推力によりウェフ
ァ−は回転しながら搬送される。Water supplied from the water supply pipes 36 and 45 is sprayed from the nozzles onto the wafer screen supported by the grooves 33 and 33' of the guides 34 and 41, and the nozzle rows 37 and 3
The wafer is conveyed while being rotated by the thrust of water jetted from 1'l and 39.
なお、上記搬送過程に於いて、ウェファ−５の両面には
、薬液洗浄、薬液スクラブ、水洗、エア乾燥などから成
る一連の洗浄作業を、第１図に示すように、施すことが
できる。In the above-mentioned transport process, both sides of the wafer 5 can be subjected to a series of cleaning operations including chemical cleaning, chemical scrubbing, water washing, air drying, etc., as shown in FIG.
［発明の効果］
以上述べた実施例の説明からも明らかなように本発明に
よれば、搬送トラックは、耐薬品性はあるが機械的強度
の劣る材質を使用しても簡単に作成できる。また、ウェ
ファ−は、水によって搬送されるためウェファ−の大口
径化に関係なく、搬送に伴う破損はほとんどなくなり、
搬送が確実に行なわれる。さらに、ウェファ−を１枚１
枚搬送でき、また洗浄を同時に行なう場合には、洗浄用
の薬品または水はウェファ−表面に直接噴射できるので
洗浄効果が高ま如、薬品または水の使用量を少なくでき
、かつ搬送中ウェファ−表面が水により濡らされている
ので、ゴミが再び付９１ｔ−ｆルようなことがなくなる
。[Effects of the Invention] As is clear from the description of the embodiments described above, according to the present invention, the transport track can be easily manufactured even if a material having chemical resistance but poor mechanical strength is used. In addition, since the wafer is transported by water, there is almost no damage caused by transport, regardless of the large diameter of the wafer.
Transport is carried out reliably. Furthermore, one wafer
In addition, when cleaning is performed at the same time, cleaning chemicals or water can be sprayed directly onto the wafer surface, increasing the cleaning effect, reducing the amount of chemicals or water used, and reducing the amount of water used to clean the wafer during transport. Since the surface is wetted with water, there is no chance of dust re-attaching.
第１図は、本発明の一実施例を示す斜視図、第２図は、
搬送ブロックの斜視図、第３図は、第２図のノズル列に
沿う断面図、第４図は、搬送トラックのノズル列に清う
断面図、第５図は、本発明の他の実施例を示す断面図、
第６図は第５図のＷ−■線の断面斜視図である０
２・・・搬送トラック、
１．２２．２２’ 、３４．４１・・・ガイド、５・・
・ウェファ−１
羽、２３’、２４，３７，３８，３９，４０，４２，４
３．４４・・・ノズル。
代理人 弁理士 則 近 憲 佑（ほか１名）下２図
ず４図
箪５図
￥６図
６
４−ｏ
−万
６６棒噛 も う−二一二−γ、−３ｆη
〜−−−−４４
ミ〃′
勾 −□−□−FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing an embodiment of the present invention.
3 is a sectional view along the nozzle row of FIG. 2, FIG. 4 is a sectional view along the nozzle row of the transport track, and FIG. 5 is another embodiment of the present invention. A cross-sectional view showing
FIG. 6 is a cross-sectional perspective view taken along the line W-■ in FIG.
・Wafer-1 feather, 23', 24, 37, 38, 39, 40, 42, 4
3.44... Nozzle. Agent Patent Attorney Noriyuki Chika (and 1 other person) Bottom 2 Zuzuzu 4 Zukan 5 ¥6 Figure 6 4-o
-212-γ, -3fη
~---44
Mi〃′ incline −□−□−
Claims (4)
状の半導体ウェファ−を垂直配置し、このウェファ−の
両面に、進行方向に傾斜させて液体を噴射し前記ウェフ
ァ−を回転させて搬送することを特徴きする半導体ウェ
ファ−の搬送方法。(1) A circular plate-shaped semiconductor wafer is arranged vertically on a transport track formed by a guide, and a liquid is sprayed on both sides of the wafer at an angle in the direction of travel, and the wafer is rotated and transported. A semiconductor wafer transport method characterized by:
状の半導体ウェファ−を垂直配置し、このウェファ−の
両面に、進行方向に傾斜させて液体を噴射し前記１クエ
フア−を回転させて搬送する過程において洗浄液を前記
ウヱファーに噴射することを特徴とする半導体ウェファ
−の搬送方法。(2) A circular plate-shaped semiconductor wafer is vertically arranged on a transport track formed by a guide, and a liquid is sprayed on both sides of the wafer at an angle in the direction of travel, and the first square is rotated to transport the wafer. A method for transporting a semiconductor wafer, comprising spraying a cleaning liquid onto the wafer during the process.
て形成された搬送トラックと、前記トラックに沿って進
行方向に傾斜して多数並設された前記ウェファ−の両面
に液体を噴射させるノズル□とを備えたことを特徴とす
る半導体ウニプアーの搬送装置。(3) A transport track formed by a guide on which the semiconductor wafer is vertically arranged, and a large number of nozzles □ that spray liquid onto both sides of the wafer, which are arranged in parallel along the track and inclined in the direction of travel. A conveying device for semiconductor Unipoor, characterized by the following:
または両面に洗浄液を噴射させる噴射装置が付設されて
なる特許請求の範囲第４項記載の半導体ウェファ−の搬
送装置。(4) A semiconductor wafer conveyance apparatus according to claim 4, wherein said conveyance track is provided with an injection device for spraying a cleaning liquid onto one or both surfaces of said wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19909382A JPS5947457B2 (en) | 1982-11-15 | 1982-11-15 | How to clean semiconductor wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19909382A JPS5947457B2 (en) | 1982-11-15 | 1982-11-15 | How to clean semiconductor wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5931039A true JPS5931039A (en) | 1984-02-18 |
| JPS5947457B2 JPS5947457B2 (en) | 1984-11-19 |
Family
ID=16401991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19909382A Expired JPS5947457B2 (en) | 1982-11-15 | 1982-11-15 | How to clean semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5947457B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4722355A (en) * | 1985-08-19 | 1988-02-02 | Rolf Moe | Machine and method for stripping photoresist from wafers |
| JPH03108717A (en) * | 1989-09-22 | 1991-05-08 | Yokogawa Electric Corp | Silicon wafer cleaning apparatus |
| DE19781822B4 (en) * | 1996-07-08 | 2004-09-09 | Speedfam-Ipec Corp.(N.D.Ges.D.Staates Delaware), Chandler | Cleaning station for use in a system for cleaning, rinsing and drying semiconductor wafers |
| JP2009105377A (en) * | 2007-10-04 | 2009-05-14 | Ihi Corp | Floating device and floating carrier |
| JP2010024012A (en) * | 2008-07-23 | 2010-02-04 | Ishino Seisakusho Co Ltd | Food and drink container carrier device |
| TWI804239B (en) * | 2022-03-17 | 2023-06-01 | 孫建忠 | System and method for wafer frame cleaning |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62118829A (en) * | 1985-11-16 | 1987-05-30 | 日高 督 | Reverse culture method and apparatus using flower pot |
-
1982
- 1982-11-15 JP JP19909382A patent/JPS5947457B2/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4722355A (en) * | 1985-08-19 | 1988-02-02 | Rolf Moe | Machine and method for stripping photoresist from wafers |
| JPH03108717A (en) * | 1989-09-22 | 1991-05-08 | Yokogawa Electric Corp | Silicon wafer cleaning apparatus |
| DE19781822B4 (en) * | 1996-07-08 | 2004-09-09 | Speedfam-Ipec Corp.(N.D.Ges.D.Staates Delaware), Chandler | Cleaning station for use in a system for cleaning, rinsing and drying semiconductor wafers |
| JP2009105377A (en) * | 2007-10-04 | 2009-05-14 | Ihi Corp | Floating device and floating carrier |
| JP2010024012A (en) * | 2008-07-23 | 2010-02-04 | Ishino Seisakusho Co Ltd | Food and drink container carrier device |
| TWI804239B (en) * | 2022-03-17 | 2023-06-01 | 孫建忠 | System and method for wafer frame cleaning |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5947457B2 (en) | 1984-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6269511B1 (en) | Surface cleaning apparatus | |
| JP3328481B2 (en) | Processing method and apparatus | |
| JP6133120B2 (en) | Substrate cleaning device | |
| JP2901098B2 (en) | Cleaning device and cleaning method | |
| US5762084A (en) | Megasonic bath | |
| JP2001213517A (en) | Conveying device for plate member | |
| JPH04225229A (en) | Method and apparatus for handling wafer | |
| JPS5931039A (en) | Conveyor of semiconductor wafer and operation thereof | |
| JP2005199196A (en) | Washing method and apparatus | |
| JP2001096245A (en) | Cleaning method and cleaning equipment | |
| JPH02250324A (en) | Manufacture of semiconductor device and cleaning apparatus used therefor | |
| JPH053184A (en) | Cleaning method of wafer | |
| JPH07328573A (en) | Washing method and apparatus | |
| JPS5846170B2 (en) | Semiconductor wafer transport method and transport device | |
| JP2002520132A (en) | Method and apparatus for cleaning a substrate | |
| JPH07249605A (en) | Substrate washing equipment | |
| KR100864262B1 (en) | Apparatus of Cleaning a Wafer | |
| JP2543007B2 (en) | Wafer single wafer cleaning device | |
| JPH0691986B2 (en) | Substrate cleaning method | |
| JPS6143430A (en) | Cassette cleaner | |
| JPS61249582A (en) | Washer | |
| JPH09326375A (en) | Method and equipment for cleaning wafer | |
| JP2767165B2 (en) | Wafer cleaning tank | |
| KR20190086202A (en) | Substrate procesing system and substrate procesing apparatus | |
| JP2000107713A (en) | Apparatus for cleaning cassette for disk |