JPS5929117B2 - Nickel-chromium alloy plating method - Google Patents
Nickel-chromium alloy plating methodInfo
- Publication number
- JPS5929117B2 JPS5929117B2 JP12900680A JP12900680A JPS5929117B2 JP S5929117 B2 JPS5929117 B2 JP S5929117B2 JP 12900680 A JP12900680 A JP 12900680A JP 12900680 A JP12900680 A JP 12900680A JP S5929117 B2 JPS5929117 B2 JP S5929117B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- chromium alloy
- plating
- current density
- alloy plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明はニッケル−クロム合金メッキ方法に関するもの
で、特に、耐熱金属に対してニッケル−クロム被膜を与
えて耐食性を持たせることに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a nickel-chromium alloy plating method, and more particularly to providing a nickel-chromium coating to a heat-resistant metal to impart corrosion resistance.
高温におけるバナジウムアタックに対しては、ニッケル
−クロム合金が有効であることは公知であるが、この合
金は加工性が劣る等の欠点を有しており、従つて、耐熱
金属の表面にニッケル−クロム合金層を被覆する方法が
考えられる。It is well known that nickel-chromium alloys are effective against vanadium attacks at high temperatures, but this alloy has drawbacks such as poor workability, and therefore, nickel-chromium alloys are not used on the surface of heat-resistant metals. A method of coating with a chromium alloy layer is considered.
この方法には下記のようなものがある。１ ニッケル−
クロム合金を溶射する方法。This method includes the following. 1 nickel
How to thermal spray chromium alloy.
２ ニッケルとクロムの２層メッキを行ない、熱拡散に
より合金メッキ層を得る方法。2. A method of plating two layers of nickel and chromium and obtaining an alloy plating layer by thermal diffusion.
３ ニッケル−クロム合金メッキを行なう方法。3. Method of performing nickel-chromium alloy plating.
ところで、１項の溶射法は母材との密着性が悪い等の欠
点を有し、また２項の熱拡散法は工程の複雑さと合金組
成の制御が困難である欠点を有する。更に、３項の合金
メッキ方法は密着性が悪いものであつた。そこで、本発
明は上記のような問題を解消し得るニッケル−クロム合
金メッキ方法を提案するもので、以下、本発明を図面に
基づき詳細に説明する。By the way, the thermal spraying method described in item 1 has drawbacks such as poor adhesion to the base material, and the thermal diffusion method described in item 2 has drawbacks such as complexity of the process and difficulty in controlling the alloy composition. Furthermore, the alloy plating method of item 3 had poor adhesion. Therefore, the present invention proposes a nickel-chromium alloy plating method that can solve the above problems, and the present invention will be described in detail below with reference to the drawings.
溶液中のＮｉ゛十とＣｒ゜十が電気化学的に還元されて
金属のニッケルとクロムが析出される電位はＮｉ２＋の
方がＣｒ３＋より約Ｏ、ＩＶ貴にある。The potential at which Ni゛ and Cr゜ in the solution is electrochemically reduced and the metals nickel and chromium are precipitated is about 0.4 IV nobler than that of Ni2+ than that of Cr3+.
従つてＮｉ２＋とＣｒ３＋の混合溶液からメッキを行な
う場合には、ニッケルの方がクロムより析出し易いが、
電流密度及び溶液中のＮｉ’＋、Ｃｒ゜＋の濃度を適当
に選定すると、任意の組成のニッケル−クロム合金属を
析出させることが可能となる。ここで溶液中のＮｉ２＋
とＣｒ３＋濃度が決まつている時、電流密度を零から徐
々に増加していくとニッケルが最初に単独に析出され、
更に電流密度を増加していくとある電流密度（Ｉｔとす
る）を越えるとニッケルとクロムの合金が析出するよう
になる。勿論、このＩｔは溶液中のＮｉ２ｆとＣｒ３＋
の濃度により異なるが、通常のメッキ液組成では５〜１
０Ａ／ｄイである。ところで、ニッケルストライクメッ
キを行なう場合の低電流密度域は１〜１０Ａ／ｄ７７７
″で、また高電流密度域は５〜４０Ａ／ｄｄで行なうの
が良い。この理由として下記のような事が考えられる。Therefore, when plating is performed from a mixed solution of Ni2+ and Cr3+, nickel precipitates more easily than chromium, but
By appropriately selecting the current density and the concentration of Ni'+ and Cr°+ in the solution, it becomes possible to deposit a nickel-chromium alloy metal of any composition. Here, Ni2+ in the solution
When the Cr3+ concentration is fixed and the current density is gradually increased from zero, nickel is first precipitated singly,
As the current density is further increased, an alloy of nickel and chromium begins to precipitate when it exceeds a certain current density (referred to as It). Of course, this It is Ni2f and Cr3+ in the solution.
Although it varies depending on the concentration of
It is 0A/d. By the way, the low current density range when performing nickel strike plating is 1 to 10 A/d777
'', and in the high current density region, it is preferable to conduct the operation at 5 to 40 A/dd.The reasons for this may be as follows.
ＩＡ／ｄイ以下においては、ニッケル−ストライクメッ
キの電着速度が低すぎるので、メッキ時間ヨが非常に長
くなる。１０Ａ／ｄ７ＦＩ’以上においては、ニッケル
ストライクメッキにクラックが入つたり、ピンホールが
生じたりする。Below IA/d, the electrodeposition rate of nickel-strike plating is too low, and the plating time becomes very long. At 10 A/d7FI' or more, cracks or pinholes occur in the nickel strike plating.
従つて、母材との密着性を良くするためのニッケルスト
ライクメッキとしては１〜１０八／ｄ７７Ｚ″が適当な
電流密度範囲門である。また、高電流密度範囲の下限を
５Ａ／ｄｍ”にした理由は、これ以下の電流密度である
と、溶液中のＣｒ３＋力塙濃度である場合でもクロムが
析クー出しない。Therefore, the appropriate current density range for nickel strike plating to improve adhesion to the base material is 1~108/d77Z''.In addition, the lower limit of the high current density range is 5A/dm''. The reason for this is that if the current density is lower than this, chromium will not be deposited even if the concentration of Cr3+ in the solution is high.
そして高電流密度範囲の上限が４０Ａ／Ｄｗｌ以上にな
ると、Ｃｒ３＋の拡散限界電流密度以上になり、電着速
度が飽和になるからである。次に、本発明の実施例につ
いて説明する。１メツキ浴組成
ＮｉＣｌ２：０．０５ｍ０１／１
ＣｒＣ１３：１．０ｍ０１／ｌ
錯化剤 ：１．０ｍ０１／ｌ
電導塩 ：１．０ｍ０１／１
２陽極：ニクロム合金（Ｎｉ；８０％，Ｃｒ；２０％）
３母材（陰極）：ＳＳ４ｌ４液温：３『Ｃ
５母材の前処理
市販の脱脂剤で脱脂した後、１０％Ｈ２ＳＯ４中で酸洗
いを行なつた。This is because when the upper limit of the high current density range becomes 40 A/Dwl or more, the current density exceeds the diffusion limit current density of Cr3+, and the electrodeposition rate becomes saturated. Next, examples of the present invention will be described. 1 Plating bath composition NiCl2: 0.05m01/1 CrC13: 1.0m01/l Complexing agent: 1.0m01/l Conductive salt: 1.0m01/1 2 Anode: Nichrome alloy (Ni: 80%, Cr: 20% )
3 Base material (cathode): SS4l4 Liquid temperature: 3'C5 Pretreatment of base material After degreasing with a commercially available degreaser, pickling was performed in 10% H2SO4.
上記のような条件下において、先ず最初に５人／ｄイで
１時間メツキし、次に２０Ａ／ｄイでｌ時間メツキを行
なつた。Under the above conditions, plating was first carried out for 1 hour at 5 persons/day, and then for 1 hour at 20 A/day.
その結果の断面のＳＥＭ像を観察すると、第１図に示す
ように、ニツケルークロム合金メツキ層１はニツケルス
トライタメツキ層２を介して母材３に完全に密着してい
た。これに対して、上記実施例の１〜５項までの条件は
同じであるが、母材の前処理後、すぐに２０Ａ／Ｄｍ”
で１時間メツキを行なつた比較用試料の断面のＳＥＭ像
を観察したところ、第２図に示すように、ニツケルーク
ロム合金メツキ層１１は母材１２からところどころ剥離
しており、またそれにつれてその表面にも凹凸が見られ
た。以上のように、本発明のニツケルークロム合金メツ
キ方法によれば、低電流密度でニツケルストライクメツ
キを行なつた後、高電流密度でニツケルークロム合金メ
ツキを行なうようにしたので、母材にニツケルークロム
合金層を確実にメツキさせることができ、また、電流密
度を変えるだけで、ニツケルストライクメツキとニツケ
ルークロム合金メツキとを行なうことができるので、同
一浴槽を使用することができ、従つて単純な工程で済む
。When the resulting cross-sectional SEM image was observed, as shown in FIG. 1, the nickel-chromium alloy plating layer 1 was completely adhered to the base material 3 via the nickel striper plating layer 2. On the other hand, although the conditions in items 1 to 5 of the above example are the same, immediately after pretreatment of the base material, 20A/Dm"
When we observed the SEM image of the cross section of the comparison sample plated for one hour at Irregularities were also observed on its surface. As described above, according to the nickel-chromium alloy plating method of the present invention, nickel strike plating is performed at a low current density and then nickel-chromium alloy plating is performed at a high current density. It is possible to reliably plate the nickel-chrome alloy layer, and it is also possible to perform nickel strike plating and nickel-chromium alloy plating by simply changing the current density, so the same bathtub can be used, and conventional It's a simple process.
第１図は本発明の一実施例によるメツキ層の拡大断面図
、第２図はその比較例の拡大断面図を示す。
１・・・・・・ニツケルークロム合金メツキ層、２・・
・・・・ニツケルストライクメツキ層、３・・・・・・
母材。FIG. 1 is an enlarged sectional view of a plating layer according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of a comparative example thereof. 1... Nickel-chrome alloy plating layer, 2...
...Nickel strike metal layer, 3...
Base material.
Claims (1)
メッキによりニッケル−クロム合金層を得る際に、同一
浴において、最初に低電流密度でニッケルストライクメ
ッキを行ない、次に高電流密度でニッケル−クロム合金
メッキを行なうことを特徴とするニッケル−クロム合金
メッキ方法。1 When obtaining a nickel-chromium alloy layer by electroplating in a mixed solution containing Ni ions and Cr ions, nickel strike plating is first performed at a low current density in the same bath, and then nickel strike plating is performed at a high current density. A nickel-chromium alloy plating method characterized by performing chromium alloy plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12900680A JPS5929117B2 (en) | 1980-09-16 | 1980-09-16 | Nickel-chromium alloy plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12900680A JPS5929117B2 (en) | 1980-09-16 | 1980-09-16 | Nickel-chromium alloy plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5754294A JPS5754294A (en) | 1982-03-31 |
| JPS5929117B2 true JPS5929117B2 (en) | 1984-07-18 |
Family
ID=14998817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12900680A Expired JPS5929117B2 (en) | 1980-09-16 | 1980-09-16 | Nickel-chromium alloy plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929117B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2531182Y2 (en) * | 1989-06-08 | 1997-04-02 | 三菱農機株式会社 | Seeding equipment |
-
1980
- 1980-09-16 JP JP12900680A patent/JPS5929117B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2531182Y2 (en) * | 1989-06-08 | 1997-04-02 | 三菱農機株式会社 | Seeding equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5754294A (en) | 1982-03-31 |
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