JPS5925883Y2 - Dry plating equipment - Google Patents

Dry plating equipment

Info

Publication number
JPS5925883Y2
JPS5925883Y2 JP16337280U JP16337280U JPS5925883Y2 JP S5925883 Y2 JPS5925883 Y2 JP S5925883Y2 JP 16337280 U JP16337280 U JP 16337280U JP 16337280 U JP16337280 U JP 16337280U JP S5925883 Y2 JPS5925883 Y2 JP S5925883Y2
Authority
JP
Japan
Prior art keywords
vacuum
plated
vacuum tube
pedestal
dry plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16337280U
Other languages
Japanese (ja)
Other versions
JPS5787060U (en
Inventor
勝景 上原
一男 廣松
Original Assignee
三菱重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱重工業株式会社 filed Critical 三菱重工業株式会社
Priority to JP16337280U priority Critical patent/JPS5925883Y2/en
Publication of JPS5787060U publication Critical patent/JPS5787060U/ja
Application granted granted Critical
Publication of JPS5925883Y2 publication Critical patent/JPS5925883Y2/en
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 本考案は乾式メッキ装置の改良に関するものである。[Detailed explanation of the idea] The present invention relates to an improvement of a dry plating apparatus.

従来の真空蒸着法を使用した最も一般的な乾式メッキ装
置を第1図により□説明す、ると、aがガラスまたは金
属材により構成された釣鐘状の真空筒、bが台座、Cが
前記真空筒aの端縁に設けた台座装着部a1と前記台座
すとの間に介装したシールパツキン、d、 dが前記
台座すを貫通して前記真空筒a内に突設した電極棒、e
が途中をパケット状に曲成するとともに両端を前記各電
極棒dに取付けたフィラメント、fが同フィラメントe
により支持された蒸着用金属、gが前記台座す上に載置
した試料台、hが同試料台g上に載置した被メッキ材、
iが電源、jが前記台座すを貫通して前記真空筒a内と
真空源(図示せず)とを連通した配管で、真空筒a内の
空気を配管jを介し排出して、真空筒a内を蒸発用金属
fの蒸発が可能な10−4〜10 ” mmHg程度の
真空度にしたのち、電源i電極棒d、 dを介してフ
ィラメントeを加熱し、蒸発用金属fを蒸発させて(f
1参照)、被メッキ材りの上に付着させることにより、
メッキ膜f2を形成するようになっている。
The most common dry plating apparatus using the conventional vacuum evaporation method is explained with reference to Fig. 1, where a is a bell-shaped vacuum tube made of glass or metal, b is a pedestal, and C is the above-mentioned vacuum tube. a seal gasket interposed between a pedestal attachment part a1 provided at the edge of the vacuum cylinder a and the pedestal; e
is a filament whose middle part is bent into a packet shape and both ends are attached to each of the electrode rods d, and f is the same filament e.
g is the sample stand placed on the pedestal, h is the material to be plated placed on the sample stand g,
i is a power supply, j is a pipe that passes through the pedestal and communicates the inside of the vacuum tube a with a vacuum source (not shown), and the air in the vacuum tube a is discharged through the pipe j to connect the vacuum tube to the vacuum tube. After creating a vacuum of about 10-4 to 10" mmHg in the interior of a, which is sufficient to evaporate the evaporation metal f, the filament e is heated via the electrode rods d and d of the power source i, and the evaporation metal f is evaporated. Te(f
1), by attaching it to the material to be plated,
A plating film f2 is formed.

前記乾式メッキ装置では、被メッキ材りを真空筒a内に
入れて、その表面にメッキ膜f2を形成するので、真空
筒aよりも大きな大形被メッキ材の一部に、補修のため
メッキ膜f2を形成する場合には、真空筒aに入る大き
さに大形被メッキ材の一部を切り出す必要があった、ま
た大形被メッキ材を入れられる大きさに真空筒aを形成
しても第2図に示すように大形製品(10:被メッキ材
)の凸部10 aにメッキ膜を形成する場合は、被メッ
キ材の凸部10 aが蒸着源に近づきすぎ、メッキ蒸着
粒子が粗くなって、メッキ性能を低下させる不具合があ
った。
In the dry plating apparatus, the material to be plated is put into the vacuum tube a and the plating film f2 is formed on its surface. When forming film f2, it was necessary to cut out a part of the large material to be plated to a size that would fit into the vacuum tube a, and to form the vacuum tube a to a size that could accommodate the large material to be plated. However, when forming a plating film on the convex part 10a of a large product (10: material to be plated) as shown in Fig. 2, the convex part 10a of the material to be plated may be too close to the vapor deposition source, causing plating vapor deposition. There was a problem that the particles became coarse and the plating performance deteriorated.

さらに第3図に示すように被メッキ材の凹部10 bに
メッキ膜を形成する場合は、被メッキ材の凹部10が適
正蒸着位置から遠くなりすぎて、蒸着時間を長くすると
いう欠点があった。
Furthermore, when a plating film is formed in the recess 10b of the material to be plated as shown in FIG. 3, the recess 10 of the material to be plated is too far from the proper deposition position, resulting in a longer deposition time. .

本案は前記の問題点に対処するもので、第1の真空筒を
第2の真空筒に上下動可能に装着するとともに同各真空
筒の間にシール装置を介装し、同第1の真空筒の他端部
にシール装置を介して台座を装着するとともに同第2の
真空筒の他端部に被メッキ材との間を閉じるシール装置
を装着したことを特徴とする乾式メッキ装置に係り、そ
の目的とする処は被メッキ材のメッキ膜の一部が剥離し
て不良品とされていた大形製品を、一部の切り出しや真
空筒の大形化を必要とせすに、最適な蒸着条件下で補修
できる改良された乾式メッキ装置を供する点にある。
This proposal deals with the above-mentioned problems by attaching the first vacuum cylinder to the second vacuum cylinder so that it can move up and down, and interposing a sealing device between each vacuum cylinder, so that the first vacuum cylinder can move up and down. Relating to a dry plating apparatus characterized in that a pedestal is attached to the other end of the tube via a sealing device, and a sealing device is attached to the other end of the second vacuum tube to close the gap with the material to be plated. The purpose of this is to remove large products that have been considered defective due to part of the plating film on the plated material peeling off, and to remove parts that need to be cut out or to make the vacuum tube larger. An object of the present invention is to provide an improved dry plating apparatus that can be repaired under deposition conditions.

本案の乾式メッキ装置は前記のように第1の真空筒を第
2の真空筒に上下動可能に装着するとともに同各真空筒
の間にシール装置を介装し、同第1の真空筒の他端部に
シール装置を介して台座を装着するとともに同第2の真
空筒の他端部に被メッキ材との間を閉じるシール装置を
装着したので、被メッキ材の凸部或は凹部上の剥離した
メッキ膜を補修するときには、第1の真空筒を上下動し
て、蒸着用金属が凸部または凹部に対して最適の蒸着位
置にくるように調節する。
In the dry plating apparatus of the present invention, the first vacuum tube is attached to the second vacuum tube so as to be movable up and down, and a sealing device is interposed between each of the vacuum tubes, so that the first vacuum tube A pedestal is attached to the other end of the second vacuum cylinder via a sealing device, and a sealing device is attached to the other end of the second vacuum tube to close the gap between the plated material and the plated material. When repairing a peeled plating film, the first vacuum tube is moved up and down to adjust the deposition metal to the optimum deposition position relative to the convex portion or concave portion.

次いで第2の真空筒と被メッキ材との間を気密的に閉じ
たのち、メッキ膜を上記剥離部上に形成して、同剥離部
を補修する。
Next, after the space between the second vacuum cylinder and the material to be plated is closed airtight, a plating film is formed on the peeled part to repair the peeled part.

従ってメッキ膜の一部が剥離して不良品とされていた大
形製品を、一部の切り出しや真空筒の大形化を必要とせ
ずに最適蒸着位置での補修ができるものである。
Therefore, a large product that is considered defective due to part of the plating film peeling off can be repaired at the optimal deposition position without the need to cut out part of the product or enlarge the vacuum tube.

また本案の乾式メッキ装置は前記のように構成されてお
り、真空筒を携帯式にすることが可能で、生産現場にも
適用できるものである。
Furthermore, the dry plating apparatus of the present invention is configured as described above, and the vacuum tube can be made portable, so that it can be applied to production sites.

また従来釣鐘状であった真空筒を製作の容易な円筒状に
することが可能で、この点からも製造コストを大幅に低
減できるものである。
Furthermore, the conventional bell-shaped vacuum tube can be made into a cylindrical shape, which is easy to manufacture, and from this point of view as well, manufacturing costs can be significantly reduced.

次に本案の乾式メッキ装置を第2図に示す一実施例によ
り説明すると、1がガラス、プラスチックなどの非金属
または金属材により構成された円筒状の第1の真空筒、
2か゛同様に構成された第2の真空筒、1aが第1の真
空筒1の一端縁に設けた台座装着部、1bが同台座装着
部1a以外の第1の真空筒1の一側に設けた開口部、1
Cが同開口部1bの周りの第1の真空筒部分、2aが第
1の真空筒1のネジ部1dと螺合して第1の真空筒1を
上下動可能に支持する第2の真空筒2の台座部、2bが
第2の真空筒2の1端に設けた開口部、2Cが同開口部
2b周りの第2の真空筒部分、3が台座、4aが同台座
3と前記台座装着部1aとの間に介装したシールパツキ
ン、4bが前記第1の真空筒部分1Cに装着したシール
パツキン、5゜5が前記台座3を貫通して前記真空筒1
内に突設した電極棒、6が途中をバスケット状に曲成す
るとともに両端を゛前記各電極棒5に取付けたフィラメ
ント、7が同フィラメント6により支持された蒸着用金
属、8が電源、9が前記台座3を貫通して前記第1の真
空筒1内と真空源(図示せず)とを連通した配管、10
が大形の被メッキ材、10 aがメッキを施こす凸部で
ある。
Next, the dry plating apparatus of the present invention will be explained with reference to an embodiment shown in FIG.
2. A second vacuum tube having a similar structure, 1a is a pedestal attachment part provided at one end edge of the first vacuum tube 1, and 1b is a pedestal attachment part provided on one side of the first vacuum tube 1 other than the pedestal attachment part 1a. Opening provided, 1
C is the first vacuum tube part around the opening 1b, and 2a is a second vacuum that is screwed into the threaded part 1d of the first vacuum tube 1 and supports the first vacuum tube 1 so as to be movable up and down. The pedestal part of the cylinder 2, 2b is an opening provided at one end of the second vacuum cylinder 2, 2C is a second vacuum cylinder part around the opening 2b, 3 is a pedestal, and 4a is the pedestal 3 and the pedestal. A seal gasket 4b is installed between the mounting portion 1a and the first vacuum cylinder portion 1C, and a seal gasket 5°5 penetrates the pedestal 3 and connects the vacuum cylinder 1.
An electrode rod 6 protruding from the inside is bent in the middle into a basket shape, and both ends are connected to ``a filament attached to each of the electrode rods 5'', 7 a metal for vapor deposition supported by the filament 6, 8 a power source, 9 a pipe 10 that penetrates the pedestal 3 and communicates the inside of the first vacuum cylinder 1 with a vacuum source (not shown);
10 is a large material to be plated, and 10a is a convex portion to be plated.

なお図中の符号11は、大形製品10の表面に凹凸があ
ってシールパツキン4Cだけでは第1と第2の真空筒1
,2内に充分な真空度が得られない場合に大形製品10
との接合部の外側に充填する粘土等のパツキン材である
Note that the reference numeral 11 in the figure indicates that the surface of the large-sized product 10 is uneven and that the first and second vacuum tubes 1 cannot be separated by the seal packing 4C alone.
, 2, if sufficient vacuum cannot be obtained within the large product 10.
This is a packing material such as clay that is filled on the outside of the joint.

次に前記乾式メッキ装置の作用を説明する。Next, the operation of the dry plating apparatus will be explained.

大形製品10の表面に形成したメッキ膜のうち、凸部1
0 aで剥離したメッキ膜を補修するときには、第1の
真空筒1を上下動して、蒸着用金属7が凸部10 aに
対して最適蒸着位置にくるように調節する。
Convex portions 1 of the plating film formed on the surface of the large product 10
When repairing the plating film that has peeled off at 0 a, the first vacuum cylinder 1 is moved up and down to adjust the deposition metal 7 to be at the optimum deposition position relative to the convex portion 10 a.

次いで第2の真空筒部分2Cと被メッキ材10との間を
気密的に閉じたのち、第1と第2の真空筒1,2内の空
気を配管9を介し排出して、第1と第2の真空筒1,2
内を所定の真空度にし、次いで電源8電極棒5,5を介
してフィラメント6を加熱し、蒸発用金属7を蒸発させ
て、(7a参照)、被メッキ材10の上に付着させるこ
とにより、メッキ膜7bを形成する。
Next, after closing the space between the second vacuum cylinder portion 2C and the material to be plated 10 airtightly, the air in the first and second vacuum cylinders 1 and 2 is exhausted through the piping 9, and the Second vacuum tube 1, 2
By creating a predetermined degree of vacuum inside, then heating the filament 6 via the power supply 8 electrode rods 5, 5, evaporating the evaporation metal 7 (see 7a), and depositing it on the material to be plated 10. , a plating film 7b is formed.

なお被メッキ材10が円筒状や波形の場合には、開口部
2bの周りの第2の真空筒部分2C及びシールパツキン
4Cを同形状に形成して、気密性を保持するようにする
Note that when the material to be plated 10 is cylindrical or corrugated, the second vacuum tube portion 2C and the seal packing 4C around the opening 2b are formed in the same shape to maintain airtightness.

なお第1、第2の真空筒1,2は、被メッキ材10の形
状に適合した他の形状の真空筒に取り換えることもでき
る。
Note that the first and second vacuum cylinders 1 and 2 can be replaced with vacuum cylinders of other shapes that match the shape of the material to be plated 10.

次に本案の乾式メッキ装置を第3に示す他の実施例によ
り説明すると、本実施例装置は乾式メッキ法の一種であ
るイオンメッキ法に適用したもので、台座3が陽極側台
座3aと陰極側台座3bとにより構成され、メッキ用金
属片6が同陰極側台座3bに装着され、アルゴンガス注
入管12に連通したアルゴンガス注入孔13が上記陽極
側台座3aに設けられている以外は、前記第2図の実施
例装置と同様に構成されている。
Next, the dry plating apparatus of the present invention will be explained with reference to another embodiment shown in the third example.The apparatus of this embodiment is applied to the ion plating method, which is a type of dry plating method, and the pedestal 3 is connected to the anode side pedestal 3a and the cathode side pedestal 3a. The plating metal piece 6 is attached to the cathode side pedestal 3b, and the anode side pedestal 3a is provided with an argon gas injection hole 13 communicating with the argon gas injection tube 12. The structure is similar to that of the embodiment shown in FIG. 2 above.

次に前記乾式メッキ装置の作用を説明する。Next, the operation of the dry plating apparatus will be explained.

被メッキ材10の表面に形成したメッキ膜のうち、凹部
10bで剥離したメッキ膜を補修するときには、第1の
真空筒1を上下動して、メッキ用金属すが最適蒸着位置
にくるように調節する。
When repairing the plating film formed on the surface of the material to be plated 10 that has peeled off at the recess 10b, the first vacuum tube 1 is moved up and down so that the metal plate for plating is at the optimum deposition position. Adjust.

次いで第2の真空筒部分2Cと被メッキ材10との間を
気密的に閉じたのち、第1と第2の真空筒1,2内の空
気を配管9を介し排出して、真空筒1,2を所定の真空
度にし、次いでアルゴンガスを注入管12注入孔13を
経て真空筒1,2内へ注入する一方、陽極側台座3aと
陰極側台座3bとの間に電圧を印加し、アルゴンガス1
4をプラスイオンe+(14a参照)にして、メッキ用
金属片6に衝突させ、同メッキ用金属片6例えば金Au
を飛散させて(7a参照)、被メッキ材10の上に付着
させることにより、最適のメッキ膜7bを形成する。
Next, after closing the space between the second vacuum cylinder portion 2C and the material to be plated 10 airtightly, the air in the first and second vacuum cylinders 1 and 2 is exhausted through the piping 9, and the vacuum cylinder 1 is removed. . Argon gas 1
4 is made into positive ions e+ (see 14a) and collided with the metal piece 6 for plating, such as gold Au.
An optimal plating film 7b is formed by scattering (see 7a) and depositing it on the material to be plated 10.

【図面の簡単な説明】 第1図は従来の乾式メッキ装置を示す縦断側面図、第2
図は本案に係る乾式メッキ装置の一実施例を示す縦断面
図、第3図は本案に係る乾式メッキ装置の他の実施例を
示す縦断側面図である。 1・・・・・・第1の真空筒、2・・・・・・第2の真
空筒、1a・・・・・・台座装着部、2a・・・・・・
台座部、lb、2b・・・・・・開口部、3・・・・・
・台座、IC,2C・・・・・・開口部lb、2bの周
りの第1と第2の真空筒部分、4a、 4b、 4
C・・・・・・シール・パツキン、10・・・・・・被
メッキ材、10 a・・・・・・被メッキ材の凸部、1
0 b・・・・・・被メッキ材の凹部。
[Brief explanation of the drawings] Figure 1 is a vertical side view showing a conventional dry plating equipment,
The figure is a longitudinal sectional view showing one embodiment of the dry plating apparatus according to the present invention, and FIG. 3 is a longitudinal sectional side view showing another embodiment of the dry plating apparatus according to the present invention. DESCRIPTION OF SYMBOLS 1...First vacuum tube, 2...Second vacuum tube, 1a...Pedestal attachment part, 2a...
Pedestal part, lb, 2b...Opening, 3...
・Pedestal, IC, 2C...First and second vacuum cylinder parts around openings lb and 2b, 4a, 4b, 4
C... Seal packing, 10... Material to be plated, 10 a... Convex portion of material to be plated, 1
0 b... Concavity in the material to be plated.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 第1の真空筒を第2の真空筒に上下動可能に装着すると
ともに同各真空筒の間にシール装置を介装し、同第1の
真空筒の他端部にシール装置を介して台座を装着すると
ともに同第2の真空筒の他端部に被メッキ材との間を閉
じるシール装置を装着したことを特徴とする乾式メッキ
装置。
The first vacuum tube is attached to the second vacuum tube so as to be movable up and down, and a sealing device is interposed between each of the vacuum tubes, and the other end of the first vacuum tube is attached to the pedestal via the sealing device. What is claimed is: 1. A dry plating apparatus characterized in that a sealing device is attached to the other end of the second vacuum cylinder to close a gap between the second vacuum cylinder and the material to be plated.
JP16337280U 1980-11-17 1980-11-17 Dry plating equipment Expired JPS5925883Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16337280U JPS5925883Y2 (en) 1980-11-17 1980-11-17 Dry plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16337280U JPS5925883Y2 (en) 1980-11-17 1980-11-17 Dry plating equipment

Publications (2)

Publication Number Publication Date
JPS5787060U JPS5787060U (en) 1982-05-28
JPS5925883Y2 true JPS5925883Y2 (en) 1984-07-28

Family

ID=29522155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16337280U Expired JPS5925883Y2 (en) 1980-11-17 1980-11-17 Dry plating equipment

Country Status (1)

Country Link
JP (1) JPS5925883Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6252862B2 (en) * 2014-07-17 2017-12-27 有限会社ファームファクトリー Vacuum deposition equipment

Also Published As

Publication number Publication date
JPS5787060U (en) 1982-05-28

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