JPS592384A - Light-emitting diode lamp - Google Patents
Light-emitting diode lampInfo
- Publication number
- JPS592384A JPS592384A JP57112367A JP11236782A JPS592384A JP S592384 A JPS592384 A JP S592384A JP 57112367 A JP57112367 A JP 57112367A JP 11236782 A JP11236782 A JP 11236782A JP S592384 A JPS592384 A JP S592384A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- emitting diode
- pieces
- substrates
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 21
- 238000009826 distribution Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 2
- 238000009751 slip forming Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は発光ダイオードランプに関するもので、特に
この種ランプにおけるリード基板の新規な構成に係わる
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light emitting diode lamp, and more particularly to a novel structure of a lead substrate in this type of lamp.
通常、発光ダイオードランプを構成するに当っては第１
図及び第２図に示すように、一対のリード基板１０．１
１の上端を折曲して基台１０ａ、 ｌｌａを形成し、片
方の基台１０ａの上面１０ｃに１乃至複数個の発光ダイ
オード素子１２．１２を固着し、他方の基台１１ａの上
面１１ｃとの間をリード線１３を介して接続して光源部
を構成し、この光源部をリード片１０ｂ、 ｌｌｂのみ
を外部に導出して透光性樹脂１４にて一体成形して発光
ダイオードランプを構成している。ところで、実際に上
述のような光源部を構成するに当っては、リード基板１
０．１１の厚さｔが非常に薄いため、基台１０ａの上面
１０ｃに固着できる素子１２の数が面積的に限定されて
しまうといった難点がある。このため第３図に示すよう
に基台１０ａの上面にポンチにより、皿状部１（Ｍを形
成するなどしてその対策としているが、このようなもの
では加工に手間がかかるほか、十分な取り付は面積が得
られない欠点があった。また、発光ダイオードランプに
おいては常にランプの配光特性を均一にする必要があり
、このためランプの略中央部に発光ダイオード素子Ｉ２
を配設するのが望ましく、このためリード基板上の基台
の配設位置をランプの略中央部に位置さゼる必要がある
。Usually, when configuring a light emitting diode lamp, the first
As shown in the figure and FIG. 2, a pair of lead substrates 10.1
The upper ends of 1 are bent to form bases 10a and 11a, one or more light emitting diode elements 12, 12 are fixed to the upper surface 10c of one base 10a, and the upper surface 11c of the other base 11a is fixed to the upper surface 11c of the other base 11a. The light source section is connected through a lead wire 13, and only the lead pieces 10b and llb are led out to the outside and integrally molded with a translucent resin 14 to form a light emitting diode lamp. are doing. By the way, when actually configuring the light source section as described above, the lead substrate 1
Since the thickness t of 0.11 is extremely thin, there is a problem that the number of elements 12 that can be fixed to the upper surface 10c of the base 10a is limited in terms of area. For this reason, countermeasures have been taken such as forming a dish-shaped portion 1 (M) on the top surface of the base 10a with a punch, as shown in FIG. The installation had the disadvantage that the area could not be obtained.Also, in a light emitting diode lamp, it is necessary to always make the light distribution characteristics of the lamp uniform, so the light emitting diode element I2 is installed approximately in the center of the lamp.
It is desirable to dispose the base on the lead board, and therefore it is necessary to locate the base on the lead board approximately at the center of the lamp.
この発明は上述の点に鑑み゛Ｃ発明されたもので、非常
に簡単な方法により、基台として十分な取り付は面積が
得られるようにし、且つランプの配光特性の良好な発光
ダイオードランプを得られるようにしたものである。This invention was invented in view of the above points, and it is possible to obtain a sufficient mounting area as a base using a very simple method, and to provide a light emitting diode lamp with good light distribution characteristics. It is designed so that you can obtain
以下、第４図乃至第１０図を参照してこの発明の詳細な
説明する。、第４図乃至第７図はこの発明の第１実施例
で、第４図はこの発明に係る発光ダイオードランプの製
作過程を示しており、第４図（Ａ）は正面図、第４図（
Ｂ）は同側面図を示す。The present invention will be described in detail below with reference to FIGS. 4 to 10. , Fig. 4 to Fig. 7 show a first embodiment of the present invention, Fig. 4 shows the manufacturing process of the light emitting diode lamp according to the invention, Fig. 4(A) is a front view, and Fig. 4(A) is a front view. (
B) shows the same side view.
また第５図はこの発明の第１実施例に係る発光ダイオー
ドランプの外観斜視図、第６図は同平面図、第７図は接
続回路図である。図において、 １．２．３はリード基
板で、その製作初期の段階におい゛Ｃ帯状部材を第４図
ａ１及びｂｌに示ずようプレスによりくし歯状に打ち抜
き且つ、隣接するり一ド基板の３冊を１組とし、各々リ
ード基板間は連結片４を介して連続的に形成される。ま
た、各々の基板１゜２．３の幅Ｔは基板の厚さ＋１）に
比較して幅広に形成される。このようにくし歯状に連続
形成された基板の上片を、第４図ａｌの点線１１．の部
分から片側方向へ略氷平位置にまで折曲し、更に、点線
１１２の部分から反対方向に折曲して」１片を第４図ｂ
２に示ずように略−状の折曲片とし、その上側水平片を
発光ダイオード素子５あるいはり一ド１１ｉ！６の接続
用の基台１ａ、 ２ａ、 ３ａとし”Ｃいる。なお、こ
の発明によれば上記基板の折曲部位１（１及び１１゜の
位置を所定の位置に設定することによって基台１ａ、
２ａ、 ３ａの略中間下側部位に基板］、２．３のリー
ド片１ｂ、 ２ｂ。Further, FIG. 5 is an external perspective view of a light emitting diode lamp according to the first embodiment of the present invention, FIG. 6 is a plan view thereof, and FIG. 7 is a connection circuit diagram. In the figure, reference numeral 1.2.3 is a lead board, and at the initial stage of its production, the C band-shaped member is punched out into a comb shape with a press as shown in Figure 4 a1 and bl, and the adjacent lead board is punched out. A set of three books is formed, and the lead boards are connected to each other with connection pieces 4 interposed therebetween. Further, the width T of each substrate 1°2.3 is formed wider than the thickness of the substrate +1). The upper piece of the substrate continuously formed in a comb-like shape as described above is connected to the dotted line 11 in FIG. 4 al. From the part indicated by the dotted line 112, bend it in one direction to a substantially flat position, and then bend it in the opposite direction from the part indicated by the dotted line 112.
As shown in FIG. 2, it is made into a substantially --shaped bent piece, and the upper horizontal piece is the light-emitting diode element 5 or the glue 11i! According to the present invention, by setting the bent portions 1 (1 and 11 degrees) of the board at predetermined positions, the bases 1a, 2a, and 3a are connected to ,
2a, 3a, and lead pieces 1b, 2b of 2.3.
３ｂが延出されるようにし”（いる。したがって、リー
ド片１ｂ、 ２ｂ、 ３ｂ側から見た場合、基台１ａ、
２ａ。Therefore, when viewed from the lead pieces 1b, 2b, and 3b, the bases 1a,
2a.
３ａは常にリード片によって中心部にバランスされて保
持された状態にある。このように加工した各基台１，２
．３において、その中央に位置する基板２の基台２ａ上
に第４図８３及びｂ３に示ずように３個の発光ダイオー
ド素子５．５．５を中心部に１個とその両横に２開環間
隔となるように固着したのち、リ−Ｆ線６を介して第７
図に示す所定の結線をする。3a is always balanced and held at the center by the reed piece. Each base 1, 2 processed in this way
．． 3, on the base 2a of the substrate 2 located at the center, there are three light emitting diode elements 5.5.5, one in the center and two on both sides, as shown in FIG. 4, 83 and b3. After the rings are fixed so that the spacing is open, the seventh
Connect the wires as shown in the figure.
このようにして光源部を形成したのち、第４図ａ４及び
す、に示ずようにリード片１ｂ、 ２ｂ、 ３ｂの下端
を外部に露呈した状態で、透光性樹脂７にて光源部のみ
を成形する。そして最終的に両端のリード片１ｂと３ｂ
をそのままにして中央のリード片２ｂの透光性樹脂７か
ら露呈した部分を切断除去することにより発光タイオー
ドランプが完成される。この発光ダイオードランプは、
第６図の平面図からも明らかなとおり、ランプの略中央
部に発光ダイオード素子５．５．５が等間隔にバランス
されて取り付けられており、良好なランプの配光特性が
得られるものである。またこの発明によると、リード基
板１．２．３の幅Ｔが基台１ａ、 ２ａ、 ３ａの取り
付は部分の幅になるので、十分な取り付は面積が得られ
るものである。第８図乃至第１０図はこの発明の第２実
施例を示すもので、第１実施例が３個のリード基板１，
２．３からなるのに対して、第２実施例では４個のリー
ド基板１．２．２’、３からなるものである。すなわち
第１実施例のものにリード基板２′を中央部に加えた構
成からなるもので、基板２′は前述の基５−
板２と実質的に同一のものである。これによると基台２
＋ｉ及び２８′上に３個ずつ計６個の発光ダイオード素
子５を第１０図に示す所定の結線で固着してなるもので
ある。この場合においても第９図に示すよ・５発光ダイ
オーＩ゛素子５はランプの略中央部に等間隔にバランス
されて取り付けられるので良好な配光特性が得られるも
のである。After forming the light source part in this way, as shown in FIG. to form. Finally, the lead pieces 1b and 3b at both ends
The light emitting diode lamp is completed by cutting and removing the portion of the central lead piece 2b exposed from the translucent resin 7 while leaving it as is. This light emitting diode lamp is
As is clear from the plan view in Fig. 6, the light emitting diode elements 5, 5, 5 are mounted approximately at the center of the lamp in a balanced manner at equal intervals, and good light distribution characteristics of the lamp can be obtained. be. Further, according to the present invention, since the width T of the lead substrate 1.2.3 is the width of the mounting portion of the bases 1a, 2a, 3a, a sufficient mounting area can be obtained. 8 to 10 show a second embodiment of the present invention, in which the first embodiment has three lead substrates 1,
2.3, whereas the second embodiment consists of four lead substrates 1, 2, 2', and 3. That is, it has a structure in which a lead board 2' is added to the center part of the first embodiment, and the board 2' is substantially the same as the base plate 2 described above. According to this, base 2
A total of six light emitting diode elements 5, three each on +i and 28', are fixed with predetermined connections shown in FIG. In this case as well, as shown in FIG. 9, the five light-emitting diode I elements 5 are mounted substantially at the center of the lamp in a balanced manner at equal intervals, so that good light distribution characteristics can be obtained.
この発明によると、リード基板の幅Ｔを厚みｔに比べて
十分に大きな幅にして帯状部材からリード基板をプレス
によりくし歯状に連続的に打ち抜いて形成し、前記リー
ド基板の上片を略−状に折曲しその上側水平片を基台と
して利用したので、従来に比べて基台面積を大きく取れ
ることはもちろん、特に各実施例に開示したように基台
を２個以上並設（第１実施例の場合３個、第２実施列の
場合４個）した場合においても各基台は常にランプの略
中央部に等間隔に位置させることができ、且つ各基台の
中央下部に必ずリード片が導出されるようになるので、
基台上に発光ダイオード素子５を配設する場合、ランプ
の配光特性を向上させ６−
る上において略理想的な素子５の配設構成を採用できる
ものである。なお、各実施例において、１個の基台上に
３ ｉｌｌの発光ダイオード素子５を配設した例につい
てのみ説明したが、基台の長手方向の長さを選択するこ
とにより、基台に配設される発光ダイオードの数の増減
を図るのはきわめて容易である。またリード基板の数も
少なくとも２個以上を１組とするものであれば、基板の
個数はなんら限定されるものでないことは勿論である。According to this invention, the width T of the lead substrate is made sufficiently larger than the thickness t, and the lead substrate is formed by continuously punching out a comb-like shape from a band-shaped member using a press, and the upper piece of the lead substrate is approximately Since it is bent into a - shape and the upper horizontal piece is used as a base, it is possible to have a larger base area than before, and in particular, as disclosed in each embodiment, two or more bases can be installed in parallel 3 in the case of the first embodiment and 4 in the case of the second implementation row), each base can always be positioned approximately at the center of the lamp at equal intervals, and at the bottom of the center of each base. The lead piece will always come out, so
When the light emitting diode elements 5 are arranged on the base, a substantially ideal arrangement of the elements 5 can be adopted in order to improve the light distribution characteristics of the lamp. In each embodiment, only an example in which 3 ill of light emitting diode elements 5 are arranged on one base has been described, but by selecting the length in the longitudinal direction of the base, it is possible to arrange the light emitting diode elements 5 on the base. It is very easy to increase or decrease the number of light emitting diodes installed. Further, it goes without saying that the number of lead boards is not limited in any way as long as at least two lead boards form one set.
この発明は、特に多数の発光ダイオード素子を基台に集
設して、照度の高い発光ダイオ−１゛ランプを実現する
上において効果がある。This invention is particularly effective in realizing a light emitting diode lamp with high illuminance by mounting a large number of light emitting diode elements on a base.
ｍ１図は従来における発光ダイオードランプの外観斜視
図、第２図は第１図の平面図、第３図は従来における異
なる発光ダイオードランプの外観斜視図、第４図乃至第
７図はこの発明の第１実施例を示すもので、第４図はこ
の発明に係る発光ダイオードランプの製作過程を示して
おり、第４図（Ａ）は正面図、第４図（Ｂ）は同側面図
を示す。
また第５図はこの発明の第１実施例に係る発光ダイオー
ドランプの外観斜視図、第６図は同平面図、第７図は接
続回路図である。第８図乃至第１０図はこの発明の第２
実施例を示すもので、第８図はこの発明の第２実施例に
係る発光ダイオードランプの外観斜視図、第９図は同平
面図、第１０図は接続回路図である。
１．２．２’、３・・・・・・リード基板、１ａ、２ａ
、２ａ’、３ａ・・・・・・基台、Ｉｂ、２ｂ、２ｂ’
、３ｂ・・・・・・リード片、５・・・・・・発光ダイ
オ−１゛素子、６・・・・・・リード線、Ｔ・・・・・
・リード基板の幅、Ｌ・・・・・・リード基板の厚さ。
区
＼
区Figure m1 is an external perspective view of a conventional light emitting diode lamp, Figure 2 is a plan view of Figure 1, Figure 3 is an external perspective view of a different conventional light emitting diode lamp, and Figures 4 to 7 are views of the present invention. This shows the first embodiment, and FIG. 4 shows the manufacturing process of a light emitting diode lamp according to the present invention, with FIG. 4(A) showing a front view and FIG. 4(B) showing a side view of the same. . Further, FIG. 5 is an external perspective view of a light emitting diode lamp according to the first embodiment of the present invention, FIG. 6 is a plan view thereof, and FIG. 7 is a connection circuit diagram. Figures 8 to 10 are the second diagrams of this invention.
Embodiment FIG. 8 is an external perspective view of a light emitting diode lamp according to a second embodiment of the present invention, FIG. 9 is a plan view thereof, and FIG. 10 is a connection circuit diagram. 1.2.2', 3...Lead board, 1a, 2a
, 2a', 3a...base, Ib, 2b, 2b'
, 3b... Lead piece, 5... Light emitting diode-1 element, 6... Lead wire, T...
・Width of lead board, L...Thickness of lead board. Ward\ Ward
Claims (1)
きにより形成するとともに、前記各リード基板の上片を
略−状に折曲して上側水平片を基台とし、少なくとも１
個の基台上面に発行ダイオード素子を固着するとともに
、各基台の略中間下側部位に前記リード基板のリード片
を延出させ、その一対を電源接続用リード片として利用
するようにしたことを特徴とする発光ダイオードランプ
。 ■基台上に等間隔に発行ダイオード素子を固着してなる
特許請求の範囲第１項記載の発光ダイオードランプ。[Claims] ■ A set of at least two lead boards is formed by punching, and the upper piece of each lead board is bent into a substantially - shape, and the upper horizontal piece is used as a base. , at least 1
A light emitting diode element is fixed to the upper surface of each base, and lead pieces of the lead board are extended to a lower part approximately in the middle of each base, and a pair of the lead pieces are used as lead pieces for connecting a power source. A light emitting diode lamp featuring (2) A light emitting diode lamp according to claim 1, comprising light emitting diode elements fixedly spaced on a base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57112367A JPS592384A (en) | 1982-06-28 | 1982-06-28 | Light-emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57112367A JPS592384A (en) | 1982-06-28 | 1982-06-28 | Light-emitting diode lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS592384A true JPS592384A (en) | 1984-01-07 |
Family
ID=14584910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57112367A Pending JPS592384A (en) | 1982-06-28 | 1982-06-28 | Light-emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS592384A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002177302A (en) * | 2000-12-15 | 2002-06-25 | Yoshida Dental Mfg Co Ltd | Dental irradiator for photopolymerization |
| JP2002177303A (en) * | 2001-04-10 | 2002-06-25 | Yoshida Dental Mfg Co Ltd | Dental irradiator for photopolymerization |
| JP2004503120A (en) * | 2000-06-15 | 2004-01-29 | システマックス プロプライアタリー リミティド | LED lamp |
-
1982
- 1982-06-28 JP JP57112367A patent/JPS592384A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004503120A (en) * | 2000-06-15 | 2004-01-29 | システマックス プロプライアタリー リミティド | LED lamp |
| JP2002177302A (en) * | 2000-12-15 | 2002-06-25 | Yoshida Dental Mfg Co Ltd | Dental irradiator for photopolymerization |
| JP2002177303A (en) * | 2001-04-10 | 2002-06-25 | Yoshida Dental Mfg Co Ltd | Dental irradiator for photopolymerization |
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