JPS5923734U - 加熱装置 - Google Patents

加熱装置

Info

Publication number
JPS5923734U
JPS5923734U JP1982115595U JP11559582U JPS5923734U JP S5923734 U JPS5923734 U JP S5923734U JP 1982115595 U JP1982115595 U JP 1982115595U JP 11559582 U JP11559582 U JP 11559582U JP S5923734 U JPS5923734 U JP S5923734U
Authority
JP
Japan
Prior art keywords
cover
guide groove
heating body
lead frame
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982115595U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0319223Y2 (enExample
Inventor
博 丑木
折田 浩一
門沢 元昭
十三男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP1982115595U priority Critical patent/JPS5923734U/ja
Publication of JPS5923734U publication Critical patent/JPS5923734U/ja
Application granted granted Critical
Publication of JPH0319223Y2 publication Critical patent/JPH0319223Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/075
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1982115595U 1982-07-31 1982-07-31 加熱装置 Granted JPS5923734U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982115595U JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982115595U JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Publications (2)

Publication Number Publication Date
JPS5923734U true JPS5923734U (ja) 1984-02-14
JPH0319223Y2 JPH0319223Y2 (enExample) 1991-04-23

Family

ID=30266783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982115595U Granted JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Country Status (1)

Country Link
JP (1) JPS5923734U (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (enExample) * 1973-04-04 1974-12-03
JPS53162659U (enExample) * 1977-05-25 1978-12-20
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (enExample) * 1973-04-04 1974-12-03
JPS53162659U (enExample) * 1977-05-25 1978-12-20
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor

Also Published As

Publication number Publication date
JPH0319223Y2 (enExample) 1991-04-23

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