JPS5923734U - 加熱装置 - Google Patents
加熱装置Info
- Publication number
- JPS5923734U JPS5923734U JP1982115595U JP11559582U JPS5923734U JP S5923734 U JPS5923734 U JP S5923734U JP 1982115595 U JP1982115595 U JP 1982115595U JP 11559582 U JP11559582 U JP 11559582U JP S5923734 U JPS5923734 U JP S5923734U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- guide groove
- heating body
- lead frame
- heating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/075—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982115595U JPS5923734U (ja) | 1982-07-31 | 1982-07-31 | 加熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982115595U JPS5923734U (ja) | 1982-07-31 | 1982-07-31 | 加熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5923734U true JPS5923734U (ja) | 1984-02-14 |
| JPH0319223Y2 JPH0319223Y2 (enExample) | 1991-04-23 |
Family
ID=30266783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982115595U Granted JPS5923734U (ja) | 1982-07-31 | 1982-07-31 | 加熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5923734U (enExample) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49126265A (enExample) * | 1973-04-04 | 1974-12-03 | ||
| JPS53162659U (enExample) * | 1977-05-25 | 1978-12-20 | ||
| JPS54113252A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Pellet bonding unit |
| JPS55127030A (en) * | 1979-03-26 | 1980-10-01 | Toshiba Corp | Assembling apparatus for semiconductor |
-
1982
- 1982-07-31 JP JP1982115595U patent/JPS5923734U/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49126265A (enExample) * | 1973-04-04 | 1974-12-03 | ||
| JPS53162659U (enExample) * | 1977-05-25 | 1978-12-20 | ||
| JPS54113252A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Pellet bonding unit |
| JPS55127030A (en) * | 1979-03-26 | 1980-10-01 | Toshiba Corp | Assembling apparatus for semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0319223Y2 (enExample) | 1991-04-23 |
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