JPS59229279A - 積層板のはんだ付け方法 - Google Patents

積層板のはんだ付け方法

Info

Publication number
JPS59229279A
JPS59229279A JP10162683A JP10162683A JPS59229279A JP S59229279 A JPS59229279 A JP S59229279A JP 10162683 A JP10162683 A JP 10162683A JP 10162683 A JP10162683 A JP 10162683A JP S59229279 A JPS59229279 A JP S59229279A
Authority
JP
Japan
Prior art keywords
solder
molten solder
laminate
laminated plate
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10162683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH031105B2 (enExample
Inventor
Ryoichi Suzuki
良一 鈴木
Rikiya Kato
力弥 加藤
Toshihisa Sudo
須藤　俊久
Nagayoshi Hasegawa
長谷川　永悦
Isamu Sato
勇 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP10162683A priority Critical patent/JPS59229279A/ja
Publication of JPS59229279A publication Critical patent/JPS59229279A/ja
Publication of JPH031105B2 publication Critical patent/JPH031105B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP10162683A 1983-06-09 1983-06-09 積層板のはんだ付け方法 Granted JPS59229279A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10162683A JPS59229279A (ja) 1983-06-09 1983-06-09 積層板のはんだ付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10162683A JPS59229279A (ja) 1983-06-09 1983-06-09 積層板のはんだ付け方法

Publications (2)

Publication Number Publication Date
JPS59229279A true JPS59229279A (ja) 1984-12-22
JPH031105B2 JPH031105B2 (enExample) 1991-01-09

Family

ID=14305610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10162683A Granted JPS59229279A (ja) 1983-06-09 1983-06-09 積層板のはんだ付け方法

Country Status (1)

Country Link
JP (1) JPS59229279A (enExample)

Also Published As

Publication number Publication date
JPH031105B2 (enExample) 1991-01-09

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