JPS59229279A - 積層板のはんだ付け方法 - Google Patents
積層板のはんだ付け方法Info
- Publication number
- JPS59229279A JPS59229279A JP10162683A JP10162683A JPS59229279A JP S59229279 A JPS59229279 A JP S59229279A JP 10162683 A JP10162683 A JP 10162683A JP 10162683 A JP10162683 A JP 10162683A JP S59229279 A JPS59229279 A JP S59229279A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- molten solder
- laminate
- laminated plate
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 74
- 230000003068 static effect Effects 0.000 claims abstract description 7
- 238000007654 immersion Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 3
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000007598 dipping method Methods 0.000 abstract description 2
- 230000000630 rising effect Effects 0.000 abstract description 2
- 238000012790 confirmation Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162683A JPS59229279A (ja) | 1983-06-09 | 1983-06-09 | 積層板のはんだ付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162683A JPS59229279A (ja) | 1983-06-09 | 1983-06-09 | 積層板のはんだ付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59229279A true JPS59229279A (ja) | 1984-12-22 |
| JPH031105B2 JPH031105B2 (enrdf_load_stackoverflow) | 1991-01-09 |
Family
ID=14305610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10162683A Granted JPS59229279A (ja) | 1983-06-09 | 1983-06-09 | 積層板のはんだ付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59229279A (enrdf_load_stackoverflow) |
-
1983
- 1983-06-09 JP JP10162683A patent/JPS59229279A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031105B2 (enrdf_load_stackoverflow) | 1991-01-09 |
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