JPS5922648A - 凝縮系物質の衝撃圧縮方法及び装置 - Google Patents
凝縮系物質の衝撃圧縮方法及び装置Info
- Publication number
- JPS5922648A JPS5922648A JP57109186A JP10918682A JPS5922648A JP S5922648 A JPS5922648 A JP S5922648A JP 57109186 A JP57109186 A JP 57109186A JP 10918682 A JP10918682 A JP 10918682A JP S5922648 A JPS5922648 A JP S5922648A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- condensed
- explosive layer
- explosives
- explosive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007906 compression Methods 0.000 title claims abstract description 15
- 230000006835 compression Effects 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 38
- 239000002360 explosive Substances 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 17
- 238000004880 explosion Methods 0.000 claims description 14
- 230000035939 shock Effects 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 4
- 230000005493 condensed matter Effects 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 10
- 239000010935 stainless steel Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 5
- XTFIVUDBNACUBN-UHFFFAOYSA-N 1,3,5-trinitro-1,3,5-triazinane Chemical compound [O-][N+](=O)N1CN([N+]([O-])=O)CN([N+]([O-])=O)C1 XTFIVUDBNACUBN-UHFFFAOYSA-N 0.000 abstract description 2
- TZRXHJWUDPFEEY-UHFFFAOYSA-N Pentaerythritol Tetranitrate Chemical compound [O-][N+](=O)OCC(CO[N+]([O-])=O)(CO[N+]([O-])=O)CO[N+]([O-])=O TZRXHJWUDPFEEY-UHFFFAOYSA-N 0.000 abstract 1
- 230000000977 initiatory effect Effects 0.000 abstract 1
- 238000005474 detonation Methods 0.000 description 13
- 230000005484 gravity Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 8
- 229910010271 silicon carbide Inorganic materials 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000713935 Mus musculus Tudor domain-containing protein 7 Proteins 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 101150084411 crn1 gene Proteins 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002635 electroconvulsive therapy Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000004449 solid propellant Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/06—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
- B01J3/08—Application of shock waves for chemical reactions or for modifying the crystal structure of substances
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57109186A JPS5922648A (ja) | 1982-06-25 | 1982-06-25 | 凝縮系物質の衝撃圧縮方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57109186A JPS5922648A (ja) | 1982-06-25 | 1982-06-25 | 凝縮系物質の衝撃圧縮方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5922648A true JPS5922648A (ja) | 1984-02-04 |
| JPH0322209B2 JPH0322209B2 (enExample) | 1991-03-26 |
Family
ID=14503814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57109186A Granted JPS5922648A (ja) | 1982-06-25 | 1982-06-25 | 凝縮系物質の衝撃圧縮方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5922648A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61146882A (ja) * | 1984-12-17 | 1986-07-04 | Dynic Corp | 装飾用シ−ト |
| JP2002306949A (ja) * | 2001-04-13 | 2002-10-22 | Asahi Kasei Corp | 超高圧の発生方法並びに物質の合成方法 |
| WO2009028642A1 (ja) * | 2007-08-31 | 2009-03-05 | Kuraray Luminas Co., Ltd. | 高密度ｉｉ－ｖｉ族化合物半導体成型体及びその製造方法 |
| JP2014000816A (ja) * | 2007-08-31 | 2014-01-09 | Kuraray Co Ltd | Ｉｉ−ｖｉ族化合物半導体成型体の製造方法 |
-
1982
- 1982-06-25 JP JP57109186A patent/JPS5922648A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61146882A (ja) * | 1984-12-17 | 1986-07-04 | Dynic Corp | 装飾用シ−ト |
| JP2002306949A (ja) * | 2001-04-13 | 2002-10-22 | Asahi Kasei Corp | 超高圧の発生方法並びに物質の合成方法 |
| WO2009028642A1 (ja) * | 2007-08-31 | 2009-03-05 | Kuraray Luminas Co., Ltd. | 高密度ｉｉ－ｖｉ族化合物半導体成型体及びその製造方法 |
| JP2014000816A (ja) * | 2007-08-31 | 2014-01-09 | Kuraray Co Ltd | Ｉｉ−ｖｉ族化合物半導体成型体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322209B2 (enExample) | 1991-03-26 |
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