JPS59222256A - Coater - Google Patents

Coater

Info

Publication number
JPS59222256A
JPS59222256A JP9535683A JP9535683A JPS59222256A JP S59222256 A JPS59222256 A JP S59222256A JP 9535683 A JP9535683 A JP 9535683A JP 9535683 A JP9535683 A JP 9535683A JP S59222256 A JPS59222256 A JP S59222256A
Authority
JP
Japan
Prior art keywords
paste
coated
squeegee
screen plate
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9535683A
Other languages
Japanese (ja)
Inventor
Masae Abe
阿部 政衛
Shigeo Ikeda
池田 重男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP9535683A priority Critical patent/JPS59222256A/en
Publication of JPS59222256A publication Critical patent/JPS59222256A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To coat uniformly paste on the surface to be coated in a recess in accordance with a screen printing method and to rationalize operation by providing a scraper and a squeegee which move cooperatively in the same direction and either of which assumes an operating position. CONSTITUTION:A screen frame 4 on which a screen plate 5 is extended and a material 1 to be coated are disposed to face each other in a desired position. A scraper 6 is positioned on the left end of the plate 5 and a squeegee 7 is inclined and is positioned on the outside of the frame 4. While the paste 21 in the scraper 6 is discharged by a prescribed amt. from a nozzle by an air pressure onto the plate 5, the scraper is moved toward the right to spread the paste 21 over the entire surface of the plate 21. The material 1 is then moved upward to fit the plate 5 into the recess 2 thereof and at the same time the squeegee 7 and the scraper 6 are moved by a prescribed distance toward the right. The paste is coated this time on the surface 3 to be coated by the movement of the squeegee 7.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は例えば半導体チップのパッケージ内への取付け
の際などに用いられる接着剤などの塗布装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an adhesive coating device used, for example, in mounting a semiconductor chip into a package.

背景技術とその問題点 従来、半導体チップ例えばCCD撮像チップのパッケー
ジ内への取付けは、ベース1〜状の電子部品用接着剤例
えば導電接着剤、銀ペースト等を使用しているが、この
ペーストのパッケージ内の底面−1の塗布は顕微鏡の下
で手塗り作業で行っている。一般にペースト状のものを
塗布する被塗布面が所謂凹部の底面にあり、且つ狭い面
積の場合、ディスペンサ法、スタンプ法9手塗り法など
が用いられている。しかし、これらの方法は、上記の半
導体チップ用のパッケージに適用した場合、いずれもペ
ーストの塗布量(膜厚、塗布面積)を調整すること、平
坦な塗布111を得ることなどが困難である。また、塗
布量を一定にするために作業条件を細かく管理制限しな
ければならないこと、熟練を必要とすること、作業能率
が想いこと、安定した品質を得るのが困難である等の問
題があった。
BACKGROUND TECHNOLOGY AND PROBLEMS Conventionally, semiconductor chips such as CCD imaging chips have been mounted in packages using base 1 adhesives for electronic components such as conductive adhesives, silver paste, etc. The coating on the bottom surface 1 of the package was done by hand under a microscope. In general, when the surface to be coated with a paste is located at the bottom of a so-called recess and is a narrow area, a dispenser method, a stamp method, 9 manual coating methods, etc. are used. However, when these methods are applied to the above semiconductor chip package, it is difficult to adjust the amount of paste applied (film thickness, application area), and to obtain a flat application 111. In addition, there are other problems such as the need to closely manage and limit the working conditions in order to maintain a constant coating amount, the need for skill, poor work efficiency, and the difficulty of achieving stable quality. Ta.

発明の目的 本発明は、上述の点に鑑のスクリーン印刷法に基づいて
パッケージ等の四部の内底面へのペーストの均一な塗布
を可能にし、且つ作業の合理化を図った塗布装置を提供
するものである。
Purpose of the Invention The present invention provides a coating device based on a screen printing method based on the above-mentioned points, which makes it possible to uniformly apply paste to the inner bottom surface of the four parts of a package, etc., and which streamlines the work. It is.

発明の8Ili要 本発明は、内底面を被塗布面とした凹部内に入り得るス
クリーン版と、互に同方向に連動しいずれか一方が上記
スクリーン版に位置するときは他方がスクリーン版の外
に位置するスフレイパー及びスキージを備え、スフレイ
パーから吐出したペーストをスフレイパーにてスクリー
ン版の全面に供給し、その後スキージをスクリーン版に
位1gさせスキージにてスクリーン版上を掃引してペー
ストを被塗布面上に均一に塗布するようにした塗布装置
である。
8Ili Summary of the Invention The present invention has a screen plate that can enter a recess with an inner bottom surface as the surface to be coated, and a screen plate that moves in the same direction, and when one of them is located on the screen plate, the other one moves outside the screen plate. The paste dispensed from the spray scraper is supplied to the entire surface of the screen plate by the spray scraper, and then the squeegee is placed on the screen plate at 1 g, and the squeegee is swept over the screen plate to apply the paste to the surface to be coated. This coating device is designed to uniformly coat the surface.

この発明の塗布装置では凹部内の被塗布面にペーストを
均一に、平坦に塗布することができ、トつ自動化による
作業の合理化が図れる。
The coating device of the present invention can uniformly and evenly coat the paste on the surface to be coated inside the recess, and the work can be streamlined through automation.

実施例 以ト、図面を参照しながら本発明の詳細な説明する。Example Hereinafter, the present invention will be described in detail with reference to the drawings.

第1図は本発明による塗布装置の主要部をボず斜視図で
ある。同図中、fl)は所要のペースト例えば銀ペース
トを塗布すべき被塗布体、即ち例えばCCD撮像チ・ノ
ブ用のパッケージ等の如き凹tIll I2)の内底面
を被塗布面(3)とした被塗布体を示す。また、(4)
はスクリーン版(5)が張られたスクリーン枠、(6)
はスフレイパー、(7)はスキージを示す。本例では基
台Gel上に植立した支持部(11)の−・側に固定台
(12)を突設してここにスクリーン枠(4)を載置固
定する。また支持部(11)の−に記−側には、垂直方
向に延びる一対のガイド軸(13)を設け、このガイド
軸(13)に沿っ”ζ−IT、 ト動司能な土部可動体
(]4)及び下部可動体(15)を配置する。この場合
上部iiJ動体(14)及び土部用動体(15)は夫々
固定台(I2)を挾んで上Fの位置に配置する。
FIG. 1 is an exploded perspective view of the main parts of a coating device according to the present invention. In the same figure, fl) is an object to be coated with the required paste, for example, silver paste, i.e., a package for a CCD imaging tip/knob, etc. The inner bottom surface of the recess I2) is the surface to be coated (3). The object to be coated is shown. Also, (4)
is a screen frame with screen version (5) attached, (6)
(7) shows a squeegee. In this example, a fixing stand (12) is provided protruding from the - side of the support part (11) set up on the base Gel, and the screen frame (4) is placed and fixed thereon. In addition, a pair of guide shafts (13) extending in the vertical direction are provided on the − side of the support portion (11), and along these guide shafts (13), the soil portion that can be moved is movable. The body (]4) and the lower movable body (15) are arranged.In this case, the upper iiJ moving body (14) and the soil movable body (15) are respectively arranged at the upper F position with the fixed base (I2) in between.

そし′C1このF部+14動体(15)のスクリーン版
(5)と対向する取イ]部(17) J−に被塗布体(
1)を取付けるようになし、被塗布体(1)が1・部用
動体(15)によって−ヒ昇したとき被塗布体(1)の
四部(2)内にスクリーン版(5)が入り込むようにな
す。一方、上部可動体(14)には水平方向に延びる一
対のガイド軸(18)を設け、このガイド軸に沿って水
平(即ら左右)方向に移動可能なスフレイバー(6)及
びスキージ(7)を配置する。スフレイバ−(6)とス
キージ(7)ば斤に水平方向に関して所定間隔を保って
機械的に連結せしめ、上下方向及び左右方向の移動に際
し共に同一方向に移動できるように構成する。ここで、
スフレイバー(6)とスキージ(7)の間隔は一方がス
クリーン版(5)に位置しているときは他方がスクリー
ン版(5)従ってスクリーン枠(4)の外に位置する関
係に選ぶ。また図示せざるも、」二部可動体(14)と
下部可動体(I5)の」−F方向の駆動は夫々の七−夕
によってなされ、同様にスフレイバー(6)及びスキー
ジ(7)の左右方向の駆動もモータによってなされる。
Then, 'C1 This F section + 14 A section (17) facing the screen plate (5) of the moving object (15) J- is the object to be coated (
1) so that when the object to be coated (1) is raised by the moving body (15) for the first part, the screen plate (5) enters into the fourth part (2) of the object to be coated (1). Eggplant. On the other hand, the upper movable body (14) is provided with a pair of guide shafts (18) extending in the horizontal direction, and a souffle flavor (6) and a squeegee (7) movable in the horizontal (i.e. left and right) direction are provided along the guide shafts. ). The souffle bar (6) and the squeegee (7) are mechanically connected to each other at a predetermined distance in the horizontal direction, so that they can both move in the same direction when moving in the vertical and horizontal directions. here,
The spacing between the souffle flavor (6) and the squeegee (7) is selected such that when one is located on the screen plate (5), the other is located on the screen plate (5) and therefore outside the screen frame (4). Also, although not shown, the two-part movable body (14) and the lower movable body (I5) are driven in the -F direction by their respective Tanabata, and similarly, the souffle flavor (6) and squeegee (7) are driven. Drive in the left and right directions is also performed by a motor.

スフレイパー(6)は所要のペースタを充填したカート
リッジを内蔵し、空気圧によっ′ζ所要量づつのペース
トがその先端のノズルより吐出されるように構成する。
The sour wrapper (6) has a built-in cartridge filled with the required paste, and is configured so that the required amount of paste is ejected from a nozzle at its tip by air pressure.

また、スクリーン枠(4)は第2図及び第3図に示すよ
うにスクリーン版(5)が張られた部分(4a)を被塗
布体(11の凹部(2)内に入り得るように垂直に形成
すると共に、これより上方に向って開口が漸次大きくな
るように傾斜した形状に形成する。スクリーン版(5)
が張られたスクリーン枠(4)の部分(4a)の下部に
は第4図にボずようにスクリーン版(5)より所定の)
ツさだけ突出する突部(20)を形成する。この突部(
20)はスクリーン版(5)が被塗布体(1)の四部(
2)内に入り込んだときにそのスクリーン版(5)と被
塗布向(3)との間隔dを規定するものである。
In addition, the screen frame (4) is arranged vertically so that the part (4a) on which the screen plate (5) is stretched can enter the recess (2) of the object to be coated (11) as shown in Figures 2 and 3. The screen plate (5) is formed in a slanted shape so that the opening gradually becomes larger upwards.
At the bottom of the part (4a) of the screen frame (4) covered with
A protrusion (20) that protrudes by the length is formed. This protrusion (
20), the screen plate (5) covers the four parts (1) of the object to be coated (1).
2) It defines the distance d between the screen plate (5) and the coating direction (3) when the screen plate (5) enters the inside.

次に、かかる構成の塗布装置の動作を説明する。Next, the operation of the coating apparatus having such a configuration will be explained.

先づ、第1図の状態で固定台(12)上に所要のスクリ
ーン版(5)が張られたスクリーン枠(4)を固定し、
また下部可動体(15)のスクリーン枠(4)と対向す
る取付部(17) J−に被塗布体(1)を固定する。
First, in the state shown in Figure 1, fix the screen frame (4) on which the required screen plate (5) is stretched on the fixing base (12),
Further, the object to be coated (1) is fixed to the mounting portion (17) J- of the lower movable body (15) facing the screen frame (4).

スフレイパー(6)はスクリーン版(5)の図面に向っ
て左端に近接して位置し、スキージ(7)は傾斜した状
態でスクリーン枠(4)の外に位置している。この状態
から第5図Aに示すようにスフレイパー(6)内のベー
ス) (21)を所定量だけ空気圧によって先端のノズ
ルよりスクリーンI坂(51上にuL出させながら、第
5図Bにボずようにスフレイバ−(6)を右方向に移動
してペースト(21)を押しつける如くしてスクリーン
版(5)の全面に均らず。次に、下部可動体(15)に
よっ′C被塗布体(1)が」二昇し、その四部(2)内
に固定のスクリーン版(5)が入り込む。このとき第4
図で説明したよ・うにスクリーン枠(4)側の突部(2
0)によってスクリーン版(5)と被塗布面に3)との
間隔dが正確に規定される。従って被塗布体(])にバ
ラツキがあっても間隔dは常に正確に保たれる。
The sprayer (6) is located close to the left end of the screen plate (5) when facing the drawing, and the squeegee (7) is located in an inclined state outside the screen frame (4). From this state, as shown in Fig. 5A, the base (21) inside the spray flapper (6) is moved by a predetermined amount of air pressure from the nozzle at the tip onto the screen I slope (51), and as shown in Fig. 5B. Move the paste flavor (6) to the right and press the paste (21) so that it is not spread evenly over the entire surface of the screen plate (5). The coating body (1) rises twice, and the fixed screen plate (5) enters into its fourth part (2).
As explained in the figure, the protrusion (2) on the screen frame (4) side
0) accurately defines the distance d between the screen plate (5) and the surface to be coated 3). Therefore, even if there are variations in the object to be coated ( ), the distance d is always maintained accurately.

同時にスキージ(7)及びスフレイバー(6)が共に土
部FiJ動体(14)に、Lっで1−昇し、続いて右方
向に所定距離移動し、さらに下部可動体(I4)によっ
て降下し第5図Cの状態即ちスフレイパー(6)がスク
リーン枠(4)の外に移り、スキージ(7)がスクリー
ン版f51−1−の右端に位置する状態に持来される。
At the same time, the squeegee (7) and the flavor bar (6) are both raised to the Dobe FiJ moving body (14) by L, then moved a predetermined distance to the right, and then lowered by the lower movable body (I4). The state shown in FIG. 5C is brought to a state where the spray scraper (6) is moved outside the screen frame (4) and the squeegee (7) is positioned at the right end of the screen plate f51-1-.

次に、スキージ(力が左方向にスクリーン版(5)十を
移動されるごとにより被塗布面(3)上にペースl−(
21)が塗布される(第513’21D参jj〈()。
Next, the squeegee (force is applied to the surface to be coated (3) each time the screen plate (5) is moved to the left)
21) is applied (see No. 513'21D jj〈().

この塗布に際し゛(は被塗布面(3)より間隔dだけ離
れて配したスクリーン版(5)をスキージ(7)によっ
てペース1−1−の厚Zノまで撓むようにしながらスキ
ージ(7)を掃引させてペースト(2I)を均一に塗4
jする。ペースト(21)の塗布が紡rした後は、下部
可動体(15)が降−トし、被塗布体+11を原位置に
復帰させる。またスキージ(7)及びスフレイパー(6
)が−1一部可動体(14)によって」−昇し、続いて
左方向に移動しく第5図E参照)、さらに上Fift可
動体(]4)によって降下し原位置に復帰し、次の塗布
の待期状態となる(第5図F参照)。第6図はこのよう
にして四部の内底面の所定領域にペースト例えば銀ベー
ス1〜(21)が塗布されたCOD撮像チップ用のパッ
ケージである。
During this application, the screen plate (5) placed at a distance d from the surface to be coated (3) is bent by the squeegee (7) to a thickness Z of the paste 1-1-. Sweep to apply paste (2I) evenly 4
j. After the paste (21) has been applied, the lower movable body (15) is lowered and the object to be coated +11 is returned to its original position. Also, squeegee (7) and souffler (6)
) is raised by the -1 partial movable body (14), then moved to the left (see Figure 5E), and then lowered by the upper Fift movable body (]4) to return to its original position, and then It is now in a waiting state for coating (see FIG. 5F). FIG. 6 shows a package for a COD imaging chip in which pastes such as silver bases 1 to (21) are applied to predetermined areas of the inner bottom surfaces of the four parts in this manner.

かかる構成の塗布装置によれば、パッケージ内の底面へ
のペーストの均一な塗布を容易且つ正確に行うことがで
きる。特にスクリーン印刷法を利用すると共にスフレイ
パーを併用し“(いるので凹部内の狭い領域においζも
塗布厚、塗布面積が正確に得られ、且つ手用な塗布面が
得られる。しかもこの場合、スフレイバ−(6)とスキ
ージ(7)とが機械的に一体化して同一方向に連動し、
またそのいずれか一方がスクリーン版」二に位置してい
るときには他方がスクリーン枠外に位置するように構成
されているので、スフレイバー(6)及びスキージ(7
)の夫々の操作が確実に行なわれ、目的の塗布面がより
lF確にi#られる。またスフレイバ=(6)から直接
ペースl−(2])がイj(給されるので、ペーストの
供給機構が単純化され、そのペーストも塗布毎に所定量
づつ(Jli給されるのでペース1−の/l!i%&I
量も少なくて済む。またスクリーン枠(4)が1一方に
向ってその開口が大きくなるように傾斜した形状である
ために、傾斜したスキージ(7)の操作が円滑である。
According to the coating device having such a configuration, it is possible to uniformly coat the paste onto the bottom surface of the package easily and accurately. In particular, by using the screen printing method in combination with a sprayer, it is possible to accurately obtain the coating thickness and coating area in a narrow area within the recess, and to obtain a coating surface that can be applied by hand. - (6) and squeegee (7) are mechanically integrated and interlock in the same direction;
In addition, when one of them is located on the screen plate 2, the other is located outside the screen frame, so the souffle flavor (6) and the squeegee (7
) are performed reliably, and the target coating surface is more accurately i#. In addition, since the paste l-(2]) is directly supplied from the paste flavor = (6), the paste supply mechanism is simplified, and the paste is also supplied in a predetermined amount (Jli) for each application, so that the paste 1 -'s/l!i%&I
Only a small amount is required. Further, since the screen frame (4) is inclined so that its opening becomes larger in one direction, the inclined squeegee (7) can be operated smoothly.

ペース1の塗布jソ、塗布而槓のjl!j整はスクリー
ン版のみを交換すれば出来るので極めて容易である。ま
た熟練あるいは作業条件の細かな管理を必要と・lずに
、能率よく安定した塗布作業ができる。
Pace 1 application j so, apply and apply jl! Adjustment is extremely easy as it can be done by replacing only the screen plate. Furthermore, efficient and stable coating work can be performed without the need for skill or detailed management of work conditions.

さらに、二の装置はダイボンダーに絹込むことがrIf
能である。このように、」−記塗布装置は凹部内のベー
スト塗布の自動化をit7能にし、塗布作業の合理化が
図られ、作業能率を大rIJに改善できる。
Furthermore, the second device can be inserted into the die bonder.
It is Noh. In this manner, the coating device can automate the base coating in the recessed portions, rationalize the coating work, and greatly improve the work efficiency.

応用例 り例ではCCI)撮像チップのパッケージの底面に銀ペ
ーストを塗布する場合に適用したが、その他例えば第7
図〜第15図に示す各種構造の被塗布体への所要のペー
スト(21)の塗布にも適用できる。
In the application example, the application was applied to the case where silver paste was applied to the bottom of the package of an imaging chip (CCI).
The present invention can also be applied to the application of the required paste (21) to objects having various structures shown in FIGS. 15 to 15.

また、′44電、接着剤、銀ベースI・等の接着剤に限
らず、第13図に示す文字印刷の場合、さらには第15
図に示ずハイブリッドICにおける異種材質(21’)
の選択塗布にも応用し得る。
In addition, in the case of character printing shown in Fig. 13, not only adhesives such as '44 adhesive, silver base I, etc., but also adhesives such as 15
Different materials (21') in hybrid IC (not shown)
It can also be applied to selective application of

発明の効果 上述せる如く、本発1!I農こよれば凹部の内底面で狭
い面積の被塗布面に所要のペーストを均一に塗布するこ
とができる。また自動化を可能にし、塗布作業の合理化
を図ることができる。
Effects of the Invention As mentioned above, the present invention 1! This allows the desired paste to be uniformly applied to a narrow area of the inner bottom surface of the recess. It also enables automation and rationalization of coating work.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による塗布装置の一例を示す要部の斜視
図、第2図及び第3図はスクリーン枠の平面図及び断面
図、第4図はスクリーン枠の要部の拡大断面図、第5図
A−Fは動作説明に供する断面図、第6図はペーストが
塗布された半導体チップ用のパッケージの斜視図、第7
図乃至第14図は夫々本発明を適用し得る被塗布体の他
の例を示す斜視図、第15図は被塗布体のさらに他の例
を示O ず要部の平面図である。 (」)は被塗布体、(2)は凹部、(3)は被塗布面、
(4)はスクリーン枠、(5)はスクリーン版、(6)
はスフレイパー、(7)はスキージである。 1 −330− Q口 第13図 第14図 331− 第15図 21゛
FIG. 1 is a perspective view of a main part showing an example of a coating device according to the present invention, FIGS. 2 and 3 are a plan view and a sectional view of a screen frame, and FIG. 4 is an enlarged sectional view of a main part of a screen frame. 5A to 5F are cross-sectional views for explaining the operation, FIG. 6 is a perspective view of a package for semiconductor chips coated with paste, and FIG.
14 are perspective views showing other examples of objects to be coated to which the present invention can be applied, and FIG. 15 is a plan view of essential parts of still another example of the object to be coated. ('') is the object to be coated, (2) is the recess, (3) is the surface to be coated,
(4) is a screen frame, (5) is a screen version, (6)
(7) is a souffler and a squeegee. 1 -330- Q port Fig. 13 Fig. 14 331- Fig. 15 21゛

Claims (1)

【特許請求の範囲】[Claims] 内底面を被塗布面とした凹部内に入り得るスクリーン版
と、互いに同方向に連動しいずれか一方が1−記スクリ
ーン版に位置するときは他方がスクリーン版の外に位置
するスフレイパー及びスキージを備え、上記スフレイバ
ーから吐出したペーストを該スフレイバーにて一ヒ記ス
クリーン版の全面にイハ給し、その後上記スキージを−
に記スクリーン版に位置させ該スキージにてスクリーン
眼中を掃引して上記ベース1−を」−記被塗布面−Fに
均一に塗布することを特徴とする塗布装置。
A screen plate that can enter the recess with the inner bottom surface as the surface to be coated, and a spray scraper and squeegee that move in the same direction and are located outside the screen plate when one of them is located on the screen plate described in 1-. Prepare the paste, apply the paste discharged from the souffle flavor to the entire surface of the above screen plate using the souffle flavor, and then apply the above squeegee to -
A coating device characterized in that the coating device is positioned on the screen plate and sweeps the inside of the screen with the squeegee to uniformly coat the base 1- on the surface to be coated F.
JP9535683A 1983-05-30 1983-05-30 Coater Pending JPS59222256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9535683A JPS59222256A (en) 1983-05-30 1983-05-30 Coater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9535683A JPS59222256A (en) 1983-05-30 1983-05-30 Coater

Publications (1)

Publication Number Publication Date
JPS59222256A true JPS59222256A (en) 1984-12-13

Family

ID=14135367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9535683A Pending JPS59222256A (en) 1983-05-30 1983-05-30 Coater

Country Status (1)

Country Link
JP (1) JPS59222256A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565151A2 (en) * 1992-04-09 1993-10-13 International Business Machines Corporation Manufacture of multi-layer ceramic interconnect structures

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565151A2 (en) * 1992-04-09 1993-10-13 International Business Machines Corporation Manufacture of multi-layer ceramic interconnect structures
EP0565151A3 (en) * 1992-04-09 1993-11-24 Ibm Manufacture of multi-layer ceramic interconnect structures
US5578151A (en) * 1992-04-09 1996-11-26 International Business Machines Corporation Manufacture of a multi-layer interconnect structure

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