JPS59220294A - Laser working method - Google Patents

Abstract

PURPOSE:To perform working with high accuracy in short time by detecting the acoustic wave generated when a working part is worked by irradiating laser light thereto and controlling the feeding of work so as to make said wave coincident with the set acoustic wave. CONSTITUTION:The laser light from a laser oscillator 1 is focused with a focusing lens 3 and gases are fed from working gas feed pipes 5, 6, by which a work 10 is worked. The acoustic wave generated during working is successively detected with a detector 9 and is encoded by an analyzing circuit 9a. The encoded acoustic wave is inputted to a control device 17. The numerical control section in the device 17 feeds respectively signals to motors 14, 15, 16 so that the detected signal coincides with the acoustic wave memorized in a predetermined program, thereby controlling the feeding of work with cross slide tables 11, 12 and a turntable 13. The body to be worked is thus subjected to working with high accuracy in short time.

Description

[Detailed description of the invention] The present invention relates to a laser processing method.

A laser processing method in which the laser beam is focused by a focusing lens and the laser beam is irradiated onto the 7L body while processing is well known and widely used. Laser machining methods that use both an oscillator and a plasma generator to further improve machining efficiency and perform -C machining have also been developed and are being used.

However, although each of the above laser processing methods has greatly improved processing efficiency and processing speed compared to conventional general laser processing methods, the processing efficiency and processing speed are still low. There are problems in that it takes time to cut a thick workpiece, and high processing accuracy cannot be obtained (1).

The present invention was made from a paper perspective, and includes:
The purpose of this is to be able to cut reliably in a short time even when cutting particularly thick workpieces, where the machining speed is extremely high and the machining speed is extremely high. The purpose is to provide a laser processing method that can perform processing.

The gist of this is that in a laser processing method in which laser light is focused by a focusing lens and processed while being irradiated onto the workpiece, the sound waves generated from the processing area irradiated with the laser light are The purpose is to set or control processing conditions so that the level or spectrum always substantially matches that of an ideal sound wave determined before processing.

In other words, in laser processing, sound waves are generated when the laser beam is irradiated onto the workpiece and the workpiece is processed, but the sound waves vary depending on the material, shape, processing conditions, etc. of the workpiece. Therefore, the state of the sound waves when the machining is being performed well is memorized in advance, and the state of the sound waves generated during the machining is approximately the same as the state of the sound waves when the machining is being performed well. If the machining is controlled in this manner, the workpiece can be efficiently and precisely machined in a short time.

Hereinafter, the NT and phase of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is an explanatory diagram showing one embodiment of an apparatus for carrying out the laser processing method according to the present invention, FIG. 2 is an explanatory diagram showing another embodiment, and FIG. 3 is an explanatory diagram showing another embodiment. It is an explanatory diagram showing an example.

First, the explanation will be given with reference to FIG.

iT! In figure 1, ■ is the laser oscillator, 2 is the housing, and 3 is the laser oscillator.
4 is a focusing lens, 4 is a focusing lens fixing member for fixing the focusing lens 3, 5 and 6 are processing gas supply pipes, 7 and 8
9 is a processing gas supply device that supplies processing gas such as halogen gas through the processing gas supply pipes 5 and 6; 9 is a sonic wave detection device attached to the tip of the housing 2; 9a is the sound wave detection device; A sound wave analysis circuit that analyzes and codes the output from the device 9, 10 is the workpiece, ]1
and 12 refer to the workpiece 10 in the X-axis direction and Y-axis direction, respectively.
a cross-slide table for moving in the axial direction; 13 is a turntable provided on the cross-slide table 11 in order to give Ii1 rolling motion to the workpiece IO;
14. Motors 15 and 16 drive the cross slide tables 11 and 12 and the turntable 13, respectively;
Reference numeral 17 indicates the output and focus of the laser oscillator 1, the amount of processing gas supplied from the processing gas supply devices 5 and 6 according to a predetermined program based on the detection signal from the acoustic wave detection device 9; The control device includes a multi-control device that collectively controls motors 14, 15, 16, etc. that move and turn the slide tables 11 and 12 and the turntable 13, respectively.

Therefore, GO2 laser ie-4 is used as the laser oscillator ■.
Gas lasers such as 1e lasers, solid lasers such as ruby lasers and YAG lasers, etc. are used, and ranges are used as necessary.
The output of the laser oscillator 1 is controlled by the control device l'?
．． ', thLd '+1, and
The laser light output of the laser oscillator 1 can be continuous, strong or weak, or pulsed.

A sonic wave detection device 9 is attached to a portion of the tip of the housing 2 facing the workpiece 10, and the sonic wave detection device 9 transmits the laser beam emitted from the oscillator 1 to the workpiece 10. 1 (emitted when being shot and processed)
- row 1 skin is detected, and this detection signal is sent to the sound wave analysis circuit 9.
After the code is converted into an analysis code according to a, it is configured to be manually inputted to the control device 17.

When processing by the laser processing method according to the present invention, first, the laser beam from the laser oscillator 1 is sufficiently focused by the focusing lens 3 and irradiated onto the part of the workpiece 10 to be processed. After that, the output of the laser oscillator 1 is gradually increased. When the workpiece 10 starts to be processed efficiently, sound waves are generated from the processed part, and the sound waves that are generated in the state where the best processing conditions can be obtained from experience are detected by the sound wave detection device 9, The detection 5) is analyzed by the sound wave analysis circuit 9a, coded, and recorded in the control device 17. The control device 17 controls each part so that the sound waves generated during actual machining match the memorized sound waves.

Here, the sound wave comparison is the overall sound pressure, Bell, and specific J? f
This is done for the sound pressure level or spectrum of lll[. Also, this sound wave is acceptable P! Sound waves in the inaudible and inaudible ranges can be used.

[・-When the machining starts, the control device 17
Laser light is emitted from a laser oscillator 1 maintained at a predetermined oscillation output, is sufficiently focused by a focusing lens 3, and is supplied to the part of the workpiece lO to be machined, and the part to be machined is Processing gas such as halogen gas is supplied from processing gas supply devices 7 and 8 via processing gas supply pipes 5 and 6, and processing is performed. 4. ζ, the processing gas "C" is not limited to halogen gas, but can be various types of furan gases, suirinki, oxygen gas, etc., or a mixture of these as appropriate, depending on the material of the workpiece and the shape of the cedar to be processed. A mixed gas etc. is used.

During processing, a sonic wave detection device 9 is attached to the tip of the How S nonge 2 facing the workpiece 10.
sequentially detects the sound waves generated during this processing, and then converts it into a sound wave analysis circuit 9atl-F, and the encoded signal is manually input to the control device 717. The numerical control device moves the cross slide tables 11 and 12 and the turntable 13, respectively, according to a predetermined program and a detection signal from the sonic detection wave W19 that is manually input and memorized before the start of processing. No. 11 is sent to motors 14, 15 and 16, and processing feed is performed so that the sound waves generated during processing are the same as the sound waves detected before processing and are kept constant, so that the workpiece IO It is possible to perform high-precision machining in a short period of time.

In particular, according to the processing method of the present invention, the output of the laser beam is set to 350W, and the laser beam is sprayed to a size of 10×10×8.
When the 855C material of No. 111 was processed, it was possible to perform the processing at ±0.2 degrees Celsius.

On the other hand, when the same material as above was processed by simply setting the output of the laser oscillator to 350W and spraying 02 without using the method of the present invention, the processing accuracy was ±0.
It was 5fl.

Next, FIG. 2 will be explained.

In FIG. 2, the same numbers as in FIG.
a is a nozzle of the machining fluid supply device 18, 19 is a rotary disk,
201 is the rotary disk mounting seat, 21 is the crank gear, 22 is the motor, and 23 is the shaft of the motor 22.
The output of the laser oscillator 1, its focus, and the processing gas are determined according to the output of the laser oscillator 1 and its focus according to the pulse 1 gram preset by the detection item 1) from the sonic wave detector 9. Feeding devices 5 and 6
Supply amount of processing gas supplied from processing liquid supply device 1
8. Motors 14 and 15 that move the slide tables 11 and 12 and the turntable 13.
This is a control device including a numerical control device that collectively controls 16 and 16, etc.

However, in this embodiment, C1 is the device shown in FIG. 1 with the addition of a liquid supply 'JP, 1B'. It is sufficiently focused by the lens 3 and supplied to the part to be machined of the workpiece 10, and the machining gas supply devices 1 and 8 are supplied to the said part via the machining gas supply pipes 5 and 6.
A processing liquid such as halogen gas is supplied from the processing liquid supply device 18, and a processing liquid such as the material of the workpiece lO, processed tea ('1, etc.), such as IIcL, rare 112, is supplied from the processing liquid supply device 18. S(L+, K(III aqueous solution, IIF aqueous solution, hydrocarbon etc. acid or alkali machining fluid is supplied to the machining fluid supply device 18 as a thin jet stream or mist droplets from the nozzle 18a of I, or F active gas etc. as appropriate. Processing is carried out by supplying a predetermined limited amount of gas as a spray atomizer.At this time, a sonic detection wave E9 is attached to the tip of the housing 2 facing the workpiece 10. teeth,
The sound waves generated during this processing are detected and detected fl'
t5 is converted into a "-code" by the sound wave analysis cycle vPI9a and sent to the "C" control device 24, so the numerical control device in the control device 24 is operated by the sound wave detection device 9 which is manually operated and memorized before the start of machining.
Oneζ according to a predetermined program with detection borrowed from
, move the slides 11 and 12, and the turntable 13, respectively.14.15 and 1
No. 46 is sent to No. 6, and the processing feed is performed so that the sound waves emitted during processing always remain constant, so the above-mentioned workpiece IO
It is possible to process a convexity of 0 degrees in a short time.

Next, FIG. 3 will be explained.

In Figure 3, 1st t! 21 and the same numbers as in FIG. 2 indicate the same components, 25 is a laser oscillator, 26 is a housing, 27 is a focusing lens, and 28 is a focusing lens that fixes the focusing lens 27. Fixed member, 2
9 and 3o are processing gas supply pipes, 31 and 32 are processing gas supply devices that supply processing gas such as halogen gas,
33 is a sound wave detection device, 34 and 35 cross slide tables, 3G is a base on which the above-mentioned cross slide tables 34 and 35 are mounted, and 37 and 38 are the above cross slide tables 34 and 35 in the X-axis direction and the Y-axis direction. A motor 39 moves the laser oscillators 1 and 25, the processing gas supply bag W'l, 8.31 and 3 according to the output signals of the sonic wave detection devices 9 and 33 and a predetermined program.
2. This is a control device that includes a numerical control device that collectively controls the morleys 37 and 38 that drive the cross slider C toe pulleys 34 and 35.

In this embodiment, the laser oscillators 1 and 25 are provided facing each other, and the workpiece 10 is attached between them for processing.・The center part 4.1 of the base 336 to which the Ido Chisol 34, 35 and the cross slide tables 34 and 35 are attached is cut through and formed into a frame shape, and is emitted from both laser oscillators 1 and 25.・- When processing is performed while irradiating the workpiece 10 with the workpiece 10 sandwiched between the laser beams and facing each other, the irradiation of the laser light may be obstructed!
It is structured like this.

When performing rede processing, please refer to Figure 1 and! ￥ S2 Similar to the device shown in Fig. 2, first, the laser beams from the laser beam oscillators 1 and 25 are sufficiently focused by the focusing unit 3 and the beam 27 and irradiated onto the part to be processed '4 of the workpiece 10. death,
After that, ``2 notes: 111. : What about the sound waves when the workpiece 10 is processed by gradually increasing the outputs of the devices 1 and 25? It is detected by three stone liquid extraction devices 9 and 33. The detection signals detected by the above-mentioned sonic wave output devices 9 and 33 are converted into analysis codes by the sonic wave analysis circuit 9a, and then manually inputted to the 9;11 control device 38 and stored in memory, and when processing is started, the above-mentioned @ According to the detection signal stored in the control device 13B and a predetermined program in the numerical control device,
The sound waves emitted at 0 o'clock are the same as the sound waves detected before processing.
And since the processing feed is done so that it is kept constant,
The workpiece 10 can be subjected to highly intensive processing in a short period of time.

In particular, in this embodiment, since the laser oscillators 1 and 25 are provided facing each other, when the laser beam from the laser oscillator J on the - side is supplied to the part of the workpiece 1o to be machined, , the other laser oscillator 25 outputs the workpiece 1
The workpiece 10 is irradiated from the back side of the workpiece 10 to a position corresponding to the irradiation point irradiated by the laser beam #kl'I51 or a position slightly ahead in the direction of processing progress. This allows for more precise processing to be performed in a shorter time.

Since the present invention is configured as shown on paper, when using the laser processing method according to the present invention, it is possible to process a workpiece with high accuracy in a short time.

Note that this defense is not limited to the examples on paper.

That is, for example, in this embodiment, the sonic wave detection device is provided at the tip of the housing so as to face the workpiece, but it may be provided separately from the housing. The mounting position of the shield focusing lens, the method of focusing the laser beam, the method of supplying the machining fluid by the machining fluid supply device, the method of supplying the machining gas from the machining gas supply device, etc. are the @ times of T1 of the present invention. The design can be freely changed within the scope of the invention, and the present invention encompasses these developments.

4. VIJrMノWa? ,E Figure 1 for explanatory purposes shows one embodiment of the apparatus for carrying out the laser y method according to the present invention; ``Figure 71, (1st movement (J, 812 clear figure showing still another example).

■, 25.
−− =−・−Housing 3.27−−−−1・−−1−−・−−−−−−1−−−Focusing lens 3.4.27.
2 B ---------Focusing lens fixing member 5.6.2
9.30---1---Processing gas supply pipe 7.8.3L3
1-・-1--Processing gas J (feeding device 9.33"
'-''-・---------m-Sound wave detection device 9a・-
---1-11---------------------------Analysis of sound waves
---Old-° Workpiece 11.12.34.35~ri1"
Sliding table 13-----1---・--1-
---Tar 2' Cheagle 14.15.16 37.38-----x-ta] 7, 24, 3 9 ---1----1
+Rimoshi*a=Patent applicant Inoue Zippax Research Institute Agent (75S!4) Masato Tsuzumami

Claims (1)

[Claims] 1) In a laser processing method in which laser light is focused by a focusing lens and processed while being irradiated onto a workpiece, the sound waves generated from the processing area irradiated with the laser light are always generated before processing. The foregoing machining method described above is characterized in that the machining feed is performed so as to substantially match the sound waves determined in the above. 2) Claim 1li for detecting the sound wave level of the A wave
11! The laser processing method according to item Il. 3) ff', t Q' to detect the spectrum of the above a-wave
The laser processing method according to item 1, where +″+Ri is required.