JPS59220294A - Laser working method - Google Patents
Laser working methodInfo
- Publication number
- JPS59220294A JPS59220294A JP58094897A JP9489783A JPS59220294A JP S59220294 A JPS59220294 A JP S59220294A JP 58094897 A JP58094897 A JP 58094897A JP 9489783 A JP9489783 A JP 9489783A JP S59220294 A JPS59220294 A JP S59220294A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- laser
- workpiece
- acoustic wave
- working
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】 本発明はレーザ加工方法に関する。[Detailed description of the invention] The present invention relates to a laser processing method.
レーザ光を集束レンスによって集束しiツ加7L体に上
記レーザ光を照射しつつ加工を行うレーザ加工方法は公
知であり広く利用されて(Sる。ますこ、この他の方法
としては、レーザ発振器とプラズマ発生器を併用し、加
工効率をより向上さ・せ−C加工を行うレーザ加工方法
も開発され利用されつつある。A laser processing method in which the laser beam is focused by a focusing lens and the laser beam is irradiated onto the 7L body while processing is well known and widely used. Laser machining methods that use both an oscillator and a plasma generator to further improve machining efficiency and perform -C machining have also been developed and are being used.
然しなから、上記のそれぞれのレーザ加工方法は従来一
般のレーザ加工方法に比べれば加工効率及び加工速度は
大幅に向上したが、まだまtどその加工効率及び加工速
度は低いものであり、特に厚い被加工体を切断加工する
ような場合等には時間がかかると共に、高い加工精度が
得られな1)と云う問題点があった。However, although each of the above laser processing methods has greatly improved processing efficiency and processing speed compared to conventional general laser processing methods, the processing efficiency and processing speed are still low. There are problems in that it takes time to cut a thick workpiece, and high processing accuracy cannot be obtained (1).
本発明は紙上の観点に立ってなされたもの−であって、
その目的とするところは、加工9hlr=及び加工速度
が極めて轟く、特に厚い被加工体を切断加工するような
場合にも短時間で確実に切断加工することができると共
に、精度のlt′tい加工を施すことができるレーザ加
工方法を提供しようとするものである。The present invention was made from a paper perspective, and includes:
The purpose of this is to be able to cut reliably in a short time even when cutting particularly thick workpieces, where the machining speed is extremely high and the machining speed is extremely high. The purpose is to provide a laser processing method that can perform processing.
而して、その要旨とするところは、レーザ光を集束レン
ズによって集束せしめ被加工体に照射しつつ加工を行う
レーザ加工方法に於て、上記レーザ光が照射された加工
部から発生ずる音波のレベル又はスペクトルが常に加工
前に定めた理想的な音波のそれと略一致するように加工
条件の設定又は制御を行うことにある。The gist of this is that in a laser processing method in which laser light is focused by a focusing lens and processed while being irradiated onto the workpiece, the sound waves generated from the processing area irradiated with the laser light are The purpose is to set or control processing conditions so that the level or spectrum always substantially matches that of an ideal sound wave determined before processing.
即ち、レーザ加工に於゛Cは、レーザ光が被加工体に照
射され加工が施される際に音波を発生曵るが、上記音波
はその被加工体の材質、形状及び加工状態等によって変
化するので、加工が良klに行われている時の音波の状
態を予めメモリしておき、加工時に発生ずる音波の状態
が上記加工が良好に行われている時の音波の状態と略一
致するように加工を制御4゛れば上記被加工体に効率よ
く、且つ短時間に精度の高い加工を施すことができるの
ある。In other words, in laser processing, sound waves are generated when the laser beam is irradiated onto the workpiece and the workpiece is processed, but the sound waves vary depending on the material, shape, processing conditions, etc. of the workpiece. Therefore, the state of the sound waves when the machining is being performed well is memorized in advance, and the state of the sound waves generated during the machining is approximately the same as the state of the sound waves when the machining is being performed well. If the machining is controlled in this manner, the workpiece can be efficiently and precisely machined in a short time.
以下、図面により本発明のNT、相を具体的に説明する
。Hereinafter, the NT and phase of the present invention will be specifically explained with reference to the drawings.
第1図は、本発明にがかるレーザ加工方法を実施するた
めの装置の一実施例を示す説明図、第2図は、他の実施
例を示す説明図、第3図は、更に他の実施例を示す説明
図である。FIG. 1 is an explanatory diagram showing one embodiment of an apparatus for carrying out the laser processing method according to the present invention, FIG. 2 is an explanatory diagram showing another embodiment, and FIG. 3 is an explanatory diagram showing another embodiment. It is an explanatory diagram showing an example.
先ず、第1図より説明する。First, the explanation will be given with reference to FIG.
iT!1図中、■はレーザ発振器、2はハウジング、3
は集束レンズ、4は上記集束レンズ3を固定する集束レ
ンズ固定部材、5及び6は加工用ガス供給管、7及び8
は上記加工用ガス供給管5及び6を介し、てハロゲンガ
ス等の加工用ガスを供給する加工用ガス供給装置、9は
上記ハウジング2の先端に取り付けられた音波検出装置
、9aは上記音波検出装置9からの出力借りを解析して
コー ド化する音波の解析回路、10は被加工体、】1
及び12は上記被加工体10をそれぞれX軸方向及びY
軸方向へ移動させるクロススライドテーブル、13は上
記被加工体IOにIi1転運動をりえるため上記クロス
スライドテーブルll上に設けられたターンテーブル、
14.15及び16はそれぞれクロススライドテーブル
11及び12、ターンテーブル13を駆動するモータ、
17は音波検出装置9からの検出信号により予め定めら
れたプログラムに従ってレーザ発振器1の出力及びその
焦点、加工用ガス供給装置5及び6から供給さする加工
用ガスのむ(給量、りし1ススライドテーブル11及び
12、ターンテーブル13をそれぞれ移動・uしめるモ
ータ14.15及び16等を一括制御」る数ta制御装
置を含も制御装置である。iT! In figure 1, ■ is the laser oscillator, 2 is the housing, and 3 is the laser oscillator.
4 is a focusing lens, 4 is a focusing lens fixing member for fixing the focusing lens 3, 5 and 6 are processing gas supply pipes, 7 and 8
9 is a processing gas supply device that supplies processing gas such as halogen gas through the processing gas supply pipes 5 and 6; 9 is a sonic wave detection device attached to the tip of the housing 2; 9a is the sound wave detection device; A sound wave analysis circuit that analyzes and codes the output from the device 9, 10 is the workpiece, ]1
and 12 refer to the workpiece 10 in the X-axis direction and Y-axis direction, respectively.
a cross-slide table for moving in the axial direction; 13 is a turntable provided on the cross-slide table 11 in order to give Ii1 rolling motion to the workpiece IO;
14. Motors 15 and 16 drive the cross slide tables 11 and 12 and the turntable 13, respectively;
Reference numeral 17 indicates the output and focus of the laser oscillator 1, the amount of processing gas supplied from the processing gas supply devices 5 and 6 according to a predetermined program based on the detection signal from the acoustic wave detection device 9; The control device includes a multi-control device that collectively controls motors 14, 15, 16, etc. that move and turn the slide tables 11 and 12 and the turntable 13, respectively.
而して、レーザ発振器■にはGO2レーレーザie−4
1eレーデ等の気体レーザ、ルビーレーザやYAGレー
ザ等の固体レージ′その他を用い、また必要に範、し−
仁はQスインJ法等によっ−CJ、り出力通商めること
かてきるよ・)に構成され”Cいる。なお、上記レーザ
発振器1は制御装置l ’?によってその出力及び魚1
.’、t hLd ′+1に制御ゼしめられると共に、
上記レーザ発振器1のレーザ光出力を連続メは強弱若し
くはパルス状とすることができる。Therefore, GO2 laser ie-4 is used as the laser oscillator ■.
Gas lasers such as 1e lasers, solid lasers such as ruby lasers and YAG lasers, etc. are used, and ranges are used as necessary.
The output of the laser oscillator 1 is controlled by the control device l'?
.. ', thLd '+1, and
The laser light output of the laser oscillator 1 can be continuous, strong or weak, or pulsed.
ハウジング2の先端の被加工体10と相対向する部分に
は音波検出装置9が取り付けられでおり、上記音波検出
装置9は上記し・−ザ発振器1かり発射されたレーザ光
が被加工体10に1(ぺ射され加工が施される際に発J
−る行1皮を検出し、この検出信号が音波の解析回路9
aによ、って解析コード化された後、制御装置17に人
力されるように構成されている。A sonic wave detection device 9 is attached to a portion of the tip of the housing 2 facing the workpiece 10, and the sonic wave detection device 9 transmits the laser beam emitted from the oscillator 1 to the workpiece 10. 1 (emitted when being shot and processed)
- row 1 skin is detected, and this detection signal is sent to the sound wave analysis circuit 9.
After the code is converted into an analysis code according to a, it is configured to be manually inputted to the control device 17.
而して、本発明にがかるレーザ加工方法によって加工を
行う場合には、最初にレーザ発振器1からのレーザ光を
集束レンズ3によって充分に集束して被加工体10の加
工ずべき部分に照射し、然る後、上記レーザ発振器1の
出力・言次第に高めて行く。そして上記被加工体10に
加工が効率よく施され始めるとその加工部分から音波が
発生するが、経験上最良の加工状態が得られる状態に於
て発生ずる音波を音波検出装置9によって検出し、その
検出化5)を音波の解析回路9aにて解析、コード化し
制御装置17に記録する。而して、制御装置17では実
際の加工時に発生ずる音波が上記メモリされた音波と一
致するように各部の制御を行うのである。When processing by the laser processing method according to the present invention, first, the laser beam from the laser oscillator 1 is sufficiently focused by the focusing lens 3 and irradiated onto the part of the workpiece 10 to be processed. After that, the output of the laser oscillator 1 is gradually increased. When the workpiece 10 starts to be processed efficiently, sound waves are generated from the processed part, and the sound waves that are generated in the state where the best processing conditions can be obtained from experience are detected by the sound wave detection device 9, The detection 5) is analyzed by the sound wave analysis circuit 9a, coded, and recorded in the control device 17. The control device 17 controls each part so that the sound waves generated during actual machining match the memorized sound waves.
ここで音波の比較は全体的な音圧し・ベル、特定J?f
lll[の音圧1ノベルまたはスペクトルについて行う
ものである。また、この音波としては可P!域及び不可
聴域の音波が利用できる。Here, the sound wave comparison is the overall sound pressure, Bell, and specific J? f
This is done for the sound pressure level or spectrum of lll[. Also, this sound wave is acceptable P! Sound waves in the inaudible and inaudible ranges can be used.
【・−ザ加工を開始遭−ると、制御装置17によっ″ζ
所定の発振出力に保たれたレーザ発振器1からレーザ光
が照射され、集束レンズ3によって充分に集束せし、め
られて被加工体lOの加工ずべき部分に供給されると共
に、上記部分に加工用ガス供給管5及び6を介して加工
用ガス供給装置7及び8からハロゲンガス等の加工用ガ
スが供給されて加工が施される。な4.ζ、加工用ガス
とし”Cはハロゲンガスに限定されず、被加工体の材質
及び加工杉状等に応じて各種のフrlン系ガス、水凛気
、酸素ガス等又はこれらを適宜に混合した混合ガス等が
利用される。[・-When the machining starts, the control device 17
Laser light is emitted from a laser oscillator 1 maintained at a predetermined oscillation output, is sufficiently focused by a focusing lens 3, and is supplied to the part of the workpiece lO to be machined, and the part to be machined is Processing gas such as halogen gas is supplied from processing gas supply devices 7 and 8 via processing gas supply pipes 5 and 6, and processing is performed. 4. ζ, the processing gas "C" is not limited to halogen gas, but can be various types of furan gases, suirinki, oxygen gas, etc., or a mixture of these as appropriate, depending on the material of the workpiece and the shape of the cedar to be processed. A mixed gas etc. is used.
而して、加工時にはハウSノンゲ2の先端に、上記被加
工体10に相対向し”ζ取り付けられた音波検出装置9
は、この加工の際に発生ずる音波を逐次検出し、然る後
、音波の解析回路9atl−F化し、そのコード化され
た信号が制御装置717に人力されるので、上記制御装
置17中の数値制御装置は加工開始前に人力されメモリ
された音波検出波W19からの検出信号と予め定められ
たプログラムに従ワて、クロススライドテーブル11及
び12、ターンテーブル13をそれぞれ移動さ一1!る
モータ14.15及び16に11号を送り、加工時に発
生される音波が加工前に検出された音波と同一で、且つ
一定に保たれるように加工送りをするので、上記被加工
体IOに短時間で精度の商い加工を施すことができるの
である。During processing, a sonic wave detection device 9 is attached to the tip of the How S nonge 2 facing the workpiece 10.
sequentially detects the sound waves generated during this processing, and then converts it into a sound wave analysis circuit 9atl-F, and the encoded signal is manually input to the control device 717. The numerical control device moves the cross slide tables 11 and 12 and the turntable 13, respectively, according to a predetermined program and a detection signal from the sonic detection wave W19 that is manually input and memorized before the start of processing. No. 11 is sent to motors 14, 15 and 16, and processing feed is performed so that the sound waves generated during processing are the same as the sound waves detected before processing and are kept constant, so that the workpiece IO It is possible to perform high-precision machining in a short period of time.
特に、本発明の加工方法によりレーザ光1う【器の出力
を350Wとし、02を吹き付けなから10×10×8
111の855C材に加工を施したところ±0.2籠の
加ニオn度で加工を行うことができた。In particular, according to the processing method of the present invention, the output of the laser beam is set to 350W, and the laser beam is sprayed to a size of 10×10×8.
When the 855C material of No. 111 was processed, it was possible to perform the processing at ±0.2 degrees Celsius.
これに対して、本発明の方法によることなく単にレーザ
発振器の出力を350Wとし、02を吹き付けながら上
記と同様の材質を加工したところその加工精度は±0.
5flであった。On the other hand, when the same material as above was processed by simply setting the output of the laser oscillator to 350W and spraying 02 without using the method of the present invention, the processing accuracy was ±0.
It was 5fl.
次に、第2図について説明する。Next, FIG. 2 will be explained.
第2図中、第1図と同一の番号を付したものし1間−の
構成要素をしめしており、18は加工液供給装置、18
aは上記加工液供給装置18のノズル、19は回転盤、
201よ回転盤取イ1座、21はクランクギア、22は
モータ、23は上記モータ22のシャフトに取すイ・J
Uられ上記クランクギア21と噛み合っているビニオン
ギア、241;I音波検出装置9からの検出イ1)号に
より予め庄”められたプし1グラムに従ってレーザ発振
器1の出力及びその焦点、加工用ガス供給装置5及び6
から供給される加工用ガスの供給量、加工液供給装置1
8、りr、lススライドテーブル11及び12、ターン
テーブル13を(れそれ移動せしめるモータ14.15
及び16等を一括制御づ゛る数値制御装置を含む制御装
置である。In FIG. 2, the same numbers as in FIG.
a is a nozzle of the machining fluid supply device 18, 19 is a rotary disk,
201 is the rotary disk mounting seat, 21 is the crank gear, 22 is the motor, and 23 is the shaft of the motor 22.
The output of the laser oscillator 1, its focus, and the processing gas are determined according to the output of the laser oscillator 1 and its focus according to the pulse 1 gram preset by the detection item 1) from the sonic wave detector 9. Feeding devices 5 and 6
Supply amount of processing gas supplied from processing liquid supply device 1
8. Motors 14 and 15 that move the slide tables 11 and 12 and the turntable 13.
This is a control device including a numerical control device that collectively controls 16 and 16, etc.
而しC1本実施例に於ては第1図に示した装置に加ユ液
供給’J P、 1 Bを付加したものCあっ゛C1加
工時に被加工体10の加工部分にレーザ光が集束レンス
3によっζ充分に集束せしめられζ被加工体10の加工
すべき部分に供給されると共に、上記部分に加工用ガス
供給管5及び6を介して加工用ガス供給装置゛l及び8
からハロゲンガス等の加ユ用カスが供給され、更に加工
液供給装置18から上記被加工体lOの材°)t、加工
茶(’1等に迫台した加工液、例えば、IIcL 、希
112 S(L+ 、K(III水溶液、IIF水溶液
、炭化水素等の酸又はアルカリの加工液が加工液供給装
置18先al;Iのノズル18aから細い噴射流又は霧
滴として、或いはF活性ガス等適宜のガスによるスプレ
ー噴霧として所定の制限された量で供給されて加工が施
される。この時、ハウジング2の先1瑞に上記被加工体
10に相対向し°C取り付けられた音波検出波E9は、
この加工の際に発生ずる音波を検出してその検出fl′
t5を音波の解析回vPI9aで」−ド化し゛C制御装
置24に送るので、上記制御装置24の中の数値制御装
置は加工開始前に人力されメモリされた音波検出装置9
からの検出借りと予め定められたプログラムに従っ一ζ
、りし1ススライドチーグル11及び12、ターンテー
ブル13をそれぞれ移動さUるで一タ14.15及び1
6に46号を送り、加工時に発仕られ音波が常に一定に
保たわるように加工送りをするので、上記被加工体IO
に短時間で(0度の凸い加工を施すことができるのであ
る。However, in this embodiment, C1 is the device shown in FIG. 1 with the addition of a liquid supply 'JP, 1B'. It is sufficiently focused by the lens 3 and supplied to the part to be machined of the workpiece 10, and the machining gas supply devices 1 and 8 are supplied to the said part via the machining gas supply pipes 5 and 6.
A processing liquid such as halogen gas is supplied from the processing liquid supply device 18, and a processing liquid such as the material of the workpiece lO, processed tea ('1, etc.), such as IIcL, rare 112, is supplied from the processing liquid supply device 18. S(L+, K(III aqueous solution, IIF aqueous solution, hydrocarbon etc. acid or alkali machining fluid is supplied to the machining fluid supply device 18 as a thin jet stream or mist droplets from the nozzle 18a of I, or F active gas etc. as appropriate. Processing is carried out by supplying a predetermined limited amount of gas as a spray atomizer.At this time, a sonic detection wave E9 is attached to the tip of the housing 2 facing the workpiece 10. teeth,
The sound waves generated during this processing are detected and detected fl'
t5 is converted into a "-code" by the sound wave analysis cycle vPI9a and sent to the "C" control device 24, so the numerical control device in the control device 24 is operated by the sound wave detection device 9 which is manually operated and memorized before the start of machining.
Oneζ according to a predetermined program with detection borrowed from
, move the slides 11 and 12, and the turntable 13, respectively.14.15 and 1
No. 46 is sent to No. 6, and the processing feed is performed so that the sound waves emitted during processing always remain constant, so the above-mentioned workpiece IO
It is possible to process a convexity of 0 degrees in a short time.
次に、第3図について説明する。Next, FIG. 3 will be explained.
第3図中、第1t!21及び第2図と同一の番号を付し
たものは同・−の構成要素を示しており、25はレーザ
発振器、26はハウジング、27は集束レンズ、28は
上記集束レンズ27を固定する集束レンズ固定部材、2
9及び3oは加工用ガス供給管、31及び32はハロゲ
ンガス等の加工用ガスを供給する加工用ガス供給装置、
33は音波検出装置、34及び35けクロススライドテ
ーブル、3Gは一上記クロススライドテーブル34及び
35が搭載される基台、37及び38は上記クロススラ
イドテーブル34及び35をX軸方向及びY軸方向に移
動させるモータ、39は音波検出装置9及び33の出力
信号及び予め定められたプログラムに従ってレーザ発振
器1及び25、加工ガス供給袋W’l、8.31及び3
2、クロススラ・Cトチ−プル34及び35を駆動する
モ〜り37及び38を一括制御する数値制御装置を含む
制御装置である。In Figure 3, 1st t! 21 and the same numbers as in FIG. 2 indicate the same components, 25 is a laser oscillator, 26 is a housing, 27 is a focusing lens, and 28 is a focusing lens that fixes the focusing lens 27. Fixed member, 2
9 and 3o are processing gas supply pipes, 31 and 32 are processing gas supply devices that supply processing gas such as halogen gas,
33 is a sound wave detection device, 34 and 35 cross slide tables, 3G is a base on which the above-mentioned cross slide tables 34 and 35 are mounted, and 37 and 38 are the above cross slide tables 34 and 35 in the X-axis direction and the Y-axis direction. A motor 39 moves the laser oscillators 1 and 25, the processing gas supply bag W'l, 8.31 and 3 according to the output signals of the sonic wave detection devices 9 and 33 and a predetermined program.
2. This is a control device that includes a numerical control device that collectively controls the morleys 37 and 38 that drive the cross slider C toe pulleys 34 and 35.
而して、本実施例に於ては、レーザ発振器l及び25を
相対向して設け、その間に被加工体10を取り付けて加
工を行うものであって、上記神加工体10が取り付けら
れるクロススラ・イドチーゾル34.35及び上記クロ
ススライドテーブル34及び35が取り付けられる基イ
336の中央部4.1剖り貫かれて枠状に形成されてお
り、両レーザ発振器1及び25から発射されたし・−ザ
光亡υに加工体10を挾んで相対向させ”ご照射しつつ
加工を行う際に上記レーザ光の照射を妨げることが7!
いように構成されている。In this embodiment, the laser oscillators 1 and 25 are provided facing each other, and the workpiece 10 is attached between them for processing.・The center part 4.1 of the base 336 to which the Ido Chisol 34, 35 and the cross slide tables 34 and 35 are attached is cut through and formed into a frame shape, and is emitted from both laser oscillators 1 and 25.・- When processing is performed while irradiating the workpiece 10 with the workpiece 10 sandwiched between the laser beams and facing each other, the irradiation of the laser light may be obstructed!
It is structured like this.
レーデ加工を行う場合には、第1図及び!¥S2図の装
置と同様に、最初にレーザ光振器1及び25からのそれ
ぞれのレーブスしを集束しンス3皮び27によって充分
に集束して被加工体10の加工′4べき部分に照射し、
然る後、」二記し・−ザ発111.:器1及び25の出
力を徐々にil’liめで被加工体10に加工が施され
る際の音波を?3石液液出装置9及び33によって検出
する。上記名音波桟出装置9及び33によって検出され
た検出信号は音波の解析回路9aで解析コード化された
後、9;11御装置38に人力されてメモリされ、加工
が開始されると上記@御装置13Bにメモリされた検出
信号と数値制御装置に予め定められたプログラムに従っ
°(、り【1ススライドテーブル34及び35をそれぞ
れ移動させるモータ37及び38に15号を送り、加]
0時に発せられ音波が加工前に検出された音波と同一・
で、且つ−・定に保たれるように加工送りをするので、
上記被加工体10に短時間で積度の高い加工を施すこと
ができるのである。When performing rede processing, please refer to Figure 1 and! ¥ S2 Similar to the device shown in Fig. 2, first, the laser beams from the laser beam oscillators 1 and 25 are sufficiently focused by the focusing unit 3 and the beam 27 and irradiated onto the part to be processed '4 of the workpiece 10. death,
After that, ``2 notes: 111. : What about the sound waves when the workpiece 10 is processed by gradually increasing the outputs of the devices 1 and 25? It is detected by three stone liquid extraction devices 9 and 33. The detection signals detected by the above-mentioned sonic wave output devices 9 and 33 are converted into analysis codes by the sonic wave analysis circuit 9a, and then manually inputted to the 9;11 control device 38 and stored in memory, and when processing is started, the above-mentioned @ According to the detection signal stored in the control device 13B and a predetermined program in the numerical control device,
The sound waves emitted at 0 o'clock are the same as the sound waves detected before processing.
And since the processing feed is done so that it is kept constant,
The workpiece 10 can be subjected to highly intensive processing in a short period of time.
特に、本実施例に於てけレーザ発振器1及び25が相対
向して設けられているので、−・方のレーザ発振器Jか
らのレーザ光が被加工体1oの加工ずべき部分に供給さ
れると、他方のレーザ発振器25からは上記被加工体1
0の裏面から上記レーザ光#kl′I51によって照射
された照射点に対応する位置若しく6才その加工進行方
向に多少先行する位置に照射がなされて加工が行われる
ので、上記被加工体10に短時間でより精度の高い加工
を施iことができるのである。In particular, in this embodiment, since the laser oscillators 1 and 25 are provided facing each other, when the laser beam from the laser oscillator J on the - side is supplied to the part of the workpiece 1o to be machined, , the other laser oscillator 25 outputs the workpiece 1
The workpiece 10 is irradiated from the back side of the workpiece 10 to a position corresponding to the irradiation point irradiated by the laser beam #kl'I51 or a position slightly ahead in the direction of processing progress. This allows for more precise processing to be performed in a shorter time.
本発明は紙上の如く構成されるので、本発明にかかるレ
ーザ加工方法による時には、被加工体に短時間で精度の
高い加工を施すことができるのである。Since the present invention is configured as shown on paper, when using the laser processing method according to the present invention, it is possible to process a workpiece with high accuracy in a short time.
なお、本弁明は紙上の実施例に限定れるものではない。Note that this defense is not limited to the examples on paper.
即ち、例えば、本実施例に於ては音波検出装置をハウジ
ングの先端部分に被加工体と相対向して設けたが、ハウ
ジングと別個に設けても良い。その楯集束レンズの取り
付は位置、レーザ光の集束方法、加工液供給装置による
加工液の供給方法及び加工用ガス供給装置がらの加工用
ガスの供給方法等は本発明のT1的の@回内で自由に設
計変更できるものであッで、本発明はそれらの紡ごを包
摂するものである。That is, for example, in this embodiment, the sonic wave detection device is provided at the tip of the housing so as to face the workpiece, but it may be provided separately from the housing. The mounting position of the shield focusing lens, the method of focusing the laser beam, the method of supplying the machining fluid by the machining fluid supply device, the method of supplying the machining gas from the machining gas supply device, etc. are the @ times of T1 of the present invention. The design can be freely changed within the scope of the invention, and the present invention encompasses these developments.
4、 VIJrMノWa単?、E説明
用1図は、本発明にががるレーザy用]−カ法を実施す
るための装置の一実施例か示す説四目1、第2図け、他
の実施例を示す説”71図、第、(1躍(J、更に他の
ス施例を示ケ812明図である。4. VIJrMノWa? ,E Figure 1 for explanatory purposes shows one embodiment of the apparatus for carrying out the laser y method according to the present invention; ``Figure 71, (1st movement (J, 812 clear figure showing still another example).
■、25・−−−−一一−−−−−−−−−・−−−一
−レーザ発wL盟2.26−−−−、−−−−−−−−
−− =−・−ハウジング3.27−−−−一・−−一
−−・−−−−−−一−−−集束レンズ3.4.27.
2 B −−−−−−−集束レンズ固定部材5.6.2
9.30−−−一−−加工用ガス供給管7.8.3L3
1− ・−一−−加工用ガスイJ(給装置9.33 ”
’−”−・−−−−−−−−m−音波検出装置9a・−
−−−一一一−−−−−−−−−−−−−−−−−−一
音波の解析Ll’l路10−・・−−一−−−−−−−
−−−旧−°被加工体11.12.34.35〜り1」
ススライドテーブル13−−−−−一−−−・−−一−
−−−ター二′チーグル14.15.16
37.38−−−−−−−x−タ
] 7 、 24 、 3 9 −−−一−−−−−1
+り御シ*a=特許出願人 株式会社 井上ジPパック
ス研究所代理人(75S!4)鼓上正人部■, 25.
−− =−・−Housing 3.27−−−−1・−−1−−・−−−−−−1−−−Focusing lens 3.4.27.
2 B ---------Focusing lens fixing member 5.6.2
9.30---1---Processing gas supply pipe 7.8.3L3
1-・-1--Processing gas J (feeding device 9.33"
'-''-・---------m-Sound wave detection device 9a・-
---1-11---------------------------Analysis of sound waves
---Old-° Workpiece 11.12.34.35~ri1"
Sliding table 13-----1---・--1-
---Tar 2' Cheagle 14.15.16 37.38-----x-ta] 7, 24, 3 9 ---1----1
+Rimoshi*a=Patent applicant Inoue Zippax Research Institute Agent (75S!4) Masato Tsuzumami
Claims (1)
に照射しつつ加工を行うレーザ加工方法に於て、 上記レーザ光が照射された加工部から発生ずる音波が常
に加工前に定めた音波と略一致するように加工送りを行
うことを特徴とする上記のし・−ザ加工方法。 2)上記a波の音波レベルを検出する特許請求の1li
11!Il第1項記載のレーザ加工方法。 3)上記a波のスペクトルを検出するff’、t Q’
+″+Ri求の範囲第1項記載のレーザ加工方法。[Claims] 1) In a laser processing method in which laser light is focused by a focusing lens and processed while being irradiated onto a workpiece, the sound waves generated from the processing area irradiated with the laser light are always generated before processing. The foregoing machining method described above is characterized in that the machining feed is performed so as to substantially match the sound waves determined in the above. 2) Claim 1li for detecting the sound wave level of the A wave
11! The laser processing method according to item Il. 3) ff', t Q' to detect the spectrum of the above a-wave
The laser processing method according to item 1, where +″+Ri is required.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58094897A JPS59220294A (en) | 1983-05-31 | 1983-05-31 | Laser working method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58094897A JPS59220294A (en) | 1983-05-31 | 1983-05-31 | Laser working method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59220294A true JPS59220294A (en) | 1984-12-11 |
JPH0462833B2 JPH0462833B2 (en) | 1992-10-07 |
Family
ID=14122818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58094897A Granted JPS59220294A (en) | 1983-05-31 | 1983-05-31 | Laser working method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59220294A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03165979A (en) * | 1989-11-27 | 1991-07-17 | Amada Co Ltd | Method and device for laser beam machining |
JPH0615468A (en) * | 1992-07-02 | 1994-01-25 | Gijutsu Kenkyu Kumiai Iryo Fukushi Kiki Kenkyusho | Incision depth monitoring device |
JPH0687086A (en) * | 1990-12-17 | 1994-03-29 | Gijutsu Kenkyu Kumiai Iryo Fukushi Kiki Kenkyusho | Method and device for monitoring incised depth |
EP1407851A1 (en) * | 2002-10-12 | 2004-04-14 | Volkswagen Aktiengesellschaft | Method and device for removing material to workpieces with a laser |
EP3799998A1 (en) | 2019-10-02 | 2021-04-07 | Adige S.p.A. | Method of detecting the operating condition of an optical element arranged along a propagation path of a laser beam of a machine for processing a material, system for carrying out said method and a laser processing machine provided with such system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5186896A (en) * | 1975-01-29 | 1976-07-29 | Tokyo Shibaura Electric Co | |
JPS589783A (en) * | 1981-07-08 | 1983-01-20 | Agency Of Ind Science & Technol | Method of inspection for laser working |
-
1983
- 1983-05-31 JP JP58094897A patent/JPS59220294A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5186896A (en) * | 1975-01-29 | 1976-07-29 | Tokyo Shibaura Electric Co | |
JPS589783A (en) * | 1981-07-08 | 1983-01-20 | Agency Of Ind Science & Technol | Method of inspection for laser working |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03165979A (en) * | 1989-11-27 | 1991-07-17 | Amada Co Ltd | Method and device for laser beam machining |
JPH0687086A (en) * | 1990-12-17 | 1994-03-29 | Gijutsu Kenkyu Kumiai Iryo Fukushi Kiki Kenkyusho | Method and device for monitoring incised depth |
JPH0615468A (en) * | 1992-07-02 | 1994-01-25 | Gijutsu Kenkyu Kumiai Iryo Fukushi Kiki Kenkyusho | Incision depth monitoring device |
EP1407851A1 (en) * | 2002-10-12 | 2004-04-14 | Volkswagen Aktiengesellschaft | Method and device for removing material to workpieces with a laser |
EP3799998A1 (en) | 2019-10-02 | 2021-04-07 | Adige S.p.A. | Method of detecting the operating condition of an optical element arranged along a propagation path of a laser beam of a machine for processing a material, system for carrying out said method and a laser processing machine provided with such system |
US11685002B2 (en) | 2019-10-02 | 2023-06-27 | Adige S.P.A. | Method for detecting the operating condition of an optical element arranged along a propagation path of a laser beam of a machine for processing a material, system for carrying out said method and laser processing machine provided with said system |
Also Published As
Publication number | Publication date |
---|---|
JPH0462833B2 (en) | 1992-10-07 |
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