JPS59219982A - Jig for inspecting withstand voltage of printed board - Google Patents

Jig for inspecting withstand voltage of printed board

Info

Publication number
JPS59219982A
JPS59219982A JP58094011A JP9401183A JPS59219982A JP S59219982 A JPS59219982 A JP S59219982A JP 58094011 A JP58094011 A JP 58094011A JP 9401183 A JP9401183 A JP 9401183A JP S59219982 A JPS59219982 A JP S59219982A
Authority
JP
Japan
Prior art keywords
printed board
voltage
conductor
contact
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58094011A
Other languages
Japanese (ja)
Inventor
遠藤 健三
「あき」本 健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58094011A priority Critical patent/JPS59219982A/en
Publication of JPS59219982A publication Critical patent/JPS59219982A/en
Pending legal-status Critical Current

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  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はプリント板の耐圧検査を行なう際に使用する耐
圧検査装置に係り、特に電圧印加接触端子の改良に関す
る。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a withstand voltage testing device used for testing printed circuit boards, and particularly to improvements in voltage application contact terminals.

〔発明の背景〕[Background of the invention]

従来より電子計算機などに用いられるプリント板は銅張
積層板に穴明け、スルホール銅メッキを行な論回路パタ
ーンを焼付し、エツチングを施こして必要な導体回路を
形成でるのが一般的である。ところが導体回路を形成す
る際に不必要な導体残りが生じ、短絡又は短絡直前の欠
陥が発生することがある。
Conventionally, printed circuit boards used for electronic computers and the like have been made by drilling holes in copper-clad laminates, performing through-hole copper plating, baking logic circuit patterns, and etching to form the necessary conductor circuits. . However, when forming a conductor circuit, unnecessary conductor remains may occur, resulting in a short circuit or a defect immediately before a short circuit.

このような欠陥が完成品になった後に発見された場合は
手直し又は損失工数が大きくなるため、導体回路形成処
理直後に発見することが望ましい。このため従来導体回
路形成処理後のプリント板の導体部分に耐圧検査機の導
通コノ−タクトグローブを接触して導体、相互間の耐圧
検査を行なってい歪。
If such a defect is discovered after the finished product has been produced, rework or lost man-hours will be large, so it is desirable to discover it immediately after the conductor circuit formation process. For this reason, conventionally, the conductor part of the printed circuit board after the conductor circuit formation process is contacted with a continuity contact glove of a withstand voltage tester to check the withstand voltage between the conductors and each other.

しかしこの方法は導体回路の密度が高くなるに従かい検
査個所数が増大するため、あらかじめ耐圧検査を行なう
導体個所に対応した位置に導通コンタクトプローブを設
けたインターフェイスを用意し、さらに高電圧印加が可
能な導通検査機を使用し又そのスウィッチング機能で被
検査個所相互間の耐圧検査を行なっている。
However, with this method, the number of inspection points increases as the density of the conductor circuit increases, so an interface with continuity contact probes is prepared in advance at positions corresponding to the conductor sections to be tested for withstand voltage, and high voltage application is required. We use a suitable continuity tester and use its switching function to perform voltage resistance tests between test points.

しかしこの方法(夷より高密度化されたプリント板にお
いては導通コンタクトプローブの設置本数が1台肖り約
1.000本〜10.ODD本また被検査品によっては
それ以上の設置が必要となり、かつ小径化に併ない機構
が細密化し製作技術も高度なものが必要となり、さらに
導通コンタクトプローブを装填するためのソケットが必
要で。
However, with this method (for higher density printed circuit boards, the number of conductive contact probes to be installed per unit is approximately 1,000 to 10.000, or more depending on the product to be inspected). In addition, as the diameter becomes smaller, the mechanism becomes more detailed, requiring advanced manufacturing technology, and a socket for loading the conductive contact probe is also required.

それな支えるソケット固定用ボードの製作とその組立と
1通電のためのソケットと導通検査槽との間の配線工数
等の設備製作費が高価なものとなり、耐圧検査実施の大
きな隘路となっている。
However, the cost of manufacturing the supporting socket fixing board, assembling it, and man-hours for wiring between the socket and the continuity test tank for energization are expensive, and this is a major bottleneck in carrying out voltage resistance tests. .

〔発明の目的〕[Purpose of the invention]

本発明の目的は耐圧検査用の導通コンタクトプローブに
とって換わる安価な接触端子を提供′fろことにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive contact terminal that can replace a continuity contact probe for testing voltage resistance.

〔発明の概要〕 本発明の特徴とするところはプリント板の導体パターン
間の耐圧性能を落とすことなく耐圧検査が実施できるよ
うにしたことにある。
[Summary of the Invention] A feature of the present invention is that a voltage resistance test can be carried out without deteriorating the voltage resistance performance between conductor patterns on a printed board.

〔発明の実施例〕[Embodiments of the invention]

次に本発明の一実施例を第1図により説明する。第1図
はプリント板耐圧検査治具を示した上面図であり、第2
図は第1図のA−i断面図を示したものである。
Next, one embodiment of the present invention will be described with reference to FIG. Figure 1 is a top view showing the printed board pressure test jig, and Figure 2
The figure shows a sectional view taken along line A-i in FIG.

被検査品プリント板5の耐圧検査を行なうため、ロケー
ションビン6を基準に電圧印加プリント板8を対面する
ように検査台4に設置する。。
In order to perform a pressure resistance test on the printed board 5 to be inspected, the voltage applied printed board 8 is placed on the inspection table 4 so as to face the location bin 6 as a reference. .

電圧印加プリント板8はあらかじめ被検査品プリント板
5の導体部1.2にスルポールランド接触端子7が接触
するように位置決めして、かつ被検査品プリント板5の
電圧印加正極導体部1には耐圧針12の電圧出力のプラ
ス側が通電できるようにプラスのプローブを電圧印加プ
リント板8の裏面導体部9の端部に接続させて、スルホ
ールを経由して表面のすべてのランドに通電できるよう
に回路を作成しておく、−万雷圧印加負極導体部2には
耐圧針12の電圧出力のマイナス側が通電されるように
、マイナスグローブを電、圧印加プリント板80表面導
体部9に接続しておく、またスルホールランド接触端子
7には接触状態を良好にするため1表面処理の例えば本
例では金メッキ処理を施こしておく、さらに接触状態を
より確実なものにするため電圧印加プリント板8のスル
ホール接触端子7のスルホールの下方より真空吸引が行
なえるように、吸引バイブ10ヲ経由した真空ポンプ1
1を設置し被検査品プリント板5の導体部とスルホール
ランド接触端子7が密着するようにし、より真空効果を
高めるためマイラーシートから成る加圧板6を設ける。
The voltage application printed board 8 is positioned in advance so that the Sulpol land contact terminal 7 contacts the conductor portion 1.2 of the printed board 5 to be inspected, and the voltage application printed board 8 is placed in contact with the voltage application positive conductor portion 1 of the printed board 5 to be inspected. The positive probe is connected to the end of the back conductor section 9 of the voltage application printed board 8 so that the positive side of the voltage output of the pressure-resistant needle 12 can be energized, and all the lands on the surface can be energized via the through holes. Create a circuit in advance. - Connect a negative globe to the surface conductor section 9 of the voltage and pressure application printed board 80 so that the negative side of the voltage output of the pressure-resistant needle 12 is energized to the negative electrode conductor section 2 for applying lightning pressure. In addition, the through-hole land contact terminal 7 is subjected to surface treatment, for example, gold plating in this example, in order to improve the contact condition.Furthermore, to further ensure the contact condition, a voltage applied printed board is applied. The vacuum pump 1 is connected via a suction vibrator 10 so that vacuum suction can be performed from below the through hole of the through hole contact terminal 7 of 8.
1 is installed so that the conductor part of the printed board 5 to be inspected and the through-hole land contact terminal 7 are in close contact with each other, and a pressure plate 6 made of a Mylar sheet is provided to further enhance the vacuum effect.

このように構成した本考案の治具を使用するには、被検
査品プリント板5と耐圧印加プリント板8をロケ−ジョ
ンビン5を両者の位置決めにして対面し、真空ポンプ1
1またはプレスで加圧板乙によって加圧しながら所定の
検査電圧例えばI)C1ooVを印加してその漏洩電流
を耐圧針12にて検出する。
To use the jig of the present invention constructed in this manner, the printed board 5 to be inspected and the pressure-resistant printed board 8 are placed facing each other with the location bin 5 positioned between them, and the vacuum pump 1
A predetermined test voltage, for example, I) C1ooV, is applied while applying pressure with a pressure plate B using a press or a press, and the leakage current is detected using a pressure-resistant needle 12.

なお本例では電圧印加プリント板8の導体層の層数は2
層であるが、被検査品プリント板の導体回路の密度の大
小によっては層数な3層以上にして電圧印加回路を形成
するものとする。
In this example, the number of conductor layers of the voltage application printed board 8 is 2.
However, depending on the density of the conductor circuit of the printed board to be inspected, the voltage application circuit may be formed using three or more layers.

また被検査品プリント板は導体層数は1層であるが2層
以上の製品についても同様に耐圧印加場所をあらかじめ
例えば隣接導体の相互間が検査できるように、正極を印
加する導体部と負極を印加する導体部に2分し、それに
対応した電圧印加プリント板を製作する。
In addition, although the number of conductor layers in the printed board to be inspected is one, for products with two or more layers, the conductor part to which the positive electrode is applied and the negative electrode part should be checked in advance so that, for example, between adjacent conductors can be inspected in advance. The conductor section to which voltage is applied is divided into two parts, and a corresponding voltage application printed board is manufactured.

また被検査品も(2くは検査治具の電圧印加プリント板
のどちらか一方にフレキシブルなプリント板を使用する
と一層良好な両者の接触状態が得られる。
In addition, if a flexible printed board is used for one of the voltage-applying printed boards of the inspection jig (2), even better contact between the two can be obtained.

〔発明の効果〕〔Effect of the invention〕

本発明によれば次の如き効果を得ることができる。 According to the present invention, the following effects can be obtained.

すなわち、高価な導通コンタクトグローブを含めた導通
検査機を使用することなく、安価な耐圧印加プリント板
を使用して耐圧検査が可能となり、耐圧検査治具の製作
費用が従来の10%以下で製作でき大巾に耐圧検査費用
が節約できた。
In other words, it is possible to perform voltage resistance testing using an inexpensive pressure-resistant printed circuit board without using a continuity testing machine including an expensive continuity contact glove, and the manufacturing cost of voltage-resistant testing jigs is less than 10% of the conventional cost. This resulted in a huge savings in pressure test costs.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の耐圧検査治具の上面図、第
2図はそのA−A線矢視断面図である。 1・・・電、圧印加正極導体部、2・・・電圧印加負極
導体部、5・・・ロケーションビン、4・・・検査台、
5・被検査プリント板、6・・・加圧板、7・・・スル
ホールランド接触端子、8・・・電圧印加プリント板、
9・・・電圧印加プリント板導体部、10・・・吸引パ
イプ、11・・・真空ポンプ、12・・・耐圧針。 第1図 4
FIG. 1 is a top view of a pressure test jig according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line A--A. DESCRIPTION OF SYMBOLS 1... Electricity, pressure application positive electrode conductor part, 2... Voltage application negative electrode conductor part, 5... Location bin, 4... Inspection table,
5. Printed board to be inspected, 6... Pressure plate, 7... Through hole land contact terminal, 8... Voltage application printed board,
9... Voltage application printed board conductor section, 10... Suction pipe, 11... Vacuum pump, 12... Pressure resistant needle. Figure 1 4

Claims (1)

【特許請求の範囲】[Claims] 1、 絶縁板の表裏ならびに内層に導体回路および導体
ヌルホールを有するプリント板の耐圧検査に用いる電圧
印加接触端子に電圧印加プリント板のスルホールランド
より成る検査治具において、該接触端子に前記プリント
板の複数の導体回路および導体スルホールに対応して、
スルホールを有したランドを設けて接触端子とし、該接
触端子の接触面に接触不良防止用の表面処理ならびに、
該スルホールより被検査品プリント板を真空吸引して接
触状態を良好にしたことを特徴とするプリント板耐圧検
査治具。
1. In an inspection jig consisting of a through-hole land of a voltage-applying printed board at a voltage-applying contact terminal used for voltage proof testing of a printed board having conductor circuits and conductor null holes on the front and back sides and inner layers of an insulating board, Compatible with multiple conductor circuits and conductor through holes,
A land with a through hole is provided as a contact terminal, and the contact surface of the contact terminal is subjected to surface treatment to prevent poor contact, and
A pressure-resistant inspection jig for a printed board, characterized in that the printed board to be inspected is vacuum-suctioned through the through-hole to achieve a good contact state.
JP58094011A 1983-05-30 1983-05-30 Jig for inspecting withstand voltage of printed board Pending JPS59219982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58094011A JPS59219982A (en) 1983-05-30 1983-05-30 Jig for inspecting withstand voltage of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58094011A JPS59219982A (en) 1983-05-30 1983-05-30 Jig for inspecting withstand voltage of printed board

Publications (1)

Publication Number Publication Date
JPS59219982A true JPS59219982A (en) 1984-12-11

Family

ID=14098520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58094011A Pending JPS59219982A (en) 1983-05-30 1983-05-30 Jig for inspecting withstand voltage of printed board

Country Status (1)

Country Link
JP (1) JPS59219982A (en)

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