JPS5921666U - Metal strip plating device - Google Patents

Metal strip plating device

Info

Publication number
JPS5921666U
JPS5921666U JP11582782U JP11582782U JPS5921666U JP S5921666 U JPS5921666 U JP S5921666U JP 11582782 U JP11582782 U JP 11582782U JP 11582782 U JP11582782 U JP 11582782U JP S5921666 U JPS5921666 U JP S5921666U
Authority
JP
Japan
Prior art keywords
metal strip
metal
plating
plating device
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11582782U
Other languages
Japanese (ja)
Other versions
JPS623391Y2 (en
Inventor
広瀬　道夫
信　勝男
早田　悟
Original Assignee
三菱電線工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電線工業株式会社 filed Critical 三菱電線工業株式会社
Priority to JP11582782U priority Critical patent/JPS5921666U/en
Publication of JPS5921666U publication Critical patent/JPS5921666U/en
Application granted granted Critical
Publication of JPS623391Y2 publication Critical patent/JPS623391Y2/ja
Granted legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係るメッキ装置を示す縦断面説明図、
第２図は第１図における■−■断面説明図である。 図において、１はメッキ槽、Ａは被メツキ金属帯、５は
給電電極である。FIG. 1 is an explanatory longitudinal cross-sectional view showing a plating apparatus according to the present invention;
FIG. 2 is an explanatory cross-sectional view taken along the line ■-■ in FIG. 1. In the figure, 1 is a plating tank, A is a metal strip to be plated, and 5 is a power supply electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被メツキ金属帯を、その長方形断面の長辺が垂直となる
ようメッキ槽に通過させ、連続メッキするメッキ装置に
おいて、被メツキ金属帯への給電電極番、上記金属帯の
下端４面に摺動接触する金属板と該金属板を上記金属帯
側へ押圧するバネ体゛　　　　　とから構成としたこと
を特徴と子る金属帯のメッキ装置。In a plating device that continuously performs plating by passing a metal strip to be plated through a plating bath so that the long side of its rectangular cross section is vertical, the power supply electrode number to the metal strip to be plated is slid on the four lower surfaces of the metal strip. 1. A metal strip plating apparatus characterized by comprising a metal plate that comes into contact with the metal plate and a spring body that presses the metal plate toward the metal band.
JP11582782U 1982-07-29 1982-07-29 Metal strip plating device Granted JPS5921666U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11582782U JPS5921666U (en) 1982-07-29 1982-07-29 Metal strip plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11582782U JPS5921666U (en) 1982-07-29 1982-07-29 Metal strip plating device

Publications (2)

Publication Number Publication Date
JPS5921666U true JPS5921666U (en) 1984-02-09
JPS623391Y2 JPS623391Y2 (en) 1987-01-26

Family

ID=30267239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11582782U Granted JPS5921666U (en) 1982-07-29 1982-07-29 Metal strip plating device

Country Status (1)

Country Link
JP (1) JPS5921666U (en)

Also Published As

Publication number Publication date
JPS623391Y2 (en) 1987-01-26

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